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FEATURES DESCRIPTION
APPLICATIONS
EN
OUT
NC − No internal connection
1
2
3
4
5
DCQ PACKAGE
NR/FB
OUT
GND
IN
EN
2
1
3
4
7
8
6
5
NC
FB
NR
IN
NC
GND
SOT223-6
(TOP VIEW)
DGN PACKAGE
MSOP-8 PowerPADt
(TOP VIEW)
IOUT = 10 mA
IOUT = 250 mA
VIN = 4.3 V,
VOUT = 3.3 V,
CIN = 1 µF,
COUT = 10 µF,
CNR = 0.01 µF
40
20
10
10 100 1 k 10 k
Ripple Rejection (dB)
60
70
Frequency (Hz)
TPS79433
RIPPLE REJECTION
vs
FREQUENCY
90
100 k 1 M 10 M
0
30
50
80
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
IOUT = 250 mA
IOUT = 1 mA
COUT = 2.2 µF,
CNR = 0.1 µF,
VIN = 3.8 V
TPS79428
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
Frequency (Hz)
100 1000 10000 100000
6
GND
Output Spectral Noise Density (µV/√Hz)
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
ULTRALOW-NOISE, HIGH-PSRR, FAST, RF, 250-mALOW-DROPOUT LINEAR REGULATORS
•250-mA Low-Dropout Regulator With Enable
The TPS794xx family of low-dropout (LDO) linearvoltage regulators features high power-supply•Available in Fixed and Adjustable (1.2 V to
rejection ratio (PSRR), ultralow-noise, fast start-up,5.5 V) Versions
and excellent line and load transient responses in•High PSRR (60 dB at 10 kHz)
small outline, MSOP-8 PowerPAD™ and SOT223-6•Ultralow Noise (32 µVrms, TPS79428)
packages. Each device in the family is stable with asmall 2.2- µF ceramic capacitor on the output. The•Fast Start-Up Time (50 µs)
family uses an advanced, proprietary BiCMOS•Stable With a 2.2- µF Ceramic Capacitor
fabrication process to yield extremely low dropout•Excellent Load/Line Transient Response
voltages (for example, 155 mV at 250 mA). Eachdevice achieves fast start-up times (approximately•Very Low Dropout Voltage (155 mV at Full
50 µs with a 0.001- µF bypass capacitor) whileLoad)
consuming low quiescent current (170 µA typical).•Available in MSOP-8 and SOT223-6 Packages
Moreover, when the device is placed in standbymode, the supply current is reduced to less than1µA. The TPS79428 exhibits approximately•RF: VCOs, Receivers, ADCs
32 µV
RMS
of output voltage noise at 2.8 V output witha 0.1- µF bypass capacitor. Applications with analog•Audio
components that are noise-sensitive, such as•Bluetooth™, Wireless LAN
portable RF electronics, benefit from the high PSRR•Cellular and Cordless Telephones
and low noise features as well as the fast response•Handheld Organizers, PDAs
time.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PowerPAD is a trademark of Texas Instruments.Bluetooth is a trademark of Bluetooth SIG, Inc.All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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ABSOLUTE MAXIMUM RATINGS
PACKAGE DISSIPATION RATINGS
θJA
SOT223
SOT223 4in2 Top Side Only
0.5in2 Top Side Only 53°C/W
110°C/W
1
2
CONDITIONS PACKAGE PCB AREA
Condition 1
Condition 2
3
2
1
00 25 50 75
4
5
6
100 125 150
TA (°C)
PD (W)
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may bemore susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.
ORDERING INFORMATION
(1)
PRODUCT V
OUT
(2)
TPS794 xxyyyzXX is nominal output voltage (for example, 28 = 2.8 V, 285 = 2.85 V, 01 = Adjustable).YYY is package designator.Zis package quantity.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .(2) Output voltages from 1.3 V to 5.0 V in 100 mV increments are available; minimum order quantities may apply. Contact factory for detailsand availability.
over operating temperature range unless otherwise noted
(1)
VALUE
V
IN
range –0.3 V to 6 V
V
EN
range –0.3 V to V
IN
+ 0.3 V
V
OUT
range –0.3 V to 6 V
Peak output current Internally limited
ESD rating, HBM 2 kV
ESD rating, CDM 500 V
Continuous total power dissipation See Dissipation Ratings Table
Junction temperature range, T
J
–40 °C to +150 °C
Storage temperature range, T
stg
–65 °C to +150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
AIR FLOW R
θJC
R
θJA
T
A
≤25 °C T
A
= 70 °C T
A
= 85 °CPACKAGE
(CFM) ( °C/W) ( °C/W) POWER RATING POWER RATING POWER RATING
0 8.47 55.09 2.27 W 1.45 W 1.18 W
DGN 150 8.21 49.97 2.50 W 1.60 W 1.30 W
250 8.20 48.10 2.60 W 1.66 W 1.35 W
Figure 1. SOT223 Power Dissipation
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ELECTRICAL CHARACTERISTICS
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
Over recommended operating temperature range (T
J
= –40 °C to 125 °C), V
EN
= V
IN
, V
IN
= V
OUT(nom)
+ 1 V
(1)
, I
OUT
= 1mA,C
OUT
= 10 µF, C
NR
= 0.01 µF, unless otherwise noted. Typical values are at 25 °C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input voltage, V
IN
(1)
2.7 5.5 V
Continuous output current, I
OUT
0 250 mA
Output voltage range TPS79401 1.225 5.5 – V
DO
VOutput
TPS79401
(2)
0µA≤I
OUT
≤250 mA, V
OUT
+ 1 V ≤V
IN
≤5.5 V
(1)
0.97(V
OUT
) V
OUT
1.03(V
OUT
) Vvoltage
Accuracy
Fixed V
OUT
0µA≤I
OUT
≤250 mA, V
OUT
+ 1 V ≤V
IN
≤5.5 V
(1)
–3.0 +3.0 %
Output voltage line regulation ( ∆V
OUT
%/ ∆V
IN
)
(1)
V
OUT
+ 1 V ≤V
IN
≤5.5 V 0.05 0.12 %/V
Load regulation ( ∆V
OUT
%/ ∆I
OUT
) 0 µA≤I
OUT
≤250 mA 10 mV
TPS79428 I
OUT
= 250 mA 155 210Dropout voltage
(3)
TPS79430 I
OUT
= 250 mA 155 210 mVV
IN
= V
OUT(nom)
– 0.1 V
TPS79433 I
OUT
= 250 mA 145 200
Output current limit V
OUT
= 0 V 925 mA
Ground pin current 0 µA≤I
OUT
≤250 mA 170 220 µA
Shutdown current
(4)
V
EN
= 0 V, 2.7 V ≤V
IN
≤5.5 V 0.07 1 µA
FB pin current V
FB
= 1.225 V 1 µA
f = 100 Hz, I
OUT
= 250 mA 65
Power-supply ripple rejection TPS79428 f = 10 kHz, I
OUT
= 250 mA 60 dB
f = 100 kHz, I
OUT
= 250 mA 40
C
NR
= 0.001 µF 55
C
NR
= 0.0047 µF 36BW = 100 Hz to 100 kHz,Output noise voltage TPS79428 µV
RMSI
OUT
= 250 mA
C
NR
= 0.01 µF 33
C
NR
= 0.1 µF 32
C
NR
= 0.001 µF 50
Time, start-up TPS79428 R
L
= 14 Ω, C
OUT
= 1 µF C
NR
= 0.0047 µF 70 µs
C
NR
= 0.01 µF 100
High-level enable input voltage 2.7 V ≤V
IN
≤5.5 V 1.7 V
IN
V
Low-level enable input voltage 2.7 V ≤V
IN
≤5.5 V 0 0.7 V
EN pin current V
EN
= 0 1 1 µA
UVLO threshold V
CC
rising 2.25 2.65 V
UVLO hysteresis 100 mV
(1) Minimum V
IN
is 2.7 V or V
OUT
+ V
DO
, whichever is greater.(2) Tolerance of external resistors not included in this specification.(3) Dropout is not measured for the TPS79418 and TPS79425 since minimum V
IN
= 2.7 V.(4) For adjustable versions, this applies only after V
IN
is applied; then V
EN
transitions high to low.
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_+
Thermal
Shutdown
Bandgap
Reference
1.225 V
VIN
Current
Sense
R2
IN
GND
EN
OUT
SHUTDOWN
Vref
UVLO
ILIM
External to
the Device
FB
R1
UVLO
250 kΩNR(1)
(1) Not Available on DCQ (SOT223) options.
Quickstart
_+
Thermal
Shutdown
VIN
Current
Sense
R1
R2
IN
GND
EN
OUT
SHUTDOWN
Vref
UVLO
ILIM
Bandgap
Reference
1.225 V
UVLO
250 kΩNR
Quickstart R2 = 40k
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
FUNCTIONAL BLOCK DIAGRAM—ADJUSTABLE VERSION
FUNCTIONAL BLOCK DIAGRAM—FIXED VERSION
Terminal Functions
TERMINAL
DESCRIPTIONDGN DCQNAME
(MSOP) (SOT223)
Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap, whichNR 4 5
improves power-supply rejection and reduces output noise.The EN terminal is an input that enables or shuts down the device. When EN is a logic high, the deviceEN 6 1
is enabled. When the device is a logic low, the device is in shutdown mode.FB 3 5 Feedback input voltage for the adjustable device.GND 5, PAD 3, 6 Regulator groundIN 8 2 Unregulated input to the device.NC 2, 7 No internal connection.OUT 1 4 Regulator output
4
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TYPICAL CHARACTERISTICS
150
155
160
165
170
175
180
185
190
IOUT = 1 mA
VIN = 3.8 V,
COUT = 10 µF
TJ (°C)
IOUT = 250 mA
−40−25 −10 5 20 35 50 65 80 95 110 125
IGND (µA)
3.250
3.255
3.260
3.265
3.270
3.275
3.280
3.285
3.290
0 50 100 200 250
(V)VOUT
IOUT (mA)
2.765
2.770
2.775
2.780
2.785
2.790
2.800
−40−25−10 5 20 35 50 65 80 95 110 125
TJ (°C)
(V)VOUT
2.795 IOUT = 1 mA
IOUT = 200 mA
VIN = 3.8 V
COUT = 10 µF
0
0.2
0.4
0.6
0.8
1.2
1.4
1.6
100 1000 10000 100000
COUT = 10 µF,
IOUT = 250 mA
VIN = 3.8 V
Frequency (Hz)
CNR = 0.1 µF
CNR = 0.01 µF
CNR = 0.0047 µF
CNR = 0.001 µF
1.0
1.8
Output Spectral Noise Density (µV/√Hz)
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
IOUT = 250 mA
IOUT = 1 mA
COUT = 10 µF,
CNR = 0.1 µF,
VIN = 3.8 V
Frequency (Hz)
100 1000 10000 100000
Output Spectral Noise Density (µV/√Hz)
0
10
20
30
40
50
60
0.001 0.0047 0.1
CNR (µF) 0.01
IOUT = 250 mA,
COUT = 10 µF
RMS Output Noise (µVRMS)
0
50
100
150
200
250
TJ (°C)
−40−25 −10 5 20 35 50 65 80 95 110 125
IOUT = 1 mA
IOUT = 250 mA
VIN = 3.8 V,
COUT = 10 µF
VDO (mV)
0.100
0.02010 100 1 k 10 k
1
10
100 k 1 M 10 M
IOUT = 1 mA
IOUT = 250 mA
VIN = 4.3 V,
COUT = 10 µF,
Frequency (Hz)
ZO, Output Impedance (Ω)
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
TPS79433 TPS79428 TPS79428OUTPUT VOLTAGE OUTPUT VOLTAGE GROUND CURRENTvs OUTPUT CURRENT vs JUNCTION TEMPERATURE vs JUNCTION TEMPERATURE
Figure 2. Figure 3. Figure 4.
TPS79428 TPS79428 TPS79428OUTPUT SPECTRAL OUTPUT SPECTRAL OUTPUT SPECTRALNOISE DENSITY NOISE DENSITY NOISE DENSITYvs FREQUENCY vs FREQUENCY vs FREQUENCY
Figure 5. Figure 6. Figure 7.
TPS79428 TPS79433 TPS79428ROOT MEAN SQUARED OUTPUT IMPEDANCE DROPOUT VOLTAGEOUTPUT NOISE vs C
NR
vs FREQUENCY vs JUNCTION TEMPERATURE
Figure 8. Figure 9. Figure 10.
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IOUT = 10 mA
IOUT = 250 mA
VIN = 4.3 V,
VOUT = 3.3 V,
CIN = 1 µF,
COUT = 2.2 µF,
CNR = 0.01 µF
40
20
10
10 100 1 k 10 k
60
70
Frequency (Hz)
90
100 k 1 M 10 M
0
30
50
80
Ripple Rejection (dB)
IOUT = 10 mA
IOUT = 250 mA
VIN = 4.3 V,
VOUT = 3.3 V,
CIN = 1 µF,
COUT = 10 µF,
CNR = 0.01 µF
40
20
10
10 100 1 k 10 k
Ripple Rejection (dB)
60
70
Frequency (Hz)
90
100 k 1 M 10 M
0
30
50
80
IOUT = 10 mA
IOUT = 250 mA
VIN = 4.3 V,
VOUT = 3.3 V,
CIN = 1 µF,
COUT = 2.2 µF,
CNR = 0.1 µF
40
20
10
10 100 1 k 10 k
60
70
Frequency (Hz)
90
100 k 1 M 10 M
0
30
50
80
Ripple Rejection (dB)
0
250
−50
0
50
0 30 60 90 120 150 180 210
Time (µs)
VIN = 4.3 V,
COUT = 10 µF
di
dt +0.02A
ms
IOUT (mA)∆VOUT (mV)
V_Enable
3
Time (µs)
0 24016080 320 400 560480 640 720 800
1
2
0
0
2
4
CNR = 0.0047 µF
VIN = 4.3 V,
VOUT = 3.3 V,
IOUT = 250 mA,
COUT = 2.2 µF
CNR = 0.001 µF
VOUT, VEN (V)
Time (µs)
−30
−20
−10
0
10
4.5
5.0
5.5
6.0
0 100 200 300 400 500
IOUT = 250 mA,COUT = 10 µF,
CNR = 0.1 µF, dv/dt = 1 V/µs
VIN (V)∆VOUT (mV)
0
50
100
150
200
0 250
TA = 125°C
TA = 25°C
TA = −40°C
IOUT (mA)
25 50 75 100 125 150 175 200 225
VDO (mV)
0
50
100
150
200
250
2.5 3.5 4.0
TA = 125°C
TA = 25°C
VIN (V)
COUT = 10 µF,
CNR = 0.01 µF,
IOUT = 250 mA
3.0 4.5 5.0
TA = −40°C
VDO (mV)
−0.5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0 1.4 2.8 4.2 5.6 7.0 8.4 9.8
VOUT
VIN
Power-Up (500 mV/div)
t (ms)
VOUT = 2.5 V,
RL = 10 Ω
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
TPS79433 TPS79433 TPS79433RIPPLE REJECTION RIPPLE REJECTION RIPPLE REJECTIONvs FREQUENCY vs FREQUENCY vs FREQUENCY
Figure 11. Figure 12. Figure 13.
TPS79433
OUTPUT VOLTAGE, TPS79433 TPS79433ENABLE VOLTAGE LINE TRANSIENT LOAD TRANSIENTvs TIME (START-UP) RESPONSE RESPONSE
Figure 14. Figure 15. Figure 16.
TPS79425 TPS79433 TPS79401POWER-UP/ DROPOUT VOLTAGE DROPOUT VOLTAGEPOWER-DOWN vs OUTPUT CURRENT vs INPUT VOLTAGE
Figure 17. Figure 18. Figure 19.
6
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0.01
0.1
1
10
100
IOUT (mA)
0 25025 50 75 100 125 150 175 200 225
COUT = 2.2 µF
TA = −40 to 85°C
Region of Instability
Region of Stability
ESR, Equivalent Series Resistance (Ω)
0.01
0.1
1
10
100
1 10 20 40 60 80 120 200 250
IOUT (mA)
COUT = 10 µF
TA = −40 to 85°C
Region of Instability
Region of Stability
ESR, Equivalent Series Resistance (Ω)
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
TYPICAL CHARACTERISTICS (continued)
TPS79428 TPS79428TYPICAL REGIONS OF STABILITY TYPICAL REGIONS OF STABILITYEQUIVALENT SERIES RESISTANCE EQUIVALENT SERIES RESISTANCE(ESR) (ESR)vs OUTPUT CURRENT vs OUTPUT CURRENT
Figure 20. Figure 21.
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APPLICATION INFORMATION
GNDEN NR
IN OUT
VIN VOUT
0.01µF
2.2µF
1 µFTPS794xx
BOARD LAYOUT RECOMMENDATION TO
EXTERNAL CAPACITOR REQUIREMENTS
REGULATOR MOUNTING
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
order for the regulator to operate properly, theThe TPS794xx family of low-dropout (LDO)
current flow out of the NR pin must be at a minimum,regulators has been optimized for use in
because any leakage current creates an IR dropnoise-sensitive equipment. The device features
across the internal resistor, thus creating an outputextremely low dropout voltages, high PSRR, ultralow
error. Therefore, the bypass capacitor must haveoutput noise, low quiescent current (265 µA
minimal leakage current. The bypass capacitortypically), and an enable input to reduce supply
should be no more than 0.1- µF in order to ensurecurrents to less than
that it is fully charged during the quickstart time1µA when the regulator is turned off.
provided by the internal switch shown in theFunctional Block Diagram .A typical application circuit is shown in Figure 22 .
For example, the TPS79430 exhibits only 33 µV
RMSof output voltage noise using a 0.1- µF ceramicbypass capacitor and a 10- µF ceramic outputcapacitor. Note that the output starts up slower asthe bypass capacitance increases because of the RCtime constant at the bypass pin that is created by theinternal 250-k Ωresistor and external capacitor.
IMPROVE PSRR AND NOISEFigure 22. Typical Application Circuit
PERFORMANCE
To improve ac measurements such as PSRR, outputnoise, and transient response, it is recommendedthat the board be designed with separate groundA 1- µF or larger ceramic input bypass capacitor,
planes for V
IN
and V
OUT
, with each ground planeconnected between IN and GND and located close
connected only at the ground pin of the device. Into the TPS794xx, is required for stability and
addition, the ground connection for the bypassimproves transient response, noise rejection, and
capacitor should connect directly to the ground pin ofripple rejection. A higher-value input capacitor may
the device.be necessary if large, fast-rise-time load transientsare anticipated and the device is located severalinches from the power source.
The tab of the SOT223-6 package is electricallyLike most low-dropout regulators, the TPS794xx
connected to ground. For best thermal performance,requires an output capacitor connected between
the tab of the surface-mount version should beOUT and GND to stabilize the internal control loop.
soldered directly to a circuit-board copper area.The minimum recommended capacitance is 1 µF.
Increasing the copper area improves heatAny
dissipation.1µF or larger ceramic capacitor is suitable.
Solder pad footprint recommendations for theThe internal voltage reference is a key source of
devices are presented in Application Reportnoise in an LDO regulator. The TPS794xx has an
SBFA015 ,Solder Pad Recommendations forNR pin which is connected to the voltage reference
Surface-Mount Devices, available from the TI webthrough a 250-k Ωinternal resistor. The 250-k Ω
site (www.ti.com ).internal resistor, in conjunction with an externalbypass capacitor connected to the NR pin, creates alow-pass filter to reduce the voltage reference noiseand, therefore, the noise at the regulator output. In
8
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PROGRAMMING THE TPS79401
C1+(3 10*7) (R1)R2)
(R1 R2)
(3)
VOUT +VREF ǒ1)R1
R2Ǔ
(1)
REGULATOR PROTECTION
R1+ǒVOUT
VREF *1Ǔ R2
(2)
OUTPUT VOLTAGE
PROGRAMMING GUIDE
OUTPUT
VOLTAGE R1R2C1
1.8 V
3.6 V
14.0 kΩ
61.9 kΩ
30.1 kΩ
30.1 kΩ
22 pF
15 pF
TPS79401
GND FB
IN OUT
EN
VIN VOUT
1µF2.2 µF
R1
R2
C1
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
In order to improve the stability of the adjustableADJUSTABLE LDO REGULATOR version, it is suggested that a small compensationcapacitor be placed between OUT and FB.The output voltage of the TPS79401 adjustableregulator is programmed using an external resistor The approximate value of this capacitor can bedivider as shown in Figure 23 . The output voltage is calculated as Equation 3 :calculated using Equation 1 :
The suggested value of this capacitor for severalresistor ratios is shown in the table within Figure 23 .where:
If this capacitor is not used (such as in a unity-gain•V
REF
= 1.2246 V typ (the internal reference
configuration), then the minimum recommendedvoltage)
output capacitor is 2.2 µF instead of 1 µF.Resistors R
1
and R
2
should be chosen forapproximately 40- µA divider current. Lower valueresistors can be used for improved noise
The TPS794xx PMOS-pass transistor has a built-inperformance, but the device wastes more power.
back diode that conducts reverse current when theHigher values should be avoided, as leakage current
input voltage drops below the output voltage (forat FB increases the output voltage error.
example, during power down). Current is conductedfrom the output to the input and is not internallyThe recommended design procedure is to choose
limited. If extended reverse voltage operation isR
2
= 30.1 k Ωto set the divider current at 40 µA,
anticipated, external limiting might be appropriate.C
1
= 15 pF for stability, and then calculate R
1
usingEquation 2 :
The TPS794xx features internal current limiting andthermal protection. During normal operation, theTPS794xx limits output current to approximately2.8 A. When current limiting engages, the outputvoltage scales back linearly until the overcurrentcondition ends. While current limiting is designed toprevent gross device failure, care should be takennot to exceed the power dissipation ratings of thepackage. If the temperature of the device exceedsapproximately 165 °C, thermal-protection circuitryshuts it down. Once the device has cooled down tobelow approximately 140 °C, regulator operationresumes.
Figure 23. TPS79401 Adjustable LDO Regulator Programming
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THERMAL INFORMATION
TJ
A
RθJC
TC
B
RθCS
TA
C
RθSA
SOT223 Package
CIRCUIT BOARD COPPER AREA
B
A
C
PDmax +ǒVIN(avg) *VOUT(avg)Ǔ IOUT(avg) )VI(avg) IQ
TJ+TA)PDmax ǒRθJC )RθCS )RθSAǓ
(5)
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
The amount of heat that an LDO linear regulatorgenerates is directly proportional to the amount ofpower it dissipates during operation. All integratedcircuits have a maximum allowable junctiontemperature (T
J
max) above which normal operationis not assured. A system designer must design theoperating environment so that the operating junctiontemperature (T
J
) does not exceed the maximumjunction temperature (T
J
max). The two mainenvironmental variables that a designer can use toimprove thermal performance are air flow andexternal heatsinks. The purpose of this information isto aid the designer in determining the properoperating environment for a linear regulator that isoperating at a specific power level.
In general, the maximum expected power (P
D
max)
Figure 24. Thermal Resistancesconsumed by a linear regulator is computed asshown in Equation 4 :
Equation 5 summarizes the computation:
(4)
where:
The R
ΘJC
is specific to each regulator as determinedby its package, lead frame, and die size provided in•V
IN(avg)
is the average input voltage
the regulator's data sheet. The R
ΘSA
is a function of•V
OUT(avg)
is the average output voltage
the type and size of heatsink. For example, black•I
OUT(avg)
is the average output current
body radiator type heatsinks can have R
ΘCS
values•I
Q
is the quiescent current
ranging from 5 °C/W for very large heatsinks to50 °C/W for very small heatsinks. The R
ΘCS
is aFor most TI LDO regulators, the quiescent current is
function of how the package is attached to theinsignificant compared to the average output current;
heatsink. For example, if a thermal compound istherefore, the term V
IN(avg)
x I
Q
can be neglected. The
used to attach a heatsink to a SOT223 package,operating junction temperature is computed by
R
ΘCS
of 1 °C/W is reasonable.adding the ambient temperature (T
A
) and theincrease in temperature due to the regulator's power
Even if no external black body radiator type heatsinkdissipation. The temperature rise is computed by
is attached to the package, the board on which themultiplying the maximum expected power dissipation
regulator is mounted provides some heatsinkingby the sum of the thermal resistances between the
through the pin solder connections. Some packages,junction and the case (R
ΘJC
), the case to heatsink
like the DDPAK and SOT223 packages, use a(R
ΘCS
), and the heatsink to ambient (R
ΘSA
). Thermal
copper plane underneath the package or the circuitresistances are measures of how effectively an
board ground plane for additional heatsinking toobject dissipates heat. Typically, the larger the
improve their thermal performance. Computer-aideddevice, the more surface area available for power
thermal modeling can be used to compute verydissipation and the lower the object's thermal
accurate approximations of an integrated circuit'sresistance.
thermal performance in different operatingenvironments (for example, different types of circuitFigure 24 illustrates these thermal resistances for a
boards, different types and sizes of heatsinks,SOT223 package mounted in a JEDEC low-K board.
different air flows, etc.). Using these models, thethree thermal resistances can be combined into onethermal resistance between junction and ambient(R
ΘJA
). This R
ΘJA
is valid only for the specificoperating environment used in the computer model.
10
Submit Documentation Feedback
www.ti.com
TJ+TA)PDmax RθJA
(6)
RθJA +TJ*TA
PDmax
(7)
PDmax +(3.3 *2.5)V 1A +800mW
(8)
RθJA max +(125 *55)°Cń800mW +87.5°CńW
0
100
120
140
160
180 No Air Flow
80
60
40
20
0.1 1 10
PCB Copper Area (in2)
RθJA − Thermal Resistance (°C/W)
SOT223 POWER DISSIPATION
0
1
2
3
6
0 25 50 75 100 150125
TA = 25°C
TA − Ambient Temperature (°C)
4
5
4 in2 PCB Area
0.5 in2 PCB Area
PD − Maximum Power Dissipation (W)
TPS794xx
SLVS349E – NOVEMBER 2001 – REVISED DECEMBER 2005
Equation 5 simplifies into Equation 6 : applications. The SOT223 package dimensions areprovided in the Mechanical Data section at the endof the data sheet. The addition of a copper planeRearranging Equation 6 gives Equation 7 :
directly underneath the SOT223 package enhancesthe thermal performance of the package.
To illustrate, the TPS79425 in a SOT223 packagewas chosen. For this example, the average inputUsing Equation 6 and the computer model generated
voltage is 3.3 V, the output voltage is 2.5 V, thecurves shown in Figure 25 , a designer can quickly
average output current is 1 A, the ambientcompute the required heatsink thermal
temperature 55 °C, no air flow is present, and theresistance/board area for a given ambient
operating environment is the same as documentedtemperature, power dissipation, and operating
below. Neglecting the quiescent current, theenvironment.
maximum average power is Equation 8 :
Substituting T
J
max for T
J
into Equation 4 givesEquation 9 :
(9)
From Figure 25 , R
θJA
vs PCB Copper Area, theground plane needs to be 0.55 in
2
for the part todissipate 800 mW. The operating environment usedto construct Figure 25 consisted of a board with 1 oz.copper planes. The package is soldered to a 1 oz.copper pad on the top of the board. The pad is tiedthrough thermal vias to the 1 oz. ground plane.
From the data in Figure 25 and rearranging equation6, the maximum power dissipation for a differentground plane area and a specific ambienttemperature can be computed, as shown inFigure 26 .Figure 25. SOT223 Thermal Resistance vs PCBCopper Area
The SOT223 package provides an effective meansof managing power dissipation in surface-mount
Figure 26. SOT223 Maximum Power Dissipationvs Ambient Temperature
11Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS79401DCQ ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79401DCQG4 ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79401DCQR ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79401DCQRG4 ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79401DGNR ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79401DGNRG4 ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79401DGNT ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79401DGNTG4 ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79418DCQ ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79418DCQR ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79418DGNR ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79418DGNRG4 ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79418DGNT ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79418DGNTG4 ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79425DCQ ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79425DCQG4 ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79425DCQR ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS79425DCQRG4 ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79425DGNR ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79425DGNRG4 ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79425DGNT ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79425DGNTG4 ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79428DCQ ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79428DCQG4 ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79428DCQR ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79428DCQRG4 ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79428DGNT ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79428DGNTG4 ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79430DCQ ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79430DCQG4 ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79430DCQR ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79430DCQRG4 ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79430DGNR ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79430DGNRG4 ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79430DGNT ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS79430DGNTG4 ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79433DCQ ACTIVE SOT-223 DCQ 6 78 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79433DCQR ACTIVE SOT-223 DCQ 6 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TPS79433DGNR ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79433DGNRG4 ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79433DGNT ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS79433DGNTG4 ACTIVE MSOP-
PowerPAD DGN 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 4
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS79401DCQR SOT-223 DCQ 6 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
TPS79401DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79401DGNT MSOP-
Power
PAD
DGN 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79418DCQR SOT-223 DCQ 6 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
TPS79418DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79418DGNT MSOP-
Power
PAD
DGN 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79425DCQR SOT-223 DCQ 6 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
TPS79425DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79425DGNT MSOP-
Power
PAD
DGN 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79428DCQR SOT-223 DCQ 6 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS79428DGNT MSOP-
Power
PAD
DGN 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79430DCQR SOT-223 DCQ 6 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
TPS79430DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79430DGNT MSOP-
Power
PAD
DGN 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79433DCQR SOT-223 DCQ 6 2500 330.0 12.4 6.8 7.3 1.88 8.0 12.0 Q3
TPS79433DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS79433DGNT MSOP-
Power
PAD
DGN 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79401DCQR SOT-223 DCQ 6 2500 358.0 335.0 35.0
TPS79401DGNR MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0
TPS79401DGNT MSOP-PowerPAD DGN 8 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS79418DCQR SOT-223 DCQ 6 2500 358.0 335.0 35.0
TPS79418DGNR MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0
TPS79418DGNT MSOP-PowerPAD DGN 8 250 210.0 185.0 35.0
TPS79425DCQR SOT-223 DCQ 6 2500 358.0 335.0 35.0
TPS79425DGNR MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0
TPS79425DGNT MSOP-PowerPAD DGN 8 250 210.0 185.0 35.0
TPS79428DCQR SOT-223 DCQ 6 2500 358.0 335.0 35.0
TPS79428DGNT MSOP-PowerPAD DGN 8 250 210.0 185.0 35.0
TPS79430DCQR SOT-223 DCQ 6 2500 358.0 335.0 35.0
TPS79430DGNR MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0
TPS79430DGNT MSOP-PowerPAD DGN 8 250 210.0 185.0 35.0
TPS79433DCQR SOT-223 DCQ 6 2500 358.0 335.0 35.0
TPS79433DGNR MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0
TPS79433DGNT MSOP-PowerPAD DGN 8 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 3
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