Surface Mount RF PIN
Switch Diodes
Technical Data
Features
•Unique Configurations in
Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
•Switching
– Low Capacitance
– Low Resistance at Low
Current
•Low Failure in Time (FIT)
Rate[1]
•Matched Diodes for
Consistent Performance
•Better Thermal
Conductivity for Higher
Power Dissipation
•Lead-free Option Available
Note:
1. For more information see the
Surface Mount PIN Reliability Data
Sheet.
HSMP-389x Series
HSMP-489x Series
Description/Applications
The HSMP-389x series is
optimized for switching applica-
tions where low resistance at low
current and low capacitance are
required. The HSMP-489x series
products feature ultra low
parasitic inductance. These
products are specifically
designed for use at frequencies
which are much higher than the
upper limit for conventional PIN
diodes.
GUx
1
2
3
6
5
4
Notes:
1. Package marking provides
orientation, identification, and
date code.
2. See “Electrical Specifications” for
appropriate package marking.
Pin Connections and
Package Marking
2
Package Lead Code
Identification, SOT-23/143
(Top View)
Package Lead Code
Identification, SOT-323
(Top View)
Package Lead Code
Identification, SOT-363
(Top View)
Absolute Maximum Ratings[1] TC = +25°C
Symbol Parameter Unit SOT-23/143 SOT-323/363
IfForward Current (1 µs Pulse) Amp 1 1
PIV Peak Inverse Voltage V 100 100
TjJunction Temperature °C 150 150
Tstg Storage Temperature °C -65 to 150 -65 to 150
θjc Thermal Resistance[2] °C/W 500 150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to
the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where
contact is made to the circuit board.
ESD WARNING:
Handling Precautions Should Be
Taken To Avoid Static Discharge.
COMMON
CATHODE
#4
COMMON
ANODE
#3
SERIES
#2
SINGLE
#0
UNCONNECTED
PAIR
#5
DUAL ANODE
4890
COMMON
CATHODE
F
COMMON
ANODE
E
SERIES
C
SINGLE
B
DUAL ANODE
489B
SERIES–
SHUNT PAIR
LOW
INDUCTANCE
SINGLE
T
UNCONNECTED
TRIO
L
123
654
123
654
123
654
U
HIGH
FREQUENCY
SERIES
V
123
654
DUAL SWITCH
MODEL
R
123
654
3
Electrical Specifications, TC = 25°C, each diode
Package Minimum Maximum Maximum
Part Number Marking Lead Breakdown Series Resistance Total Capacitance
HSMP- Code Code Configuration Voltage VBR (V) RS (Ω)C
T (pF)
3890 G0[1] 0 Single 100 2.5 0.30
3892 G2[1] 2 Series
3893 G3[1] 3 Common Anode
3894 G4[1] 4 Common Cathode
3895 G5[1] 5 Unconnected Pair
389B G0[2] B Single
389C G2[2] C Series
389E G3[2] E Common Anode
389F G4[2] F Common Cathode
389L GL[2] L Unconnected Trio
389R S[2] R Dual Switch Mode
389T Z[2] T Low Inductance Single
389U GU[2] U Series-Shunt Pair
389V GV[2] V High Frequency Series Pair
Test Conditions VR = VBR IF = 5 mA VR = 5 V
Measure f = 100 MHz f = 1 MHz
IR ≤ 10 µA
Notes:
1. Package marking code is white.
2. Package is laser marked.
High Frequency (Low Inductance, 500 MHz–3 GHz) PIN Diodes
Minimum Maximum Typical Maximum Typical
Part Package Breakdown Series Total Total Total
Number Marking Voltage Resistance Capacitance Capacitance Inductance
HSMP- Code[1] Configuration VBR (V) RS (Ω)C
T (pF) C T (pF) L T (nH)
489x GA Dual Anode 100 2.5 0.33 0.375 1.0
Test Conditions VR = VBR IF = 5 mA f = 1 MHz VR = 5 V f = 500 MHz–
Measure VR = 5 V f = 1 MHz 3 GHz
IR ≤ 10 µA
Note:
1. SOT-23 package marking code is white; SOT-323 is laser marked.
Typical Parameters at TC = 25°C
Part Number Series Resistance Carrier Lifetime Total Capacitance
HSMP- RS (Ω)τ (ns) CT (pF)
389x 3.8 200 0.20 @ 5 V
Test Conditions IF = 1 mA IF = 10 mA
f = 100 MHz IR = 6 mA
4
HSMP-389x Series Typical Performance, TC = 25°C, each diode
Typical Applications for Multiple Diode Products
Figure 1. Total RF Resistance at 25°C
vs. Forward Bias Current.
100
10
1
0.1
RF RESISTANCE (OHMS)
IF – FORWARD BIAS CURRENT (mA)
0.01 0.1 1 10 100
120
115
110
105
100
95
90
85
11030
IF – FORWARD BIAS CURRENT (mA)
Figure 3. 2nd Harmonic Input
Intercept Point vs. Forward Bias
Current.
INPUT INTERCEPT POINT (dBm)
Diode Mounted as a
Series Attenuator in a
50 Ohm Microstrip and
Tested at 123 MHz
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20 04 8121620
VR – REVERSE VOLTAGE (V)
TOTAL CAPACITANCE (pF)
1 MHz
1 GHz
Figure 2. Capacitance vs. Reverse
Voltage.
200
160
120
80
40
0
10 2015 25 30
Trr – REVERSE RECOVERY TIME (nS)
FORWARD CURRENT (mA)
Figure 4. Typical Reverse Recovery
Time vs. Reverse Voltage.
VR = –2V
VR = –5V
VR = –10V
100
10
1
0.1
0.01 0 0.2 0.4 0.6 0.8 1.0 1.2
IF – FORWARD CURRENT (mA)
VF – FORWARD VOLTAGE (V)
Figure 5. Forward Current vs. Forward
Voltage.
125°C25°C–50°C
1
123
4
056
b1 b2 b3
2
3
1
11
RF in RF out
2
2
3
456
1
0
0
2
+V
–V
“ON”
“OFF”
Figure 6. HSMP-389L used in a SP3T Switch. Figure 7. HSMP-389L Unconnected Trio used in a
Dual Voltage, High Isolation Switch.
5
Typical Applications for Multiple Diode Products (continued)
Figure 11. HSMP-389V Series/Shunt Pair used in a
1.8 GHz Transmit/Receive Switch.
Figure 10. HSMP-389U Series/Shunt Pair used in a
900 MHz Transmit/Receive Switch.
Figure 8. HSMP-389L Unconnected Trio used in a
Positive Voltage, High Isolation Switch.
Figure 9. HSMP-389T used in a Low Inductance
Shunt Mounted Switch.
RF in RF out
1
+V
0
2
0
+V
“ON”
“OFF”
456
1
11
2
2
3
RF in
RF out
456
12 3
λ
4
Rcvr
Xmtr
Bias Ant
PA
bias
HSMP-389U
LNA
λ
4
Rcvr
Bias
Xmtr
HSMP-389V
Antenna
λ
4
λ
4
Rcvr
Xmtr
Bias Ant
CC
6
Typical Applications for Multiple Diode Products (continued)
RF COMMON
RF COMMON
RF 1
BIAS 1 BIAS BIAS
RF 2
BIAS 2
Figure 12. Simple SPDT Switch, Using Only Positive Current.
RF COMMON
RF 1 RF 2
BIAS
Figure 14. Switch Using Both Positive and Negative Bias
Current.
Figure 15. Very High Isolation SPDT Switch, Dual Bias.
Figure 13. High Isolation SPDT Switch, Dual Bias.
RF 2
RF 1
RF COMMON
RF 2
RF 1
BIAS
7
Equivalent Circuit Model
HSMP-389x Chip*
0.12 pF*
* Measured at -20 V
0.5 Ω
R
j
R
s
C
j
R
j
= 20 Ω
I
0.9
R
T
= 0.5 + R
j
C
T
= C
P
+ C
j
I = Forward Bias Current in mA
* See AN1124 for package models
Typical Applications for
HSMP-489x Low
Inductance Series
Microstrip Series Connection
for HSMP-489x Series
In order to take full advantage of
the low inductance of the
HSMP-489x series when using
them in series applications, both
lead 1 and lead 2 should be
connected together, as shown in
Figure 17.
12
3
HSMP-489x
Figure 16. Internal Connections.
Figure 17. Circuit Layout.
Microstrip Shunt Connections
for HSMP-489x Series
In Figure 18, the center conductor
of the microstrip line is inter-
rupted and leads 1 and 2 of the
HSMP-489x diode are placed
across the resulting gap. This
forces the 1.5 nH lead inductance
of leads 1 and 2 to appear as part
of a low pass filter, reducing the
shunt parasitic inductance and
increasing the maximum available
attenuation. The 0.3 nH of shunt
inductance external to the diode
is created by the via holes, and is
a good estimate for 0.032" thick
material.
50 OHM MICROSTRIP LINES
PAD CONNECTED TO
GROUND BY TWO
VIA HOLES
Figure 18. Circuit Layout.
0.3 nH
0.3 nH
0.3 pF
1.5 nH 1.5 nH
Figure 19. Equivalent Circuit.
Co-Planar Waveguide Shunt
Connection for HSMP-489x
Series
Co-Planar waveguide, with
ground on the top side of the
printed circuit board, is shown in
Figure 20. Since it eliminates the
need for via holes to ground, it
offers lower shunt parasitic
inductance and higher maximum
attenuation when compared to a
microstrip circuit.
Co-Planar Waveguide
Groundplane
Center Conductor
Groundplane
Figure 20. Circuit Layout.
0.3 pF
0.75 nH
Figure 21. Equivalent Circuit.
A SPICE model is not available
for PIN diodes as SPICE does not
provide for a key PIN diode
characteristic, carrier lifetime.
8
Assembly Information
0.026
0.075
0.016
0.035
Figure 22. PCB Pad Layout, SOT-363.
(dimensions in inches).
0.026
0.035
0.07
0.016
Figure 23. PCB Pad Layout, SOT-323.
(dimensions in inches).
0.037
0.95
0.037
0.95
0.079
2.0
0.031
0.8
DIMENSIONS IN inches
mm
0.035
0.9
Figure 24. PCB Pad Layout, SOT-23.
DIMENSIONS IN
inches
mm
0.075
1.9 0.071
1.8
0.112
2.85
0.079
2
0.033
0.85
0.041
1.05
0.108
2.75
0.033
0.85
0.047
1.2
0.031
0.8
0.033
0.85
Figure 25. PCB Pad Layout, SOT-143.
TIME (seconds)
TMAX
TEMPERATURE (°C)
0
0
50
100
150
200
250
60
Preheat
Zone Cool Down
Zone
Reflow
Zone
120 180 240 300
Figure 26. Surface Mount Assembly Profile.
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent’s diodes have been
qualified to the time-temperature
profile shown in Figure 26. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (TMAX) should not
exceed 235°C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
9
Package Characteristics
Lead Material .................... Copper (SOT-323/363); Alloy 42 (SOT-23/143)
Lead Finish............................................................................ Tin-Lead 85-15%
Maximum Soldering Temperature .............................. 260°C for 5 seconds
Minimum Lead Strength .......................................................... 2 pounds pull
Typical Package Inductance .................................................................. 2 nH
Typical Package Capacitance .............................. 0.08 pF (opposite leads)
Package Dimensions
Outline 23 (SOT-23)
Outline 143 (SOT-143)
3
12
SIDE VIEW
TOP VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS
(
INCHES
)
1.02 (0.040)
0.89 (0.035)
0.60 (0.024)
0.45 (0.018)
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
3.06 (0.120)
2.80 (0.110)
2.04 (0.080)
1.78 (0.070)
1.02 (0.041)
0.85 (0.033)
0.152 (0.006)
0.066 (0.003)
0.10 (0.004)
0.013 (0.0005)
0.69 (0.027)
0.45 (0.018)
0.54 (0.021)
0.37 (0.015)
X X X
PACKAGE
MARKING
CODE (XX)
DATE CODE (X)
0.69 (0.027)
0.45 (0.018)
1.40 (0.055)
1.20 (0.047)
2.65 (0.104)
2.10 (0.083)
0.60 (0.024)
0.45 (0.018) 0.54 (0.021)
0.37 (0.015)
0.10 (0.004)
0.013 (0.0005)
1.04 (0.041)
0.85 (0.033)
0.92 (0.036)
0.78 (0.031)
2.04 (0.080)
1.78 (0.070)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.15 (0.006)
0.09 (0.003)
3.06 (0.120)
2.80 (0.110)
PACKAGE
MARKING
CODE (XX)
43
12
X X X
DATE CODE (X)
Outline SOT-363 (SC-70 6 Lead)
Outline SOT-323 (SC-70 3 Lead)
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
1.30 (0.051)
REF.
0.650 BSC (0.025)
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.25 (0.010)
0.15 (0.006)
1.00 (0.039)
0.80 (0.031) 0.20 (0.008)
0.10 (0.004)
0.30 (0.012)
0.10 (0.004)
0.30 REF.
10°
0.425 (0.017)
TYP.
DIMENSIONS ARE IN MILLIMETERS
(
INCHES
)
PACKAGE
MARKING
CODE (XX)
X X X
DATE CODE (X)
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
1.30 (0.051)
REF.
0.650 BSC (0.025)
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.25 (0.010)
0.15 (0.006)
1.00 (0.039)
0.80 (0.031)
0.20 (0.008)
0.10 (0.004)
0.30 (0.012)
0.10 (0.004)
0.30 REF.
10°
0.425 (0.017)
TYP.
DIMENSIONS ARE IN MILLIMETERS
(
INCHES
)
PACKAGE
MARKING
CODE (XX)
X X X
DATE CODE (X)
10
Ordering Information
Specify part number followed by option. For example:
HSMP - 389x - XXX
Bulk or Tape and Reel Option
Part Number; x = Lead Code
Surface Mount PIN
Option Descriptions
-BLK = Bulk, 100 pcs. per antistatic bag
-TR1 = Tape and Reel, 3000 devices per 7" reel
-TR2 = Tape and Reel, 10,000 devices per 13" reel
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of
Surface Mounted Components for Automated Placement.”
For lead-free option, the part number will have the character "G" at the
end, eg. -TR2G for a 10K pc lead-free reel.
Device Orientation
USER
FEED
DIRECTION
COVER TAPE
CARRIER
TAPE
REEL
For Outline SOT-143
Note: "AB" represents package marking code.
"C" re
p
resents date code.
END VIE
W
8 mm
4 mm
TOP VIEW
ABC ABC ABC ABC
For Outlines SOT-23, -323
Note: "AB" represents package marking code.
"C" represents date code.
END VIE
W
8 mm
4 mm
TOP VIEW
ABC ABC ABC ABC
END VIE
W
8 mm
4 mm
TOP VIEW
Note: "AB" represents package marking code.
"C" represents date code.
ABC ABC ABC ABC
For Outline SOT-363
11
Tape Dimensions and Product Orientation
For Outline SOT-23
9° MAX
A
0
P
P
0
DP
2
E
F
W
D
1
Ko 8° MAX
B
0
13.5° MAX
t1
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A
0
B
0
K
0
P
D
1
3.15 ± 0.10
2.77 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.05
0.124 ± 0.004
0.109 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 ± 0.002
CAVITY
DIAMETER
PITCH
POSITION
D
P
0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
PERFORATION
WIDTH
THICKNESS
W
t1
8.00 + 0.30 – 0.10
0.229 ± 0.013
0.315 + 0.012 – 0.004
0.009 ± 0.0005
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
2
3.50 ± 0.05
2.00 ± 0.05
0.138 ± 0.002
0.079 ± 0.002
DISTANCE
BETWEEN
CENTERLINE
W
F
E
P
2
P
0
D
P
D
1
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A
0
B
0
K
0
P
D
1
3.19 ± 0.10
2.80 ± 0.10
1.31 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.126 ± 0.004
0.110 ± 0.004
0.052 ± 0.004
0.157 ± 0.004
0.039 + 0.010
CAVITY
DIAMETER
PITCH
POSITION
D
P
0
E
1.50 + 0.10
4.00 ± 0.10
1.75 ± 0.10
0.059 + 0.004
0.157 ± 0.004
0.069 ± 0.004
PERFORATION
WIDTH
THICKNESS
W
t1
8.00 + 0.30 – 0.10
0.254 ± 0.013
0.315+ 0.012 – 0.004
0.0100 ± 0.0005
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
2
3.50 ± 0.05
2.00 ± 0.05
0.138 ± 0.002
0.079 ± 0.002
DISTANCE
A
0
9° MAX 9° MAX
t
1
B
0
K
0
For Outline SOT-143
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (65) 6756 2394
India, Australia, New Zealand: (65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand, Philippines,
Indonesia: (65) 6755 2044
Taiwan: (65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5968-7701E
March 24, 2004
5989-0486EN
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P
P
0
P
2
F
W
C
D
1
D
E
A
0
An
t
1
(CARRIER TAPE THICKNESS) T
t
(COVER TAPE THICKNESS)
An
B
0
K
0
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
A
0
B
0
K
0
P
D
1
2.40 ± 0.10
2.40 ± 0.10
1.20 ± 0.10
4.00 ± 0.10
1.00 + 0.25
0.094 ± 0.004
0.094 ± 0.004
0.047 ± 0.004
0.157 ± 0.004
0.039 + 0.010
CAVITY
DIAMETER
PITCH
POSITION
D
P
0
E
1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10
0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004
PERFORATION
WIDTH
THICKNESS
W
t
1
8.00 ± 0.30
0.254 ± 0.02
0.315 ± 0.012
0.0100 ± 0.0008
CARRIER TAPE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
F
P
2
3.50 ± 0.05
2.00 ± 0.05
0.138 ± 0.002
0.079 ± 0.002
DISTANCE
FOR SOT-323 (SC70-3 LEAD) An 8°C MAX
FOR SOT-363 (SC70-6 LEAD) 10°C MAX
ANGLE
WIDTH
TAPE THICKNESS
C
T
t
5.4 ± 0.10
0.062 ± 0.001
0.205 ± 0.004
0.0025 ± 0.00004
COVER TAPE
