EK51 - Apex Microtechnology - Datasheet.Directory

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MICROTECHNOLOGY

EVALUATION KIT FOR PSOP1

EK51

INTRODUCTION

The EK51 evaluation kit provides a fast and easy bread-

board solution for all devices in Apex’s PSOP1 package (24

PIN PSOP). The EK51 includes the EVAL43 board shown in

Figure 1, as well as the universal EVAL36 board. The combi-

nation of the two boards provides a large area for breadboard

circuit space while also providing an effective method of

thermal management of the surface mount package. The

device under evaluation is surface mounted directly to the

EVAL43 PC board which provides a foil footprint area the size

of the heat slug. This foil heat slug connection area consists of

plated through thermal vias. The thermal vias offer a cost-

effective way to decrease the thermal resistance between one

side of the PC board which allows for the direct mounting of a

heat sink or heat sink surface mount fan on the back side of the

PC board.

PARTS LIST

Part# Description Qty

EVAL36 Universal PC Board, Apex 1

EVAL43 PC Board, PSOP1, Apex 1

TSM-116-01-T-SV Terminal Strip, 16pin, Samtec 2

SSW-116-01-T-S Socket Strip, 16pin, Samtec 2

OX7R105KWN Cap, 200V, 1µF, Ceramic 4

*ERJ-6GEYOR00V Res, 0.0Ω, 0805SMD, Panasonic 4

*AVS336M2AG24T Cap, 100V, 33µF, CDE 4

*031606 Heat Sink w/ Fan, 3.4°C/W, AAVID 1

or or

*031613 Heat Sink, 11.0°C/W, AAVID 1

* Parts not supplied. Parts are application dependent. Sug-

gested part numbers are provided.

Figure 1

ASSEMBLY

The PSOP1 should be assembled to the EVAL43 PC board

using surface mount processes. Solder paste may be dis-

pensed or screen-printed on the DUT pads as well as the foil

heat slug pad. The heat slug on the bottom surface of the

PSOP1 provides maximum heat dissipation capabilities when

soldered to the PCB foil footprint area. However, for prototype

purposes, the tab can be thermally connected to the PCB foil

area using thermal grease.

If soldering the heat slug, ideally the PSOP1 should be

soldered to the PCB using a solder reflow furnace. If a reflow

furnace is not available, a heat plate capable of solder reflow

temperatures may be used. Otherwise, the leads may be

carefully soldered individually to the PCB with a thin tip solder-

ing iron. However, in this case, the use of thermal grease under

the heat tab is recommended instead of solder for thermal

connection through the thermal vias.

The kit comes with ceramic bypass capacitors, which should

be soldered on the space provided on the EVAL43 board. Also,

space is provided for the appropriate electrolytic by-pass

capacitors. Although these capacitors are not provided in the

kit, a recommended capacitor is listed for 100V applications.

For higher voltage applications, a larger electrolytic capacitor

can be mounted on the EVAL36 board.

The EVAL43 is a generic evaluation board for the PSOP1.

Jumpers are required to make appropriate connection to +Vs,

-Vs and ground. When applicable, surface mount 0805 0Ω

resistors can be used in the locations provided.

Once all the surface mount components are installed, the

heat sink can then be mounted to the back of the PC board.

High thermal conductive grease should be used when mount-

ing the heat sink to the PC board. Note: A heat sink is not

supplied with the kit, but several options are listed which are

produced by AAVID Thermal Product, Inc.

Review Figure 2 on the next page for all other assemblies

needed to construct this evaluation kit.

BEFORE YOU GET STARTED

*All Apex amplifiers should be handled using proper ESD

precautions.

*Always provide the appropriate heat sinking.

*Always use adequate power supply bypass capacitors.

* Do not change connections while the circuit is powered.

*Initially set all power supplies to the minimum operating

levels allowed in the device data sheet.

*Check for oscillations.