2001 May 30 Rev.5 7 www.phycomp-components.com
Phycomp Product specification
Surface-mount ceramic
multilayer capacitors Class 2, X7R 10 V
TESTS AND REQUIREMENTS
Table 2 Test procedures and requirements
IEC
60384-10/
CECC 32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.4 mounting the capacitors may be mounted
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive adhesive
no visible damage
4.5 visual inspection and
dimension check
any applicable method using
×10 magnification
in accordance with specification
4.6.1 capacitance f = 1 kHz; measuring voltage
1V
rms at 20 °C
within specified tolerance
4.6.2 tan δf = 1 kHz; measuring voltage
1V
rms at 20 °C
in accordance with specification
4.6.3 insulation resistance at UR (DC) for 1 minute in accordance with specification
4.6.4 voltage proof 2.5 ×URfor 1 minute no breakdown or flashover
4.7.1 temperature
characteristic
between minimum and
maximum temperature
in accordance with specification
4.8 adhesion a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
no visible damage
4.9 bond strength of
plating on end face
mounted in accordance with
CECC 32 100, paragraph 4.4
no visible damage
conditions: bending
1 mm at a rate of 1 mm/s,
radius jig 340 mm
∆C/C: ≤10%
4.10 Tb resistance to
soldering heat
precondition:
120 to 150 °C for 1 minute;
260 ±5°C for 10 ±0.5 s
the terminations shall be well
tinned after recovery
∆C/C: ≤10%
resistance to
leaching
260 ±5°C for 30 ±1s
in a static solder bath
using visual enlargement of
×10, dissolution of the
terminations shall not
exceed 10%
4.11 Ta solderability zero hour test, and test after
storage (20 to 24 months) in
original packing in normal
atmosphere;
unmounted chips completely
immersed for 2 ±0.5 s in a solder
bath at 235 ±5°C
the terminations shall be well
tinned