JAN2N485602 - VISHAY - Datasheet.Directory

GENERAL DESCRIPTION

The HI-8190 is a quad analog CMOS switch fabricated with Sili-

con-on-Insulator (SOI) technology for latch-up free operation

and maximum switch isolation. The switch voltages can range

from bipolar

Each switch is designed using

back to back high voltage transistors. Switch transistors are

symmetrical and conduct equally well in either direction. Signal

range can run the full rails. Off leakages are very low (1 nA typi-

cal) and charge injection is less than 3 pC. Switch ESD toler-

ance is greater than 4 KV.

The Off state is achieved first before any On condition is ap-

plied. Switching times with a 3.3V VLOGIC supply are typically

35 ns to the On state and 20 ns to the Off state.

(-40°C to +85°C) and extended (-55°C to +125°C) temperature

range options.

± 3.3V to ± 15V or single ended from 3.3V to 15V.

The logic supply can range from 3.3V to 5.0V. The HI-8190 pro-

vides four each normally open switches when the switch control

inputs are Low. The HI-8191 provides four each normally

closed switches when the switch control inputs are Low. The HI-

8192 provides a combination of two normally On and two nor-

mally Off switches. The limits of the operating range are de-

fined by the V+/V- bias voltage.

On-resistance of each switch depends upon only the VLOGIC

selection.At 5V, R ranges from 10 to 17 while at 3.3V sup-

ply R ranges from 10 to 22

Industry-standard plastic package options include 16-pin

TSSOP, SO, DIP and 16-pin QFN. Ceramic packaging is avail-

able on request. All three products are offered in both Industrial

WW.

FEATURES

± 3.3V to ± 15V CMOS analog switches

Low RON: 12 to 15 typical

Robust CMOS Silicon-on-Insulator (SOI) technology

SOI switch isolation with 1nA typical Off leakage

Superior ESD protection > 4KV HBM

Fast switching time with break-before-make

Low power

Extended Temperature Range (-55°C to +125°C)

PIN CONFIGURATIONS (Top Views)

October 2017

(DS8190 Rev. D) 10/17

HI-8190, HI-8191, HI-8192

12W, Quad, SPST, 3.3V / 5.0V compatible

Analog Switch

16 S1A

15 IN1

14 IN2

13 S2A

S1B 1

V- 2

GND 3

S4B 4

12 S2B

11 V+

10 VLOGIC

9 S3B

S4A 5

IN4 6

IN3 7

S3A 8

16-pin 5mm x 5mm Chip-scale package

HI-8190PCx

APPLICATIONS

Data bus isolation

Sample-and-Hold circuits

Test Equipment

Communications Systems

Battery operated Systems

PBX, PABX

Audio Signal Routing

Data Acquisition Systems

xDSL Modems

Avionics

IN1 1

S1A 2

S1B 3

V- 4

GND 5

S4B 6

S4A 7

IN4 8

16 IN2

15 S2A

14 S2B

13 V+

12 VLOGIC

11 S3B

10 S3A

9 IN3

16-Pin SO or DIP package

HI-8190PSx, HI-8190PDx

PRODUCT OPTIONS

PART TYPE IN1 Switch 1 IN2 Switch 2 IN3 Switch 3 IN4 Switch 4

HI-8190 0 Open 0 Open 0 Open 0 Open

1 Closed 1 Closed 1 Closed 1 Closed

HI-8191 0 Closed 0 Closed 0 Closed 0 Closed

1 Open 1 Open 1 Open 1 Open

HI-8192 0 Open 0 Closed 0 Closed 0 Open

1 Closed 1 Open 1 Open 1 Closed

HOLT INTEGRATED CIRCUITS

www.holtic.com

HI-8190, HI-8191, HI-8192

SIGNAL FUNCTION DESCRIPTION

IN1 Logic Input HI-8190 and HI-8192 are normally Open when input Low

S1A Switch Node Switch 1 Node

S1B Switch Node Switch 1 Node

V- Supply Negative supply for Bipolar configuration. GND for Unipolar use

GND Supply Reference Ground

S4B Switch Node Switch 4 Node

S4A Switch Node Switch 4 Node

IN4 Logic Input HI-8190 and HI-8192 are normally Open when input Low

IN3 Logic Input HI-8191 and HI-8192 are normally Closed when input Low

S3A Switch Node Switch 3 Node

S3B Switch Node Switch 3 Node

VLOGIC Supply 3.3V or 5.0V Logic supply

V+ Supply Positive supply for Bipolar and Unipolar configurations

S2B Switch Node Switch 2 Node

S1B Switch Node Switch 2 Node

IN2 Logic input HI-8191 and HI-8192 are normally Closed when input Low

PIN DESCRIPTIONS

-15V -10V -5V 0V 5V 10V 15V

10W

12W

14W

16W

18W

20W

22W

24W

VSWITCH

-15V -10V -5V 0V 5V 10V 15V

10W

12W

14W

16W

18W

20W

22W

24W

VSWITCH

-15V -10V -5V 0V 5V 10V 15V

VSWITCH

Typical R as a function of V

(10mA switch current)

V=5V

ON SWITCH

LOGIC

and

Temperature

Typical R as a function of V and V

(10mA switch current,

ON LOGIC SWITCH

25°C)

V = 3.3VLOGIC

V = 5.0VLOGIC

T = +125°C

T = +25°C

T = -55°C

HOLT INTEGRATED CIRCUITS

HI-8190, HI-8191, HI-8192

HOLT INTEGRATED CIRCUITS

Switch leakage vs switch voltage as a function of temperature at Vdd = 5.0V

1.00E-09

1.00E-08

1.00E-07

10 11 12 13 14 15

Leakage (A)

Vswitch (V)

VDD = 5.0V

125C

85C

25C

-40C

Switch leakage vs switch voltage as a function of temperature at Vdd = 3.0V

1.00E-09

1.00E-08

1.00E-07

1.00E-06

10 11 12 13 14 15

Leakage (A)

Vswitch (V)

VDD = 3.3V

125C

85C

25C

-40C -55C

ELECTRICAL CHARACTERISTICS

V+ = 15V, V- = -15V, GND = 0V. Operating temperature range (unless otherwise noted).

V = 3.3V V = 5.0V

PARAMETER CONDITIONS FIGURE UNIT

LOGIC LOGIC

SYMBOL

SWITCH PARAMETERS

Switch Signal Range V -15 +15 V

Switch Resistance R 25°C, 10mA 1 10 22 10 17

-55°C to +125°C, 10mA 1 8 26 8 20

Leakage I Switch voltage 2 5 5 nA

LOGIC INPUTS

Input High Voltage V 70 70 %V

Input Low Voltage V 30 30 %V

Input Current I V = 0V or V =VLOGIC -0.5 0.5 -0.5 0.5

SUPPLY

VLOGIC Current I Any state 0.5 0.5

V+ Current I Any state 0.5 0.5

V- Current I Any state -0.5 -0.5

DYNAMIC PARAMETERS

Turn On Time T V+/V- = 10V, 25°C 3 55 35 ns

Turn Off time T

Break-Before-Make Time T 10V signal, 25°C 4 8 8 ns

10V signal, -55°C to +125°C 4 4 4 ns

Charge Injection Q V =0V, R =0 25°C 5 4 4 pC

Off Isolation R f = 1 MHz, 25°C 6 65 65 dB

Crosstalk C 25°C 7 90 90 dB

Capacitance C Switch Off, 25°C 8 5 5 pF

C Switch On, 25°C 9 20 20 pF

MIN TYP MAX MIN TYP MAX

RANGE

SWLEAK

IH LOGIC

IL LOGIC

IN IN IN

DD1

DD2

OFF

| | ± 15V, 25°C

|I | Switch voltage ± 15V, 125° 2 20 20 nA

|I | Switch voltage ± 15V, -55°C 2 150 150 nA

µA

V = ±10V, -55°C to +125°C 3 75 55 ns

V+/V- = ±10V, 25°C 3 35 20 ns

V = ±10V, -55°C to +125°C 3 40 25 ns

f = 1 MHz,

SWLEAK

HI-8190, HI-8191, HI-8192

NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only.

Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.

Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ABSOLUTE MAXIMUM RATINGS

Continuous Power Dissipation (TA=70°C):

SO Package (derate 6.7mW/°C above 70°C)...................696mW

Plastic DIP (derate 10.53 mw/°C above 70°C) .................842mW

Thin QFN (derate 21.3mW/°C above 70°C) ...................1702mW

Storage Temperature Range: ......................................-65°C to +150°C

Soldering Temperature: (Ceramic)......................60 sec. at +300°C

(Plastic - leads).............10 sec. at +280°C

(Plastic - body) .....................+260°C Max.

Supply Voltage, V+: ............................................................................16.5V

Supply Voltage, V-:.............................................................................-16.5V

Supply Volgate, V .........................................................................5.5V

Switch Current (either direction, DC)

Peak Switch Current (1 ms pulse, 10% duty cycle max.)..................100mA

Digital Input Voltage (IN1-4):.....................................

LOGIC

: .................................................20mA

-0.3V to V + 0.3V

Operating Temperature Range: (Industrial)..........................-40°C to +85°C

(Hi-Temp)........................-55°C to +125°C

Maximum Junction Temperature ........................................................175°C

LOGIC

(Voltages referenced to GND = 0V)

HOLT INTEGRATED CIRCUITS

Figure 1 - On Resistance

Figure 3. Switching Times

V (HI-8191)

OUT

V (HI-8190)

50% 50%

tON tOFF

50%

90%

TEST CIRCUITS

HI-8190, HI-8191, HI-8192

IDS

R=V/ION 1 DS

Figure 2 - Off Leakage

I (OFF)S

I (OFF)

VS35pF 300W

+5V +15V

-15V

VLOGIC V+

V-GND

0.1 Fµ0.1 Fµ

0.1 Fµ

VOUT

SA SB SA SB

SA SB

50% 50%

Figure 4. Break-Before-Make Time Delay (HI-8192)

35pF 300W

+5V +15V

-15V

VLOGIC V+

V-GND

0.1 Fµ0.1 Fµ

0.1 Fµ

VOUT1

S1A S1B

S2A S2B

VS1

VS2 VOUT2

300W

35pF

OUT1

50% 50%

OUT2

50%

90%

50%

90%

HOLT INTEGRATED CIRCUITS

HI-8190, HI-8191, HI-8192

Figure 5. Charge Injection

OUT

10nF

+5V +15V

-15V

VLOGIC V+

V-GND

VOUT

SA SB

OUT

INJ = L x UT

50W

+5V +15V

-15V

VLOGIC V+

V-GND

0.1 Fµ0.1 Fµ

0.1 Fµ

VOUT

SA SB

Figure 6 - Off Isolation

50W

+5V +15V

-15V

VLOGIC V+

V-GND

0.1 Fµ0.1 Fµ

0.1 Fµ

SA1 SB1

IN1

Figure 7 - Channel-to-Channel Crosstalk

VOUT SA2

SB2

IN2

50W

+5V +15V

-15V

VLOGIC V+

V-GND

0.1 Fµ0.1 Fµ

0.1 Fµ

SA SB

Figure 8 - Off Capacitance

Capacitance

Meter

f=1MHz

+5V +15V

-15V

VLOGIC V+

V-GND

0.1 Fµ0.1 Fµ

0.1 Fµ

SA SB

Figure 9 - On Capacitance

Capacitance

Meter

f=1MHz

HOLT INTEGRATED CIRCUITS

HI-8190, HI-8191, HI-8192

FREQUENCY RESPONSE

Figure 10 shows a typical frequency response.

Figure 10. Frequency Response.

HOLT INTEGRATED CIRCUITS

ORDERING INFORMATION

HI - 819x xx x x

TEMPERATURE

RANGE

FLOW BURN

-40°C TO +85°C

-55°C TO +125°C

YES

-55°C TO +125°C NO

PART

NUMBER

PACKAGE

DESCRIPTION

16 PIN PLASTIC 5x5 mm CHIP SCALE (16PCS1) (No M-flow, Pb-free only)

PART

NUMBER

16 PIN PLASTIC NARROW BODY SOIC (16HN)

LEAD

FINISH

PART

NUMBER

100% Matte Tin (Pb-free, RoHS compliant)

Tin / Lead (Sn / Pb) Solder

Blank

16 PIN PLASTIC DIP (16P)

FUNCTION

QUAD SWITCH, NORMALLY OPEN

PART

NUMBER

8190

QUAD SWITCH, NORMALLY CLOSED

8191

8192 QUAD SWITCH, TWO NORMALLY OPEN, TWO NORMALLY CLOSED

HI-8190, HI-8191, HI-8192

P/N Rev Date Description of Change

DS8190 New 10/26/11 Initial release

A 12/12/11 Update DC and Peak switch current values in maximum ratings. Clarify QFN available only

in Pb-free.

B 09/26/12 Add frequency response curve.

C 12/05/13 Add leakage vs switch voltage as a function of temperature curves. Update package

drawings.

10/26/17 Update frequency response curve.

REVISION HISTORY

HOLT INTEGRATED CIRCUITS

HI-8190, HI-8191, HI-8192

HI-8190 PACKAGE DIMENSIONS

16-PIN PLASTIC SMALL OUTLINE (SOIC) - NB

(Narrow Body)

millimeters (inches)

Package Type: 16HN

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

0°to 8°

Detail A

0.175 ± 0.075

(0.007 ± 0.003)

0.835 ± 0.435

(0.033 ± 0.017)

1.25

(0.049)

0.410 ± 0.100

(0.016 ± 0.004)

9.90

(0.390)

0.175 ± 0.075

(0.007 ± 0.003)

See Detail A

Top View

1.27

(0.050)

BSC

6.00

(0.236) BSC 3.90

(0.154) BSC

min

BSC

16-PIN PLASTIC CHIP-SCALE PACKAGE millimeters (inches)

Package Type: 16PCS1

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

Top View Bottom

View

Electrically isolated heat sink

pad on bottom of package

Connect to any ground or

power plane for optimum

thermal dissipation

5.00

(0.197)

BSC

5.00

(0.197)

BSC

1.00

(0.039)

max.

.203

(0.008)

typ.

0.50 ± 0.050

(0.0197 ± 0.002)

3.355 ± 0.075

(0.132 ± 0.003)

0.80

(0.031)

BSC

0.30 ± 0.050

(0.012 ± 0.002)

3.355 ± 0.075

(0.132 ± 0.003)

HOLT INTEGRATED CIRCUITS

HI-8190 PACKAGE DIMENSIONS

16-PIN PLASTIC DUAL IN-LINE PACKAGE (PDIP)

(300mil Body)

inches (millimeters)

Package Type: 16P

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

.300

(7.62)

BSC .255

(6.48)

BSC

0.755

(19.18)BSC

.018 ± .002

(.457 ± .051)

.100

(2.54) BSC

.130 ± .010

±.254(3.302 )

.058 ± .013

(1.473 ± .330)

.150 ± .020

± .508(3.81 )

.028 ± .013

(.711 )± .330 .345 ± .035

(8.763 )± .889

.011 ± .002

(.279 )± .051