GI820 thru GI828
Vishay Semiconductors
for merly General Semiconductor
Document Number 88629 www.vishay.com
21-Mar-02 1
Fast Switching Rectifier Reverse V oltage 500 to 800 V
Forward Current 5.0 A
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol GI820 GI821 GI822 GI824 GI826 GI828 Unit
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 V
Maximum RMS voltage VRMS 35 70 140 280 420 560 V
Maximum DC blocking voltage VDC 50 100 200 400 600 800 V
Maximum non-repetitive peak reverse voltage VRSM 75 150 250 450 650 880 V
Maximum average forward rectified current
0.375" (9.5mm) lead length at TA=55°C IF(AV) 5.0 A
Peak forward surge current
8.3ms single half sine-wave superimposed on IFSM 300 A
rated load (JEDEC Method)
Typical ther mal resistance (1) RΘJA 10 °C/W
Operating junction and storage temperature range TJ, TSTG -50 to +150 °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Maximum instantaneous forward voltage
at 5.0A TJ=25°C VF1.10 V
at15.7A TJ=100°C 1.05
Maximum DC reverse current TA=25°C 10
at rated DC blocking voltage TA=100°C IR1.0 µA
Typical junction capacitance at 4.0V, 1MHz CJ300 pF
Maximum reverse recovery time
IF=1.0A, VR=30V, di/dt=50A/µs, Irr = 10% IRM trr 200 ns
Maximum reverse recovery current
IF=1.0A, VR=30V, di/dt=50A/µs, IRM(REC) 2.0 ns
Notes:
(1) Thermal resistance from junction to ambient at 0.375” (9.5mm) lead length, P.C.B. mounted
Features
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• High surge current capability
• High forward current operation
• Fast switching for high efficiency
• Construction utilizes void-free molded plastic technique
• Unifor m molded body
• High temperature soldering guaranteed:
250°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
Mechanical Data
Case: Void-free molded plastic body
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.07 oz., 2.1 g
Packaging codes/options:
1/750 EA. per Bulk Box
4/800 EA. per 13" Reel (52mm Tape)
23/300 EA. per Ammo Box (52mm Tape)
0.052 (1.32)
0.048 (1.22)
0.360 (9.1)
0.340 (8.6)
DIA.
1.0 (25.4)
MIN.
0.360 (9.1)
0.340 (8.6)
1.0 (25.4)
MIN.
Case Style P600
Dimensions in inches and (millimeters)
GI820 thru GI828
Vishay Semiconductors
for merly General Semiconductor
www.vishay.com Document Number 88629
221-Mar-02
Ratings and
Characteristic Curves(TA= 25°C unless otherwise noted)
Ambient Temperature (°C)
Fig. 1 – Forward Current
Derating Curves
Average Forward Current (A)
Fig. 3 – Maximum Non-Repetitive
Peak Forward Surge Current
Number of Cycles at 60 HZ
Peak Forward Surge Current (A)
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Fig. 4 – Typical Instantaneous
Forward Characteristics
Fig. 5 – Typical Reverse
Characteristics
Lead Temperature °C
Percent of Rated Peak Reverse Voltage (V)
Fig. 2 – Forward Current
Derating Curve
Average Forward Current (A)
Instantaneous Reverse Current (µA)
Fig. 6 – Typical Thermal Resistance
Equal Lead Lengths to Heatsink (Inches)
RθJL Thermal Resistance From Junction
to Lead, °CW
20 40 60 80 100 120 140 160 180
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
75 80 85 90 95 100 105 110 115 120 125
0
4
8
12
16
20
110 100
100
150
200
250
300
350
400
8.3ms Single Half Sine-Wave
(JEDEC Method)
0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0.1
1
10
100
Pulse Width = 300µs
1% Duty Cycle
TJ = 25°C
020 40 60 80 100
0.01
0.1
1
10
TJ = 100°C
TJ = 25°C
TJ = 50°C
00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
0
5.0
10
15
20
25
L = 0.375" (9.5mm)
L = 0.62" (15.9mm)
Capacitive Load
5.0
10
20
=
I(pk)
I(AV)
TA = 25°C
TJ= 125°C
1.1 x 1.1" (30 x 30mm)
Copper Pads
I(pk)
I(AV) = π
1.6 x 1.6 x 0.04"
(40 x 40 x 1mm)
Copper Heatsink
L = Lead Length
Resistive or Inductive Load
L = 0.12" (3.2mm)
L = 0.25" (6.3mm)
L = Lead Length
