DATA SH EET
Product specification
File under Integrated Circuits, IC11 2000 Sep 08
INTEGRATED CIRCUITS
TEA152x family
STARplugTM
2000 Sep 08 2
Philips Semiconductors Product specification
STARplugTM TEA152x family
FEATURES
Designed for general purpose supplies up to 50 W
Integrated power switch:
TEA1520: 48 ; 650 V
TEA1521: 24 ; 650 V
TEA1522: 12 ; 650 V
TEA1523: 6.5 ; 650 V
TEA1524: 3.4 ; 650 V.
Operates from universal AC mains supplies
(80 to 276 V)
Adjustable frequency for flexible design
RC oscillator for load insensitive regulation loop
constant
Valley switching for minimum switch-on loss (not
implemented in TEA152xAJM versions)
Frequency reduction at low power output makes low
standby power possible (<100 mW)
Adjustable overcurrent protection
Under voltage protection
Temperature protection
Short circuit winding protection
Simple application with both primary and secondary
(opto) feedback
Available in 8-pin DIP, 14-pin SO and 9-pin DBS
packages.
GENERAL DESCRIPTION
The TEA152x family is a Switched Mode Power
Supply (SMPS) controller IC that operates directly from
the rectified universal mains. It is implemented in the high
voltage EZ-HV SOI process, combined with a low voltage
BICMOS process. The device includes a high voltage
power switch and a circuit for start-up directly from the
rectified mains voltage.
A dedicated circuit for valley switching is built in (not
implemented in TEA152xAJM versions), which makes a
very efficient slim-line electronic powerplug concept
possible.
Initsmostbasicversionofapplication,theTEA152xfamily
acts as a voltage source. Here, no additional secondary
electronics are required. A combined voltage and current
source can be realized with minimum costs for external
components. Implementation of the TEA152x family
renders an efficient and low cost power supply system.
Table 1 Available type numbers
APPLICATIONS
Typical application areas for the STARplugTM are:
Chargers
Adapters
STB (Set Top Box)
DVD
CD(R)
TV/monitor standby supplies
PC peripherals
Microcontroller supplies in home applications and small
portable equipment, etc.
RDS(on) DIP8 SO14 DBS9P
48 TEA1520P TEA1520T
24 TEA1521P TEA1521T
12 TEA1522P TEA1522T TEA1522AJM
6.5 TEA1523P TEA1523T TEA1523AJM
3.4 TEA1524P TEA1524AJM
2000 Sep 08 3
Philips Semiconductors Product specification
STARplugTM TEA152x family
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Vdrain(max) maximum voltage at the DRAIN
pin Tj>0°C−−650 V
RDS(on) drain-source on-state resistance
of TEA1520 Tj=25°C; Isource =0.06 A 48 55.2
Tj= 100 °C; Isource =0.06 A 68 78.2
drain-source on-state resistance
of TEA1521 Tj=25°C; Isource =0.125 A 24 27.6
Tj= 100 °C; Isource =0.125 A 34 39.1
drain-source on-state resistance
of TEA1522 Tj=25°C; Isource =0.25 A 12 13.8
Tj= 100 °C; Isource =0.25 A 17 19.6
drain-source on-state resistance
of TEA1523 Tj=25°C; Isource =0.5 A 6.5 7.5
Tj= 100 °C; Isource =0.5 A 9.0 10.0
drain-source on-state resistance
of TEA1524 Tj=25°C; Isource =1.0 A 3.4 3.9
Tj= 100 °C; Isource =1.0 A 4.8 5.5
VCC(max) maximum supply voltage −−40 V
fosc frequency range of oscillator 10 100 200 kHz
Idrain supply current drawn from DRAIN
pin no auxiliary supply 1.5 mA
Tamb ambient temperature 20 +85 °C
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TEA152xP DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TEA152xT SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
TEA152xAJM DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length
12/11 mm); exposed die pad SOT523-1
2000 Sep 08 4
Philips Semiconductors Product specification
STARplugTM TEA152x family
BLOCK DIAGRAM
handbook, full pagewidth
MGT419
PROTECTION
LOGIC
LOGIC
SUPPLY
TEA152x VALLEY
POWER-UP
RESET
THERMAL
SHUTDOWN
OSCILLATOR
PWM
stop
low freq
100 mV
0.75 V
0.5 V
blank
short circuit winding
overcurrent
10x
2.5 V
F
1.8 U
1
2
3
4
8
7
6
5
DRAIN
n.c.
GND
SOURCE
AUX
REG
RC
VCC
Fig.1 Block diagram.
The valley switching circuit is not implemented in the TEA152xAJM versions.
The pinning shown in this diagram is the pinning of the DIP8 package. For the pinning of
the other packages, see the relevant pinning tables and pin configurations.
2000 Sep 08 5
Philips Semiconductors Product specification
STARplugTM TEA152x family
PINNING
SYMBOL PIN DESCRIPTION
TEA152xP TEA152xT TEA152xAJM
VCC 1 1 1 supply voltage
GND 22, 3, 4, 5,
9 and 10 2ground
RC 3 6 3 frequency setting
REG 4 7 4 regulation input
SGND −−5
signal ground; connected to exposed die pad; must be
connected to pin 2
AUX 586
input for voltage from auxiliary winding for timing
(demagnetization)
SOURCE 6 11 7 source of internal MOS switch
n.c. 7 12 and 13 8 not connected
DRAIN 8149
drain of internal MOS switch; input for start-up current
and valley sensing
handbook, halfpage
1
2
3
4
8
7
6
5
MGT420
TEA152xP
DRAIN
n.c.GND
SOURCE
AUX
REG
RC
VCC
Fig.2 Pin configuration of TEA152xP.
handbook, halfpage
MGT421
TEA152xT
1
2
3
4
5
6
78
14
13
12
11
10
9
VCC
GND
GND
GND
GND
RC
REG AUX
GND
GND
SOURCE
n.c.
n.c.
DRAIN
Fig.3 Pin configuration of TEA152xT.
handbook, halfpage
VCC
GND
RC
REG
SGND
AUX
SOURCE
n.c.
DRAIN
1
2
3
4
5
6
7
8
9
TEA152xAJM
MGT422
Fig.4 Pin configuration of TEA152xAJM.
2000 Sep 08 6
Philips Semiconductors Product specification
STARplugTM TEA152x family
FUNCTIONAL DESCRIPTION
The TEA152x family is the heart of a compact flyback
converter, with the IC placed at the primary side. The
auxiliary winding of the transformer can be used for
indirect feedback to control the isolated output. This
additional winding also powers the IC. A more accurate
control of the output voltage and/or current can be
implemented with an additional secondary sensing circuit
and optocoupler feedback.
The TEA152x family uses voltage mode control. The
frequency is determined by the maximum transformer
demagnetizing time and the time of the oscillator. In the
first case, the converter operates in the Self Oscillating
Power Supply (SOPS) mode. In the latter case, it operates
at a constant frequency, which can be adjusted with
external components RRC and CRC. This mode is called
Pulse Width Modulation (PWM). Furthermore, a primary
stroke is started only in a valley of the secondary ringing.
This valley switching principle minimizes capacitive
switch-on losses.
Start-up and under voltage lock-out
Initially, the IC is self supplying from the rectified mains
voltage. The IC starts switching as soon as the voltage on
pin VCC passes the VCC(start) level. The supply is taken
over by the auxiliary winding of the transformer as soon as
VCC is high enough and the supply from the line is stopped
for high efficiency operation.
Whenforsomereasontheauxiliarysupplyisnotsufficient,
the high voltage supply also supplies the IC. As soon as
the voltage on pin VCC drops below the VCC(stop) level, the
IC stops switching and restarts from the rectified mains
voltage.
Oscillator
The frequency of the oscillator is set by the external
resistor and capacitor on pin RC. The external capacitor is
charged rapidly to the VRC(max) level and, starting from a
new primary stroke, it discharges to the VRC(min) level.
Because the discharge is exponential, the relative
sensitivity of the duty factor to the regulation voltage at low
duty factor is almost equal to the sensitivity at high duty
factors. This results in a more constant gain over the duty
factor range compared to PWM systems with a linear
sawtooth oscillator. Stable operation at low duty factors is
easily realized. For high efficiency, the frequency is
reduced as soon as the duty factor drops below a certain
value. This is accomplished by increasing the oscillator
charge time.
Duty factor control
The duty factor is controlled by the internal regulation
voltage and the oscillator signal on pin RC. The internal
regulation voltage is equal to the external regulation
voltage (minus 2.5 V) multiplied by the gain of the error
amplifier (typical 20 dB (10 ×)).
Valley switching (not implemented in TEA152xAJM
versions)
A new cycle is started when the primary switch is switched
on (see Fig.5). After a certain time (determined by the
oscillator voltage RC and the internal regulation level), the
switch is turned off and the secondary stroke starts. The
internal regulation level is determined by the voltage on
pin REG. After the secondary stroke, the drain voltage
shows an oscillation with a frequency of approximately
where Lp is the primary self inductance and Cp is the
parasitic capacitance on the drain node.
As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for a low
drain voltage before starting a new primary stroke.
Figure 5 shows the drain voltage together with the valley
signal, the signal indicating the secondary stroke and the
RC voltage.
The primary stroke starts some time before the actual
valley at low ringing frequencies, and some time after the
actual valley at high ringing frequencies. Figure 6 shows a
typical curve for a reflected output voltage N ×Voof 80 V.
This voltage is the output voltage Vo (see Fig.7)
transferred to the primary side of the transformer with the
factor N (determined by the turns ratio of the transformer).
Figure 6 shows that the system switches exactly at
minimum drain voltage for ringing frequencies of 480 kHz,
thus reducing the switch-on losses to a minimum.
At 200 kHz,the next primarystroke is startedat 33°before
the valley. The switch-on losses are still reduced
significantly.
Demagnetization
Thesystemoperatesindiscontinuousconductionmodeall
the time. As long as the secondary stroke has not ended,
the oscillator will not start a new primary stroke. During the
first tsuppr seconds, demagnetization recognition is
suppressed. This suppression may be necessary in
applications where the transformer has a large leakage
inductance and at low output voltages.
1
2π× LpCp
×()×()
----------------------------------------------------
2000 Sep 08 7
Philips Semiconductors Product specification
STARplugTM TEA152x family
handbook, full pagewidth
MGT423
drain
valley
secondary
ringing
secondary
stroke
primary
stroke
secondary
stroke
RC
oscillator regulation level
A
B
Fig.5 Signals for valley switching.
A: Start of new cycle with valley switching.
B: Start of new cycle in a classical PWM system.
handbook, halfpage
0 200 400 800
f (kHz)
phase
(°)
40
20
20
40
0
MGT424
600
Fig.6 Typical phase of drain ringing at switch-on (at N ×Vo= 80 V).
2000 Sep 08 8
Philips Semiconductors Product specification
STARplugTM TEA152x family
Minimum and maximum duty factor
The minimum duty factor of the switched mode power
supply is 0%. The maximum duty factor is set to 75%
(typical value at 100 kHz oscillation frequency).
Overcurrent protection
The cycle-by-cycle peak drain current limit circuit uses the
externalsource resistor to measurethe current. Thecircuit
is activated after the leading edge blanking time tleb. The
protection circuit limits the source voltage to VSRC(max),
and thus limits the primary peak current.
Short circuit winding protection
The short circuit winding protection circuit is also activated
after the leading edge blanking time. If the source voltage
exceeds the short circuit winding protection voltage Vswp,
the IC stops switching. Only a Power-on reset will restart
normal operation. The short circuit winding protection also
protects in case of a secondary diode short circuit.
Overtemperature protection
An accurate temperature protection is provided in the
device. When the junction temperature exceeds the
thermal shutdown temperature, the IC stops switching.
During thermal protection, the IC current is lowered to the
start-up current. The IC continues normal operation as
soon as the overtemperature situation has disappeared.
Overvoltage protection
Overvoltage protection can be achieved in the application
by pulling pin REG above its normal operation level. The
current primary stroke is terminated immediately, and no
new primary stroke is started until the voltage on pin REG
drops to its normal operation level. Pin REG has an
internal clamp. The current feed into this pin must be
limited.
Output characteristics of complete powerplug
OUTPUT POWER
A wide range of output power levels can be handled by
choosing the RDS(on) and package of the TEA152x family.
Power levels up to 50 W can be realised.
ACCURACY
The accuracy of the complete converter, functioning as a
voltage source with primary sensing, is approximately 8%
(mainly dependent on the transformer coupling). The
accuracy with secondary sensing is defined by the
accuracy of the external components. For safety
requirements in case of optocoupler feedback loss, the
primary sensing remains active when an overvoltage
circuit is connected.
EFFICIENCY
An efficiency of 75% at maximum output power can be
achieved for a complete converter designed for universal
mains.
RIPPLE
A minimum ripple is obtained in a system designed for a
maximum duty factor of 50% under normal operating
conditions, and a minimized dead time. The magnitude of
the ripple in the output voltage is determined by the
frequency and duty factor of the converter, the output
current level and the value and ESR of the output
capacitor.
Input characteristics of complete powerplug
INPUT VOLTAGE
Theinputvoltagerangecomprisestheuniversal AC mains
(80 to 276 V).
2000 Sep 08 9
Philips Semiconductors Product specification
STARplugTM TEA152x family
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are measured with respect to
ground; positive currents flow into the device; pins VCC and RC are not allowed to be current driven, pins REG and AUX
are not allowed to be voltage driven.
Notes
1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. All pins are
2500 V maximum, except pin DRAIN, which is 1000 V maximum.
2. Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 series resistor.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Voltages
VCC low supply voltage continuous 0.4 +40 V
VRC oscillator input voltage 0.4 +3 V
Vsource source of the DMOS power transistor voltage 0.4 +5 V
Vdrain drain of the DMOS power transistor voltage 0.4 +650 V
Currents
IREG regulation input current 6mA
I
AUX auxiliary winding input current 10 +5 mA
Isource source current of
TEA1520 0.25 +0.25 A
TEA1521 0.5 +0.5 A
TEA1522 1+1A
TEA1523 2+2A
TEA1524 3+3A
I
drain drain current of
TEA1520 0.25 +0.25 A
TEA1521 0.5 +0.5 A
TEA1522 1+1A
TEA1523 2+2A
TEA1524 3+3A
General
Ptot total power dissipation
TEA152xP Tamb <45°C1.0 W
TEA152xT Tamb <50°C1.0 W
TEA152xAJM Tamb <45°C without heatsink 1.5 W
Tstg storage temperature 55 +150 °C
Tamb ambient temperature 20 +85 °C
Tjjunction temperature 20 +145 °C
Vesd electrostatic discharge voltage human body model; note 1 2500 V
machine model; note 2 200 V
2000 Sep 08 10
Philips Semiconductors Product specification
STARplugTM TEA152x family
THERMAL CHARACTERISTICS
Note
1. Thermal resistance Rth(j-a) can be lower when the GND pins are connected to sufficient copper area on the
printed-circuit board. See the TEA152x application notes for details.
QUALITY SPECIFICATION
In accordance with
“SNW-FQ-611 part E”
.
CHARACTERISTICS
Tamb =25°C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing
into the IC; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient note 1
TEA152xP in free air 100 K/W
TEA152xT in free air 91 K/W
TEA152xAJM in free air 65 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
ICC(operate) supply current normal operation 1.3 1.9 mA
ICC(startup) start-up supply current start-up 180 400 µA
Idrain supply current drawn from DRAIN
pin no auxiliary supply; Vdrain >60V 1.5 2 mA
with auxiliary supply; Vdrain >60V 30 125 µA
ICC(ch) VCC pin charging current Vdrain >60V 643mA
V
CC(start) VCC start voltage 9 9.5 10 V
VCC(stop) VCC stop voltage (under voltage
lock-out) 7.0 7.5 8.0 V
Pulse width modulator
δmin minimum duty factor 0%
δmax maximum duty factor f = 100 kHz 75 %
SOPS
Vdemag demagnetization recognition
voltage level 50 100 150 mV
tsuppr suppression of transformer ringing
at start of secondary stroke 1.0 1.5 2.0 µs
RC oscillator
VRC(min) minimum voltage of RC oscillator
setting 60 75 90 mV
VRC(max) maximum voltage of RC oscillator
setting 2.4 2.5 2.6 V
tRC(ch) RC charging time 1−µs
f
osc frequency range of oscillator 10 100 200 kHz
2000 Sep 08 11
Philips Semiconductors Product specification
STARplugTM TEA152x family
Duty factor regulator (pin REG)
VREG input voltage 2.4 2.5 2.6 V
GV(erroramp) voltage gain of error amplifier 20 dB
VREG(clamp) clamping voltage at pin REG IREG =6mA −−7.5 V
Valley switching (not implemented in TEA152xAJM versions)
dV/dtvalley dV/dt for valley recognition 102 102 V/µs
fvalley ringing frequency for valley
switching N×Vo= 100 V 200 550 800 kHz
td(valley-swon) delay from valley recognition to
switch-on 150 ns
Current and short circuit winding protection
Vsource(max) maximum source voltage dV/dt = 0.1 V/µs 0.47 0.50 0.53 V
td(propagation) delay from detecting VSRC(max) to
switch-off dV/dt = 0.5 V/µs160 185 ns
Vswp short circuit winding protection
voltage dV/dt = 0.5 V/µs 0.7 0.75 0.8 V
tleb blanking time for current and short
circuit winding protection 250 350 450 ns
Output stage (FET)
IL(drain) drain leakage current Vdrain = 650 V −−125 µA
V(BR)drain drain breakdown voltage Tj>0°C 650 −−V
R
DS(on) drain-source on-state resistance
of TEA1520 Tj=25°C; Isource =0.06 A 48 55.2
Tj= 100 °C; Isource =0.06 A 68 78.2
drain-source on-state resistance
of TEA1521 Tj=25°C; Isource =0.125 A 24 27.6
Tj= 100 °C; Isource =0.125 A 34 39.1
drain-source on-state resistance
of TEA1522 Tj=25°C; Isource =0.25 A 12 13.8
Tj= 100 °C; Isource =0.25 A 17 19.6
drain-source on-state resistance
of TEA1523 Tj=25°C; Isource =0.5 A 6.5 7.5
Tj= 100 °C; Isource =0.5 A 9.0 10.0
drain-source on-state resistance
of TEA1524 Tj=25°C; Isource =1.0 A 3.4 3.9
Tj= 100 °C; Isource =1.0 A 4.8 5.5
tdrain(f) drain fall time Vi= 300 V; no external capacitor at
drain 75 ns
Temperature protection
Tprot(max) maximum temperature threshold 150 160 170 °C
Tprot(hys) hysteresis temperature 2−°C
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
2000 Sep 08 12
Philips Semiconductors Product specification
STARplugTM TEA152x family
APPLICATION INFORMATION
Further application information can be found in the TEA152x application notes.
handbook, full pagewidth
MGT425
1
2
3
4
8
7
6
5
TEA152xP
DRAIN
n.c.
GND
SOURCE
AUX
R4
R3
R2
R1 D2
C6 - Ycap
D1
D5
Z1 C5
CF2
LF
CF1
mains
Vo
RAUX
RI
REG
RC
RRC
CRC
CVCC VCC
Fig.7 Primary sensed application; configuration for TEA152xP.
2000 Sep 08 13
Philips Semiconductors Product specification
STARplugTM TEA152x family
PACKAGE OUTLINES
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT97-1 95-02-04
99-12-27
UNIT A
max. 12 b
1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.10 0.30 0.32
0.31 0.39
0.33 0.0450.17 0.020 0.13
b2
050G01 MO-001 SC-504-8
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
2000 Sep 08 14
Philips Semiconductors Product specification
STARplugTM TEA152x family
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 8.75
8.55 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06 MS-012
pin 1 index
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.35
0.34 0.16
0.15 0.050
1.05
0.041
0.244
0.228 0.028
0.024 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
97-05-22
99-12-27
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
2000 Sep 08 15
Philips Semiconductors Product specification
STARplugTM TEA152x family
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
SOT523-1
0 10 mm5
scale
wM
bp
Dh
q1
Z
19
e
e
1m
e
2
x
A
2
non-concave
D1
D
P
kq2
L3
L2
L
Qc
E
98-11-12
00-07-03
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1
view B: mounting base side
B
UNIT bpL1
cD
(1) DhLq
2
mm 2.7
2.3
A2(2)
0.80
0.65 0.58
0.48 13.2
12.8
D1(2)
6.2
5.8 3.5
Eh
3.5
e
2.54
e1
1.27
e2
5.08 4.85
QE(1)
14.7
14.3
Z(1)
1.65
1.10
11.4
10.0
L2
6.7
5.5
L3
4.5
3.7 3.4
3.1 1.15
0.85
q
17.5
16.3
q1
2.8
m
0.8
v
3.8
3.6
3.0
2.0 12.4
11.0
Pk
0.02
x
0.3
w
Eh
L1
q
vM
2000 Sep 08 16
Philips Semiconductors Product specification
STARplugTM TEA152x family
SOLDERING
Introduction
Thistextgivesaverybriefinsighttoa complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Surface mount packages
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board byscreen printing, stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
WAVE SOLDERING
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Sep 08 17
Philips Semiconductors Product specification
STARplugTM TEA152x family
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
MOUNTING PACKAGE SOLDERING METHOD
WAVE REFLOW(1) DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) suitable
Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS not suitable(3) suitable
PLCC(4), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(4)(5) suitable
SSOP, TSSOP, VSO not recommended(6) suitable
2000 Sep 08 18
Philips Semiconductors Product specification
STARplugTM TEA152x family
DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DATA SHEET STATUS PRODUCT
STATUS DEFINITIONS (1)
Objective specification Development This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification Production This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratany other conditions abovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation or warrantythatsuchapplicationswillbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomers usingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyoftheseproducts,conveysnolicenceortitle
under any patent, copyright, or mask work right to these
products,andmakes no representations orwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2000 Sep 08 19
Philips Semiconductors Product specification
STARplugTM TEA152x family
NOTES
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2000 70
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Printed in The Netherlands 613502/01/pp20 Date of release: 2000 Sep 08 Document order number: 9397 750 07242