This document is a general product description and is subject t o change without notice. Hynix Semiconductor do es not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 1.0 / June 2008 1
128Mb DDR SDRAM
HY5DU281622FTP-xI
Rev. 1.0 / June 2008 2
HY5DU281622FT(P)-xI Series
Revision History
Revision No. History Draft Date Remark
0.01 First version for internal review June 2007
1.0 Release Jun. 2008
Rev. 1.0 / June 2008 3
HY5DU281622FT(P)-xI Series
DESCRIPTION
The HY5DU281622FT(P)-xI is a 134,217,728-bit CMOS Double Data Rate(DDR) Synchronous DRAM, ideally suited for
the main memory applications which requires large memory density and high bandwidth.
This Hynix 128Mb DDR SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the
clock. While all addresses and contro l inputs ar e latched on th e rising edges of the CK (falling edg es of the /CK), Data,
Data strobes and W rite data mas ks inputs ar e samp led on both rising and falling edges of it. The data paths are inter-
nally pipelined and 2-bit prefetched to achiev e very high bandwidth. All input and output voltage levels are compatible
with SSTL_2.
FEATURES
•VDD, VDDQ = 2.3V min ~ 2.7V max
(Typical 2.5V Operation +/- 0.2V for DDR266, 333)
•V
DD, VDDQ = 2.4V min ~ 2.7V max
(Typical 2.6V Operation +0.1/- 0.2V for DDR400,
400Mbps/pin product and 500Mbps/pin product )
• All inputs and outputs are compatible with SSTL_2
interface
• Fully differential clock inputs (CK, /CK) operation
• Double data rate interface
• Source synchronous - data transaction aligned to
bidirectional data strobe (DQS)
• x16 device has two bytewide data strobes (UDQS,
LDQS) per each x8 I/O
• Data outputs on DQS edges when read (edged DQ)
Data inputs on DQS centers when write (centered
DQ)
• On chip DLL align DQ and DQS transition with CK
transition
• DM mask write data-in at the both rising and falling
edges of the data strobe
• All addresses and control inputs except data, data
strobes and data masks latched on the rising edges
of the clock
• Programmable CAS latency 2/2.5 (DDR266, 333)
and 3/4 (DDR400, 400Mbps/pin product and
500Mbps/pin product) supported
• Programmable burst length 2/4/8 with both sequen-
tial and interleave mode
• Internal four bank operations with single pulsed
/RAS
• Auto refresh and self refresh supported
•t
RAS
lock out function supported
• 4096 refresh cycles/64ms
• JEDEC standard 400mil 66pin TSOP-II with 0.65mm
pin pitch
• Lead free (*ROHS Compliant)
ORDERING INFORMATION
* X means speed grade
** Lead-free product
Part No. Configuration Package
HY5DU281622F(L)TP-xI* 8Mx16 400mil
66pin
TSOP-II**
OPERATING FREQUENCY
Grade Clock Rate Remark
-4 250MHz@CL4 500Mbps/pin
(maximum Date rate)
-5 200MHz@CL3 / 100MHz @CL2 400Mbps/pin
(maximum Date rate)
-D43 200MHz@CL3 / 100MHz @CL2 DDR400B (3-3-3)
-D4 200MHz@CL3 / 100MHz @CL2 DDR400 (3-4-4)
- J 133MHz@CL2 166MHz @CL2.5
& @CL3 DDR333 (2.5-3-3)
DDR333 (3-3-3)
- K 133MHz@CL2 133MHz@CL2.5 DDR266A (2-3-3)
- H 100MHz@CL2 133MHz@CL2.5 DDR266B (2.5-3-3)
*ROHS (Restriction Of Hazardous Substances)
Rev. 1.0 / June 2008 4
HY5DU281622FT(P)-xI Series
PIN CONFIGURATION
ROW AND COLUMN ADDRESS INFORMATION
• Organization : 2M x 16 x 4banks
• Row Address : A0 - A11
• Column Address : A0 - A8
• Bank Address : BA0, BA1
• Auto Precharge Flag : A10
• Refresh : 4K
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
400m il x 875m il
66pin TSO P-II
0.65m m pin pitch
V
DD
DQ0
V
DDQ
DQ1
DQ2
V
SSQ
DQ3
DQ4
V
DDQ
DQ5
DQ6
V
SSQ
DQ7
NC
V
DDQ
LDQS
NC
V
DD
NC
LDM
/WE
/CAS
/RAS
/CS
NC
BA0
BA1
A10/AP
A0
A1
A2
A3
V
DD
V
SS
DQ15
V
SSQ
DQ14
DQ13
V
DDQ
DQ12
DQ11
V
SSQ
DQ10
DQ9
V
DDQ
DQ8
NC
V
SSQ
UDQS
NC
VREF
V
SS
UDM
/CK
CK
CKE
NC
NC
A11
A9
A8
A7
A6
A5
A4
V
SS
Rev. 1.0 / June 2008 5
HY5DU281622FT(P)-xI Series
PIN DESCRIPTION
PIN TYPE DESCRIPTION
CK, /CK Input Clock: CK and /CK are diff erential clock inputs. All address and control input signa ls are
sampled on the crossing of the positive edge of CK and negative edge of /CK. Output
(read) data is referenced to the crossings of CK and /CK (both directions of crossing).
CKE Input
Clock Enable: CKE HIGH activates, and CKE LOW deactivate s internal clock signals, and
device input buffers and output driv ers. Taking CKE L OW provides PRECHARGE POWER
DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER DOWN (row
ACTIVE in any bank). CKE is synchronous for POWER DOWN entry and exit, and for
SELF REFRESH entry. CKE is asynchronous for SELF REFRESH exit, and for output dis-
able. CKE must be maintained high throughout READ and WRITE accesses. Input buff-
ers, excluding CK, /CK and CKE are disabled during POWER DOWN. Input buffers,
excluding CKE are disabled during SELF REFRESH. CKE is an SSTL_2 input, but will
detect an LVCMOS LOW level after V
DD
is applied.
/CS Input
Chip Select: Enables or disables all inputs except CK, /CK, CKE, DQS and DM. All com-
mands are masked when Chip Select is registered high. Chip Select provides for exter-
nal bank selection on systems with multiple banks. Chip Select is considered part of the
command code.
BA0, BA1 Input Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, Read, Write or
PRECHARGE command is being applied.
A0 ~ A11 Input
Address Inputs: Provide the row address for ACTIVE commands, and the column
address and AUTO PRECHARGE bit for READ/WRITE commands, to select one location
out of the memory array in the respective bank. A10 is sampled during a precharge
command to determine whether the PRECHARGE applies to one bank (A10 L OW) or all
banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by BA0,
BA1. The address inputs also provide the op code during a MODE REGISTER SET com-
mand. BA0 and BA1 define which mode register is loaded during the MODE REGISTER
SET command (MRS or EMRS).
/RAS, /CAS, /
WE Input Command Inputs: /RAS, /CAS and /WE (along with /CS) define the command being
entered.
DM
(LDM,UDM) Input
Input Data Mask: DM is an input mask signal f or write data. Input data is masked when
DM is sampled HIGH along with that input data during a WRITE access. DM is sampled
on both edges of DQS. Although DM pins are input only, the DM loading matches the
DQ and DQS loading. For the x16, LDM corresponds to the data on DQ0-Q7; UDM cor-
responds to the data on DQ8-Q15.
DQS
(LDQS,UDQS) I/O Data Strobe: Output with read data, input with write data. Edge aligned with read data,
centered in write data. Used to capture write data. For the x16, LDQS corresponds to
the data on DQ0-Q7; UDQS corresponds to the data on DQ8-Q15.
DQ I/O Data input / output pin: Data bus
V
DD
/ V
SS
Supply Power supply for internal circuits and input buffers.
V
DDQ
/ V
SSQ
Supply Power supply for output buffers for noise immunity.
V
REF
Supply Reference voltage for inputs for SSTL interface.
NC NC No connection.
Rev. 1.0 / June 2008 6
HY5DU281622FT(P)-xI Series
Functinal Block Diagram (8M x16)
4Banks x 2Mbit x 16I/O Double Data Rate Syncronous DRAM
Sense AMP
Sense AMP
Sense AMP
Mode
Register
Command
Decoder
CLK
/CLK
CKE
/CS
/RAS
/CAS
/WE
LDM
UDM
Bank
Control
Mode
Register Row
Decoder
2Mx16 BANK 0
2Mx16 BANK 1
2Mx16 BANK 2
2Mx16 BANK 3
Memory
Cell
Array
Sense AMP
Column
Decoder
Address
Buffer
A0
A1
A
max
BA0
BA1
Column Address
Decoder
16
Output Buffer
DQ0
DQ15
Input Buffer
DS
32
2-bit Prefetch Unit
Write Data Register
2-bit Prefetch Unit 16
32
Data Strobe
Transmitter
Data Strobe
Receiver
LDQS,
UDQS
LDQS,
UDQS
DLL
Block
CLK,
/CLK
CLK_DLL
Mode
Register
Rev. 1.0 / June 2008 7
HY5DU281622FT(P)-xI Series
SIMPLIFIED COMMAND TRUTH TABLE
Command CKEn-1 CKEn CS RAS CAS WE ADDR A10
/AP BA Note
Extended Mode Register
Set H XLLLL OP code 1,2
Mode Register Set H X L L L L OP code 1,2
Device Deselect HX
HXXX X1
No Operation L H H H
Bank Active H X L L H H RA V 1
Read H X LHLHCALV1
Read with Autoprecharge H 1,3
Write HXLHLLCA
LV1
Write with Autoprecharge H 1,4
Precharge All Banks HXLLHLX
HX1,5
Precharge selected Bank LV1
Read Burst Stop H X L H H L X 1
Auto Refresh H H L L L H X 1
Self Refresh
Entry H L L L L H
X
1
Exit L H HXXX 1
LHHH
Precharge
Power Down
Mode
Entry H L HXXX
X
1
LHHH 1
Exit L H HXXX 1
LHHH 1
Active Power
Down Mode Entry H L HXXX
X
1
LVVV 1
Exit L H X 1
( H=Logic High Level, L=Logic Low Level, X=Don’t Care, V=V alid Data Input, OP Code=Operand Code, NOP=No Operation )
Rev. 1.0 / June 2008 8
HY5DU281622FT(P)-xI Series
WRITE MASK TRUTH TABLE
Function CKEn-1 CKEn /CS, /RAS,
/CAS, /WE DM ADD
RA10/
AP BA Note
Data Write H X X L X 1,2
Data-In Mask H X X H X 1,2
Notes :
1. Write Mask command masks burst write data with reference to LDQS/UDQS(Data Strobes) and it is not related with read data.
In case of x16 data I/O, LDM and UDM control lower byte(DQ0~7) and Upper byte(DQ8~15) respectively.
2. In here, Don’t Care means logical value only, it doesn’t mean ’Don’t care for DC level of each signals’. DC level should be out of
VIHmin ~ VILmax
Notes :
1. UDM, LDM states are Don’t Care. Refer to below Write Mask Truth Table.(note 6)
2. OP Code(Operand Code) consists of A0~A11 and BA0~BA1 used for Mode Register setting during Extended MRS or MRS. Before
entering Mode R egi ster Set mode, a ll banks must be in a pr echarg e state and MR S co mmand can be i ssued aft er tR P period fr om
Prechagre command.
3. If a Read with Auto-precharge command is detected by memory component in CK(n), then there will be no command presented
to activate bank until CK(n+BL/2+tRP).
4. If a Write with Auto-precharge command is detected by memory component in CK(n), then there will be no command presented
to activate bank until CK(n+BL/2+1+tDPL+t RP). Last Data-In to Prechage delay(tDPL) which is also ca lled Write Recovery
Time(tWR) is neede d to guarantee that the last data have been comp letely written.
5. If A10/AP is High when Precharge command being issued, BA0/BA1 are ignored and all banks are selected to be precharged.
6. In here, Don’t Care means logical value only, it doesn’t mean ’Don’t care for DC level of each signals’. DC level should be out of
VIHmin ~ VILmax
Rev. 1.0 / June 2008 9
HY5DU281622FT(P)-xI Series
SIMPLIFIED STATE DIAGRAM
MRS SREF
SREX
PDEN
PDEX
ACT
AREF
PDEX
PDEN
BST
READWRITE
WRITE
WRITEAP
WRITEAP
READ
READAP READAP
PRE(PALL)
PRE(PALL)
PRE(PALL)
Command Input
A utom atic Sequence
ID LE
AUTO
REFRESH
PRE-
CHARGE
POW ER-UP
POW ER APPLIED
MODE
REGISTER
SET
POW ER
DOWN
WRITE
WITH
AUTOPRE-
CHARGE
POW ER
DOWN
WRITE
READ
WITH
AUTOPRE-
CHARGE
BANK
ACTIVE
READ
SELF
REFRESH
Rev. 1.0 / June 2008 10
HY5DU281622FT(P)-xI Series
POWER-UP SEQUENCE AND DEVICE INITIALIZATION
DDR SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those
specified may result in undefined operation. Power must first be applied to V
DD
, then to V
DDQ
, and finally to VREF
(and to the system VTT). VT T must be applied after V
DDQ
to avoi d device latch-up , which may cause perman ent dam-
age to the device. VREF can be applied anytime after V
DDQ
, but is expected to be nominally coincident with VTT.
Except for CKE, inputs ar e not recognized as v alid until after VREF is applied. CKE is an SS TL_2 input, but will dete ct an
LVCMOS LOW level after V
DD
is applied. Maintaining an LVCMOS LOW level on CKE during power-up is required to
guarantee that the DQ and DQS outputs will be in the High-Z state, where they will remain until driven in normal oper-
ation (by a read access). After all power supply and reference voltages are stable, and the clock is stable, the DDR
SDRAM requires a 200us delay prior to applying an executable command.
Once the 200us delay has been satisfied, a DESELECT or NOP command should be applied, and CKE should be
brought HIGH. Following the NOP command, a PRECHARGE ALL command should be applied. Next a EXTENDED
MODE REGISTER SET command should be issued for the Extended Mode Register, to enable the DLL, then a MODE
REGISTER SET command should be issued for the Mode Register, to reset the DLL, and to program the operating
parameters. After the DLL r eset, tXSRD(DLL locking time) should be satisfied fo r read command. After the Mode R egis-
ter set command, a PRECHARGE ALL command should be applied, placing the device in the all banks idle state.
Once in the idle state, two AUTO REFRESH cycles must be performed. Additionally, a MODE REGISTER SET command
for the Mode Register, with the reset DLL bit deactivated low (i.e. to program operating parameters without resetting
the DLL) must be performed. Following these cycles, the DDR SDRAM is ready for normal operation.
1. Apply power - V
DD
, V
DDQ
, VTT, VREF in the following power up sequencing and attempt to maintain CKE at LVC-
MOS low state. (All the other input pins may be undefined.)
•V
DD
and V
DDQ
are driven from a single power converter output.
• VTT is limited to 1.44V (reflecting V
DDQ
(max)/2 + 50mV VREF variation + 40mV VTT variation.
•V
REF tracks V
DDQ
/2.
• If the above criteria cannot be met by the system design, then the following sequencing and voltage relation-
ship must be adhered to during power up.
2. Start clock and maintain stable clock for a minimum of 200usec.
3. After stable power and clock, apply NOP condition and take CKE high.
4. Issue Extended Mode Register Set (EMRS) to enable DLL.
5. Issue Mode Register Set (MRS) to reset DLL and set device to idle state with bit A8=high. (An additional 200
cycles(tXSRD) of clock are required for locking DLL)
6. Issue Precharge commands for all banks of the device.
7. Issue 2 or more Auto Refresh commands.
8. Issue a Mode Register Set command to initialize the mode register with bit A8 = Low
Voltage description Sequencing Voltage relationship to avoid latch-up
V
DDQ
After or with V
DD
< V
DD
+ 0.3V
VTT After or with V
DDQ
< V
DDQ
+ 0.3V
VREF After or with V
DDQ
< V
DDQ
+ 0.3V
Rev. 1.0 / June 2008 11
HY5DU281622FT(P)-xI Series
Power-Up Sequence
CODECODE CODE CODECODE
CODECODE CODE CODECODE
CODE CODECODECODECODE
NOP PRE MRSEMRS PRENOP MRSAREF ACT RD
VDD
VDDQ
VTT
VREF
/CLK
CLK
CKE
CMD
DM
ADDR
A10
BA0, BA1
DQS
DQ'S
LVCMOS Low Level
tIS tIH
tVTD
T=200usec tRP tMRD tRP tRFC tMRD
tXSRD*
READ
Non-Read
Command
Power UP
VDD and CK stable Precharge All EMRS Set MRS Set
Reset DLL
(with A8=H)
Precharge All 2 or more
Auto Refresh
MRS Set
(with A8=L)
* 200 cycle(tXSRD) of CK are required (for DLL locking) before Read Command
tMRD
Rev. 1.0 / June 2008 12
HY5DU281622FT(P)-xI Series
MODE REGISTER SET (MRS)
The mode register is used to store the various operating modes such as /CAS latency, addressing mode, burst length,
burst type, test mode, DLL reset. The mode register is programed via MRS command. This command is issued by the
low signals of /RAS, /CAS, /CS, /WE and BA0. This command can be issued only when all banks are in idle state and
CKE must be high at least one cycle before the Mode Re gister Set Comm and can be issued. Two cycles are required to
write the data in mode register. During the MRS cycle, any command cannot be issued. Once mode register field is
determined, the information will be held until reset by another MRS command.
BA1 BA0 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
0 0 Operating Mode CAS Latency BT Burst Length
A2 A1 A0 Burst Length
Sequential Interleave
0 0 0 Reserved Reserved
001 2 2
010 4 4
011 8 8
1 0 0 Reserved Reserved
1 0 1 Reserved Reserved
1 1 0 Reserved Reserved
1 1 1 Reserved Reserved
A3 Burst Type
0Sequential
1Interleave
A6 A5 A4 CAS Latency
000 Reserved
001 Reserved
010 2
011 3
100 4
101 1.5
110 2.5
111 Reserved
BA0 MRS Type
0MRS
1EMRS
A12~A9 A8 A7 A6~A0 Operating Mode
0 0 0 Valid Normal Operation
0 1 0 Valid Normal Operation/ Reset DLL
0 0 1 VS Vendor specific Test Mode
- - - - All other st ates reser ved
Rev. 1.0 / June 2008 13
HY5DU281622FT(P)-xI Series
BURST DEFINITION
BURST LENGTH & TYPE
Read and write accesses to th e DDR SD RAM are bu rst orien ted, wi th the burst length being programmable. The burst
length determines the maximum number of column locations that can be accessed for a given Read or Write com-
mand. Burst lengths of 2, 4 or 8 locations are available for both the sequential and the interleaved burst types.
Reserved states should not be used, as unknown operation or incompatibility with future versions may result.
When a Read or Write command is issued, a block of columns equal to the burst length is effectively selected. All
accesses for that burst take place within this block, meaning that the burst wraps within the block if a boundary is
reached. The block is uniquely selected by A1-Ai when the burst length is set to two, by A2 -Ai when the burst length
is set to four and by A3 -Ai when the burst length is set to eight (where Ai is the most significant column address bit
for a given configuration). The remaining (least significant) address bit(s) is (are) used to select the starting location
within the block. The programmed burst length applies to both Read and Write bursts.
Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the
burst type and is selected via bit A3. The ordering of accesses within a burst is determined by the burst length, the
burst type and the starting column address, as shown in Burst Definition Table
Burst Length Starting Address
(A2,A1,A0) Sequential Interleave
2XX0 0, 1 0, 1
XX1 1, 0 1, 0
4
X00 0, 1, 2, 3 0, 1, 2, 3
X01 1, 2, 3, 0 1, 0, 3, 2
X10 2, 3, 0, 1 2, 3, 0, 1
X11 3, 0, 1, 2 3, 2, 1, 0
8
000 0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7
001 1, 2, 3, 4, 5, 6, 7, 0 1, 0, 3, 2, 5, 4, 7, 6
010 2, 3, 4, 5, 6, 7, 0, 1 2, 3, 0, 1, 6, 7, 4, 5
011 3, 4, 5, 6, 7, 0, 1, 2 3, 2, 1, 0, 7, 6, 5, 4
100 4, 5, 6, 7, 0, 1, 2, 3 4, 5, 6, 7, 0, 1, 2, 3
101 5, 6, 7, 0, 1, 2, 3, 4 5, 4, 7, 6, 1, 0, 3, 2
110 6, 7, 0, 1, 2, 3, 4, 5 6, 7, 4, 5, 2, 3, 0, 1
111 7, 0, 1, 2, 3, 4, 5, 6 7, 6, 5, 4, 3, 2, 1, 0
Rev. 1.0 / June 2008 14
HY5DU281622FT(P)-xI Series
CAS LATENCY
The Read latency or CAS latency is the delay in clock cycles between the registration of a Read command and the
av aila bility of the first burst of output data. The latency can be pr ogrammed 2 or 2.5 clocks for DDR266 /3 33 and 3 or
4 clocks for DDR400 and 400Mbps/pin or 500Mbps/pin product.
If a Read comma nd is registered at clock ed ge n, and the latency is m clocks, the data is av aila ble nominally coinciden t
with clock edge n + m.
Reserved states should not be used as unknown operation or incompatibility with future versions may result.
DLL RESET
The DLL must be enabled f or normal oper ation. DLL enable is requ ired during pow er up init ializat ion, an d upon ret urn-
ing to normal operation after having disabled the DLL fo r the purpose of debug or evaluation. The DLL is automatically
disabled when entering self refresh operation and is automatically re-enabled upon exit of self refresh operation. Any
time the DLL is enabled, 200 clock cycles must occur to allow time for the internal clock to lock to the externally
applied clock before an any command can be issued.
OUTPUT DRIVER IMPEDANCE CONTROL
The normal drive strength for all outputs is specified to be SSTL_2, Class II. Hynix also supports a half strength driver
option, intended for lighter load and/or point-to-point environments. Selection of the half strength driver option will
reduce the output drive strength by 50% of that of the full strength driver. I-V curves for both the full strength driver
and the half strength driver are included in this document.
Rev. 1.0 / June 2008 15
HY5DU281622FT(P)-xI Series
EXTENDED MODE REGISTER SET (EMRS)
The Extended Mode Register controls functions beyond those controlled by the Mode Register; these additional func-
tions include DLL enable/disable, output driver strength se lection(optional). These f unctions are contr olled via the bits
shown below. The Extended Mode Register is programmed via the Mode Register Set command (BA0=1 and BA1=0)
and will retain the stored information until it is programmed again or the device loses power.
The Extended Mode Register mus t be loaded when all banks are idle and no bursts are in progress, and the controller
must wait the specified time before initiating any subsequent operation. Violating either of these requirements will
result in unspecified operation.
BA1 BA0 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
0 1 Operating Mode 0* DS DLL
A0 DLL enable
0Enable
1Disable
BA0 MRS Type
0MRS
1EMRS
A1 Output Driver
Impedance Control
0 Full Strength Driver
1 Half Strength Driver
* This part do not support/QFC function, A2 must be programmed to Zero.
An~A3 A2~A0 Operating Mode
0 Valid Normal Operation
_ _ All other states reserved
Rev. 1.0 / June 2008 16
HY5DU281622FT(P)-xI Series
ABSOLUTE MAXIMUM RATINGS
Note:
Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITIONS (TA=-40 to 85 oC, Voltage referenced to VSS = 0V)
Notes:
1. VDDQ must not exceed the level of VDD.
2. VIL (min) is acceptable -1.5V AC pulse width with < 5ns of duration.
3. V
REF
is expected to be equal to 0.5*VDDQ of the transmitting device, and to track variations in the dc level of the same.
Peak to peak noise on VREF may not exceed ±2% of the DC value.
4. VID is the magnitude of the difference between the input level on CK and the input level on /CK.
Parameter Symbol Rating Unit
Operating Temperature (Ambient) TA-40 ~ 85 oC
Storage Temperature TSTG -55 ~ 150 oC
Voltage on VDD relative to VSS VDD -1.0 ~ 3.6 V
Voltage on VDDQ relative to VSS VDDQ -1.0 ~ 3.6 V
Voltage on inputs relative to VSS VINPUT -1.0 ~ 3.6 V
Voltage on I/O pins relative to VSS VIO -0.5 ~3.6 V
Output Short Circuit Current IOS 50 mA
Soldering Temperature ⋅ Time TSOLDER 260 ⋅ 10 oC ⋅ Sec
Parameter Symbol Min Typ. Max Unit
Power Supply Voltage (DDR200, 266, 333) VDD 2.3 2.5 2.7 V
Power Supply Voltage (DDR200, 266, 333)1VDDQ 2.3 2.5 2.7 V
Power Supply Voltage
(DDR400, 400Mbps/pin or 500Mbps/pin product) VDD 2.4 2.6 2.7 V
Power Supply Voltage
(DDR400, 400Mbps/pin or 500Mbps/pin product)1VDDQ 2.4 2.6 2.7 V
Input High Voltage VIH VREF + 0.15 - VDDQ + 0.3 V
Input Low Voltage2VIL -0.3 - VREF - 0.15 V
Termination Voltage VTT VREF - 0.04 VREF VREF + 0.04 V
Reference Voltage3VREF 0.49*VDDQ 0.5*VDDQ 0.51*VDDQ V
Input Voltage Level, CK and CK inputs VIN(DC) -0.3 - VDDQ+0.3 V
Input Differential Voltage, CK and CK inputs4VID(DC) 0.36 - VDDQ+0.6 V
V-I Matching: Pullup to Pulldown Current Ratio5VI(RATIO) 0.71 - 1.4 -
Input Leakage Current6ILI -2 - 2 uA
Output Leakage Current7ILO -5 - 5 uA
Normal Strength
Output Driver
(VOUT=VTT ±0.84)
Output High Current
(min VDDQ, min VREF, min VTT)IOH -16.8 - - mA
Output Low Current
(min VDDQ, max VREF, max
VTT)IOL 16.8 - - mA
Half Strength Out-
put Driver
(VOUT=VTT ±0.68)
Output High Current
(min VDDQ, min VREF, min VTT)IOH -13.6 - - mA
Output Low Current
(min VDDQ, max VREF, max
VTT)IOL 13.6 - - mA
Rev. 1.0 / June 2008 17
HY5DU281622FT(P)-xI Series
5. The ratio of the pullup current to the pulldown current is specified for the same temperature and voltage, over the entire temper-
ature and voltage r ange, f or devi ce dr ain to source v oltages from 0.25V to 1.0V. For a giv en ou tput , it r eprese nts t he ma ximum dif-
ference between pullup and pulldown drivers due to process variation. The full variation in the ratio of the maximum to minimum
pullup and pulldown current will not exceed 1/7 for device drain to source voltages from 0.1 to 1.0.
6. VIN=0 to VDD, All other pins are no t tested under VIN =0V.
7. DQs are disabled, VOUT=0 to VDDQ
IDD SPECIFICATION AND CONDITIONS (TA=0 to 70 oC, Voltage referenced to VSS = 0V)
Test Conditions
Test Condition Symbol
Operating Current:
One bank; Active - Precharge; tRC=tRC(min); tCK=tCK(min); DQ,DM and DQS inputs changing twice
per clock cycle; address and control inputs changing once per clock cycle IDD0
Operating Current:
One bank; Active - Read - Precharge;
Burst Length=2; tRC=tRC(min); tCK=tCK(min); address and control inputs changing once per clock
cycle
IDD1
Precharge Power Down Standby Current:
All banks idle; Power down mode; CKE=Low, tCK=tCK(min) IDD2P
Idle Standby Current:
/CS=High, All banks idle; tCK=tCK(min);
CKE=High; address and control inputs changing once per clock cycle.
VIN=VREF for DQ, DQS and DM
IDD2F
Idle Quiet Standby Current:
/CS>=Vih(min); All banks idle; CKE>=Vih(min); Addresses and other control inputs stable, Vin=Vref
for DQ, DQS and DM IDD2Q
Active Power Down Standby Current:
One bank active; Power down mode; CKE=Low, tCK=tCK(min) IDD3P
Active Standby Current:
/CS=HIGH; CKE=HIGH; One bank; Active-Precharge; tRC=tRAS(max); tCK=tCK(min);
DQ, DM and DQS inputs changing twice per clock cycle; Address and other control inputs changing
once per clock cycle
IDD3N
Operating Current:
Burst=2; Reads; Continuous burst; One bank active; Address and control inputs changing once per
clock cycle; tCK=tCK(min); IOUT=0mA IDD4R
Operating Current:
Burst=2; Writes; Continuous burst; One bank active; Address and control inputs changing once per
clock cycle; tCK=tCK(min); DQ, DM and DQS inputs changing twice per clock cycle IDD4W
Auto Refresh Current:
tRC=tRFC(min) - 8 *tCK for DDR200 at 100Mhz, 10*tCK f or DDR266A & DDR266B at 133 Mhz; distributed
refresh
tRC=tRFC(min) - 14*tCK for DDR400 at 200Mhz
IDD5
Self Refresh Current:
CKE =< 0.2V; External clock on; tCK=tCK(min) IDD6
Operating Current - Four Bank Operation:
Four bank interleaving with BL=4, Refer to the following page for detailed test condition IDD7
Rev. 1.0 / June 2008 18
HY5DU281622FT(P)-xI Series
DC CHARACTERISTICS II (TA=- 40 to 85 oC, Voltage referenced to VSS = 0V)
8Mx16 (2M x4Bank x16I/O)
Parameter Symbol Test Condition
Speed Unit Note45/ D43/ D4
250 200 MHz
Operating
Current IDD0
One bank; Active - Precharge ; tRC=tRC(min);
tCK=tCK(min) ; DQ,DM and DQS inputs changing twice
per clock cycle; address and control inputs changing
once per clock cycle
130 120 mA
Operating
Current IDD1 One bank; Active - Read - Precharge;
Burst Length=2; tRC=tRC(min); tCK=tCK(min); address
and control inputs changing once per clock cycle 140 120 mA
Precharge
Power Down
Standby
Current
IDD2P All banks idle; Power down mode; CKE=Low,
tCK=tCK(min) 20 10 mA
Idle Standby
Current IDD2N VIN>=VIH(min) or VIN=<VIL(max) for DQ, DQS and
DM 70 60 mA
Idle Standby
Current IDD2F
/CS=High, All banks idle; tCK=tCK(min);
CKE=High; address and control inputs changing once
per clock cycle.
VIN=VREF for DQ, DQS and DM
70 60 mA
Idle Quiet
Standby
Current IDD2Q /CS>=VIH(min); All banks idle; CKE>=VIH(min);
Addresses and other control inputs sta ble, VIN=Vref for
DQ, DQS and DM 70 60 mA
Active Power
Down
Standby
Current
IDD3P One bank active; Power down mode; CKE=Low,
tCK=tCK(min) 20 20 mA
Active
Standby
Current IDD3N
/CS=HIGH; CKE=HIGH; One bank; Active-Precharge;
tRC=tRAS(max); tCK=tCK(min);
DQ, DM and DQS inputs changing twice per clock
cycle; Address and other control inputs changing once
per clock cycle
70 70 mA
Rev. 1.0 / June 2008 19
HY5DU281622FT(P)-xI Series
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Parameter Symbol Test Condition
Speed Unit Note45/ D43/ D4
250 200 MHz
Operating
Current IDD4R Burst=2; Reads; Continuous burst; One bank active;
Address and control inputs changing once per clock
cycle; tCK=tCK(min); IOUT=0mA 210 200
mA
Operating
Current IDD4W
Burst=2; Writes; Continuous burst; One bank active;
Address and control inputs changing once per clock
cycle; tCK=tCK(min); DQ, DM and DQS inputs changing
twice per clock cycle
170 200
Auto Refresh
Current IDD5 tRC=tRFC(min) - 14*t CK for DDR400 at 200Mhz 180 200
Self Refresh
Current IDD6 CKE =< 0.2V; External clock on; tCK=tCK(min) 2 3 mA
Operating
Current -
Four Bank
Operation
IDD7 Four bank interleaving with BL=4, Refer to the
following page for detailed test condition 310 300 mA
Random Read
Current IDD7A
4banks active read with activate every 20ns, AP(Auto
Precharge) read every 20ns, BL=4, tRCD=3, IOUT=0
mA, 100% DQ , DM and DQS in puts changing twice per
clock cycle; 100% addresses changing once per clock
cycle
30 300 mA
Rev. 1.0 / June 2008 20
HY5DU281622FT(P)-xI Series
DC CHARACTERISTICS II (TA=- 40 to 85 oC, Voltage referenced to VSS = 0V)
8Mx16 (2M x4Bank x16I/O)
Parameter Symbol Test Condition
Speed Unit NoteJ K H
133 133 100 MHz
Operating
Current IDD0
One bank; Active - Precharge ; tRC=tRC(min);
tCK=tCK(min) ; DQ,DM and DQS inputs changing twice
per clock cycle; address and control inputs changing
once per clock cycle
110 100 100 mA
Operating
Current IDD1 One bank; Active - Read - Precharge;
Burst Length=2; tRC=tRC(min); tCK=tCK(min); address
and control inputs changing once per clock cycle 110 100 100 mA
Precharge
Power Down
Standby
Current
IDD2P All banks idle; Power down mode; CKE=Low,
tCK=tCK(min) 10 mA
Idle Standby
Current IDD2N VIN>=VIH(min) or VIN=<VIL(max) for DQ, DQS and
DM -mA
Idle Standby
Current IDD2F
/CS=High, All banks idle; tCK=tCK(min);
CKE=High; address and control inputs changing once
per clock cycle.
VIN=VREF for DQ, DQS and DM
50 45 mA
Idle Quiet
Standby
Current IDD2Q /CS>=VIH(min); All banks idle; CKE>=VIH(min);
Addresses and other control inp uts stable, VIN=Vr ef for
DQ, DQS and DM -mA
Active Power
Down
Standby
Current
IDD3P One bank active; Power down mode; CKE=Low,
tCK=tCK(min) 20 mA
Active
Standby
Current IDD3N
/CS=HIGH; CKE=HIGH; One bank; Active-Precharge;
tRC=tRAS(max); tCK=tCK(min);
DQ, DM and DQS inputs changing twice per clock cycle;
Address and other control inputs changing once per
clock cycle
60 50 mA
Rev. 1.0 / June 2008 21
HY5DU281622FT(P)-xI Series
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Parameter Symbol Test Condition
Speed Unit NoteJ K H
133 133 100 MHz
Operating
Current IDD4R Burst=2; Reads; Continuous burst; One bank active;
Address and control inputs changing once per clock
cycle; tCK=tCK(min); IOUT=0mA 160 150
mA
Operating
Current IDD4W
Burst=2; Writes; Continuous burst; One bank active;
Address and control inputs changing once per clock
cycle; tCK=tCK(min); DQ, DM and DQS inputs
changing twice per clock cycle
160 150
Auto Refresh
Current IDD5 tRC=tRFC(min) - 14*tCK for DDR400 at 200Mhz 180 170
Self Refresh
Current IDD6 CKE =< 0.2V; External clock on; tCK=tCK(min) 2 mA
Operating
Current -
Four Bank
Operation
IDD7 Four bank interleaving with BL=4, Refer to the
following page for detailed test condition 250 230 mA
Random Read
Current IDD7A
4banks active read with activate every 20ns, AP(Auto
Precharge) read every 20ns, BL=4, tRCD=3, IOUT=0
mA, 100% DQ, DM and DQS inputs changing twice
per clock cycle; 100% addresses changing once per
clock cycle
-mA
Rev. 1.0 / June 2008 22
HY5DU281622FT(P)-xI Series
DETAILED TEST CONDITIONS FOR DDR SDRAM IDD1 & IDD7
IDD1 : Operating current: One bank operation
1. Typical Case : VDD = 2.6V, T=25 oC
2. Worst Case : VDD = 2.7V, T= 0 oC
3. Only one bank is accessed with tRC(min), Burst Mode, Address and Control inputs on NOP edge are
changing once per clock cycle. lout = 0mA
4. Timing patterns
- DDR400(200Mhz, CL=3) : tCK = 5ns, CL = 3, BL = 4, tRCD = 3*tCK, tRC = 11*tCK, tRAS = 8*tCK
Read : A0 N N R0 N N N P0 N N A0 N - repeat the same timing with random add
Legend : A=Activate, R=Read, W=Write, P=Precharge, N=NOP
IDD7 : Operating current: Four bank operation
1. Typical Case : VDD = 2.6V, T=25 oC
2. Worst Case : VDD= 2.7V, T= 0 oC
3. Four banks are being interleaved with tRC(min), Burst Mode, Address and Control inputs on NOP edge are not
changing. lout = 0mA
4. Timing patterns
- DDR400(200Mhz, CL=3) : tCK = 5ns, CL = 3, BL = 4, tRRD = 2*tCK, tRCD = 3*tCK, Read with autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing
50% of data changing at every burst
Legend : A=Activate, R=Read, W=Write, P=Precharge, N=NOP
Rev. 1.0 / June 2008 23
HY5DU281622FT(P)-xI Series
AC OPERATING CONDITIONS (TA=-40 to 85 oC, Voltage referenced to VSS = 0V)
Notes:
1. V
ID
is the magnitude of the difference between the input level on CK and the input on /CK.
2. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same.
*For more information about AC Overshoot/Undershoot Specifications, refer to “Device Operation” section in hynix website.
AC OPERATING TEST CONDITIONS (TA=-40 to 85oC, Voltage referenced to VSS = 0V)
Parameter Symbol Min Max Unit
Input High (Logic 1) Voltage, DQ, DQS and DM signals VIH(AC) VREF + 0.31 - V
Input Low (Logic 0) Voltage, DQ, DQS and DM signals VIL(AC) - VREF - 0.31 V
Input Differential Voltage, CK and /CK inputs1VID(AC) 0.7 VDDQ + 0.6 V
Input Crossing Point Voltage, CK and /CK inputs2VIX(AC) 0.5*VDDQ-0.2 0.5*VDDQ+0.2 V
Parameter Value Unit
Reference Voltage VDDQ x 0.5 V
Termination Voltage VDDQ x 0.5 V
AC Input High Level Voltage (VIH, min) VREF + 0.31 V
AC Input Low Level Voltage (VIL, max) VREF - 0.31 V
Input Timing Measurement Reference Level Voltage VREF V
Output Timing Measurement Reference Level Voltage VTT V
Input Signal maximum peak swing 1.5 V
Input minimum Signal Slew Rate 1 V/ns
Termination Resistor (RT) 50 Ω
Series Resistor (RS) 25 W
Output Load Capacitance for Access Time Measurement (CL) 30 pF
Rev. 1.0 / June 2008 24
HY5DU281622FT(P)-xI Series
AC CHARACTERISTICS (note: 1 - 9 / AC operating conditions unless otherwise noted)
Parameter Symbol -4 -5 / D43 D4 UNIT
Min Max Min Max Min Max
Row Cycle Time tRC 60 - 55 - 60 - ns
Auto Refre sh Row C ycle Time t RFC 72 - 70 - 70 - ns
Row Active Time tRAS 40 70K 40 70K 40 70K ns
Active to R ead with Auto Precharge
Delay tRAP tRCD or
tRAS(min) -tRCD or
tRAS(min) -tRCD or
tRAS(min) -ns
Row Address to Column Address
Delay tRCD 12 - 15 - 18 - ns
Row Active to Row Active Delay tRRD 12 - 10 - 10 - ns
Column Address to Column
Address Delay tCCD 1-1-1-tCK
Row Precharge Time tRP 20 - 15 - 18 - ns
Write Re covery Time tWR 15 - 15 - 15 - ns
Internal Write to Read Command
Delay tWTR 2-2-2-tCK
Auto Precharge Write Recovery +
Precharge Time22 tDAL (tWR/tCK)
+
(tRP/tCK)-(tWR/tCK)
+
(tRP/tCK)-(tWR/tCK)
+
(tRP/tCK)-t
CK
System Clock
Cycle Time24
CL = 4
tCK
410----
nsCL = 3 - - 5 10 5 10
CL = 2 - - 7.5 12 7.5 12
Clock High Level Width tCH 0.45 0.55 0.45 0.55 0.45 0.55 tCK
Clock Low Level Wid th tCL 0.45 0.55 0.45 0.55 0.45 0.55 tCK
Data-Out edge to Clock edge Skew tAC -0.6 0.6 -0.7 0.7 -0.7 0.7 ns
DQS-Out edge to Clock edge Skew tDQSCK -0.6 0.6 -0.55 0.55 -0.65 0.65 ns
DQS-Out edge to Data-Out edge
Skew21 tDQSQ -0.4-0.4-0.4ns
Data-Out hold time from DQS20 tQH tHP
-tQHS -tHP
-tQHS -tHP
-tQHS -ns
Clock Half Period 19,20 tHP min
(tCL,tCH)-min
(tCL,tCH)-min
(tCL,tCH)-ns
Data Hold Skew Factor20 tQHS -0.5-0.5-0.5ns
Valid Data Output Window tDV tQH - tDQSQ tQH - tDQSQ tQH - tDQSQ ns
Rev. 1.0 / June 2008 25
HY5DU281622FT(P)-xI Series
- Continue
Parameter Symbol J K H UNIT
Min Max Min Max Min Max
Row Cycle Time tRC 60 - 65 - 65 - ns
Auto Refre sh Row C ycle Time tRFC 72 - 75 - 75 - ns
Row Active Time tRAS 42 70K 45 120K 50 120K ns
Active to Read with Auto
Precharge Delay tRAP tRCD or
tRAS(min) -tRCD or
tRAS(min) -tRCD or
tRAS(min) -ns
Row Address to Column
Address Delay tRCD 18 - 20 - 20 - ns
Row Active to Row Active Delay tRRD 12 - 15 - 15 - ns
Column Address to Column
Address Delay tCCD 1-1-1-t
CK
Row Precharge Time tRP 18 - 20 - 20 - ns
Write Re covery Time tWR 15 - 15 - 15 - ns
Internal Write to Read
Command Delay tWTR 1-1-1-t
CK
Auto Precharge Write Recovery
+ Precharge Time22 tDAL (tWR/tCK)
+
(tRP/tCK)-(tWR/tCK)
+
(tRP/tCK)-(tWR/tCK)
+
(tRP/tCK)-t
CK
System Clock
Cycle Time24
CL = 3
tCK
612- - - -
CL = 2.5 6 12 7.5 12 7.5 12 ns
CL = 2 7.5 12 7. 5 12 10 12 ns
Clock High Level Width tCH 0.45 0.55 0.45 0.55 0.45 0.55 tCK
Clock Low Level Wid th tCL 0.45 0.55 0.45 0.55 0.45 0.55 tCK
Data-Out edge to Clock edge
Skew tAC -0.7 0.7 -0.75 0.75 -0.75 0.75 ns
DQS-Out edge to Clock edge
Skew tDQSCK -0.6 0.6 -0.75 0.75 -0.75 0.75 ns
DQS-Out edge to Data-Out
edge Skew21 tDQSQ -0.45- 0.5 - 0.5ns
Data-Out hold time from
DQS20 tQH t
HP
-t
QHS
-t
HP
-t
QHS
-t
HP
-t
QHS
-ns
Clock Half Period 19,20 tHP min
(tCL,tCH)-min
(tCL,tCH)-min
(tCL,tCH)-ns
Data Hold Skew Factor20 tQHS - 0.55 - 0.75 - 0.75 ns
Valid Data Output Window tDV tQH - tDQSQ tQH - tDQSQ tQH - tDQSQ ns
Rev. 1.0 / June 2008 26
HY5DU281622FT(P)-xI Series
- Continue
Parameter Symbol -4 -5 / -D43 -D4 UNIT
Min Max Min Max Min Max
Data-out high-impedance window from CK,/CK10 tHZ -tAC
(Max) -tAC
(Max) -tAC
(Max) ns
Data-out low-impedance window from CK, /CK10 tLZ -0.7 0.7 -0.7 0.7 -0.7 0.7 ns
Input Setup Time (fast slew rate)14,16-18 tIS 0.75 - 0.6 - 0.6 - ns
Input Hold Time (fast slew rate)14,16-18 tIH 0.75 - 0.6 - 0.6 - ns
Input Setup Time (slow slew rate)15-18 tIS 0.7 - 0.7 - 0.7 - ns
Input Hold Time (slow slew rate)15-18 tIH 0.7 - 0.7 - 0.7 - ns
Input Pulse Widt h17 tIPW 2.2 -2.2 -2.2 -ns
Write DQS High Level Width tDQSH 0.4 0.6 0.35 -0.35 -tCK
Write DQS Low Level Width tDQSL 0.4 0.6 0.35 -0.35 -tCK
Clock to First Rising edge of DQS-In tDQSS 0.85 1.15 0.72 1.25 0.72 1.25 tCK
DQS falling edge to CK setup time tDSS 0.3 -0.2 -0.2 -tCK
DQS falling edge hold time from CK tDSH 0.3 -0.2 -0.2 -tCK
DQ & DM input setup time25 tDS 0.4 -0.4 -0.4 -ns
DQ & DM input hold time25 tDH 0.4 -0.4 -0.4 -ns
DQ & DM Input Pulse Width17 tDIPW 1.75 -1.75 -1.75 -ns
Read DQS Preamble Time tRPRE 0.9 1.1 0.9 1.1 0.9 1.1 tCK
Read DQS Postamble Time tRPST 0.4 0.6 0.4 0.6 0.4 0.6 tCK
Write DQS Preamble Setup Time12 tWPRES 0-0-0-ns
Write DQS Preamble Hold Time tWPREH 0.35 -0.25 -0.25 -tCK
Write DQS Postamble Time11 tWPST 0.4 0.6 0.4 0.6 0.4 0.6 tCK
Mode Register Set Delay tMRD 2-2-2-tCK
Exit Self Refresh to non-Read command23 tXSNR 75 -75 -75 -ns
Exit Self Refresh to Read command tXSRD 200 -200 -200 -tCK
Average Periodic Refresh Interval13,25 tREFI -15.6 -15.6 -15.6 us
Rev. 1.0 / June 2008 27
HY5DU281622FT(P)-xI Series
- Continue
Parameter Symbol J K H UNIT
Min Max Min Max Min Max
Data-out high-impedance window from
CK,/CK10 tHZ -t
AC
(Max) -t
AC
(Max) -t
AC
(Max) ns
Data-out low-impedance window from
CK, /CK10 tLZ -0.7 0.7 -0.75 0.75 -0.75 0.75 ns
Input Setup Time (fast slew rate)14,16-18 tIS 0.75 - 0.9 - 0.9 - ns
Input Hold Time (fast slew rate)14,16-18 tIH 0.75 - 0.9 - 0.9 - ns
Input Setup Time (slow slew rate)15-18 tIS 0.8 - 1.0 - 1.0 - ns
Input Hold Time (slow slew rate)15-18 tIH 0.8 - 1.0 - 1.0 - ns
Input Pulse Widt h17 tIPW 2.2 - 2.2 - 2.2 - ns
Write DQS High Level Width tDQSH 0.35 - 0.35 - 0.35 - tCK
Write DQS Low Level Width tDQSL 0.35 - 0.35 - 0.35 - tCK
Clock to First Rising edge of DQS-In tDQSS 0.75 1.25 0.75 1.25 0.75 1.25 tCK
DQS falling edge to CK setup time tDSS 0.2 -0.2-0.2-tCK
DQS falling edge hold time from CK tDSH 0.2 -0.2-0.2-tCK
DQ & DM input setup time25 tDS 0.45-0.5-0.5- ns
DQ & DM input hold time25 tDH 0.45-0.5-0.5- ns
DQ & DM Input Pulse Width17 tDIPW 1.75 - 1.75 - 1.75 - ns
Read DQS Preamble Time tRPRE 0.9 1.1 0.9 1.1 0.9 1.1 tCK
Read DQS Postamble Time tRPST 0.4 0.6 0.4 0.6 0.4 0.6 tCK
Write DQS Preamble Setup Time12 tWPRES 0-0-0-ns
Write DQS Preamble Hold Time tWPREH 0.25 - 0.25 - 0.25 - tCK
Write DQS Postamble Time11 tWPST 0.4 0.6 0.4 0.6 0.4 0.6 tCK
Mode Register Set Delay tMRD 2-2-2-tCK
Exit Self Refresh to non-Read command23 tXSNR 75 - 75 - 75 - ns
Exit Self Refresh to Read command tXSRD 200 - 200 - 200 - tCK
Average Periodic Refresh Interval13,25 tREFI - 15.6 - 15.6 - 15.6 us
Rev. 1.0 / June 2008 28
HY5DU281622FT(P)-xI Series
Notes:
1. All voltages referenced to Vss.
2. Tests for ac timing, IDD, and electrical, ac and dc charact eristics, may be conducted at nominal reference/supply voltage levels,
but the related specifications and device operation are guaranteed for the full voltage range specified.
3. Below figure represents the timing reference load used in defining the relevant timing parameters of the part. It is not intended to
be either a precise representation of the typical system environm ent nor a depiction o f the actual load p resented by a producti on
tester. System designers will use IBIS or other simul a tion tools to correlate the timing reference load to a system environment.
Manufactur ers will correlat e to their product ion test conditio ns (generall y a coaxial tr ansmission line terminated at the tester elec-
tronics).
4. AC timing and IDD tests may use a VIL to VIHswing of up to 1.5 V in the test environment, but input timing is still referenced to
VREF (or to the crossing point for CK, /CK), and parameter specifications are guaranteed for the specified ac input levels unde r
normal use conditions. The minimum slew rate for the input signals is 1 V/ns in the range between VIL(ac) and VIH(ac).
5. The ac and dc input level sp ecifications are as defined in the SSTL_2 Standard (i.e., the receiver will effectively switch as a result
of the signal crossing the ac input level and will remain in that state as long as the signal does not ring back above (below) the
dc input LOW (HIGH) level.
6. Inputs are not recognized as valid until VREF stabilizes. Exception: during the period before VREF stabilizes, CKE < 0.2VDDQ is
recognized as LOW.
7. The CK, /CK input referen ce level (for timing referenced to CK, /CK) is the point at which CK and /CK cross; the input reference
level for signals other than CK, /CK is VREF.
8. The output timing reference voltage level is VTT.
9. Oper at ion or timin g that i s not s pecif ied is illegal and after such an event, in order to guar antee proper operation, the DRAM must
be powered down and then restarted through the specified initialization sequence before normal operation can continue.
10. tHZ and tLZ tr an siti ons oc cur in the same acc ess time win dows as v ali d data transitions. These parameters are not r ef er enced t o
a specific voltage level but specify when the device output is no longer driving (HZ), or begins driving (LZ).
11. The maximum limit for this parameter is not a device limit. The d evice will operate with a greater value for this parameter, but
system performance (bus turnaround) will degrade accordingly.
12. The specific requirement is that DQS be valid (HIGH, LOW, or at some point on a valid transition) on or before this CK edge. A
valid transition is de fined as monotonic and meeting the input slew rate specifications of the device. When no writes were previ-
ously in progress on the bus, DQ S will be transition in g from High-Z to logic LOW. If a previous write was in progress, DQS could
be HIGH, LOW, or transitioning f rom HIGH to LOW at this time, depending on tDQSS.
13. A maximum of eight AUTO REFRESH commands can be posted to any given DDR SDRAM device.
14. For command/address input slew rate ≥1.0 V/ns.
15. For command/address input slew rate ≥0.5 V/ns and ＜1.0 V/ns
16. For CK & /CK slew rate ≥1.0 V/ns (single-ended)
17. These parameters guarantee device ti m ing, but they are not nec essarily tested on each d evice.
They may be guaranteed by device design or tester correlation.
18. Slew Rate is measured between VOH(ac) and VOL(ac).
19. Min (tCL, tCH) r ef ers to th e smaller of the ac tual clo ck l ow time an d the actu al cl ock hi gh t ime as pr ov ided t o the dev ice (i.e. th is
value can be greater than the minimum specification limits for tCL and tCH).
For example, tCL and tCH are = 50% o f the period , less the half period jitter (tJIT(HP)) of the clock source, and less the half
period jitter due to crosst alk (tJIT(crosstalk)) into the clock traces.
Figure: Timing Reference Load
VDDQ
50
Output
(VOUT)
30 pF
Ω
Rev. 1.0 / June 2008 29
HY5DU281622FT(P)-xI Series
20.tQH = tHP - tQHS, where:
tHP = minimum half clock period for any given cycle and is defined by clock high or clock low (tCH, tCL). tQHS accounts for 1) The
pulse duration distortion of on-chip clock circuits; and 2) The worst case p ush--out of DQS on one transitio n foll owed by the
worst case pull--in of DQ on the next transition, both of which are, separately, due to data pin skew and output pattern effects,
and p-channel to n-channel variation of the output drivers.
21. tDQSQ:
Consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers for any given
cycle.
22. tDAL = (tWR/tCK) + (tRP/tCK)
For each of the terms above, if not already an integer, round to the next highest integer.
Example: For DDR266B at CL=2.5 and tCK=7.5 ns
tDAL = ((15 ns / 7.5 ns) + (20 ns / 7.5 ns)) clocks
= ((2) + (3)) clocks
= 5 clocks
23. In all circumstances, tXSNR can be satisfied us ing
tXSNR = tRFCmin + 1*tCK
24. The only time that the clock frequency is allowed to change is durin g self-refresh mode.
25. If refresh timing or tDS/tDH is violated, data corruption may occur and the data must be re-written with valid data bef or e a valid
READ can be executed.
Rev. 1.0 / June 2008 30
HY5DU281622FT(P)-xI Series
SYSTEM CHARACTERISTICS CONDITIONS for DDR SDRAMS
The following tables are described specification parameters that required in systems using DDR devices to ensure
proper performannce. These characteristics are for system simulation purposes and are guaranteed by design.
Input Slew Rate for DQ/DM/DQS (Table a.)
Address & Control Input Setup & Hold Time Derating (Table b.)
DQ & DM Input Setup & Hold Time Derating (Table c.)
DQ & DM Input Setup & Hold Time Derating for Rise/Fall Delta Slew Rate (Table d.)
Output Slew Rate Characteristics (for x16 Device) (Table e.)
Output Slew Rate Matching Ratio Characteristics (Table f.)
AC CHARACTERISTICS DDR400 DDR333 DDR266 UNIT Note
PARAMETER Symbol min max min max min max
DQ/DM/DQS inpu t slew rate
measured between VIH(DC),
VIL(DC) and VIL(DC), VIH(DC) DCSLEW 0.5 4.0 0.5 4.0 0.5 4.0 V/ns 1,12
Input Slew Rate Delta tIS Delta tIH UNIT Note
0.5 V/ns 0 0 ps 9
0.4 V/ns +50 0 ps 9
0.3 V/ns +100 0 ps 9
Input Slew Rate Delta tDS Delta tDH UNIT Note
0.5 V/ns 0 0 ps 11
0.4 V/ns +75 0 ps 11
0.3 V/ns +150 0 ps 11
Input Slew Rate Delta tDS Delta tDH UNIT Note
±0.0 ns/V 00ps10
±0.25 ns/V +50 +50 ps 10
±0.5 ns/V +100 +100 ps 10
Slew Rate Characteristic Typical Range (V/
ns) Minimum (V/
ns) Maximum (V/
ns) Note
Pullup Slew Rate 1.2 - 2.5 1.0 4.5 1,3,4,6,7,8
Pulldown Slew Rate 1.2 - 2.5 1.0 4.5 2,3,4,6,7,8
Slew Rate Characteristic DDR266A DDR266B Note
Parameter min max min max
Output Slew Rate Matching Ratio
(Pullup to Pulldown) - --- 5,12
Rev. 1.0 / June 2008 31
HY5DU281622FT(P)-xI Series
Notes:
1. Pullup slew rate is characterized under the te st conditions as shown in below Figure.
2. Pulldown slew rate is measured under the test conditions sho w n in below Figure.
3. Pullup slew rate is measured between (VDDQ/2 - 320 mV ±250mV)
Pulldown slew rate is measured between (VDDQ/2 + 320mV ±250mV)
Pullup and Pulldown slew r ate c onditions are to be met fo r any pat tern of d ata, includi ng all outp uts switch ing and only one output
switching.
Example: For typical slew, DQ0 is switching
For minimum slew rate, all DQ bits are switching worst case pattern
For maximum slew rate, only one DQ is switching from either high to low, or low to high.
The remaining DQ bits remain the same as for previous state.
4. Evaluation condit io ns
Typical: 25 oC (Ambient), VDDQ = nominal, typical process
Minimum: 70 oC (Ambient), VDDQ = minimum, slow-slow process
Maximum: 0 oC (Ambient), VDDQ = Maximum, fast-fast process
5. The ratio of pullup sl ew r a te to pulldown slew r ate is spec ified f or the same temperature and voltag e, ov er the ent ire tempe rature
and voltage range. F or a giv en output, it r epresents th e maximum differ ence between pullup and pulldown drivers due t o process
variation.
6. Verified under typical conditions for qualification purposes.
7. TSOP-II package devices only.
8. Only intended for operation up to 256 Mbps per pin.
9. A derating factor will be used to increase tIS and tIH in the case where the input slew rate is below 0.5 V/ns as shown in Tab le b .
The Input slew rate is based on the lesser of the slew rates determined by either VIH(AC) to VIL(AC) or VIH(DC) to VIL(DC), sim-
ilarly for rising transitions.
10. A der ating fa ctor will be used t o inc rease tD S and tD H in the case where DQ , DM, and DQS slew rates differ, as shown in Tables c
& d. Input sl ew r ate is bas ed on the lar ger of AC - AC delta rise , fall r ate an d DC -DC delta rise, fall r ate . Input sl ew rat e is based on
the lesser of the slew rates determined by either VIH(AC) to VIL(AC) or VIH(DC) to VIL(DC), similarly for rising transitions. The
delta rise/fall rate is calculated as:
{1/(Slew Rate1)} - {1/(slew Rate2)}
For example:
If Slew Rate 1 is 0.5 V/ ns and Slew Rate 2 is 0.4 V/ns, then the d elta rise, fall rate is -0.5 ns/V. Using the table given, this would
result in the need for an increase in tDS and tDH of 100ps.
11. Table c is used to increase tDS and tDH in the case where the I/O slew rate is below 0.5 V/ns. The I/O slew rate is based on the
lesser of the AC- AC slew r ate and the DC -DC slew r ate. The input slew rate is based on the lesser of the slew rates determined by
either VIH(ac) to VIL(AC) or VIH(DC) to VIL(DC), and similarly for rising transitions.
12. DQS, DM, and DQ input sl ew rate is spec ified to prevent doub le clocking of da ta and preserve setup an d hold times. Si gnal tran-
sitions through the DC region must be monotonic.
50
Output
(VOUT)
VSSQ
Test Point
Figure: Pu llup S lew rate
Ω
VDDQ
50
Test Point
Output
(VOUT)
Figure: Pulldown Slew rate
Ω
Rev. 1.0 / June 2008 32
HY5DU281622FT(P)-xI Series
CAPACITANCE (TA=25oC, f=100MHz)
Note:
1. VDD = min. to max., VDDQ = 2.3V to 2.7V, VODC = VDDQ/2, VOpeak-to-peak = 0.2V
2. Pins not under test are tied to GND.
3. These values are guaranteed by desig n and are tested on a sample basi s only.
OUTPUT LOAD CIRCUIT
Parameter Pin Symbol Min Max Unit
Input Clock Capacitance CK, /CK CI1 2.0 3.0 pF
Delta Input Clock Capacitance CK, /CK Delta CI1 - 0.25 pF
Input Capacitance All other input-only pins CI1 2.0 3.0 pF
Delta Input Capacitance All other input-only pins Delta CI2 - 0.5 pF
Input / Output Capacitance DQ, DQS, DM CIO 4.0 5.0 pF
Delta Input / Output Capacitance DQ, DQS, DM Delta CIO - 0.5 pF
V
REF
V
TT
C
L
= 30pF
Z
O
= 50 Ohm
Out put
R
T
= 50 Ohm
Rev. 1.0 / June 2008 33
HY5DU281622FT(P)-xI Series
PACKAGE INFORMATION
400mil 66pin Thin Small Outline Package
10.26 (0.404)
10.05 (0.396)
11.94 (0.470)
11.79 (0.462)
22.33 (0.879)
22.12 (0.871)
1.194 (0.0470)
0.991 (0.0390)
0.65 (0.0256) BSC 0.35 (0.0138)
0.25 (0.0098)
0.15 (0.0059)
0.05 (0.0020)
BASE PLANE
SEATING PLANE
0.597 (0.0235)
0.406 (0.0160) 0.210 (0.0083)
0.120 (0.0047)
0 ~ 5 Deg.
Unit : m m (Inch)
