2004 Microchip Technology Inc. DS21109F-page 1
37LV36/65/128
FEATURES
Operati onally equi valen t to Xil inx XC 1700 f amily
Wide voltage range 3.0 V to 6.0 V
Maximum read current 10 mA at 5.0 V
Standby cu rrent 100 µA typical
Industry standard Synchronous Serial Interface/
1 bit per rising edge of clock
Full Static Operation
Seque nti al Read/ Program
Cascadable Output Enable
10 MHz Maximum Cl ock Rate @ 5.0 Vdc
Programmable Polarity on Hardware Reset
Programming with industry standard EPROM pro-
grammers
Electrostatic discharge protection > 4,000 volts
8-pin PDIP/SOIC and 20-pin PLCC packages
Data Retention > 200 years
Temperature ranges:
- Commercial: 0°C to +70°C
- Industrial: -40°C to +85°C
DESCRIPTION
The Microchip Technology Inc. 37LV36/65/128 is a
family of Serial OTP EPROM devices organized inter-
nally in a x32 configuratio n. Th e fam il y al so feat ures a
cascadable option for increased memory storage
where needed. The 37LV36/65/128 is suitable for
many applications in which look-up table information
storage i s desirab le and prov ides full static operation i n
the 3.0V to 6.0V VCC range. The devices also support
the industry standard serial interface to the popular
RAM-ba sed Fiel d Programmab le Gate Array s (FPGA).
Advance d CM OS te chnol ogy m akes thi s an ideal boot-
strap solution for today's high speed SRAM-based
FPGAs. The 37LV36/65/128 family is available in the
standard 8-pin plastic DIP, 8-pin SOIC and 20-pin
PLCC pac k age s.
Device Bits Programming Word
37LV36 36,288 1134 x 32
37LV65 65,536 2048 x 32
37LV128 131,072 4096 x 32
PACKAGE TYPES
BLOCK DIAGRAM
CLK
R
ESET/OE
CE CEO
VPP
Vss
9
10
11
12
13
3
2
1
20
19
18
17
16
15
14
4
5
6
7
8
V
CC
DATA
1
2
3
4
8
7
6
5
VCC
VPP
CEO
VSS
DATA
CLK
R
ESET/OE
CE
1
2
3
4
8
7
6
5
DATA
CLK
R
ESET/OE
CE
VCC
VPP
CEO
VSS
PDIP
37LV36
37LV65
37LV128
SOIC
PLCC
37LV36
37LV65
37LV128
37LV36
37LV65
37LV128
36K, 64K, and 128K Serial EPROM Family
Xilinx is a registered trademark of Xilinx Corporation.
Obsolete Device
37LV36/65/128
DS21109F-page 2 2004 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
1.1 Maximum Ratings*
VCC and input voltages w.r.t. VSS..........-0.6V to +0.6V
VPP voltage w.r.t. VSS during
programming......................................-0.6V to +14.0V
Output voltage w.r.t. VSS .......... ..... .-0.6V to VCC +0.6V
Storage temperature ..........................-65°C to +150°C
Ambient temp. with power applied.....-65°C to +125°C
Soldering temperature of leads (10 sec.).........+300°C
ESD protection on all pins ..................................... 4 kV
*Notice: Stresses above those listed under “Maximum Ratings”
may cause per mane nt damage t o the devic e. This is a stre ss rat-
ing only and functional operation of the device at those or any
other conditions above those indicated in the operation listings of
this spe cification is not implied . Exposure to maximum rating con-
ditio ns for extended pe riods may affect device reliability.
TABLE 1-1: PIN FUNCTION TABLE
Name Function 8 20
DATA Data I/O 1 2
CLK Clock Input 2 4
RESET/OE Reset Input and Output
Enable 36
CE Chip Enable Input 4 8
VSS Ground 5 10
CEO Chip Enable Output 6 14
VPP Programmi ng Voltage Supply 7 17
VCC +3.0V to 6.0V Power Supply 8 20
Not Labeled Not utilized, not connected
TABLE 1-2: READ OPERATION DC CHARACTERISTICS
VCC = +3.0 to 6.0V
Commercial (C): Tamb = 0°C to +70°C
Industrial (I): Tamb = -40°C to +85°C
Parameter Symbol Min. Max. Units Conditions
DATA, CE, CEO and Res et p ins :
High level input voltage
Low level input voltage
High lev el outp ut vol t ag e
Low level output voltage
VIH
VIL
VOH1
VOH2
VOL
2.0
-0.3
3.86
2.4
VCC
0.8
.32
V
V
V
V
IOH = -4 mA VCC 4.5 V
IOH = -4 mA VCC 3.0 V
IOL = 4.0 mA
Input Leakage ILI -10 10 µAVIN = .1V to VCC
Output Lea ka ge ILO -10 10 µAVOUT = .1V to VCC
Input Capacitance
(all inputs/outpu ts) CINT 10 pF Tamb = 25°C; FCLK = 1 MHz (Note 1)
Operati ng Curren t ICC Read
10
2mA
mA VCC = 6.0V, CLK = 10 MHz
VCC = 3.6V, CLK = 2.5 MHz
Outputs open
Standby Current ICCS —100
50 µA
µAVCC = 6.0V, CE = 5.8V
VCC = 3.6V, CE = 3.4V
Note 1: This parameter is initially characterized and not 100% tested.
2004 Microchip Technology Inc. DS21109F-page 3
37LV36/65/128
2.0 DATA
2.1 Data I/O
Three-state DATA output for reading and input during
programming.
3.0 CLK
3.1 Clock Input
Used to increment the internal address and bit counters
for reading and programming.
4.0 RESET/OE
4.1 Reset Input and Output Enable
A LOW level on both the CE and RESET/OE inputs
enables the data output driver. A HIGH level on
RESET/OE resets both the address and bit counters.
In the 37LVXXX, the logic polarity of this input is pro-
grammable as either RESET/OE or OE/RESET. This
document describes the pin as RESET/OE although
the opposite polarity is also possible. This option is
defined and set at device program time.
5.0 CE
5.1 Chip Enable Input
CE is used for device selection. A LOW level on both
CE and OE enables the data output driver. A HIGH
level on C E disa ble s both the add res s and bi t c ou nte rs
and forces the device into a low power mode.
6.0 CEO
6.1 Chip Enable Output
This signal is asserted LOW on the clock cycle follow-
ing the last bit read from the memory. It will stay LOW
as long as CE and OE are both LOW. It will then follow
CE until OE goes HIGH. Thereafter, CEO will stay
HIGH until the entire EPROM is read again. This pin
also used to sense the status of RESET polarity when
Programming Mode is entered.
7.0 VPP
7.1 Programming Voltage Supply
Used to enter programming mode (+13 volts) and to
program the memory (+13 volts). Must be connected
directly to Vcc for normal Read operation. No over-
shoot above +14 volts is permitted.
8.0 CASCADING SERIAL EPROMS
Cascading Serial EPROMs provide additional memory
for multiple FPGAs configured as a daisy-chain, or for
future applications requiring larger configuration mem-
ories.
When the last bit from the first Serial EPROM is read,
the next clock signal to the Serial EPROM asserts its
CEO outpu t LOW a nd dis ables it s DATA line. The sec-
ond Serial EPR OM recognizes the LO W level on its CE
input and enables its DATA output.
When configuration is complete, the address counters
of all cascaded Serial EPROMs are reset if RESET
goes LOW forcing the RESET/OE on each Serial
EPROM to go HIGH. If the a ddress co unters are not to
be reset upon completion, then the RESET/OE inputs
can be tied to ground.
Addition al logic ma y be requ ired i f cas caded memo ries
are so large that the rippled chip enable is not fast
enough to activat e succ essive Serial EPROMs.
9.0 STANDBY MODE
The 37LVXXX enters a low-power Standby Mode
whenever CE is HIGH. In Standby Mode, the Serial
EPROM consumes less than 100 µA of current. The
output will remain in a high-i mpedance state rega rdless
of the state of the OE input.
10.0 PROGRAMMING MODE
Programming Mode is entered by holding VPP HIGH
(+13 volts) for two clock edges and then holding VPP =
VDD for one clock edge. Programming mode is exited
by dr iving a LOW on both CE and OE and then remov-
ing power from the device. Figures 4 through 7 show
the programming alg orithm.
11.0 37LVXXX RESET POLARITY
The 37LVXXX lets the us er choose the rese t polarity as
either RESET/OE or OE/RESET. Any third-party com-
mercial programmer should prompt the user for the
desired reset polarity.
The programming of the overflow word should be han-
dled transparently by the EPROM programmer; it is
mentioned here as supplemental information only.
The polarity is programm ed in to the first ov erfl ow wo rd
location, maximum address+1. 00000000 in these
locations makes the reset active LOW, FFFFFFFF in
these locations makes the reset active HIGH. The
default condition is RESET active HIGH.
37LV36/65/128
DS21109F-page 4 2004 Microchip Technology Inc.
FIGURE 11-1: READ CHARACTERISTICS TIMING
TABLE 11-1: READ CHARACTERISTICS
AC Testing Waveform: VIL = 0.2V; VIH = 3.0V
AC Test Load: 50 pF
VOL = V OL_MAX; VOH = VOH_MIN
Symbol Parameter
Limits 3.0V
Vcc 6.0V Limits 4.5V
Vcc 6.0V Units Conditions
Min. Max. Min. Max.
TOE OE to Data Delay 45 45 ns
TCE CE to Data Delay 60 50 ns
TCAC CLK to Data Delay 200 60 ns
TOH Data Hold from CE, OE or CLK 0 0 ns
TDF CE or OE to Data Float Delay 50 50 ns Notes 1, 2
TLC CLK Low Time 100 25 ns
THC CLK High Time 100 25 ns
TSCE CE Set up Time to CLK
(to guarantee proper counting) 40 25 ns Note 1
TSCED CE setup time to CLK
(to guarantee proper DATA read) 100 80 ns
THCE CE Hold Time to CLK
(to guarantee proper counting) 0 0 ns Note 1
THCED CE hold time to CLK
(to guarantee proper DATA read) 50 0 ns
THOE OE High Time
(Guarantees counters are Reset) 100 20 ns
CLK max Clock Frequency 2.5 10 MHz
Note 1: This parameter is periodically sampled and not 100% tested.
2: Float delays are measured with output pulled through 1k to VLOAD = VCC/2.
2004 Microchip Technology Inc. DS21109F-page 5
37LV36/65/128
FIGURE 11-2: READ CHARACTERISTICS AT END OF ARRAY TIMING
TABLE 11-2: READ CHARACTERISTICS AT END OF ARRAY
AC Testing Waveform: VIL = 0.2V; VIH = 3.0V
AC Test Load: 50 pF
VOL = VOL_MAX; VOH = VOH_MIN
Symbol Parameter
Limit s 3.0V Vcc
6.0V Limits 4.5V Vcc
6.0V Units Conditions
Min. Max. Min. Max.
TCDF CLK to Data Float Delay 50 50 ns Notes 1, 2
TOCK CLK to CEO Delay 65 40 ns
TOCE CE to CEO Delay 45 40 ns
TOOE RESET/OE to CEO Delay 45 40 ns
Note 1: This parameter is periodically sampled and not 100% tested.
2: Float delays are measured with output pulled through 1k to VLOAD = VCC/2.
37LV36/65/128
DS21109F-page 6 2004 Microchip Technology Inc.
TABLE 11-3: PIN ASSIGNMENTS IN THE PROGRAMMING MODE
DIP/SOIC
Pin PLCC Pin Name I/O Description
1 2 DATA I/O The rising ed ge of t he clock s hi ft s a d at a word in or ou t of the
EPROM one bit at a time.
2 4 CLK I Clock Input. Used to increment the internal address/word
counter for reading and programming operation.
3 6 RESET/OE I The rising edge of CLK shifts a data word into the EPROM
when CE and OE are HIGH; it shifts a data word out of the
EPROM when CE is LOW and OE is HIGH. The address/
word counter is incremented on the rising edge of CLK while
CE is held HIGH and OE is held LOW.
Note 1: Any modified polarity of the RESET/OE pin is
ignored in the programming mo de.
48CEI The rising edge of CLK shifts a data word into the EPROM
when CE and OE are HIGH; it shifts a data word out of the
EPROM when CE is LOW and OE is HIGH. The address/
word counter is incremented on the rising edge of CLK while
CE is held HIGH and OE is held LOW.
510V
SS Ground pin.
614CEO
O The polarity of the RESET/OE pi n can be read by sens ing the
CEO pin.
Note 1: The polarity of the RESET/OE pin i s ignored w hile in
the Programming Mode. In final verification, this pin
must be monitored to go LOW one clock cycle after
the last data bit has been read.
717VPP Programm ing V oltage Supply . Prog ramming Mode is e ntered
by ho lding CE and OE HIGH and VPP at VPP1 for two rising
clock edges and then lowering VPP to VPP2 for one more ris-
ing cloc k edge. A word is programmed by strobing the devi ce
with VPP for the duratio n TPGM . V PP must be tied to VCC for
normal read operation.
820V
CC +5 V power supply input.
2004 Microchip Technology Inc. DS21109F-page 7
37LV36/65/128
TABLE 11-4: DC PROGRAMMING SPECIFICATIONS
TABLE 11-5: AC PROGRAMMING SPECIFICATIONS (SEE NOTE 2)
Symbol Parameter Ambient Temperature: Tamb = 25°C ±5°CLimits Units
Min. Max.
VCCP Supply voltage du ring programming 5.0 6.0 V
VIL Low-level input voltage 0.0 0.5 V
VIH High-level input voltage 2.4 VCC V
VOL Low-level output voltage 0.4 V
VOH High-level output voltage 3.7 V
VPP1 Programming voltage* 12.5 13.5 V
VPP2 Programming Mode access voltage VCCP VCCP+1 V
IPPP Supply current in Programming Mode 100 mA
ILInput or output leakage current -10 10 µA
VCCL First pass Low-level supply voltage for final verification 2.8 3.0 V
VCCH Second pass High-level supply voltage for final verification 6.4 6.6 V
* No overshoot is permitted on this signal. VPP must not be allowed to exceed 14 volts.
Symbol Parameter Limits Units Conditions
Min. Max.
TRPP 10% to 90% Rise Time of VPP 1µsNote 1
TFPP 90% to 10% Fall Time of VPP 1µsNote 1
TPGM VPP Programming Pulse Width .50 1.05 ms
TSVC VPP Setup to CLK for Entering Programming Mode 100 ns Note 1
TSVCE CE Setup to CLK for Entering Programming Mode 100 ns Note 1
TSVOE OE Setup to CLK for Entering Programming Mode 100 ns Note 1
THVC VPP Hold from CLK for Entering Programming Mode 300 ns Note 1
TSDP Data Setup to CLK for Programming 50 ns
THDP Data Hold from CLK for Programming 0 ns
TLCE CE Low time to clear data latches 100 ns
TSCC CE Setu p to C LK for Pro gramming/Verifying 100 ns
TSIC OE Setup to CLK for Incrementing Address Counter 100 ns
THIC OE Hold from CLK for Incrementing Address Counter 0 ns
THOV OE Hold from VPP 200 ns Note 1
TPCAC CLK to Data Valid 400 ns
TPOH Data Hold from CLK 0 ns
TPCE CE Low to Da ta Valid 250 ns
Note 1: This parameter is periodically sampled and not 100% tested.
Note 2: While in Pro gramming Mode, CE should o nly be changed while O E is HIG H and has bee n HIGH for 200 ns,
and OE should only be changed while CE is HIGH and has been HIGH for 200 ns.
37LV36/65/128
DS21109F-page 8 2004 Microchip Technology Inc.
FIGURE 11-3: ENTER AND EXIT PROGRAMMING MODES
FIGURE 11-4: PROGRAMMING CYCLE OVERVIEW (NO VERIFY UNTIL ENTIRE ARRAY IS
PROGRAMMED)
FIGURE 11-5: DETAILS OF PROGRAM CYCLE
VCC
VPP
VPP2
VPP1
VCCP
TRPP TFPP
TSVC THVC TSVC
TSVCE
TSVOE
CLK
DATA
CE
RESET/OE
Enter Mode Exit Mode
**
32 Clocks
*Note: The CEO pin is high impedance when V
PP
= V
PP
1
High if RESET/OE configured
Low if RESET/OE configured
2 CLKS **Load
Word 1 **Load
Word 2 **Load
Word 3 **Load
Word 4 **Load
Word 5
CE low to clear
data latches Clock Increments
Address Counter
Enter
Programming
Mode
500 µs
Programming
Mode
500 µs
Programming
Mode
500 µs
Programming
Mode
500 µs
Programming
Mode
V
PP
= V
PP2
V
CC
= V
CCP
V
PP1
V
CC
V
PP
CLK
CE
RESET/OE
CEO **** *
2004 Microchip Technology Inc. DS21109F-page 9
37LV36/65/128
FIGURE 11-6: READ MANUFACTURER AND DEVICE ID OVERVIEW
FIGURE 11-7: DETAILS OF READ MANUFACTURER AND DEVICE ID
37LV36/65/128
DS21109F-page 10 2004 Microchip Technology Inc.
FIGURE 11-8: 37LVX XX PROGRAMM ING SPECIFICATIONS
Device Passed
Device Fai lu re
1st Pass? Verify
All Data Bits (Read Mode)
VCC = VPP = VCCL and
VCC = VPP = VCCH
Exit Programming Mo de
Device Power Off
Device Power On
Pulse VPP to VPP1
(13V) for Tpgm
(500 µs)
Load 32-bit word to be
programmed
CE low to clear
EPROM internal data
latches
32 bit data word to be
programmed =
FFFFFFFFhex
Last Word?
Increment Address
Counter
Device Power Of f
Device Power On
Check Device ID
Start
Enter Programm ing Mode
1. VCC = VCCP VPP = VPP2 CE = OE = VIH
2. VPP = VPP1 for 2 CLK Rising Edges
3. VPP = VPP2 for 1 CLK Rising Edge
Pass
No
Fail
Yes
No
Yes
No
Yes
37LV36/65/128
2004 Microchip Technology Inc. DS21109F-page 11
37LV36/65/128 Product Identificatio n System
To order or to obtain information, e.g., on pricing or delivery, please us e the listed part numbers, and refe r to the factory or the listed
sales offices.
Package: P = Plastic DIP, 8 lead
SN = Plastic SOIC (150 mil Body), 8 lead
L = Plastic Leaded Chip Carrier (PLCC), 20 lead
Temperature Blank = 0°C to +70°C
Range: I=-40°C to +85°C
Shipping: Blank = Tube
T = Tape and Reel
Device: 37LV128 128K Serial EPROM
37LV65 64K Serial EPROM
37LV36 36K Serial EPROM
37LV36/65 /12 8 I T /P
37LV36/65/128
DS21109F-page 12 2004 Microchip Technology Inc.
NOTES:
2004 Microchip Technology Inc. DS21109F-page 13
Information contained in this publication regarding device
applications and the like is intended through sug gestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microc hip Technology Incorporat ed with respect
to the accuracy or use of such inf orm ation, or inf ringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICST ART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, MX DE V, MXLAB, PICMASTER, SEEV AL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPI C, Migra table Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB , rfPICD EM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microchip are committed to continuously improving t he c ode protect ion f eatures of our
products. Attempts to break Microchip’ s code protection f eature may be a violati on of t he Digit al Millennium Copyright Act. If such act s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MC Us, KEELOQ® code hopping
devices, Serial EEPROMs, micro peripherals, nonvolat ile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
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Taiwan
Taiwan Branch
11F-3, No. 207
Tung H ua Nort h Ro ad
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Taiwan
Taiwan Branch
13F-3, No. 295, Sec. 2, Kung Fu Road
Hsinchu City 300, Taiwan
Tel: 886-3-572-9526
Fax: 886-3-572-6459
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
France
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - l er Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Via Salvatore Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
Waegenburghtplein 4
NL-5152 JR, Drunen, Netherlands
Tel: 31-416-690399
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berk shire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
07/12/04
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