© Semiconductor Components Industries, LLC, 2014
November, 2014 − Rev. 5 Publication Order Number:
BAT54CTT1/D
1
BAT54CT
Dual Series Schottky
Barrier Diodes
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
•Extremely Fast Switching Speed
•Low Forward Voltage − 0.35 Volts (Typ) @ IF = 10 mAdc
•S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TJ = 125°C unless otherwise noted)
Rating Symbol Value Unit
Reverse Voltage VR30 V
Forward Power Dissipation
@ TA = 25°C
Derate above 25°C
PF225
1.8 mW
mW/°C
Thermal Resistance,
Junction-to-Ambient (Note 1) RqJA 555 °C/W
Forward Current (DC) IF200 Max mA
Non−Repetitive Peak Forward
Current,
tp < 10 msec
IFSM
600
mA
Repetitive Peak Forward Current
Pulse Wave = 1 sec,
Duty Cycle = 66%
IFRM 300 mA
Junction Temperature TJ−55 to 125 °C
Storage Temperature Range Tstg −55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be af fected.
1. FR−4 board with minimum mounting pad.
30 VOLT
DUAL COMMON CATHODE
SCHOTTKY BARRIER DIODES
3
CATHODE
1
ANODE 2
ANODE
Device Package Shipping†
ORDERING INFORMATION
SC−75
CASE 463
STYLE 3
MARKING DIAGRAM
BAT54CTT1G SC−75
(Pb−Free) 3,000 / Tape & Ree
l
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
5CM G
G
5C = Device Code
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending up-
on manufacturing location.
1
SBAT54CTT1G SC−75
(Pb−Free) 3,000 / Tape & Ree
l
12
3
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BAT54CT
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (EACH DIODE)
Characteristic Symbol Min Typ Max Unit
Reverse Breakdown Voltage
(IR = 10 mA) V(BR)R 30 − − V
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz) CT− 7.6 10 pF
Reverse Leakage
(VR = 25 V) IR− 0.5 2.0 mAdc
Forward Voltage
(IF = 0.1 mA)
(IF = 1.0 mA)
(IF = 10 mA)
(IF = 30 mA)
(IF = 100 mA)
VF−
−
−
−
−
0.22
0.29
0.35
0.41
0.52
0.24
0.32
0.40
0.50
0.80
V
Reverse Recovery Time
(IF = IR = 10 mAdc, IR(REC) = 1.0 mAdc, Figure 1) trr − − 5.0 ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
+10 V 2 k
820
W
0.1 mF
DUT
VR
100 mH0.1 mF
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
trtpT
10%
90%
IF
IR
trr T
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measure
d
at iR(REC) = 1 mA)
IF
INPUT SIGNAL
Figure 1. Recovery Time Equivalent Test Circuit
BAT54CT
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3
CT, TOTAL CAPACITANCE (pF)
100
0.0 0.1VF, FORWARD VOLTAGE (VOLTS)
0.2 0.3 0.4 0.5
10
1.0
0.1
85°C
10
0VR, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001 51015 20 25
0VR, REVERSE VOLTAGE (VOLTS)
51015 30
Figure 2. Forward Voltage
Figure 3. Leakage Current
Figure 4. Total Capacitance
−40°C
25°C
TA = 150°C
0.6
−55°C
150°C
125°C
100
1000
30
2520
IR, REVERSE CURRENT (mA) IF, FORWARD CURRENT (mA)
14
12
10
8
6
4
2
0
TA = 125°C
TA = 85°C
TA = 25°C
BAT54CT
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4
PACKAGE DIMENSIONS
SC−75 / SOT−416
CASE 463
ISSUE F
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
M
0.20 (0.008) D
−E−
−D−
b
e
3 PL
0.20 (0.008) E
C
L
A
A1
3
2
1
HE
DIM MIN NOM MAX
MILLIMETERS
A0.70 0.80 0.90
A1 0.00 0.05 0.10
b
C0.10 0.15 0.25
D1.55 1.60 1.65
E
e1.00 BSC
0.027 0.031 0.035
0.000 0.002 0.004
0.004 0.006 0.010
0.059 0.063 0.067
0.04 BSC
MIN NOM MAX
INCHES
0.15 0.20 0.30 0.006 0.008 0.012
HE
L0.10 0.15 0.20
1.50 1.60 1.70 0.004 0.006 0.008
0.061 0.063 0.065
0.70 0.80 0.90 0.027 0.031 0.035
0.787
0.031
0.508
0.020 1.000
0.039
ǒmm
inchesǓ
SCALE 10:1
0.356
0.014
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.803
0.071
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
BAT54CTT1/D
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Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative
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