ATWINC3400-MR210CA131 - MICROCHIP TECHNOLOGY

ATWINC3400-MR210xA

IEEE® 802.11 b/g/n Network Controller with Integrated

Bluetooth® Low Energy Module

Introduction

The ATWINC3400-MR210xA is an IEEE 802.11 b/g/n RF/Baseband/Medium Access Control (MAC) network

controller with Bluetooth Low Energy module. The ATWINC3400-MR210xA modules are Bluetooth 5.0 certified.

This module is optimized for low power and high performance mobile applications. This module features small

form factor with integrated Power Amplifier (PA), Low-Noise Amplifier (LNA), Transmit/Receive (T/R) switch (for

Wi-Fi® and Bluetooth) and Power Management Unit (PMU). The ATWINC3400-MR210CA integrates a chip antenna

while the ATWINC3400-MR210UA adds a micro co-ax (u.FL) connector for connecting to an external antenna. The

ATWINC3400-MR210xA module requires a 32.768 kHz clock for sleep operation.

The ATWINC3400-MR210xA module utilizes highly optimized IEEE 802.11 Bluetooth coexistence protocols, and

provides Serial Peripheral Interface (SPI) to interface with the host controller.

The references to the ATWINC3400-MR210xA module include the following devices:

• ATWINC3400-MR210CA – Integrates a chip antenna

• ATWINC3400-MR210UA – Adds a micro co-ax (u.FL) connector for connecting to an external antenna

Features

Wi-Fi features:

• IEEE 802.11 b/g/n RF/PHY/MAC

• IEEE 802.11 b/g/n (1x1) with Single Spatial Stream, up to 72 Mbps PHY Rate in a 2.4 GHz ISM Band

• Integrated Chip Antenna or Micro Co-ax (U.FL) Connector for an External Antenna

• Superior Sensitivity and Range via Advanced PHY Signal Processing

• Advanced Equalization and Channel Estimation

• Advanced Carrier and Timing Synchronization

• Supports Soft-AP

• Supports IEEE 802.11 WEP, WPA and WPA2 Personal and WPA2 Enterprise (firmware version 1.3.1 or later)

• Superior MAC Throughput through Hardware Accelerated Two-Level A-MSDU/A-MPDU Frame Aggregation and

Block Acknowledgment

• On-Chip Memory Management Engine to Reduce the Host Load

• Operating Temperature Range from -40°C to +85°C

• Input/Output voltage ranges from 2.7V to 3.6V

• Power supply (VBAT) ranges from 3.0V to 4.2V

• Wi-Fi Alliance® Certified for Connectivity and Optimizations

– ID: WFA62065

• Integrated On-Chip Microcontroller

• SPI Host Interface

• Integrated Flash Memory for Wi-Fi and Bluetooth System Software

• Low Leakage On-Chip Memory for State Variables

• Fast AP Re-Association (150 ms)

• On-Chip Network Stack to Offload MCU

• Network Features: Firmware version 1.2.0 or later

– TCP, UDP, DHCP, ARP, HTTP, TLS, DNS and SNTP

Bluetooth features:

• ATWINC3400-MR210xA Bluetooth Low Energy Certification (end product) QD ID: 112092

• Adaptive Frequency Hopping (AFH)

• Superior Sensitivity and Range

ATWINC3400-MR210xA

Table of Contents

Introduction.....................................................................................................................................................1

Features......................................................................................................................................................... 1

1. Ordering Information and Module Marking..............................................................................................5

2. Block Diagram.........................................................................................................................................6

3. Pinout and Package Information............................................................................................................. 7

3.1. Package Description.................................................................................................................. 10

4. Electrical Characteristics....................................................................................................................... 11

4.1. Absolute Maximum Ratings........................................................................................................11

4.2. Recommended Operating Conditions........................................................................................ 11

4.3. DC Characteristics..................................................................................................................... 12

4.4. IEEE 802.11 b/g/n Radio Performance...................................................................................... 12

4.5. Bluetooth Radio Performance.................................................................................................... 14

5. Power Management.............................................................................................................................. 17

5.1. Device States............................................................................................................................. 17

5.2. Controlling Device States........................................................................................................... 17

5.3. Power-Up/Down Sequence........................................................................................................ 18

5.4. Digital I/O Pin Behavior During Power-Up Sequences...............................................................19

6. Clocking................................................................................................................................................ 20

6.1. Low-Power Clock....................................................................................................................... 20

7. CPU and Memory Subsystem...............................................................................................................21

7.1. Processor................................................................................................................................... 21

7.2. Memory Subsystem....................................................................................................................21

7.3. Nonvolatile Memory (eFuse)...................................................................................................... 21

8. WLAN Subsystem................................................................................................................................. 23

8.1. MAC........................................................................................................................................... 23

8.2. PHY............................................................................................................................................24

8.3. Radio..........................................................................................................................................24

9. Bluetooth Low Energy........................................................................................................................... 26

10. External Interfaces................................................................................................................................ 27

10.1. Interfacing with the Host Microcontroller.................................................................................... 27

10.2. SPI Client Interface.................................................................................................................... 28

10.3. UART Interface...........................................................................................................................30

10.4. I2C Client Interface..................................................................................................................... 31

11. Application Reference Design...............................................................................................................33

11.1. Host Interface............................................................................................................................. 33

12. Module Outline Drawings...................................................................................................................... 35

ATWINC3400-MR210xA

13. Design Considerations.......................................................................................................................... 39

13.1. ATWINC3400-MR210CA............................................................................................................39

13.2. ATWINC3400-MR210UA External Antenna Connector............................................................. 42

13.3. Reflow Profile Information.......................................................................................................... 44

13.4. Module Assembly Considerations.............................................................................................. 44

13.5. Conformal Coating..................................................................................................................... 44

14. Appendix A: Regulatory Approval......................................................................................................... 45

14.1. United States..............................................................................................................................45

14.2. Canada.......................................................................................................................................47

14.3. Europe........................................................................................................................................49

14.4. Japan..........................................................................................................................................50

14.5. Korea..........................................................................................................................................50

14.6. Taiwan........................................................................................................................................ 51

14.7. China..........................................................................................................................................52

14.8. Other Regulatory Information..................................................................................................... 52

15. Reference Documentation.................................................................................................................... 53

16. Document Revision History...................................................................................................................54

The Microchip Website.................................................................................................................................56

Product Change Notification Service............................................................................................................56

Customer Support........................................................................................................................................ 56

Microchip Devices Code Protection Feature................................................................................................ 56

Legal Notice................................................................................................................................................. 57

Trademarks.................................................................................................................................................. 57

Quality Management System....................................................................................................................... 58

Worldwide Sales and Service.......................................................................................................................59

ATWINC3400-MR210xA

1. Ordering Information and Module Marking

The following table provides the ordering details for the ATWINC3400-MR210xA module.

Table 1-1. Ordering Details

Model Number Ordering Code Package Description Regulatory

Information

ATWINC3400-MR210CA ATWINC3400-MR210CAxxx(1) 22.43 x 14.73

x 2.0 mm

Certified module

with chip

antenna

FCC, IC, CE,

MIC, KCC, NCC,

SRC

ATWINC3400-MR210UA ATWINC3400-MR210UAxxx(1) 22.43 x 14.73

x 2.0 mm

Certified module

with u.FL

connector for an

external antenna

FCC, IC, CE

Note:

1. 'xxx' in the preceding table and following figure denotes the software version. For example, at the time of

publish, the software is v1.22, so its equivalent order code is ATWINC3400-MR210CA122. The order code

changes with the software version. For more information on the ordering code, refer to the ATWINC3400

product page.

The following figure illustrates the ATWINC3400-MR210xA module marking information.

Figure 1-1. Marking Information

MR 2 1 0C/U

Device name

MR: Internal Code

2: OTA with shield

1: Reserved

0: Reserved

C: Chip antenna

U: External antenna

Revision letter

Software version

ATWINC3400 A xxx

Blank: Tray Packing

T: Tape and Reel

ATWINC3400-MR210xA

Ordering Information and Module Marking

2. Block Diagram

The following figure shows the block diagram of the ATWINC3400-MR210xA module.

Figure 2-1. ATWINC3400-MR210xA Module Block Diagram

ATWINC3400 IC

UART TXD/RXD

BT TXD/RXD

BT RTS/CTS

SPI

I2C

GPIOs

SPI_CFG

IRQN

RESET_N

Chip_En

RTC (32 kHz)

DVDDIO

VBAT

RX/TX

Discrete Balun

and

Filter

26 MHz

Crystal

2.4 GHz

Chip Antenna

u.FL Connector for

an External Antenna

GND

ATWINC3400-MR210xA

Block Diagram

3. Pinout and Package Information

This package contains an exposed paddle that must be connected to the system board ground. The ATWINC3400-

MR210xA module pin assignment is shown in the following figure. This package contains an exposed paddle, Pin 37,

PADDLE VSS, that must be connected to the system board ground.

Figure 3-1. ATWINC3400-MR210xA Module Pin Assignment

ATWINC3400-MR210xA

MODULE

J10

J11

J12

J13

J14

J15

J16

J17

J18

J19

J20

J21

J22

J23

J24

J25

J26

J27

J28

J29

J30

J31

J32

J33

J34

J35

J36 GND

I2C_SDA_M

I2C_SCL_M

IRQN

GPIO20

GPIO19

GPIO18

GPIO17

GND

GPIO7

SPI_MOSI

SPI_SSN

SPI_MISO

SPI_SCK

GPIO8

GND

RTC_CLK

CHIP_EN

VBAT

UART_RXD

UART_TXD

GPIO4

GPIO3

GND

VDDIO

BT_RXD

BT_TXD

RESETN

N/C

SPI_CFG

GND

I2C_SDA_S

I2C_SCL_S

The following table provides the ATWINC3400-MR210xA module pin description.

Table 3-1. ATWINC3400-MR210xA Module Pin Description

Pin # Pin Name Pin Type Description

1 GND GND Ground pin

2 SPI_CFG Digital Input Serial Peripheral Interface pin, which must be tied to

VDDIO

3 NC — No connection

4 NC — No connection

5 NC — No connection

6 NC — No connection

ATWINC3400-MR210xA

Pinout and Package Information

...........continued

Pin # Pin Name Pin Type Description

7 RESETN Digital Input • Active-low hard Reset pin

• When the Reset pin is asserted low, the module

is in the Reset state. When the Reset pin is

asserted high, the module functions normally

• This pin must connect to a host output that is

low by default on power-up. If the host output is

tri-stated, add a 1 MOhm pull-down resistor to

ensure a low level at power-up

8 BT_TXD Digital I/O,

Programmable pull up

• Bluetooth UART transmit data output pin

• Used only during debug for DTM interface. SPI

is the data and control interface with the host

Microcontroller

• It is recommended to add a test point for this pin

9 BT_RXD Digital I/O,

Programmable pull up

• Bluetooth UART receive data input pin

• Used only during debug for the DTM interface.

SPI is the data and control interface with the

host Microcontroller

• Adding a test point for this pin is recommended

10 I2C_SDA_S Digital I/O,

Programmable pull up

• I2C Client data pin

• Used only for test purposes. Adding a test point

for this pin is recommended

11 I2C_SCL_S Digital I/O,

Programmable pull up

• I2C Client clock pin

• Used only for test purposes. Adding a test point

for this pin is recommended

12 VDDIO Power Digital I/O power supply

13 GND GND Ground pin

14 GPIO3 Digital I/O,

Programmable pull up

General Purpose Input/Output pin(1)

15 GPIO4 Digital I/O,

Programmable pull up

General Purpose Input/Output pin(1)

16 UART_TXD Digital I/O,

Programmable pull up

• Wi-Fi UART TxD output pin

• Used only for debug development purposes.

Adding a test point for this pin is recommended

17 UART_RXD Digital I/O,

Programmable pull up

• Wi-Fi UART RxD input pin

• Used only for debug development purposes.

Adding a test point for this pin is recommended

18 VBAT Power Power supply pin for DC/DC converter and PA

ATWINC3400-MR210xA

Pinout and Package Information

...........continued

Pin # Pin Name Pin Type Description

19 CHIP_EN Digital Input • PMU enable pin

• When the CHIP_EN pin is asserted high, the

module is enabled. When the CHIP_EN pin is

asserted low, the module is disabled or put into

Power-Down mode

• Connect to a host output that is low by default

at power-up. If the host output is tri-stated, add

a 1 MOhm pull-down resistor, if necessary, to

ensure a low level at power-up

20 RTC_CLK Digital I/O,

Programmable pull up

• RTC Clock input pin

• This pin must connect to a 32.768 kHz clock

source

21 GND GND Ground pin

22 GPIO8 Digital I/O,

Programmable pull up

General Purpose Input/Output pin(1)

23 SPI_SCK Digital I/O,

Programmable pull up

SPI clock pin

24 SPI_MISO Digital I/O,

Programmable pull up

SPI MISO (Host In Client Out) pin

25 SPI_SSN Digital I/O,

Programmable pull up

Active-low SPI SSN (Client Select) pin

26 SPI_MOSI Digital I/O,

Programmable pull up

SPI MOSI (Host Out Client In) pin

27 GPIO7 Digital I/O,

Programmable pull up

General Purpose Input/Output pin(1)

28 GND GND Ground pin

29 GPIO17 Digital I/O,

Programmable pull up

General Purpose Input/Output pin(1)

30 GPIO18 Digital I/O,

Programmable pull up

General Purpose Input/Output pin(1)

31 GPIO19 Digital I/O,

Programmable pull up

General Purpose Input/Output pin(1)

32 GPIO20 Digital I/O,

Programmable pull up

General Purpose Input/Output pin(1)

33 IRQN Digital output,

Programmable pull up

• ATWINC3400-MR210xA module host interrupt

request output pin

• This pin must connect to a host interrupt pin

34 I2C_SCL_M Digital I/O,

Programmable pull up

I2C Host clock pin

35 I2C_SDA_M Digital I/O,

Programmable pull up

I2C Host data pin

36 GND GND Ground pin

37 PADDLE VSS GND Connect to the system board ground

ATWINC3400-MR210xA

Pinout and Package Information

Note:

1. Usage of the GPIO functionality is not supported by the firmware. The data sheet will be updated once the

support for this feature is added.

3.1 Package Description

The following table provides the ATWINC3400-MR210xA module package dimensions.

Table 3-2. ATWINC3400-MR210xA Module Package Information

Parameter Value Unit

Pad count 37 —

Package size 22.43 x 14.73

Total thickness 2.09

Pad pitch 1.20

Pad width 0.81

Exposed pad size 4.4 x 4.4

ATWINC3400-MR210xA

Pinout and Package Information

4. Electrical Characteristics

This chapter provides an overview of the electrical characteristics of the ATWINC3400-MR210xA module.

4.1 Absolute Maximum Ratings

The following table provides the absolute maximum ratings for the ATWINC3400-MR210xA module.

Table 4-1. ATWINC3400-MR210xA Module Absolute Maximum Ratings

Symbol Parameter Min. Max. Unit

VDDIO I/O supply voltage -0.3 5.0

VBAT Battery supply voltage -0.3 5.0

VIN Digital input voltage -0.3 VDDIO

VAIN Analog input voltage -0.3 1.5

VESDHBM

Electrostatic discharge

Human Body Model (HBM)

-1000, -2000 (see notes

below)

+1000, +2000 (see notes

below)

TAStorage temperature -65 150

ºC

— Junction temperature — 125

— RF input power — 23 dBm

1. VIN corresponds to all the digital pins.

2. For VESDHBM, each pin is classified as Class 1, Class 2 or both:

2.1. The Class 1 pins include all the pins (both analog and digital).

2.2. The Class 2 pins include all digital pins only.

2.3. VESDHBM is ±1 kV for Class 1 pins. VESDHBM is ± 2 kV for Class 2 pins.

CAUTION

Stresses beyond those listed under “Absolute Maximum Ratings” cause permanent damage to the device.

This is a stress rating only. The functional operation of the device at those or any other conditions above

those indicated in the operation listings of this specification is not implied. Exposure to maximum rating

conditions for extended periods affects the device reliability.

4.2 Recommended Operating Conditions

The following table provides the recommended operating conditions for the ATWINC3400-MR210xA module.

Table 4-2. ATWINC3400-MR210xA Module Recommended Operating Conditions

Symbol Parameter Min. Typ. Max. Units

VDDIO I/O supply voltage (1) 2.7 3.3 3.6 V

VBAT Battery supply voltage(2)(3) 3.0 3.3 4.2 V

— Operating temperature -40 — 85 ºC

ATWINC3400-MR210xA

Electrical Characteristics

Notes:

1. I/O supply voltage is applied to the VDDIO pin.

2. Battery supply voltage is applied to the VBAT pin.

3. The ATWINC3400-MR210xA module is functional across this range of voltages; however, optimal RF

performance is ensured for VBAT of 3.3V.

4.3 DC Characteristics

The following table provides the DC characteristics for the ATWINC3400-MR210xA module digital pads.

Table 4-3. DC Electrical Characteristics

Symbol Parameter Min Typ Max Unit

VIL Input Low

Voltage

-0.30 — 0.60

VIH Input High

Voltage

VDDIO - 0.60 — VDDIO + 0.30

VOL Output Low

Voltage

— — 0.45

VOH Output High

Voltage

VDDIO - 0.50 — —

— Output Load

Capacitance

— — 20

— Digital Input Load

Capacitance

— — 6

4.4 IEEE 802.11 b/g/n Radio Performance

4.4.1 Receiver Performance

The receiver performance is tested under the following conditions:

• VBAT = 3.3V

• VDDIO = 3.3V

• Temp = 25°C

• Measured after RF matching network

The following table provides the receiver performance characteristics for the ATWINC3400-MR210xA module.

Table 4-4. IEEE 802.11 Receiver Performance Characteristics

Parameter Description Min. Typ. Max. Unit

Frequency — 2,412 — 2,484 MHz

Sensitivity 802.11b

1 Mbps DSSS — -95.0 —

dBm

2 Mbps DSSS — -94.0 —

5.5 Mbps DSSS — -90.0 —

11 Mbps DSSS — -86.0 —

ATWINC3400-MR210xA

Electrical Characteristics

...........continued

Parameter Description Min. Typ. Max. Unit

Sensitivity 802.11g

6 Mbps OFDM — -90.0 —

dBm

9 Mbps OFDM — -89.0 —

12 Mbps OFDM — -87.0 —

18 Mbps OFDM — -85.0 —

24 Mbps OFDM — -82.0 —

36 Mbps OFDM — -79.0 —

48 Mbps OFDM — -75.0 —

54 Mbps OFDM — -73.0 —

Sensitivity 802.11n

(BW = 20 MHz, 800

ns GI)

MCS 0 — -89.0 —

dBm

MCS 1 — -87.0 —

MCS 2 — -84.0 —

MCS 3 — -82.0 —

MCS 4 — -78.0 —

MCS 5 — -75.0 —

MCS 6 — -73.0 —

MCS 7 — -71.0 —

Maximum receive

signal level

1-11 Mbps DSSS — 0 —

dBm6-54 Mbps OFDM — 0 —

MCS 0 – 7 (800 ns GI) — 0 —

Adjacent channel

rejection

1 Mbps DSSS (30 MHz offset) — 50 —

11 Mbps DSSS (25 MHz offset) — 43 —

6 Mbps OFDM (25 MHz offset) — 40 —

54 Mbps OFDM (25 MHz offset) — 25 —

MCS 0 – 20 MHz BW (25 MHz offset) — 40 —

MCS 7 – 20 MHz BW (25 MHz offset) — 20 —

4.4.2 Transmitter Performance

The transmitter performance is tested under the following conditions:

• VBAT = 3.3V

• VDDIO = 3.3V

• Temp = 25°C

The following table provides the transmitter performance characteristics for the ATWINC3400-MR210xA module.

Table 4-5. IEEE 802.11 Transmitter Performance Characteristics

Parameter Description Minimum Typical Max. Unit

Frequency — 2,412 — 2,484 MHz

ATWINC3400-MR210xA

Electrical Characteristics

...........continued

Parameter Description Minimum Typical Max. Unit

Output power

802.11b 1 Mbps — 16.7(1) —

dBm

802.11b 11 Mbps — 17.5(1) —

802.11g OFDM 6 Mbps — 18.3(1) —

802.11g OFDM 54 Mbps — 13.0(1) —

802.11n HT20 MCS 0 (800 ns GI) — 17.5(1) —

802.11n HT20 MCS 7 (800 ns GI) — 12.5 (1)(2) —

TX power accuracy — — ±1.5(3) — dB

Carrier suppression — — 30.0 — dBc

Harmonic output power

(Radiated, Regulatory

mode)

2nd — — -41

dBm/MHz

3rd — — -41

Notes:

1. Measured as per IEEE 802.11 specifications.

2. The typical output power is 10 dBm only for channel-10 (2.457 GHz). Values mentioned in the preceding table

are applicable for all the other channels.

3. Measured after RF matching network.

4. The operating temperature range is -40°C to +85°C. RF performance is ensured at a room temperature of

25°C with a 2-3 dB change at the boundary conditions.

5. With respect to TX power, different (higher/lower) RF output power settings may be used for specific antennas

and/or enclosures, in which case re-certification may be required.

6. The availability of some specific channels and/or operational frequency bands are country-dependent and

must be programmed at the host product factory to match the intended destination. Regulatory bodies prohibit

exposing the settings to the end user. This requirement needs to be taken care of via the host implementation.

7. The RF parameters for the ATWINC3400-MR210UA are approximately 1 dB less than the values in the table.

This insertion loss accounts for PCB trace losses, and the filter network loss to the U.FL connector.

4.5 Bluetooth Radio Performance

4.5.1 Receiver Performance

The receiver performance is tested under the following conditions:

• VBAT = 3.3V

• VDDIO = 3.3V

• Temp: 25°C

• Measured after RF matching network

The following table provides the Bluetooth receiver performance characteristics for the ATWINC3400-MR210xA

module.

Table 4-6. Bluetooth Receiver Performance Characteristics

Parameter Description Min. Typ. Max. Unit

Frequency — 2,402 — 2,480 MHz

Sensitivity (ideal Tx) Bluetooth Low Energy (GFSK) — -92.5 —

dBm

Maximum receive signal level Bluetooth Low Energy (GFSK) — -2 —

ATWINC3400-MR210xA

Electrical Characteristics

...........continued

Parameter Description Min. Typ. Max. Unit

Interference performance

(Bluetooth Low Energy)

Co-channel — 9 —

adjacent + 1 MHz — -4 —

adjacent - 1 MHz — -2 —

adjacent + 2 MHz (image

frequency)

— -24 —

adjacent - 2 MHz — -25 —

adjacent + 3 MHz (adjacent to

image)

— -27 —

adjacent - 3 MHz — -27 —

adjacent + 4 MHz — -28 —

adjacent - 4 MHz — -27 —

adjacent + 5 MHz — -27 —

adjacent - 5 MHz — -27 —

4.5.2 Transmitter Performance

The transmitter performance is tested under the following conditions:

• VBAT = 3.3V

• VDDIO = 3.3V

• Temp: 25°C

• Measured after RF matching network

The following table provides the Bluetooth transmitter performance characteristics for the ATWINC3400-MR210xA

module.

Table 4-7. Bluetooth Transmitter Performance Characteristics

Parameter Description Min. Typ. Max. Unit

Frequency — 2,402 — 2,480 MHz

Output power Bluetooth Low Energy (GFSK) — 3.3 3.8

dBm

In-band spurious emission

(Bluetooth Low Energy)

N + 2 (Image frequency) — -33 —

N + 3 (Adjacent to image

frequency)

— -32 —

N - 2 — -48 —

N - 3 — -47 —

ATWINC3400-MR210xA

Electrical Characteristics

Notes:

1. Measured after RF matching network.

2. The operating temperature range is -40°C to +85°C. RF performance is ensured at a room temperature of

25°C with a 2-3 dB change at the boundary conditions.

3. With respect to TX power, different (higher/lower) RF output power settings may be used for specific antennas

and/or enclosures, in which case re-certification may be required.

4. The availability of some specific channels and/or operational frequency bands are country-dependent and

must be programmed at the host product factory to match the intended destination. Regulatory bodies prohibit

exposing the settings to the end user. This requirement needs to be taken care of via the host implementation.

5. The RF parameters for the ATWINC3400-MR210UA are approximately 1 dB less than the values in the table.

This insertion loss accounts for PCB trace losses and the filter network loss to the u.FL connector.

ATWINC3400-MR210xA

Electrical Characteristics

5. Power Management

5.1 Device States

The ATWINC3400-MR210xA module has multiple device states, based on the state of the IEEE 802.11 and Bluetooth

subsystems. It is possible for both subsystems to be active at the same time. To simplify the device power

consumption breakdown, the following basic states are defined. One subsystem can be active at a time:

• WiFi_ON_Transmit – Device actively transmits IEEE 802.11 signal

• WiFi_ON_Receive – Device actively receives IEEE 802.11 signal

• BT_ON_Transmit – Device actively transmits Bluetooth signal

• BT_ON_Receive – Device actively receives Bluetooth signal

• Doze – Device is powered on but it does not actively transmit or receive data

• Power_Down – Device core supply is powered off

5.2 Controlling Device States

The following table shows different device states and their power consumption for the ATWINC3400-MR210xA . The

device states can be switched using the following:

• CHIP_EN – Module pin (pin 19) enables or disables the DC/DC converter

• VDDIO – I/O supply voltage from external supply

In the ON states, VDDIO is ON and CHIP_EN is high (at VDDIO voltage level). To change from the ON states

to Power_Down state, connect the RESETN and CHIP_EN pin to logic low (GND) by following the power-down

sequence mentioned in Figure 5-1. When VDDIO is OFF and CHIP_EN is low, the chip is powered off with no

leakage.

Table 5-1. Device States Current Consumption

Device State Code Rate Output Power

(dBm)

Current Consumption(1)

IVBAT IVDDIO

ON_WiFi_Transmit 802.11b 1 Mbps 16.7 271 mA 24 mA

802.11b 11 Mbps 17.5 265 mA 24 mA

802.11g 6 Mbps 18.3 275 mA 24 mA

802.11g 54 Mbps 13.0 235 mA 24 mA

802.11n MCS 0 17.5 272 mA 24 mA

802.11n MCS 7 12.5 232 mA 24 mA

ON_WiFi_Receive 802.11b 1 Mbps N/A 63.9 mA 23.7 mA

802.11b 11 Mbps N/A 63.9 mA 23.7 mA

802.11g 6 Mbps N/A 63.9 mA 23.7 mA

802.11g 54 Mbps N/A 63.9 mA 23.7 mA

802.11n MCS 0 N/A 63.9 mA 23.7 mA

802.11n MCS 7 N/A 63.9 mA 23.7 mA

ON_BT_Transmit BLE 1 Mbps 3.3 79.37 mA 23.68 mA

ON_BT_Receive BLE 1 Mbps N/A 51.36 mA 23.68 mA

ATWINC3400-MR210xA

Power Management

...........continued

Device State Code Rate Output Power

(dBm)

Current Consumption(1)

IVBAT IVDDIO

Doze (Bluetooth Low

Energy Idle)

N/A N/A 53 mA (2)

Doze (Bluetooth Low

Energy Low Power)

N/A N/A 1 mA (2)

Power_Down N/A N/A 10.5 uA(2)

Notes:

1. Conditions: VBAT = 3.3V, VDDIO = 3.3V, at 25°C.

2. Current consumption mentioned for these states is the sum of current consumed in VDDIO and VBAT voltage

rails.

When power is not supplied to the device (DC/DC converter output and VDDIO are OFF, at ground potential), voltage

cannot be applied to the ATWINC3400-MR210xA module pins because each pin contains an ESD diode from the pin

to supply. This diode turns on when voltage higher than one diode-drop is supplied to the pin.

If voltage must be applied to the signal pads when the chip is in a low-power state, the VDDIO supply must be ON,

so the Power_Down state must be used. Similarly, to prevent the pin-to-ground diode from turning ON, do not apply

voltage that is more than one diode-drop below the ground to any pin.

5.3 Power-Up/Down Sequence

The following figure illustrates the power-up/down sequence for the ATWINC3400-MR210xA.

Figure 5-1. Power-Up/Down Sequence

VBATT

VDDIO

CHIP_EN

RESETN

XO Clock

tC'

tB'

tA'

The following table provides power-up/down sequence timing parameters.

Table 5-2. Power-Up/Down Sequence Timing

Paramet

er Min. Max. Units Description Notes

tA0 — ms VBAT rise to VDDIO

rise

VBAT and VDDIO can rise simultaneously or connected

together. VDDIO must not rise before VBAT.

tB0 — ms VDDIO rise to

CHIP_EN rise

CHIP_EN must not rise before VDDIO. CHIP_EN must

be driven high or low and must not be left floating.

ATWINC3400-MR210xA

Power Management

...........continued

Paramet

er Min. Max. Units Description Notes

tC5 — ms CHIP_EN rise to

RESETN rise

This delay is required to stabilize the XO clock before

RESETN removal. RESETN must be driven high or low

and must not be left floating.

tA’ 0 — ms VDDIO fall to VBAT

fall

VBAT and VDDIO must fall simultaneously or be

connected together. VBAT must not fall before VDDIO.

tB’ 0 — ms CHIP_EN fall to

VDDIO fall

VDDIO must not fall before CHIP_EN. CHIP_EN and

RESETN must fall simultaneously.

tC’ 0 — ms RESETN fall to

VDDIO fall

VDDIO must not fall before RESETN. RESETN and

CHIP_EN fall simultaneously.

5.4 Digital I/O Pin Behavior During Power-Up Sequences

The following table represents the digital I/O pin states corresponding to the device power modes.

Table 5-3. Digital I/O Pin Behavior in Different Device States

Device State VDDIO CHIP_EN RESETN Output Driver Input

Driver

Pull Up/Down

Resistor (96

kOhm)

Power_Down: core supply

OFF

High Low Low Disabled (Hi-Z) Disabled Disabled

Power-On Reset: core supply

and hard reset ON

High High Low Disabled (Hi-Z) Disabled Enabled

Power-On Default: core supply

ON, device out of reset and

not programmed

High High High Disabled (Hi-Z) Enabled Enabled

On_Doze/ On_Transmit/

On_Receive: core supply

ON, device programmed by

firmware

High High High Programmed by

firmware for

each pin:

enabled or

disabled

Opposite

of Output

Driver

state

Programmed by

firmware for each

pin: enabled or

disabled

ATWINC3400-MR210xA

Power Management

6. Clocking

6.1 Low-Power Clock

The ATWINC3400-MR210xA module requires an external 32.768 kHz clock to be supplied at the module pin 20. This

clock is used during the sleep operation. The frequency accuracy of this external clock must be within ±200 ppm.

ATWINC3400-MR210xA

Clocking

7. CPU and Memory Subsystem

7.1 Processor

The ATWINC3400-MR210xA module has two Cortus APS3 32-bit processors, one is used for Wi-Fi and the other

is used for Bluetooth. In IEEE 802.11 mode, the processor performs many of the MAC functions, including but

not limited to: association, authentication, power management, security key management and MSDU aggregation/de-

aggregation. In addition, the processor provides flexibility for various modes of operation, such as Station (STA) and

Access Point (AP) modes. In Bluetooth mode, the processor handles multiple tasks of the Bluetooth protocol stack.

7.2 Memory Subsystem

The APS3 core uses a 256 KB instruction/boot ROM (160 KB for IEEE 802.11 and 96 KB for Bluetooth) along with

a 420 KB instruction RAM (128 KB for IEEE 802.11 and 292 KB for Bluetooth), and a 128 KB data RAM (64 KB for

IEEE 802.11 and 64 KB for Bluetooth). In addition, the device uses a 160 KB shared/exchange RAM (128 KB for

IEEE 802.11 and 32 KB for Bluetooth), accessible by the processor and MAC, which allows the processor to perform

various data management tasks on the Tx and Rx data packets.

7.3 Nonvolatile Memory (eFuse)

The ATWINC3400-MR210xA modules have 768 bits of nonvolatile eFuse memory that can be read by the CPU after

a device reset. The eFuse is partitioned into six 128-bit banks (Bank 0 – Bank 5). Each bank has the same bit map

(see the following figure). The purpose of the first 108 bits in each bank is fixed, and the remaining 20 bits are

general-purpose software dependent bits, or reserved for future use. Currently, the Bluetooth address is derived from

the Wi-Fi MAC address such that the Bluetooth address = Wi-Fi MAC address + 1.

Note: If IQ Amp Used, IQ Amp Correction, IQ Pha Used, and IQ Pha Correction bit fields are programmed, Bank 0

and Bank 1 must not be programmed with any values, and only the Bank Invalid bit must be programmed.

This nonvolatile one-time-programmable (OTP) memory can be used for storing the following customer-specific

parameters:

• MAC address

• Calibration information (crystal frequency offset (XO offset) and so on)

• Other software-specific configuration parameters

Each bank can be programmed independently, which allows for several updates of the device parameters following

the initial programming. For example, if the MAC address is currently programmed in Bank 3, and to update the new

MAC address, perform the following steps:

1. Invalidate the contents of Bank 3 by programming the Bank Invalid bit field of Bank 3.

2. Program Bank 4 with the new MAC address along with the values of ADC Calib (if used in Bank 3), Frequency

Offset (from Bank 3), IQ Amp Correction (from Bank 3) and IQ Pha Correction (from Bank 3). The Used bit

field for each corresponding value bit field must also be programmed.

3. Validate the contents of Bank 4 by programming the Bank Used bit field of Bank 4.

Each bit field (i.e., MAC Address, ADC Calibration, Frequency Offset, IQ Amp Correction, and IQ Pha Correction) has

its corresponding Used bit field. Each Used bit field indicates to the firmware that the value in the related bit field is

valid. A value of '0' in the Used bit field indicates that the following bit field is invalid and a value of '1' programmed to

the Used bit field indicates that the corresponding bit field is valid and can be used by firmware.

By default, all the ATWINC3400-MR210xA modules are programmed with the MAC address, Frequency Offset bits,

IQ Amp and IQ Phase fields of Bank 3.

ATWINC3400-MR210xA

CPU and Memory Subsystem

Figure 7-1. Bitmap for ATWINC3400-MR210xA eFuse Bank

Width

Bit

1 1 3 2 1 48 1 7 1 15 1 13 201 13

Word

31 30 29:27 24 7 6:0 31 30:16 15 14:2 191 0 - 31:2023:0 31:826:25

Reserved

IQ Pha Correction

IQ Pha Used

IQ Amp Correction

IQ Amp Used

Freq Offset

Freq Offset Used

ADC Calib

ADC Calib Used

Mac Addr

Mac Addr Used

Reserved

Version

Bank Invalid

Bank Used

Word 0 Word 1 Word 2 Word 3

Note: The bit map has been updated with the IQ Amp Correction and IQ Pha Correction fields from firmware version

1.4 onwards. Earlier, these bit fields were reserved for future use. For customers using firmware older than 1.4, the

IQ Amp Correction and IQ Pha Correction bit fields will not be used by the firmware.

The matrix table below provides details on how different versions of the firmware would handle the IQ Amp Used, IQ

Amp Correction, IQ Pha Used and IQ Pha Correction bit fields during Initialization.

Firmware Version

Used by

Customer

IQ Amp Used and IQ Pha Used Bit Status

Device with IQ Amp Used and IQ Pha Used

Bits with Value ‘1’

Device with IQ Amp Used and IQ Pha

Used Bits with Value ‘0’

1.4 or later The firmware loads the IQ calibration values

from the IQ Amp Correction and IQ Pha

Correction bit fields of the corresponding eFuse

bank and proceeds with Initialization.

The firmware ignores the values in the IQ

Amp Correction and IQ Pha Correction bit

fields and proceeds with Initialization.

Prior to 1.4 The firmware does not check for the IQ Amp Used and IQ Pha Used bit fields and proceeds

with Initialization.

ATWINC3400-MR210xA

CPU and Memory Subsystem

8. WLAN Subsystem

The WLAN subsystem is composed of the Media Access Controller (MAC), Physical Layer (PHY) and the radio.

8.1 MAC

The ATWINC3400-MR210xA module is designed to operate at low power, while providing high data throughput. The

IEEE 802.11 MAC functions are implemented with a combination of dedicated datapath engines, hardwired control

logic and a low power, high-efficiency microprocessor. The combination of dedicated logic with a programmable

processor provides optimal power efficiency and real-time response while providing the flexibility to accommodate

evolving standards and future feature enhancements.

The dedicated datapath engines are used to implement datapath functions with heavy computational requirements.

For example, a Frame Check Sequence (FCS) engine checks the Cyclic Redundancy Check (CRC) of the

transmitting and receiving packets, and a cipher engine performs all the required encryption and decryption

operations for the WEP, WPA-TKIP and WPA2 CCMP-AES security requirements.

Control functions, which have real-time requirements, are implemented using hardwired control logic modules.

These logic modules offer real-time response while maintaining configurability through the processor. Examples

of hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX

control, interframe spacing and so on), protocol timer module (responsible for the Network Access vector, back-off

timing, timing synchronization function and slot management), MAC Protocol Data Unit (MPDU) handling module,

aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block

communication) and TX/RX control Finite State Machine (FSM) (coordinates data movement between PHY and MAC

interface, cipher engine and the Direct Memory Access (DMA) interface to the TX/RX FIFOs).

The following are the characteristics of the MAC functions implemented solely in the software on the microprocessor:

• Functions with high memory requirements or complex data structures. Examples include association table

management and power save queuing.

• Functions with low computational load or without critical real-time requirements. Examples include

authentication and association.

• Functions that require flexibility and upgradeability. Examples include beacon frame processing and QoS

scheduling.

Features

The ATWINC3400-MR210xA MAC supports the following functions:

• IEEE 802.11b/g/n

• IEEE 802.11e WMM QoS EDCA/HCCA/PCF multiple access categories traffic scheduling

• Advanced IEEE 802.11n features:

– Transmission and reception of aggregated MPDUs (A-MPDU)

– Transmission and reception of aggregated MSDUs (A-MSDU)

– Immediate block acknowledgment

– Reduced Interframe Spacing (RIFS)

• IEEE 802.11i and WFA security with key management:

– WEP 64/128

– WPA-TKIP

– 128-bit WPA2 CCMP (AES)

• Advanced power management:

– Standard IEEE 802.11 power save mode

• RTS-CTS and CTS-self support

• Either STA or AP mode in the infrastructure basic service set mode

ATWINC3400-MR210xA

WLAN Subsystem

8.2 PHY

The ATWINC3400-MR210xA module WLAN PHY is designed to achieve the reliable and power-efficient physical

layer communication specified by the IEEE 802.11 b/g/n in single stream mode with 20 MHz bandwidth. The

advanced algorithms are used to achieve maximum throughput in a real-world communication environment with

impairments and interference. The PHY implements all the required functions such as Fast Fourier Transform (FFT),

filtering, Forward Error Correction (FEC) that is a Viterbi decoder, frequency, timing acquisition and tracking, channel

estimation and equalization, carrier sensing, clear channel assessment and automatic gain control.

Features

The IEEE 802.11 PHY supports the following functions:

• Single antenna 1x1 stream in 20 MHz channels

• Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5 and 11 Mbps

• Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48 and 54 Mbps

• Supports IEEE 802.11n HT modulations MCS0-7, 20 MHz, 800 and 400 ns guard interval: 6.5, 7.2, 13.0, 14.4,

19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0 and 72.2 Mbps(1)

• IEEE 802.11n mixed mode operation

• Per packet TX power control

• Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery and frame

detection

Note:

1. Short GI is currently not supported by the firmware. The data sheet will be updated when the feature is

supported.

8.3 Radio

This section presents information describing the properties and characteristics of the ATWINC3400-MR210xA and

Wi-Fi radio transmit and receive performance capabilities of the device.

The performance measurements are taken at the RF pin assuming 50Ω impedance; the RF performance is ensured

for a room temperature of 25oC with a derating of 2-3 dB at the boundary conditions.

The measurements were taken under typical conditions: VBATT = 3.3V; VDDIO = 3.3V; temperature: +25ºC

Table 8-1. Features and Properties

Feature Description

Part Number ATWINC3400-MR210xA

WLAN Standard IEEE 802.11 b/g/n, Wi-Fi Compliant

Host Interface SPI

Dimension 22.4 x 14.7 x 2.0 mm

Frequency Range 2.412 GHz ~ 2.472 GHz (2.4 GHz ISM Band)

Number of Channels 11 for North America and 13 for Europe and Japan

Modulation 802.11b: DQPSK, DBPSK, CCK

802.11g/n: OFDM /64-QAM,16-QAM, QPSK, BPSK

Data Rate 802.11b: 1, 2, 5.5, 11 Mbps

802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

Data Rate

(20 MHz, normal GI, 800 ns)

802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps

ATWINC3400-MR210xA

WLAN Subsystem

...........continued

Feature Description

Data Rate

(20 MHz, short GI, 400 ns)(1)

802.11n: 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2 Mbps

Operating Temperature -40 to +85oC

Note:

1. Currently, short GI is not supported by the firmware. The data sheet will be updated when the feature is

supported.

ATWINC3400-MR210xA

WLAN Subsystem

9. Bluetooth Low Energy

The Bluetooth subsystem implements all the mission critical real-time functions. It encodes/decodes HCI packets,

constructs baseband data packages; and manages and monitors the connection status, slot use, data flow, routing,

segmentation and buffer control. The Bluetooth subsystem supports Bluetooth Low Energy modes of operation.

The following advanced low energy applications are supported:

• Smart energy

• Consumer wellness

• Home automation

• Security

• Proximity detection

• Entertainment

• Sports and fitness

• Automotive

Coexistence Mechanism

The ATWINC3400-MR210xA supports simultaneous use of both Bluetooth Low Energy and Wi-Fi via a coexistence

mechanism that allows the protocols to share the same radio. The radio defaults to Wi-Fi use until a Bluetooth Low

Energy event occurs (such as connection or advertising), in which case the radio is gracefully switched over for

Bluetooth Low Energy use. For the duration of the Bluetooth Low Energy event, the radio is switched back and forth

between Wi-Fi and Bluetooth Low Energy, as demanded by the Bluetooth Low Energy activity, before returning to

Wi-Fi until the next Bluetooth Low Energy event.

ATWINC3400-MR210xA

Bluetooth Low Energy

10. External Interfaces

The ATWINC3400-MR210CA external interfaces include:

• I2C for debugging

• SPI for control and data transfer

• UART for debugging

• General Purpose Input/Output pins(1)

Note:

1. Usage of the GPIO functionality is not supported by the ATWINC3400 firmware. The data sheet will be

updated once the support for this feature is added.

10.1 Interfacing with the Host Microcontroller

This section describes interfacing the ATWINC3400-MR210xA module with the host microcontroller. The interface is

comprised of a client SPI and additional control signals, as shown in the following figure. For more information on SPI

interface specification and timing, refer to the SPI Interface. Additional control signals are connected to the GPIO/IRQ

interface of the microcontroller.

Figure 10-1. Interfacing with Host Microcontroller

Host

Microcontroller

CHIP_EN

RESET

IRQN

SPI

Wi-Fi Controller

Module

Table 10-1. Host Microcontroller Interface Pins

Pin Number Pin Name

7 RESETN

33 IRQN

19 CHIP_EN

25 SPI_SSN

26 SPI_MOSI

24 SPI_MISO

ATWINC3400-MR210xA

External Interfaces

...........continued

Pin Number Pin Name

23 SPI_SCK

10.2 SPI Client Interface

10.2.1 Overview

The ATWINC3400-MR210xA has a Serial Peripheral Interface (SPI) that operates as an SPI client. The SPI interface

can be used for control and for serial I/O of 802.11 and Bluetooth Low Energy data. The SPI pins are mapped as

shown in the following table. The SPI is a full-duplex, client-synchronous serial interface that is available immediately

following a Reset when pin 2 (SPI_CFG) is tied to VDDIO.

Table 10-2. SPI Interface Pin Mapping

Pin # SPI function

2 CFG: Must be tied to VDDIO

25 SSN: Active-Low Client Select

26 MOSI(RXD): Serial Data Receive

23 SCK: Serial Clock

24 MISO(TXD): Serial Data Transmit

When the SPI is not selected, that is, when the SSN is high, the SPI interface will not interfere with data transfers

between the serial-host and other serial-client devices. When the serial-client is not selected, its transmitted data

output is buffered, resulting in a high impedance drive onto the MISO line.

The SPI interface responds to a protocol that allows an external host to read or write any register in the chip, as well

as, initiate DMA transfers.

The SPI SSN, MOSI, MISO and SCK pins of the ATWINC3400-MR210xA have internal programmable pull-up

resistors. These resistors must be programmed to be disabled; otherwise, if any of the SPI pins are driven to a low

level while the ATWINC3400-MR210xA is in the low-power sleep state, the current will flow from the VDDIO supply

through the pull-up resistors, increasing the current consumption of the module.

10.2.2 SPI Timing

The SPI Client interface supports four standard modes as determined by the Clock Polarity (CPOL) and Clock Phase

(CPHA) settings. These modes are illustrated in the following table and figure.

Table 10-3. SPI Client Modes

Mode CPOL CPHA

0 0 0

1 0 1

2 1 0

3 1 1

Note: The ATWINC3400-MR210xA firmware uses “SPI MODE 0” to communicate with the host.

The red lines in the following figure correspond to Clock Phase = 0 and the blue lines correspond to Clock Phase = 1.

ATWINC3400-MR210xA

External Interfaces

Figure 10-2. SPI Client Clock Polarity and Clock Phase Timing

z z

SCK

CPOL = 0

CPOL = 1

SSN

RXD/TXD

(MOSI/MISO)

CPHA = 0

CPHA = 1

2 3 4 5 6 7 8

1 2 3 4 5 6 7

The SPI timing is provided in the following figure and table.

Figure 10-3. SPI Timing Diagram (SPI Mode CPOL = 0, CPHA = 0)

tLH

SCK

TXD

RXD

tWH

tHL

tWL

tODLY

tISU tIHD

fSCK

SSN

tSUSSN tHDSSN

Table 10-4. SPI Client Timing Parameters(

Parameter Symbol Min. Max. Units

Clock Input Frequency(2) fSCK — 48 MHz

ATWINC3400-MR210xA

External Interfaces

...........continued

Parameter Symbol Min. Max. Units

Clock Low Pulse Width tWL 4 —

Clock High Pulse Width tWH 5 —

Clock Rise Time tLH 0 7

Clock Fall Time tHL 0 7

TXD Output Delay(3) tODLY 4 9 from SCK fall

RXD Input Setup Time tISU 1 —

RXD Input Hold Time tIHD 5 —

SSN Input Setup Time tSUSSN 3 —

SSN Input Hold Time tHDSSN 5.5 —

Notes:

1. The timing is applicable to all SPI modes.

2. The maximum clock frequency specified is limited by the SPI Client interface internal design; the actual

maximum clock frequency can be lower and depends on the specific PCB layout.

3. The timing is based on 15 pF output loading. Under all conditions, tLH + tWH + tHL + tWL must be less than or

equal to 1/ fSCK.

10.3 UART Interface

The ATWINC3400-MR210xA supports the Universal Asynchronous Receiver/Transmitter (UART) interface. Wi-Fi and

Bluetooth Low Energy interfaces must be used for debug purposes only. Wi-Fi UART pins are available on pins 16

(TXD) and 17 (RXD). Bluetooth Low Energy UART pins are available on pins 8 (TXD) and 9 (RXD). The UART is

compatible with the RS-232 standard.

The default configuration for accessing the Wi-Fi UART interface of the ATWINC3400-MR210xA is mentioned below:

• Baud rate: 460800

• Data: 8-bit

• Parity: None

• Stop bit: 1-bit

• Flow control: None

It also has RX and TX FIFOs, which ensure reliable high-speed reception and low software overhead transmission.

FIFO size is 4 x 8 for both RX and TX direction. The UART also has status registers showing the number of received

characters available in the FIFO and various error conditions, as well as, the ability to generate interrupts based on

these status bits.

An example of the UART receiving or transmitting a single packet is shown in the following figure. This example

shows 7-bit data (0x45), odd parity and two stop bits.

Figure 10-4. Example of UART RX of TX Packet

Packets or

Leading

Idle Bits

Current Packet

Data

Start

Bit

Parity

Bit Stop Bits

Packet

ATWINC3400-MR210xA

External Interfaces

10.4 I2C Client Interface

The I2C client interface is a two-wire serial interface consisting of a serial data line (SDA) on module Pin 10 and a

serial clock line (SCL) on module Pin 11. This interface is used for debugging of ATWINC3400-MR210xA modules.

The I2C client responds to the seven bit address value 0x60. The ATWINC3400-MR210xA I2C supports I2C bus

version 2.1 - 2000 and can operate in Standard mode (with data rates up to 100 Kb/s) and Fast mode (with data rates

up to 400 Kb/s).

Note: For specific information on I2C bus, refer to Philips Specification entitled “The I2C-Bus Specification, Version

2.1”. The I2C client is a synchronous serial interface. The SDA line is a bidirectional signal and changes only

while the SCL line is low, except for STOP, START, and RESTART conditions. The output drivers are open-drain to

perform wire-AND functions on the bus. The maximum number of devices on the bus is limited by only the maximum

capacitance specification of 400 pF. Data is transmitted in byte packages.

10.4.1 I2C Client Timing

The I2C Client timing diagram for the ATWINC3400-MR210xA module is shown in the following figure.

Figure 10-5. I2C Client Timing Diagram

The following table provides the I2C Client timing parameters for the ATWINC3400-MR210xA module.

Table 10-5. I2C Client Timing Parameters

Parameter Symbol Min. Max. Units Remarks

SCL Clock Frequency fSCL 0 400 kHz —

SCL Low Pulse Width tWL 1.3 —

µs

—

SCL High Pulse Width tWH 0.6 — —

SCL, SDA Fall Time tHL — 300

—

SCL, SDA Rise Time tLH — 300 This is dictated by external

components

START Setup Time tSUSTA 0.6 —

µs

—

START Hold Time tHDSTA 0.6 — —

SDA Setup Time tSUDAT 100 — ns —

SDA Hold Time tHDDAT

0 — ns Client and Host Default

40 — µs Host Programming Option

ATWINC3400-MR210xA

External Interfaces

...........continued

Parameter Symbol Min. Max. Units Remarks

STOP Setup Time tSUSTO 0.6 —

µs

—

Bus Free Time Between STOP

and START tBUF 1.3 — —

Glitch Pulse Reject tPR 0 50 ns —

ATWINC3400-MR210xA

External Interfaces

11. Application Reference Design

The ATWINC3400-MR210xA module application schematics for different supported host interfaces are shown in this

section.

11.1 Host Interface

Figure 11-1. ATWINC3400-MR210xA Reference Schematic

Note: It is recommended to add test points for module pins J8, J9, J10, J11, J16 and J17 in the design.

The following table provides the reference Bill of Material (BoM) details for the ATWINC3400-MR210xA module with

SPI as host interface.

Table 11-1. ATWINC3400-MR210xA Reference Bill of Materials for SPI Operation

Item Quantity Referenc

Value Description Manufacturer Part Number Footprint

1 1 U1 ATWINC3400-

MR210xA

Wi-Fi/

Bluetooth/BLE

Combo Module

Microchip

Technology

Inc.®

ATWINC3400

-MR210xA

Custom

2 1 U2 ASH7KW-32.76

8kHZ-L-T

Oscillator,

32.768 kHz,

+0/-175 ppm,

1.2V - 5.5V,

-40°C - +85°C

Abracon®

Corporation

ASH7KW-32.

768kHZ-L-T

OSCCC320

X150X100-4

ATWINC3400-MR210xA

Application Reference Design

...........continued

Item Quantity Referenc

Value Description Manufacturer Part Number Footprint

3 1 R1 1M RESISTOR,

Thick Film, 1

MOhm, 0201

Panasonic®ERJ-1GEJ10

RS0201

4 13 R2-R14 0 RESISTOR,

Thick Film, 0

Ohm, 0201

Panasonic®ERJ-1GN0R0

RS0201

ATWINC3400-MR210xA

Application Reference Design

12. Module Outline Drawings

The ATWINC3400-MR210xA module package details are outlined in the following figure.

Figure 12-1. ATWINC3400-MR210CA Footprint and Module Package Drawings - Top, Bottom and Side View

TOP VIEW

SIDE VIEW

BOTTOM VIEW

4.40

5.21

6.13

0.94

1.346

1.341

1.981

22.428

14.732

1.204 PITCH

1.204

PITCH

0.787

1.30

THIS PAD MUST BE

SOLDERED TO GROUND

25 36

13 1

25 26 27 28 29 30 31 32 33 34 35 36

13 12 11 10 9 8 7 6 5 4 3 2 1

2.09

METAL SHIELD

ANTENNA

ATWINC3400-MR210xA

Module Outline Drawings

Figure 12-2. ATWINC3400-MR210CA Module Package Drawings - 3D View and Recommended Land Pattern

RECOMMENDED LAND PATTERN

1.985

12.045

25 36

13 1

SILK

SCREEN

22.428

EDGE OF

PC BOARD

4.400

13.244

6.128

5.118

5.214

14.732

1.204

PITCH

0.813

1.880

RECOMMENDED LAND PATTERN

1.985

12.045

25 36

13 1

SILK

SCREEN

22.428

EDGE OF

PC BOARD

4.400

13.244

6.128

5.118

5.214

14.732

1.204

PITCH

0.813

1.880

ATWINC3400-MR210xA

Module Outline Drawings

Figure 12-3. ATWINC3400-MR210UA Footprint and Module Package Drawings - Top, Bottom and Side View

TOP VIEW

SIDE VIEW

BOTTOM VIEW

4.40

5.21

6.13

0.94

1.346

1.341

1.981

22.428

14.732

1.204 PITCH

1.204

PITCH

0.787

1.30

THIS PAD MUST BE

SOLDERED TO GROUND

25 36

13 1

25 26 27 28 29 30 31 32 33 34 35 36

13 12 11 10 9 8 7 6 5 4 3 2 1

2.09

METAL

SHIELD

RF CONNECTOR 3.64

2.72

ATWINC3400-MR210xA

Module Outline Drawings

Figure 12-4. ATWINC3400-MR210UA Module Package Drawings - 3D View and Recommended Land Pattern

RECOMMENDED LAND PATTERN

1.985

12.045

25 36

13 1

SILK

SCREEN

22.428

EDGE OF

PC BOARD

4.400

13.244

6.128

5.118

5.214

14.732

1.204

PITCH

0.813

1.880

Notes:

1. Dimensions are in mm.

2. Having a 5x5 grid of GND vias solidly connecting the exposed GND paddle of the module to the ground plane

on the inner/other layers of the host board is recommended. This will provide a good ground and thermal

transfer for the ATWINC3400-MR210xA module.

ATWINC3400-MR210xA

Module Outline Drawings

13. Design Considerations

This chapter provides the guidelines on module placement and routing to achieve the best performance.

13.1 ATWINC3400-MR210CA

13.1.1 ATWINC3400-MR210CA Module Placement and Routing Guidelines

It is critical to follow the recommendations listed below to achieve the best RF performance:

• The module must be placed on the host board and the chip antenna area must not overlap with the host board.

The following figure on placement reference shows the best, poor and worst case module placements in the

host board.

Figure 13-1. ATWINC3400-MR210CA Placement Example

CAUTION

Do not place the module in the middle of the host board or far away from the host board edge.

• Follow the host board mechanical recommendation, ground plane and keepout recommendations, as shown in

the following figure. Module chip antenna is specifically tuned for this host board mechanical recommendation,

as shown in the following figure. The host PCB must have a thickness of 1.5 mm.

– Follow the module placement and keepout recommendation, as shown in the following figure.

• Avoid routing any traces on the top layer of the host board, which is directly below the module area.

• In the keepout region, there must be no copper traces in all signal layers.

• Avoid placing any components (like mechanical spacers, bumpon and so on) on the host board close

to the chip antenna region.

• Place the GND polygon pour below the module on the top layer of the host board. Avoid breaks in this

GND plane and ensure continuous GND plane for better RF performance.

ATWINC3400-MR210xA

Design Considerations

• The GND polygon pour in the top layer of the host board must have a minimum area of 20 x 40 mm.

• Place sufficient GND vias on the host board edge and below the module for better RF performance.

• Having a 5 x 5 grid of GND vias solidly connecting the exposed GND paddle of the module to

the ground plane of the host board is recommended. This will act as a good ground and thermal

conduction path for the ATWINC3400-MR210CA module. The GND vias must have a minimum via

hole size of 0.2 mm.

• The antenna on the module must not be placed in direct contact or close proximity to plastic casing/

objects. Keep a minimum clearance of > 7 mm in all directions around the chip antenna.

Figure 13-2. ATWINC3400-MR210CA Best Case Placement Reference Example

13.1.2 ATWINC3400-MR210CA Antenna Performance

The ATWINC3400-MR210CA uses a chip antenna, which is fed via matching network. The table below lists the

technical specification of the chip antenna.

Table 13-1. Chip antenna specification

Parameter Value

Peak gain 0.5 dBi

Operating frequency 2400 – 2500 MHz

Antenna P/N 2450AT18A100

Antenna vendor Johanson Technology Inc.

13.1.2.1 Radiation Pattern

Following figures illustrate the antenna radiation pattern measured for the ATWINC3400-MR210CA module mounted

in the ATWINC3400-Xpro evaluation kit. During the measurement, the module is placed in the XZ plane with Y axis

being perpendicular to the module and pointing to the front of the module.

ATWINC3400-MR210xA

Design Considerations

Figure 13-3. Antenna Radiation Pattern - XY Plane

Figure 13-4. Antenna Radiation Pattern - ZY Plane

Figure 13-5. Antenna Radiation Pattern - ZX Plane

ATWINC3400-MR210xA

Design Considerations

13.2 ATWINC3400-MR210UA External Antenna Connector

13.2.1 ATWINC3400-MR210UA Module Placement and Routing Guidelines

The ATWINC3400-MR210UA module has an Ultra Small Miniature RF Connector (u.FL) for the external antenna.

The choice of antenna is limited to the antenna types for which the module was tested and approved. For a list of

tested and approved antennas that may be used with the module, refer to the respective country in the Regulatory

Approval section.

An approved list of external antennas tested and certified with the ATWINC3400-MR210UA module is shown in

13.2.2 ATWINC3400-MR210UA Approved External Antennas.

It is critical to follow the recommendations listed below to achieve the best RF performance:

• Avoid routing any traces on the top layer of the host board, which is directly below the module area.

• Place the GND polygon pour below the complete module area. Do not have any breaks in this GND plane.

• Place sufficient GND vias in the GND polygon pour below the module area for better RF performance.

• Having a 3 x 3 grid of GND vias solidly connecting the exposed GND paddle of the module to the inner layer

ground plane of the host board is recommended. This will act as a good ground and thermal conduction path for

the ATWINC3400-MR210UB module. The GND vias must have a minimum via hole size of 0.3 mm.

• Keep large metal objects away from the external antenna to avoid electromagnetic field blocking.

• Make sure the width of the traces routed to GND, VDDIO and VBAT rails are sufficiently larger for handling the

peak TX current consumption.

13.2.1.1 Antenna Placement Recommendations for ATWINC3400-MR210UA

The following recommendations must be applied for the placement of antenna and its cable:

• The antenna cable must not be routed over circuits generating electrical noise on the host board or alongside or

underneath the module. It is preferable that the cable be routed straight out of the module.

• The antenna must not be placed in direct contact or in close proximity of the plastic casing/objects.

– Do not enclose the antenna within a metal shield.

• Keep any components that may radiate noise, signals or harmonics within the 2.4 GHz to 2.5 GHz frequency

band away from the antenna and, if possible, shield those components. Any noise radiated from the host board

in this frequency band degrades the sensitivity of the module.

• It is recommended that the antenna be placed at a distance greater than 5 cm away from the module. The

following figure shows the antenna keepout area; the antenna must not be placed in this area.

• This recommendation is based on an open-air measurement and does not take into account any metal shielding

of the customer end product. When a metal enclosure is used, the antenna can be located closer to the

ATWINC3400-MR210UA module.

• The drawing provides an option for routing the antenna cable depending on the location of the antenna with

respect to the ATWINC3400-MR210UA PCB. There are two possible options for the optimum routing of the

cable.

ATWINC3400-MR210xA

Design Considerations

Figure 13-6. Antenna Placement Guideline

Note: These guidelines are generic and it is recommended that customers check and fine-tune the antenna

positioning in the final host product based on RF performance.

13.2.2 ATWINC3400-MR210UA Approved External Antennas

The ATWINC3400-MR210UA module is approved for use with the antennas listed in the following table. It is

permissible to use a different antenna, provided the antenna is of the same type, gain (equal or less than), and

has similar in-band and out-of-band characteristics are present (refer to specification sheet for cutoff frequencies).

If other antenna types are used, the OEM installer must conduct the necessary assessments and authorize

the antenna with respective regulatory agencies and ensure compliance. For more details on the corresponding

regulatory approval sections, 14. Appendix A: Regulatory Approval.

Table 13-2. List of Approved External Antennas

List Items Part Number Manufacturer Antenna Gain at 2.4

GHz band

Antenna type

1 RFA-02-P33 Aristotle 2 PCB

2 RFA-02-D3 Aristotle 2 Dipole

ATWINC3400-MR210xA

Design Considerations

...........continued

List Items Part Number Manufacturer Antenna Gain at 2.4

GHz band

Antenna type

3 RFA-02-L2H1 Aristotle 2 Dipole

4 RFA-02-P05 Aristotle 2 PCB

5 RFA-02-C2M2 Aristotle 2 Dipole

6 W3525B039 Pulse Electronics 2 PCB

7 RFDPA870920IMLB3

WALSIN 1.84 Dipole

8 RN-SMA-S Microchip 0.56 Dipole

Notes:

1. If the end-product using the module is designed to have an antenna port that is accessible to the end user,

then the unique antenna connector (permissible by FCC) must be used (for example, Reverse Polarity (RP)-

SMA).

2. If an RF coaxial cable is used between the module RF output and the enclosure, then the unique antenna

connector must be used in the enclosure wall to interface with an antenna.

3. Contact the antenna vendor for detailed antenna specifications to review suitability to end-product operating

environment and to identify alternatives.

13.3 Reflow Profile Information

For information on the reflow process guidelines, refer to the “Solder Reflow Recommendation” Application Note

(AN233).

13.4 Module Assembly Considerations

The ATWINC3400-MR210xA module is assembled with an EMI shield to ensure compliance with EMI emission and

immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically sealed. Solutions such as

IPA and similar solvents can be used to clean this module. Cleaning solutions containing acid must never be used on

the module.

13.5 Conformal Coating

The modules are not intended for use with a conformal coating and the customer assumes all risks (such as the

module reliability, performance degradation and so on) if a conformal coating is applied to the modules.

ATWINC3400-MR210xA

Design Considerations

14. Appendix A: Regulatory Approval

The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have received regulatory approval for the

following countries:

• ATWINC3400-MR210CA

– United States/FCC ID: 2ADHKWINC3400

– Canada/ISED:

• IC: 20266-ATWINC3400

• HVIN: ATWINC3400-MR210CA

• PMN: Wi-Fi and Bluetooth Module

– Europe/CE

– Japan/MIC: 005-101794

– Korea/KCC: R-CRM-mcp-WINC3400MR210C

– Taiwan/NCC: CCAN18LP0450T0

– China/SRRC: CMIIT ID: 2018DJ2733

• ATWINC3400-MR210UA

– United States/FCC ID: 2ADHKWINC3400U

– Canada/ISED:

• IC: 20266-WINC3400UA

• HVIN: ATWINC3400-MR210UA

• PMN: ATWINC3400-MR210UA

– Europe/CE

Gain Table for Individual Regulatory Region

The ATWINC3400-MR210CA module has received regulatory approvals for many regions in the world, namely

United States/FCC, Canada/ISED, Europe/CE, Japan/MIC, Korea/KCC, Taiwan/NCC, and China/SRRC. The

ATWINC3400-MR210UA module has received regulatory approvals for United States/FCC, Canada/ISED and

Europe/CE.

The default firmware uses a common gain table that meets IEEE 802.11 specifications, and regulatory region limits

for both ATWINC3400-MR210CA and ATWINC3400-MR210UA as noted above. In some cases, the output power

is reduced by limits of regulatory region with stringent transmit power limits. To optimize performance, and if end

products’ destination is known, the specific gain table for that region can be optionally embedded into the firmware.

The regulatory region certified gain table for individual regulatory region is available on ATWINC3400-MR210CA and

ATWINC3400-MR210UA product page. Customers can update the gain table in firmware by following the instructions

in section 6. Updating Application Gain Table into WINC3400 of ATWINC3400 – Deriving Application Gain Table

Application Note

14.1 United States

The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have received Federal Communications

Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” single-modular approval

in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a

complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate

compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed

in different end-use products (referred to as a host, host product or host device) by the grantee or other equipment

manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter

function provided by that specific module or limited module device.

The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating

conditions necessary for compliance.

A host product itself is required to comply with all other applicable FCC equipment authorization regulations,

requirements, and equipment functions that are not associated with the transmitter module portion. For example,

ATWINC3400-MR210xA

Appendix A: Regulatory Approval

compliance must be demonstrated: to regulations for other transmitter components within a host product; to

requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio

receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter

module (i.e., Suppliers Declaration of Conformity (SDoC) or certification) as appropriate (e.g., Bluetooth and Wi-Fi

transmitter modules may also contain digital logic functions).

14.1.1 Labeling and User Information Requirements

The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have been labeled with its own FCC ID number,

and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished

product into which the module is installed must display a label referring to the enclosed module. This exterior label

must use the following wording:

• For ATWINC3400-MR210CA

Contains Transmitter Module FCC ID: 2ADHKWINC3400

Contains FCC ID: 2ADHKWINC3400

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

• For ATWINC3400-MR210UA

Contains Transmitter Module FCC ID: 2ADHKWINC3400U

Contains FCC ID: 2ADHKWINC3400U

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

The user's manual for the finished product must include the following statement:

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part

15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed

and used in accordance with the instructions, may cause harmful interference to radio communications. However,

there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful

interference to radio or television reception, which can be determined by turning the equipment off and on, the user

is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna

• Increase the separation between the equipment and receiver

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected

• Consult the dealer or an experienced radio/TV technician for help

Additional information on labeling and user information requirements for Part 15 devices can be found in KDB

Publication 784748, which is available at the FCC Office of Engineering and Technology (OET) Laboratory Division

Knowledge Database (KDB) apps.fcc.gov/oetcf/kdb/index.cfm.

ATWINC3400-MR210xA

Appendix A: Regulatory Approval

14.1.2 RF Exposure

All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure

Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations

or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal

Communications Commission (FCC).

From the FCC Grant: Output power listed is conducted. This transmitter is restricted for use with the specific

antenna(s) tested in this application for Certification.

The antenna(s) used with this transmitter must be installed to provide a separation distance of at least 6.5 cm from

all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Users and

installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying

RF exposure compliance.

14.1.3 Approved External Antennas

To maintain modular approval in the United States, only the antenna types that have been tested shall be used. It

is permissible to use different antenna, provided the same antenna type, antenna gain (equal to or less than), with

similar in-band and out-of band characteristics (refer to specification sheet for cutoff frequencies).

For ATWINC3400-MR210CA, the approval is received using the integral chip antenna.

For ATWINC3400-MR210UA, approved antennas are listed in the table 13.2.2 ATWINC3400-MR210UA Approved

External Antennas.

14.1.4 Helpful Web Sites

• Federal Communications Commission (FCC): www.fcc.gov.

• FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) apps.fcc.gov/

oetcf/kdb/index.cfm.

14.2 Canada

The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have been certified for use in Canada under

Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio Standards

Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits

the installation of a module in a host device without the need to recertify the device.

14.2.1 Labeling and User Information Requirements

Labeling Requirements (from RSP-100 - Issue 12, Section 5): The host product shall be properly labeled to identify

the module within the host device.

The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible

at all times when installed in the host device; otherwise, the host product must be labeled to display the Innovation,

Science and Economic Development Canada certification number of the module, preceded by the word “Contains” or

similar wording expressing the same meaning, as follows:

• For ATWINC3400-MR210CA

Contains IC: 20266-ATWINC3400

• For ATWINC3400-MR210UA

Contains IC: 20266-WINC3400UA

User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 5, March 2019): User

manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location

in the user manual or alternatively on the device or both:

ATWINC3400-MR210xA

Appendix A: Regulatory Approval

This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and

Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two

conditions:

(1) This device may not cause interference;

(2) This device must accept any interference, including interference that may cause undesired operation of

the device.

L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR

d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts

de licence. L’exploitation est autorisée aux deux conditions suivantes:

1. L’appareil ne doit pas produire de brouillage;

2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en

compromettre le fonctionnement.

Transmitter Antenna (From Section 6.8 RSS-GEN, Issue 5, March 2019): User manuals, for transmitters shall display

the following notice in a conspicuous location:

This radio transmitter [IC: 20266-ATWINC3400 and IC: 20266-WINC3400UA] has been approved by

Innovation, Science and Economic Development Canada to operate with the antenna types listed below,

with the maximum permissible gain indicated. Antenna types not included in this list that have a gain

greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.

Le présent émetteur radio [IC: 20266-ATWINC3400 and IC: 20266-WINC3400UA] a été approuvé par

Innovation, Sciences et Développement économique Canada pour fonctionner avec les types d'antenne

énumérés cidessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste,

et dont le gain est supérieur au gain maximal indiqué pour tout type figurant sur la liste, sont strictement

interdits pour l'exploitation de l'émetteur.

Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use

with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each.

14.2.2 RF Exposure

All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must comply with RF

exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication

Apparatus (All Frequency Bands).

This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not

be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in

accordance with Canada multi-transmitter product procedures.

The installation of the transmitter must ensure that the antenna has a separation distance of at least 6.5 cm from all

persons or compliance must be demonstrated according to the ISED SAR procedures.

14.2.3 Approved Antenna Types

For the ATWINC3400-MR210CA, the approval is received using the integral chip antenna.

For the ATWINC3400-MR210UA, approved antennas are listed in the table 13.2.2 ATWINC3400-MR210UA

Approved External Antennas.

14.2.4 Helpful Web Sites

Innovation, Science and Economic Development Canada (ISED): www.ic.gc.ca/.

ATWINC3400-MR210xA

Appendix A: Regulatory Approval

14.3 Europe

The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules is/are a Radio Equipment Directive (RED)

assessed radio module that is CE marked and has been manufactured and tested with the intention of being

integrated into a final product.

The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules has/have been tested to RED 2014/53/EU

Essential Requirements mentioned in the following European Compliance table.

Table 14-1. European Compliance

Certification Standards Article

Safety EN 62368 3.1a

Health EN 62311

EMC EN 301 489-1 3.1b

EN 301 489-17

Radio EN 300 328 3.2

The ETSI provides guidance on modular devices in the “Guide to the application of harmonised standards

covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and non-

radio equipment” document available at http://www.etsi.org/deliver/etsi_eg/203300_203399/20 3367/01.01.01_60/

eg_203367v010101p.pdf.

Note: To maintain conformance to the standards listed in the preceding European Compliance table, the module

shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When

integrating a radio module into a completed product, the integrator becomes the manufacturer of the final product and

is therefore responsible for demonstrating compliance of the final product with the essential requirements against the

RED.

14.3.1 Labeling and User Information Requirements

The label on the final product that contains the ATWINC3400-MR210CA and ATWINC3400-MR210UA modules must

follow CE marking requirements.

14.3.2 Conformity Assessment

From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio product:

If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent

assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to

the installation instructions for the radio product, then no additional assessment of the combined equipment against

article 3.2 of the RED is required.

14.3.2.1 Simplified EU Declaration of Conformity

Hereby, Microchip Technology Inc. declares that the radio equipment type ATWINC3400-MR210xA is in compliance

with Directive 2014/53/EU.

The full text of the EU declaration of conformity for this product is available at www.microchip.com/ATWINC3400

(available under Documents > Certifications).

14.3.3 Approved Antenna Types

For the ATWINC3400-MR210CA, the approval is received using the integral chip antenna.

For the ATWINC3400-MR210UA, approved antennas are listed in the table 13.2.2 ATWINC3400-MR210UA

Approved External Antennas.

14.3.4 Helpful Websites

A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is

the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from

the European Communications Committee (ECC) at: http://www.ecodocdb.dk/.

ATWINC3400-MR210xA

Appendix A: Regulatory Approval

Additional helpful web sites are:

• Radio Equipment Directive (2014/53/EU):

https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en

• European Conference of Postal and Telecommunications Administrations (CEPT):

http://www.cept.org

• European Telecommunications Standards Institute (ETSI):

http://www.etsi.org

• The Radio Equipment Directive Compliance Association (REDCA):

http://www.redca.eu/

14.4 Japan

The ATWINC3400-MR210CA module has/have received type certification and is required to be labeled with its own

technical conformity mark and certification number as required to conform to the technical standards regulated by the

Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan.

Integration of this module into a final product does not require additional radio certification provided installation

instructions are followed and no modifications of the module are allowed. Additional testing may be required:

• If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the

host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should

contact their conformance laboratory to determine if this testing is required

• There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI:

www.vcci.jp/vcci_e/index.html

14.4.1 Labeling and User Information Requirements

The label on the final product which contains the ATWINC3400-MR210CA module must follow Japan marking

requirements. The integrator of the module should refer to the labeling requirements for Japan available at the

Ministry of Internal Affairs and Communications (MIC) website.

For the ATWINC3400-MR210CA module, due to a limited module size, the technical conformity logo and ID is

displayed in the data sheet and/or packaging and cannot be displayed on the module label. The final product in

which this module is being used must have a label referring to the type certified module inside:

005-101794

14.4.2 Helpful Web Sites

• Ministry of Internal Affairs and Communications (MIC): www.tele.soumu.go.jp/e/index.htm.

• Association of Radio Industries and Businesses (ARIB): www.arib.or.jp/english/.

14.5 Korea

The ATWINC3400-MR210CA module has/have received certification of conformity in accordance with the Radio

Waves Act. Integration of this module into a final product does not require additional radio certification provided

installation instructions are followed and no modifications of the module are allowed.

14.5.1 Labeling and User Information Requirements

The label on the final product which contains the ATWINC3400-MR210CA module must follow KC marking

requirements. The integrator of the module should refer to the labeling requirements for Korea available on the

Korea Communications Commission (KCC) website.

ATWINC3400-MR210xA

Appendix A: Regulatory Approval

For ATWINC3400-MR210CA, due to a limited module size, the KC mark and ID are displayed in the data sheet

and/or packaging and cannot be displayed on the module label. The final product requires the KC mark and

certificate number of the module:

R-CRM-mcp-WINC3400MR210C

14.5.2 Helpful Websites

• Korea Communications Commission (KCC): www.kcc.go.kr.

• National Radio Research Agency (RRA): rra.go.kr.

14.6 Taiwan

The ATWINC3400-MR210CA module has/have received compliance approval in accordance with the

Telecommunications Act. Customers seeking to use the compliance approval in their product should contact

Microchip Technology sales or distribution partners to obtain a Letter of Authority.

Integration of this module into a final product does not require additional radio certification provided installation

instructions are followed and no modifications of the module are allowed.

14.6.1 Labeling and User Information Requirements

For the ATWINC3400-MR210CA module, due to the limited module size, the NCC mark and ID are displayed in the

data sheet only and cannot be displayed on the module label:

CCAN18LP0450T0

The user's manual should contain following warning (for RF device) in traditional Chinese:

注意 !

依據低功率電波輻射性電機管理辦法

第十二條經型式認證合格之低功率射頻電機，非經許可，

公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計

之特性及功能。

第十四條低功率射頻電機之使用不得影響飛航安全及干擾合法通信；

經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。

前項合法通信，指依電信規定作業之無線電信。

低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性

電機設備之干擾。

14.6.2 Helpful Web Sites

National Communications Commission (NCC): www.ncc.gov.tw

ATWINC3400-MR210xA

Appendix A: Regulatory Approval

14.7 China

The ATWINC3400-MR210CA modules has/have received certification of conformity in accordance with the China

MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module

into a final product does not require additional radio certification, provided installation instructions are followed and no

modifications of the module are allowed. Refer to SRRC certificate available in ATWINC3400-MR210xA product page

for expiry date.

14.7.1 Labeling and User Information Requirements

The ATWINC3400-MR210CA module is labeled with its own CMIIT ID as follows:

CMIIT ID: 2018DJ2733

When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing

the statement “This device contains SRRC approved Radio module CMIIT ID: 2018DJ2733”.

14.8 Other Regulatory Information

• For information about other countries' jurisdictions, refer to www.microchip.com/wwwproducts/en/ATWINC3400

(available under Documents > Certifications).

• Should other regulatory jurisdiction certification be required by the customer, or the customer needs to recertify

the module for other reasons, contact Microchip for the required utilities and documentation

ATWINC3400-MR210xA

Appendix A: Regulatory Approval

15. Reference Documentation

For further details, refer to the following documents:

• ATWINC3400A-MU Datasheet

• Wi-Fi Network Controller Software Design Guide Application Note

• Integrated Serial Flash Memory Download Procedure Application Note

• Wi-Fi Network Controller Software Programming Guide Application Note

•ATWINC3400 XPro User Guide

• BLE Profiles Application User Guide

•Solder Reflow Recommendation Application Note

• ATWINC3400A/ATWINC3400-MR110xA Errata

• ATWINC3400 – Deriving Application Gain Table Application Note

Note: For a complete listing of development-support tools and documentation, visit http://www.microchip.com/

wwwproducts/en/ATWINC3400 or refer to the customer support section for details on the nearest Microchip field

representative.

ATWINC3400-MR210xA

Reference Documentation

16. Document Revision History

Revision Date Section Changes

D 04/2021 Document Replaced Master/Slave with the new terminologies. For more details, see the

following note.

1. Ordering Information and Module

Marking

Updated Figure 1-1 with tape and reel information.

14.3 Europe Updated EN 301 489 in EMC to EN 301 489-1 and EN 301 489-17.

C 12/2020 Document • Updated ATWINC3400-MR210CA to ATWINC3400-MR210xA

• Added ATWINC3400-MR210UA module information

• Minor edits

2. Block Diagram Updated Figure 2-1

3. Pinout and Package Information • Updated Figure 3-1

• Updated pin descriptions of Pin 8, 9, 14, 15, 22,27, 28,29, 30, 31, 32 and 37

• Added Note

4. Electrical Characteristics Updated VBAT specification in 4.2 Recommended Operating Conditions

8. WLAN Subsystem Added footnotes for Short GI feature

10.2.2 SPI Timing • Updated Note

• Added description in 10.4 I2C Client Interface

13.1.1 ATWINC3400-MR210CA

Module Placement and Routing

Guidelines

• Added ATWINC3400-MR210CA for the section name

• Updated Figure 13-2

13.2.1 ATWINC3400-MR210UA

Module Placement and Routing

Guidelines

Added

13.2.2 ATWINC3400-MR210UA

Approved External Antennas

Added

1. Ordering Information and Module

Marking

• Updated Table 1-1

• Updated Figure 1-1

10.3 UART Interface Updated with Wi-Fi and Bluetooth Low Energy data information

11.1 Host Interface Updated Figure 11-1

14. Appendix A: Regulatory Approval • Updated Japan, Korea, Taiwan and China regulatory IDs for ATWINC3400-

MR210CA

• Updated USA, Canada and Europe regulatory IDs for ATWINC3400-

MR210UA

• Added 14. Gain Table for Individual Regulatory Region

• Updated 14.1 United States, 14.2 Canada and 14.3 Europe with the

details of antennas used for approval

• Revamped 14.3 Europe

• Updated module label information in 14.5 Korea

• Updated expiry date information in 14.7 China

• Updated contents of 14.8 Other Regulatory Information

B 08/2018 Document Updated from Bluetooth 4.0 to Bluetooth 5.0 throughout the document

Features • Removed Bluetooth Host and Controller QD ID

• Added QD ID for an end product

ATWINC3400-MR210xA

Document Revision History

...........continued

Revision Date Section Changes

1. Ordering Information and Module

Marking

Updated product web page link

Table 10-1 and Table 10-2 Updated pin numbers

Reflow profile information • Removed Reflow Profile information sections

• Added link to Solder Reflow Recommendation Application Note

14. Appendix A: Regulatory Approval Added PMN details under Canada/ISED

15. Reference Documentation • Updated web links

• Added Solder Reflow Recommendation

Radiation Pattern Newly added

A 11/2017 Document Initial Release

Note: Microchip is aware that some terminologies used in the technical documents and existing software codes of

this product are outdated and unsuitable. This document may use these new terminologies, which may or may not

reflect on the source codes, software GUIs, and the documents referenced within this document. The following table

shows the relevant terminology changes made in this document.

Table 16-1. Terminology Related Changes

Old Terminology New Terminology Description

Master Host The following sections are updated with new terminology:

•3. Pinout and Package Information

•10.1 Interfacing with the Host Microcontroller

•10.2 SPI Client Interface

•10.2.1 Overview

•10.2.2 SPI Timing

•10.4 I2C Client Interface

Slave Client

ATWINC3400-MR210xA

Document Revision History

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ATWINC3400-MR210xA

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ISBN: 978-1-5224-8269-7

ATWINC3400-MR210xA

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ATWINC3400-MR210xA

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