INTEGRATED CIRCUITS DATA SHEET PCF8575 Remote 16-bit I/O expander for I2C-bus Product specification Supersedes data of 1999 Feb 25 File under Integrated Circuits, IC12 1999 Apr 07 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING 6 CHARACTERISTICS OF THE I2C-BUS 6.1 6.2 6.3 6.4 Bit transfer START and STOP conditions System configuration Acknowledge 7 FUNCTIONAL DESCRIPTION 7.1 7.2 7.3 7.4 7.5 Quasi-bidirectional I/Os Addressing Reading from a port (input mode) Writing to the port (output mode) Interrupt 8 LIMITING VALUES 9 HANDLING 10 CHARACTERISTICS 11 I2C-BUS TIMING CHARACTERISTICS 12 DEVICE PROTECTION 13 PACKAGE OUTLINE 14 SOLDERING 14.1 Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods 14.2 14.3 14.4 14.5 15 DEFINITIONS 16 LIFE SUPPORT APPLICATIONS 17 PURCHASE OF PHILIPS I2C COMPONENTS 1999 Apr 07 2 PCF8575 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus 1 PCF8575 FEATURES * Operating supply voltage 2.5 to 5.5 V * Low standby current consumption of 10 A maximum * I2C-bus to parallel port expander * 400 kbits/s FAST I2C-bus * Open-drain interrupt output The device consists of a 16-bit quasi-bidirectional port and an I2C-bus interface. The PCF8575 has a low current consumption and includes latched outputs with high current drive capability for directly driving LEDs. It also possesses an interrupt line (INT) which can be connected to the interrupt logic of the microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C-bus. This means that the PCF8575 is an I2C-bus slave transmitter/receiver. * 16-bit remote I/O port for the I2C-bus * Compatible with most microcontrollers * Latched outputs with high current drive capability for directly driving LEDs * Address by 3 hardware address pins for use of up to 8 devices * SSOP24 package. 2 Every data transmission from the PCF8575 must consist of an even number of bytes, the first byte will be referred to as P07 to P00 and the second byte as P17 to P10. The third will be referred to as P07 to P00 and so on. GENERAL DESCRIPTION The PCF8575 is a silicon CMOS circuit. It provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I2C-bus). 3 ORDERING INFORMATION TYPE NUMBER PCF8575TS 1999 Apr 07 PACKAGE NAME DESCRIPTION VERSION SSOP24 plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 3 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus 4 PCF8575 BLOCK DIAGRAM handbook, full pagewidth INT A0 A1 A2 SCL SDA 1 INTERRUPT LOGIC LP FILTER PCF8575 21 2 3 22 23 INPUT FILTER I2C-BUS CONTROL P00 to P07 4 to 11 SHIFT REGISTER 16 BITS I/O PORT P10 to P17 13 to 20 WRITE pulse VDD VSS 24 12 READ pulse POWER-ON RESET MGL537 Fig.1 Block diagram. 1999 Apr 07 4 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus 5 PCF8575 PINNING SYMBOL PIN DESCRIPTION INT 1 interrupt output (active LOW) A1 2 address input 1 A2 3 address input 2 P00 4 quasi-bidirectional I/O 00 P01 5 quasi-bidirectional I/O 01 P02 6 P03 handbook, halfpage INT 1 24 VDD quasi-bidirectional I/O 02 A1 2 23 SDA 7 quasi-bidirectional I/O 03 A2 3 22 SCL P04 8 quasi-bidirectional I/O 04 P00 4 21 A0 P05 9 quasi-bidirectional I/O 05 P01 5 20 P17 P06 10 quasi-bidirectional I/O 06 P07 11 quasi-bidirectional I/O 07 VSS 12 supply ground P10 13 quasi-bidirectional I/O 10 P11 14 P12 P02 6 19 P16 PCF8575 P03 7 18 P15 P04 8 17 P14 quasi-bidirectional I/O 11 P05 9 16 P13 15 quasi-bidirectional I/O 12 P06 10 15 P12 P13 16 quasi-bidirectional I/O 13 P07 11 14 P11 P14 17 quasi-bidirectional I/O 14 VSS 12 13 P10 P15 18 quasi-bidirectional I/O 15 P16 19 quasi-bidirectional I/O 16 P17 20 quasi-bidirectional I/O 17 A0 21 address input 0 SCL 22 serial clock line input SDA 23 serial data line input/output VDD 24 supply voltage 1999 Apr 07 MGL538 Fig.2 Pin configuration. 5 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus 6 CHARACTERISTICS OF THE I2C-BUS 6.4 The I2C-bus is for bidirectional, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 6.1 A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse, set-up and hold times must be taken into account. Bit transfer A master receiver must signal an end of data to the transmitter by not generating an acknowledge after the last byte that has been clocked out of the slave. This is done by the master receiver by holding the SDA line HIGH. In this event the transmitter must release the data line to enable the master to generate a STOP condition. START and STOP conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition P (see Fig.4). 6.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The transmitter must release the SDA line before the receiver can send an acknowledge bit. One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Fig.3). 6.2 PCF8575 System configuration A device generating a message is a `transmitter', a device receiving the message is the `receiver'. The device that controls the message is the `master' and the devices which are controlled by the master are the `slaves' (see Fig.5). handbook, full pagewidth SDA SCL data line stable; data valid change of data allowed Fig.3 Bit transfer. 1999 Apr 07 6 MBC621 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus PCF8575 handbook, full pagewidth SDA SDA SCL SCL S P START condition STOP condition MBC622 Fig.4 Definition of START and STOP conditions. SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER SLAVE RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER / RECEIVER MBA605 Fig.5 System configuration. handbook, full pagewidth DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL FROM MASTER 1 2 8 9 S clock pulse for acknowledgement START condition MGL539 Fig.6 Acknowledgment on the I2C-bus. 1999 Apr 07 7 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus 7 7.1 PCF8575 FUNCTIONAL DESCRIPTION Quasi-bidirectional I/Os The PCF8575's 16 ports (see Fig.7) are entirely independent and can be used either as input or output ports. Input data is transferred from the ports to the microcontroller in the READ mode (see Fig.10). Output data is transmitted to the ports in the WRITE mode (see Fig.9). This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction. At power-on the I/Os are HIGH. In this mode only a current source (IOH) to VDD is active. An additional strong pull-up to VDD (IOHt) allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH, and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs. After power-on as all the I/Os are set HIGH all of them can be used as input. Any change in setting of the I/Os as either inputs or outputs can be done with the write mode. Warning: If a HIGH is applied to an I/O which has been written earlier to LOW, a large current (IOL) will flow to VSS. (see Characteristics note 3). dbook, full pagewidth 100 A IOHt data from shift register VDD IOH write pulse D Q FF CI P00 to P07 P10 to 17 IOL S power-on reset VSS Q D FF CI read pulse S to interrupt logic data to shift register MGL540 Fig.7 Simplified schematic diagram of each I/O. 7.2 Addressing Figures 8, 9 and 10 show the address and timing diagrams. Before any data is transmitted or received the master must send the address of the receiver via the SDA line. The first byte transmitted after the START condition carries the address of the slave device and the read/write bit. The address of the slave device must not be changed between the START and the STOP conditions. The PCF8575 acts as a slave receiver or a slave transmitter. slave address handbook, halfpage S 0 1 0 0 A2 A1 A0 R/W A MGL541 Fig.8 Byte containing the slave address and the R/W bits. 1999 Apr 07 8 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1 2 3 4 5 6 7 8 slave address (PCF8575) SDA S 0 1 start condition 0 0 A2 A1 data to port 0 A0 0 R/W A P07 P06 1 acknowledge P05 from slave data to port 1 P00 A P17 P10 A acknowledge from slave acknowledge from slave WRITE TO PORT 9 Data A0 and B0 valid DATA OUTPUT FROM PORT Philips Semiconductors SCL Remote 16-bit I/O expander for I2C-bus handbook, full pagewidth 1999 Apr 07 Integral multiples of two bytes tpv P05 OUTPUT VOLTAGE IOHt P05 PULL-UP OUTPUT CURRENT IOH INT tir Product specification PCF8575 Fig.9 WRITE mode (output). MGL542 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... S 0 1 0 0 A2 A1 A0 1 R/W A P07 P06 P05 P04 P03 P02 P01 P00 acknowledge from slave A P17 P10 A P07 acknowledge from receiver acknowledge from receiver P00 A P17 P10 acknowledge from receiver 1 P non acknowledge from receiver READ FROM PORT 10 DATA INTO PORT P07 to P00 P17 to P10 P07 to P00 th P17 to P10 P07 to P00 P17 to P10 Philips Semiconductors SDA Remote 16-bit I/O expander for I2C-bus dbook, full pagewidth 1999 Apr 07 SCL tsu INT tiv tir tir MGL543 Product specification Fig.10 READ mode (input). PCF8575 A LOW-to-HIGH transition of SDA, while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). Input data is lost. Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus 7.3 Reading from a port (input mode) 7.5 All ports programmed as input should be set to logic 1. To read, the master (microcontroller) first addresses the slave device after it receives the interrupt. By setting the last bit of the byte containing the slave address to logic 1 the read mode is entered. The data bytes that follow on the SDA are the values on the ports. Interrupt The PCF8575 provides an open-drain interrupt (INT) which can be fed to a corresponding input of the microcontroller (see Figs 9, 10 and 12). This gives these chips a kind of a master function which can initiate an action elsewhere in the system. An interrupt is generated by any rising or falling edge of the port inputs. After time tiv the signal INT is valid. If the data on the input port changes faster than the master can read, this data may be lost. 7.4 PCF8575 The interrupt disappears when data on the port is changed to the original setting or data is read from or written to the device which has generated the interrupt. Writing to the port (output mode) To write, the master (microcontroller) first addresses the slave device. By setting the last bit of the byte containing the slave address to logic 0 the write mode is entered. The PCF8575 acknowledges and the master sends the first data byte for P07 to P00. After the first data byte is acknowledged by the PCF8575, the second data byte P17 to P10 is sent by the master. Once again the PCF8575 acknowledges the receipt of the data after which this 16-bit data is presented on the port lines. In the write mode the interrupt may become deactivated (HIGH) on the rising edge of the write to port pulse. On the falling edge of the write to port pulse the interrupt is definitely deactivated (HIGH). The interrupt is reset in the read mode on the rising edge of the read from port pulse. During the resetting of the interrupt itself any changes on the I/Os may not generate an interrupt. After the interrupt is reset any change in I/Os will be detected and transmitted as an INT. The number of data bytes that can be sent successively is not limited. After every two bytes the previous data is overwritten. The first data byte in every pair refers to Port 0 (P07 to P00), whereas the second data byte in every pair refers to Port 1 (P17 to P10), see Fig.11. First Byte handbook, full pagewidth 07 06 05 04 03 02 Second Byte 01 00 P07 P06 P05 P04 P03 P02 P01 P00 17 A 16 15 14 13 12 11 10 A P17 P16 P15 P14 P13 P12 P11 P10 MGL545 Fig.11 Correlation between bits and ports. 1999 Apr 07 11 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus handbook, full pagewidth VDD MICROCOMPUTER PCF8575 PCF8575 (1) PCF8575 (2) PCF8575 (8) INT INT INT INT MGL544 Fig.12 Application of multiple PCF8575s with interrupt. 1999 Apr 07 12 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus PCF8575 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); note 1. SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage -0.5 +6.5 V IDD supply current - 100 mA ISS supply current - 100 mA VI input voltage VSS - 0.5 VDD + 0.5 V II DC input current - 20 mA IO DC output current - 25 mA Ptot total power dissipation - 400 mW PO power dissipation per output - 100 mW Tstg storage temperature -65 +150 C Tamb operating ambient temperature -40 +85 C Note 1. Stress above those listed under `Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 9 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under "Handling MOS Devices". 10 CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VDD supply voltage 2.5 - 5.5 V IDD supply current operating mode; no load; VI = VDD or VSS; fSCL = 400 kHz - 100 200 A IDD(stb) standby current standby mode; no load; VI = VDD or VSS - 2.5 10 A VPOR power-on reset voltage note 1 - 1.2 1.8 V VIL1 LOW-level input voltage pins A0, A1 and A2 0.0 - 0.2VDD V VIL2 LOW-level input voltage on all other signal pins 0.0 - 0.3VDD V VIH HIGH-level input voltage 0.7VDD - VDD V IL1 leakage current at pins A0, A1 and A2 -1 - +1 A 1999 Apr 07 VI = VDD or VSS 13 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus SYMBOL IL2 PARAMETER leakage current on all other signal pins PCF8575 CONDITIONS MIN. TYP. MAX. UNIT VI = VDD or VSS -10 - +10 A Input SCL; input/output SDA IOL LOW-level output current VOL = 0.4 V; note 3 3 - - mA CI input capacitance VI = VSS; note 2 - - 7 pF I/Os; P00 to P07 and P10 to P17 IOL LOW-level output current VOL = 1 V; note 3 10 25 - mA IOH HIGH-level output current VOH = VSS -30 - -300 A IOHt transient pull-up current VOH = VSS; see Fig.9 -0.5 -1.0 - mA CI input capacitance note 2 - - 10 pF CO output capacitance note 2 - - 10 pF Port timing; CL 100 pF (see Figs 9 and 10) tpv output data valid - - 4 s tsu input data set-up time 0 - - s th input data hold time 4 - - s 1.6 - - mA Interrupt INT (see Fig.13) IOL LOW-level output current VOL = 0.4 V TIMING; CL 100 pF (see Figs 9 and 10) tiv input data valid time - - 4 s tir reset delay time - - 4 s Notes 1. The power-on reset circuit resets the I2C-bus logic with VDD < VPOR and sets all I/Os to logic 1 (with current source to VDD). 2. The value is not tested, but verified on sampling basis. 3. A single LOW-level output current (IOL) must not exceed 20 mA for an extended time. The sum of all IOLs at any point in time must not exceed 100 mA. 1999 Apr 07 14 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus PCF8575 11 I2C-BUS TIMING CHARACTERISTICS See Fig.13 and note 1. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT - 400 - 50 ns 1.3 - s START condition set-up time 0.6 - s tHD;STA START condition hold time 0.6 - s tLOW SCL LOW time 1.3 - s tHIGH SCL HIGH time 0.6 - s tr SCL and SDA rise time note 3 20 + 0.1Cb 300 ns tf SCL and SDA fall time note 3 20 + 0.1Cb 300 ns tSU;DAT data set-up time 100 - ns tHD;DAT data hold time 0 - ns tSU;STO STOP condition set-up time 0.6 - s Cb capacitive load represented by each bus line - 400 pF fSCL SCL clock frequency tSW tolerable spike width on bus tBUF BUS free time between a STOP and START condition tSU;STA note 2 kHz Notes 1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL and VIH with an input voltage swing of VSS to VDD. 2. The device inputs SDA and SCL are filtered and will reject spikes on the bus lines of widths less than tSW(max). 3. The rise and fall times specified here refer to the driver device (PCF8575) and are part of the general fast I2C-bus specification when PCF8575 asserts an acknowledge on SDA, the minimum fall time is 20 ns + 0.1Cb. handbook, full pagewidth PROTOCOL tLOW tSU;STA BIT 6 (A6) BIT 7 MSB (A7) START CONDITION (S) tHIGH BIT 0 LSB (R/W) ACKNOWLEDGE (A) STOP CONDITION (P) 1/fSCL SCL tBUF tr tf SDA tHD;STA tSU;DAT tHD;DAT tSU;STO MGL546 Fig.13 I2C-bus timing diagram. 1999 Apr 07 15 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus PCF8575 12 DEVICE PROTECTION handbook, full pagewidth INT A1 A2 P00 P01 P02 P03 P04 P05 P06 P07 VSS VDD 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 substrate VSS MGR789 Fig.14 Device protection diagram. 1999 Apr 07 16 VDD SDA SCL A0 P17 P16 P15 P14 P13 P12 P11 P10 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus PCF8575 13 PACKAGE OUTLINE SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm D SOT340-1 E A X c HE y v M A Z 24 13 Q A2 A (A 3) A1 pin 1 index Lp L 1 12 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 0.8 0.4 8 0o Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 1999 Apr 07 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 93-09-08 95-02-04 MO-150AG 17 o Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. 14 SOLDERING 14.1 Introduction to soldering surface mount packages * For packages with leads on two sides and a pitch (e): This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. 14.2 The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. 14.3 14.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 1999 Apr 07 PCF8575 18 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus 14.5 PCF8575 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE HLQFP, HSQFP, HSOP, SMS not suitable(2) suitable PLCC(3), suitable suitable SO recommended(3)(4) LQFP, QFP, TQFP not SQFP not suitable SSOP, TSSOP, VSO not suitable suitable recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Apr 07 19 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus PCF8575 15 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 16 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 17 PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1999 Apr 07 20 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus NOTES 1999 Apr 07 21 PCF8575 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus NOTES 1999 Apr 07 22 PCF8575 Philips Semiconductors Product specification Remote 16-bit I/O expander for I2C-bus NOTES 1999 Apr 07 23 PCF8575 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com (c) Philips Electronics N.V. 1999 SCA63 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 465006/00/03/pp24 Date of release: 1999 Apr 07 Document order number: 9397 750 05528