SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D2-V to 6-V VCC Operation
DInputs Accept Voltages to 6 V
DMax tpd of 7 ns at 5 V
SN54AC04 ...FK PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
1Y
1A
NC
4Y
4A
V
6A
3Y
GND
NC
CC
NC − No internal connection
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
SN54AC04 ...J OR W PACKAGE
SN74AC04 ...D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
description/ordering information
The ‘AC04 devices contain six independent inverters. The devices perform the Boolean function Y = A.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP − N Tube SN74AC04N SN74AC04N
SOIC D
Tube SN74AC04D
AC04
SOIC − D Tape and reel SN74AC04DR AC04
−40°C to 85°CSOP − NS Tape and reel SN74AC04NSR AC04
40 C
to
85 C
SSOP − DB Tape and reel SN74AC04DBR AC04
TSSOP PW
Tube SN74AC04PW
AC04
TSSOP − PW Tape and reel SN74AC04PWR AC04
CDIP − J Tube SNJ54AC04J SNJ54AC04J
−55°C to 125°CCFP − W Tube SNJ54AC04W SNJ54AC04W
55 C
to
125 C
LCCC − FK Tube SNJ54AC04FK SNJ54AC04FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT OUTPUT
INPUT
A
OUTPUT
Y
H L
L H
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram, each inverter (positive logic)
YA
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±200 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54AC04 SN74AC04
UNIT
MIN MAX MIN MAX UNIT
VCC Supply voltage 2 6 2 6 V
VCC = 3 V 2.1 2.1
VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V
VIH
High level
input
voltage
VCC = 5.5 V 3.85 3.85
V
VCC = 3 V 0.9 0.9
VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VIL
Low level
input
voltage
VCC = 5.5 V 1.65 1.65
V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 3 V −12 −12
IOH High-level output current VCC = 4.5 V −24 −24 mA
IOH
High level
output
current
VCC = 5.5 V −24 −24
mA
VCC = 3 V 12 12
IOL Low-level output current VCC = 4.5 V 24 24 mA
IOL
Low level
output
current
VCC = 5.5 V 24 24
mA
Δt/ΔvInput transition rise or fall rate 8 8 ns/ V
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
V
TA = 25°C SN54AC04 SN74AC04
UNIT
PARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT
3 V 2.9 2.99 2.9 2.9
IOH = −50 μA4.5 V 4.4 4.49 4.4 4.4
IOH
50
μA
5.5 V 5.4 5.49 5.4 5.4
V
IOH = −12 mA 3 V 2.56 2.4 2.46
V
VOH
I24 mA
4.5 V 3.86 3.7 3.76 V
IOH = −24 mA 5.5 V 4.86 4.7 4.76
IOH = −50 mA†5.5 V 3.85
IOH = −75 mA†5.5 V 3.85
3 V 0.002 0.1 0.1 0.1
IOL = 50 μA4.5 V 0.001 0.1 0.1 0.1
IOL
50
μA
5.5 V 0.001 0.1 0.1 0.1
V
IOL =12 mA 3 V 0.36 0.5 0.44
V
VOL
I24 mA
4.5 V 0.36 0.5 0.44 V
IOL = 24 mA 5.5 V 0.36 0.5 0.44
IOL = 50 mA†5.5 V 1.65
IOL = 75 mA†5.5 V 1.65
IIVI = VCC or GND 5.5 V ±0.1 ±1±1μA
ICC VI = VCC or GND, IO = 0 5.5 V 2 40 20 μA
CiVI = VCC or GND 2.8 pF
†Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO TA = 25°C SN54AC04 SN74AC04
UNIT
PARAMETER
(INPUT)
(OUTPUT) MIN TYP MAX MIN MAX MIN MAX UNIT
tPLH
1.5 4.5 9 1 11 1 10
ns
tPHL
A Y 1.5 4.5 8.5 1 10 1 9.5 ns
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO TA = 25°C SN54AC04 SN74AC04
UNIT
PARAMETER
(INPUT)
(OUTPUT) MIN TYP MAX MIN MAX MIN MAX UNIT
tPLH
1.5 4 7 1 8.5 1 7.5
ns
tPHL
A Y 1.5 3.5 6.5 1 7.5 1 7 ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance CL = 50 pF, f = 1 MHz 45 pF
SN54AC04, SN74AC04
HEX INVERTERS
SCAS519E − JULY 1995 − REVISED OCTOBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
2 × VCC
500 Ω
500 Ω Open 50% VCC
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
50% VCC 50% VCC
VCC
0 V
50% VCC
50% VCC
Input
(see Note B)
Out-of-Phase
Output
In-Phase
Output 50% VCC
VOLTAGE WAVEFORMS
S1TEST
tPLH/tPHL Open
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤ 2.5 ns.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-87609012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-8760901CA ACTIVE CDIP J 14 1 TBD Call TI Call TI
5962-8760901DA ACTIVE CFP W 14 1 TBD Call TI Call TI
SN74AC04D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04DBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74AC04DBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74AC04NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74AC04NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04PW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74AC04PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74AC04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AC04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54AC04FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54AC04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54AC04W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 3
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54AC04, SN74AC04 :
•Catalog: SN74AC04
•Automotive: SN74AC04-Q1, SN74AC04-Q1
•Enhanced Product: SN74AC04-EP, SN74AC04-EP
•Military: SN54AC04
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AC04DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74AC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74AC04NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AC04PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AC04DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74AC04DR SOIC D 14 2500 367.0 367.0 38.0
SN74AC04NSR SO NS 14 2000 367.0 367.0 38.0
SN74AC04PWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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