6-4
ESD Capability
ESD capability is dependent on the application and defined
test standard. The evaluation results for various test
standards and methods based on Figure 1 are shown in
Table 1.
For the “Modified” MIL-STD-3015.7 condition that is defined
as an “in-circuit” method of ESD testing, the V+ and V- pins
have a return path to ground and the SP720 ESD capability
is typically greater than 15kV from 100pF through 1.5k
Ω
. By
strict definition of MIL-STD-3015.7 using “pin-to-pin” device
testing, the ESD voltage capability is greater than 6kV. The
MIL-STD-3015.7 results were determined from AT&T ESD
Test Lab measurements.
The HBM capability to the IEC 1000-4-2 standard is greater
than 15kV for air discharge (Level 4) and greater than 4kV
for direct discharge (Level 2). Dual pin capability (2 adjacent
pins in parallel) is well in excess of 8kV (Level 4).
For ESD testing of the SP720 to EIAJ IC121 Machine Model
(MM) standard, the results are typically better than 1kV from
200pF with no series resistance.
Absolute Maximum Ratings Thermal Information
Continuous Supply Voltage, (V+) - (V-) . . . . . . . . . . . . . . . . . . +35V
Forward Peak Current, I
IN
to V
CC
, I
IN
to GND
(Refer to Figure 6) . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
2A, 100
µ
s
ESD Ratings and Capability (Figure 1, Table 1)
Load Dump and Reverse Battery (Note 2)
Thermal Resistance (Typical, Note 1) . . . . . . . . . . . . .
θ
JA
(
o
C/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Maximum Storage Temperature Range . . . . . . . . . . -65
o
C to 150
o
C
Maximum Junction Temperature (Plastic Package) . . . . . . . . .150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
o
C
(SOIC Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
T
A
= -40
o
C to 105
o
C; V
IN
= 0.5V
CC
, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Operating Voltage Range,
V
SUPPLY
= [(V+) - (V-)]
V
SUPPLY
- 2 to 30 - V
Forward Voltage Drop:
IN to V-
IN to V+
V
FWDL
V
FWDH
I
IN
= 1A (Peak Pulse)
-
-
2
2
-
-
V
V
Input Leakage Current I
IN
-20 5 20 nA
Quiescent Supply Current I
QUIESCENT
- 50 200 nA
Equivalent SCR ON Threshold Note 3 - 1.1 - V
Equivalent SCR ON Resistance V
FWD
/I
FWD
; Note 3 - 1 -
Ω
Input Capacitance C
IN
-3-pF
Input Switching Speed t
ON
-2-ns
NOTES:
2. In automotive and battery operated systems, the power supply lines should be externally protected for load dump and reverse battery. When the
V+ and V- pins are connected to the same supply voltage source as the device or control line under protection, a current limiting resistor should
be connected in series between the external supply and the SP720 supply pins to limit reverse battery current to within the rated maximum
limits. Bypass capacitors of typically 0.01
µ
F or larger from the V+ and V- pins to ground are recommended.
3. Refer to the Figure 3 graph for definitions of equivalent “SCR ON Threshold” and “SCR ON Resistance.” These characteristics are given here
for thumb-rule information to determine peak current and dissipation under EOS conditions.
TABLE 1. ESD TEST CONDITIONS
STANDARD TYPE/MODE R
D
C
D
±
V
D
MIL STD 3015.7 Modified HBM 1.5k
Ω
100pF 15kV
Standard HBM 1.5k
Ω
100pF 6kV
IEC 1000-4-2 HBM, Air Discharge 330
Ω
150pF 15kV
HBM, Direct Discharge 330
Ω
150pF 4kV
HBM, Direct Discharge,
Two Parallel Input Pins
330
Ω
150pF 8kV
EIAJ IC121 Machine Model 0k
Ω
200pF 1kV
H.V.
SUPPLY
°±VD
IN
DUT
CD
R1
IEC 1000-4-2: R150 to 100MΩ
RD
CHARGE
SWITCH
DISCHARGE
SWITCH
MIL STD 3015.7: R11 to 10MΩ
FIGURE 1. ELECTROSTATIC DISCHARGE TEST
SP720