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105170.R5 4/05 www.protekdevices.com
UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
Only One Name Means ProTek’Tion™
U0408
(Single Chip Shown)
05170
PIN CONFIGURATION
APPLICATIONS
✔ Cellular Phones
✔ Personal Digital Assistant (PDA)
✔ Notebook Computers
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Low Clamping Voltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 4 to 7 Lines
✔
LOW CAPACITANCE
✔
LOW LEAKAGE CURRENT
✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0408
✔ Weight 0.73 milligrams (Approximate)
✔ Solder Reflow Temperature:
Tin-Lead: 240-245°C
Lead-Free: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
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DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
Operating Temperature
SYMBOL VALUE
-55°C to 150°C°C
°C
-55°C to 150°C
UNITS
TJ
TSTG
PARAMETER
Storage Temperature
Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 200 Watts
0 5 10 15 20 25 30
t - Time - µs
0
20
40
60
80
100
120
IPP - Peak Pulse Current - % of IPP
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
tfPeak Value IPP
e-t
td = t IPP/2
FIGURE 2
PULSE WAVE FORM
0.01 1 10 100 1,000 10,000
td - Pulse Duration - µs
10
100
1,000
10,000
PPP - Peak Pulse Current - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
200W, 8/20µs Waveform
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IP = 1A
VC
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20µs
VC @ IPP
TYPICAL
CAPACITANCE
@0V, 1 MHz
C
pF
ULC0408FC3.3C
ULC0408FC05C
ULC0408FC08C
ULC0408FC12C
ULC0408FC15C
ULC0408FC24C
ULC0408FC36C
3.3
5.9
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
11.0
13.2
19.8
25.4
37.2
70.0
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
80.0V @ 2.5A
70
35
32
30
25
20
18
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@VWM
ID
µA
75*
10**
1
1
1
1
1
RATED
STAND-OFF
VOLTAGE
VWM
VOLTS
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
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GRAPHS
0 5 10 15 20
VC - Clamping Voltage - Volts
0
4
8
12
14
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR ULC0408FC05C
10
6
2
IPP - Peak Pulse Current - Amps
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR ULC0408FC05C
5 Volts per Division
-5
5
15
25
35
0 25 50 75 100 125 150
TL - Lead Temperature - °C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20µs
Average Power
FIGURE 3
POWER DERATING CURVE
0
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Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
TS - Preheat
TSMAX
TSMIN
TL
t 25°C to Peak
30-60 seconds
Temperature - °C
TP
155°
140°
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
REQUIREMENTS
Temperature:
TP for Lead-Free (SnAgCu): 260-265°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
APPLICATION INFORMATION
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PACKAGE OUTLINE & DIMENSIONS
A
B
C
E
F
I
0.56 NOM
0.86 NOM
0.99 ± 0.0254
0.15 SQ
2.0 ± 0.0254
0.406 NOM
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.079 ± 0.001
0.016 NOM
DIM MILLIMETERS INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
PACKAGE OUTLINE
MOUNTING PAD LAYOUT - Option 1
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
NOTE:
1.
Preferred:
Using 0.1mm (0.004”) stencil.
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
PAD DIMENSIONS
DIM MILLIMETERS INCHES
Outline & Dimensions: Rev 3 - 2/04, 06026
C
SOLDER PRINT 0.010” - 0.012” DIA.
A
H
D
I
SOLDER PADS
F
G
E
SOLDER
MASK
DIE
SOLDER
CONTACT
Metalized Die Contact
E
F
I
SIDE
A
B
C
TOP
END
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PACKAGE OUTLINE & DIMENSIONS
A
F
G
H
I
0.51
0.15 SQ
0.71
0.99
0.51
0.020
0.006 SQ
0.028
0.039
0.020
DIM MILLIMETERS INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3.
Preferred:
Using 0.1mm (0.004”) stencil.
MOUNTING PAD LAYOUT - Option 2
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., ULC0408FC05C-T75-1).
3.
8mm Paper Tape:
7 Inch Reels -5,000
pieces per reel. Ordering Suffix: -T75-2
(i.e., ULC0408FC05C-T75-2).
Outline & Dimensions: Rev 3 - 2/04, 06026
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
TAPE & REEL ORIENTATION
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
Quad Die - 0408
COPPER CONTACT 0.009” [0.23] DIA.
SOLDER PRINT 0.014” [0.36] DIA.
A
H
I
F
G
SOLDER
MASK
DIE
SOLDER
CONTACT
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
