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FEATURES
DESCRIPTION/ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
DB, DGV, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
1 20
10 11
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
1OE
2A1 V
GND
CC
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
•Operates From 1.65 V to 3.6 V•Inputs Accept Voltages to 5.5 V•Specified From –40°C to 85°C and –40°C to125°C
•Max t
pd
of 5.9 ns at 3.3 V•Typical V
OLP
(Output Ground Bounce) < 0.8 Vat V
CC
= 3.3 V, T
A
= 25°C•Typical V
OHV
(Output V
OH
Undershoot) > 2 Vat V
CC
= 3.3 V, T
A
= 25°C•Supports Mixed-Mode Signal Operation on AllPorts (5-V Input/Output Voltage With3.3-V V
CC
)•I
off
Supports Partial-Power-Down ModeOperation
•Latch-Up Performance Exceeds 250 mA PerJESD 17•ESD Protection Exceeds JESD 22– 2000-V Human-Body Model (A114-A)– 200-V Machine Model (A115-A)– 1000-V Charged-Device Model (C101)
This octal buffer/line driver is operational at 1.5-V to3.6-V V
CC
, but is designed specifically for 1.65-V to3.6-V V
CC
operation.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
QFN – RGY Reel of 1000 SN74LVC244ARGYR LC244A–40°C to 85°C VFBGA – GQN SN74LVC244AGQNR
Reel of 1000 LC244AVFBGA – ZQN (Pb-Free) SN74LVC244AZQNRPDIP – N Tube of 20 SN74LVC244AN SN74LVC244ANTube of 25 SN74LVC244ADWSOIC – DW LVC244AReel of 2000 SN74LVC244ADWRSOP – NS Reel of 2000 SN74LVC244ANSR LVC244A–40°C to 125°C SSOP – DB Reel of 2000 SN74LVC244ADBR LC244ATube of 70 SN74LVC244APWTSSOP – PW Reel of 2000 SN74LVC244APWR LC244AReel of 250 SN74LVC244APWTTVSOP – DGV Reel of 2000 SN74LVC244ADGVR LC244A
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1992–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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DESCRIPTION/ORDERING INFORMATION (CONTINUED)
GQN OR ZQN PACKAGE
(TOP VIEW)
1 2 3 4
A
B
C
D
E
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
The SN74LVC244A is organized as two 4-bit line drivers with separate output-enable ( OE) inputs. When OE islow, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in thehigh-impedance state.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator ina mixed 3.3-V/5-V system environment.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullupresistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
TERMINAL ASSIGNMENTS
1 2 3 4
A1A1 1 OE V
CC
2 OE
B1A2 2A4 2Y4 1Y1
C1A3 2Y3 2A3 1Y2
D1A4 2A2 2Y2 1Y3
EGND 2Y1 2A1 1Y4
FUNCTION TABLE(EACH BUFFER)
INPUTS
OUTPUT
YOE A
L H HL L LH X Z
2
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1
2 18 1Y1
1OE
1A1
4 16 1Y21A2
6 14 1Y3
1A3
8 12 1Y4
1A4
19
11 9 2Y1
2OE
2A1
13 7 2Y22A2
15 5 2Y3
2A3
17 3 2Y4
2A4
Pin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages.
Absolute Maximum Ratings
(1)
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 6.5 VV
I
Input voltage range
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high or low state
(2) (3)
–0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 –50 mAI
OK
Output clamp current V
O
< 0 –50 mAI
O
Continuous output current ±50 mAContinuous current through V
CC
or GND ±100 mADB package
(4)
70DGV package
(4)
92DW package
(4)
58GQN/ZQN package
(4)
78θ
JA
Package thermal impedance °C/WN package
(4)
69NS package
(4)
60PW package
(4)
83RGY package
(5)
37T
stg
Storage temperature range –65 150 °CP
tot
Power dissipation T
A
= –40°C to 125°C
(6) (7)
500 mW
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CC
is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.(5) The package thermal impedance is calculated in accordance with JESD 51-5.(6) For the DW package: above 70°C the value of P
tot
derates linearly with 8 mW/K.(7) For the DB, DGV, N, NS, and PW packages: above 60°C the value of P
tot
derates linearly with 5.5 mW/K.
3
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Recommended Operating Conditions
(1)
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
T
A
= 25° C –40 TO 85° C –40 TO 125° C
UNITMIN MAX MIN MAX MIN MAX
Operating 1.65 3.6 1.65 3.6 1.65 3.6V
CC
Supply voltage VData retention only 1.5 1.5 1.5V
CC
= 1.65 V to 1.95 V 0.65 × V
CC
0.65 × V
CC
0.65 × V
CCHigh-level
V
IH
V
CC
= 2.3 V to 2.7 V 1.7 1.7 1.7 Vinput voltage
V
CC
= 2.7 V to 3.6 V 2 2 2V
CC
= 1.65 V to 1.95 V 0.35 × V
CC
0.35 × V
CC
0.35 × V
CCLow-level
V
IL
V
CC
= 2.3 V to 2.7 V 0.7 0.7 0.7 Vinput voltage
V
CC
= 2.7 V to 3.6 V 0.8 0.8 0.8V
I
Input voltage 0 5.5 0 5.5 0 5.5 VV
O
Output voltage 0 V
CC
0 V
CC
0 V
CC
VV
CC
= 1.65 V –4 –4 –4V
CC
= 2.3 V –8 –8 –8High-level
I
OH
mAoutput current
V
CC
= 2.7 V –12 –12 –12V
CC
= 3 V –24 –24 –24V
CC
= 1.65 V 4 4 4V
CC
= 2.3 V 8 8 8Low-level
I
OL
mAoutput current
V
CC
= 2.7 V 12 12 12V
CC
= 3 V 24 24 24
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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Electrical Characteristics
Switching Characteristics
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
over recommended operating free-air temperature range (unless otherwise noted)
T
A
= 25°C –40 TO 85°C –40 TO 125°CPARAMETER TEST CONDITIONS V
CC
UNITMIN TYP MAX MIN MAX MIN MAX
V
CC
– V
CC
– V
CC
–I
OH
= –100 µA 1.65 V to 3.6 V
0.2 0.2 0.3I
OH
= –4 mA 1.65 V 1.29 1.2 1.05I
OH
= –8 mA 2.3 V 1.9 1.7 1.55V
OH
V2.7 V 2.2 2.2 2.05I
OH
= –12 mA
3 V 2.4 2.4 2.25I
OH
= –24 mA 3 V 2.3 2.2 2I
OL
= 100 µA 1.65 V to 3.6 V 0.1 0.2 0.3I
OL
= 4 mA 1.65 V 0.24 0.45 0.6V
OL
I
OL
= 8 mA 2.3 V 0.3 0.7 0.75 VI
OL
= 12 mA 2.7 V 0.4 0.4 0.6I
OL
= 24 mA 3 V 0.55 0.55 0.8I
I
V
I
= 5.5 V or GND 3.6 V ±1 ±5 ±20 µAI
off
V
I
or V
O
= 5.5 V 0 ±1 ±10 ±20 µAI
OZ
V
O
= 0 to 5.5 V 3.6 V ±1 ±10 ±20 µAV
I
= V
CC
or GND 1 10 40I
CC
I
O
= 0 3.6 V µA3.6 V ≤V
I
≤5.5 V
(1)
1 10 40One input at V
CC
– 0.6 V,∆I
CC
2.7 V to 3.6 V 500 500 5000 µAOther inputs at V
CC
or GNDC
i
V
I
= V
CC
or GND 3.3 V 4 pFC
o
V
O
= V
CC
or GND 3.3 V 5.5 pF
(1) This applies in the disabled state only.
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )
T
A
= 25°C –40 TO 85°C –40 TO 125°CFROM TOPARAMETER V
CC
UNIT(INPUT) (OUTPUT)
MIN TYP MAX MIN MAX MIN MAX
1.5 V 1 7 14.4 1 14.9 1 16.41.8 V ± 0.15 V 1 5.9 10.4 1 10.9 1 12.4t
pd
A Y 2.5 V ± 0.2 V 1 4.2 7.4 1 7.9 1 10 ns2.7 V 1 4.2 6.7 1 6.9 1 8.23.3 V ± 0.3 V 1.5 3.9 5.7 1.5 5.9 1.5 7.21.5 V 1 8.3 17.8 1 18.3 1 19.81.8 V ± 0.15 V 1 6.4 12.1 1 12.6 1 14.1t
en
OE Y 2.5 V ± 0.2 V 1 4.6 9.1 1 9.6 1 11.7 ns2.7 V 1 5 8.4 1 8.6 1 10.33.3 V ± 0.3 V 1.5 4.5 7.4 1.5 7.6 1.5 9.41.5 V 1 7.2 15.6 1 16.1 1 17.61.8 V ± 0.15 V 1 5.8 11.6 1 12.1 1 13.6t
dis
OE Y 2.5 V ± 0.2 V 1 3.7 7.3 1 7.8 1 9.9 ns2.7 V 1 3.8 6.6 1 6.8 1 8.63.3 V ± 0.3 V 1.5 3.8 6.3 1.5 6.5 1.5 8t
sk(o)
3.3 V ± 0.3 V 1 1.5 ns
5
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Operating Characteristics
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
T
A
= 25°C
PARAMETER TEST CONDITIONS V
CC
TYP UNIT
1.8 V 43Outputs enabled f = 10 MHz 2.5 V 433.3 V 44C
pd
Power dissipation capacitance per buffer/driver pF1.8 V 1Outputs disabled f = 10 MHz 2.5 V 13.3 V 2
6
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PARAMETER MEASUREMENT INFORMATION
VM
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
RL
Data Input
Timing Input VI
0 V
VI
0 V
0 V
tw
Input
VOLTAGE WA VEFORMS
SETUP AND HOLD TIMES
VOLTAGE WA VEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WA VEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 V
Input
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
VLOAD/2
0 V
VOL + V∆
VOH − V∆≈0 V
VI
VOLTAGE WA VEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.5 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
2 kΩ
1 kΩ
500 Ω
500 Ω
500 Ω
VCC RL
2 × VCC
2 × VCC
2 × VCC
6 V
6 V
VLOAD CL
15 pF
30 pF
30 pF
50 pF
50 pF
0.1 V
0.15 V
0.15 V
0.3 V
0.3 V
V∆
VCC
VCC
VCC
2.7 V
2.7 V
VI
VCC/2
VCC/2
VCC/2
1.5 V
1.5 V
VM
tr/tf
≤2 ns
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
INPUTS
SN74LVC244A
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCAS414X – NOVEMBER 1992 – REVISED MARCH 2005
Figure 1. Load Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com 4-May-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC244ADBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74LVC244ADBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244AGQNR LIFEBUY BGA
MICROSTAR
JUNIOR
GQN 20 1000 TBD SNPB Level-1-240C-UNLIM
SN74LVC244AN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74LVC244ANE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74LVC244ANSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 4-May-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC244ANSRG4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244APW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244APWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74LVC244APWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244APWRG3 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM
SN74LVC244APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244APWT ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244APWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244APWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC244ARGYR ACTIVE VQFN RGY 20 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74LVC244ARGYRG4 ACTIVE VQFN RGY 20 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74LVC244AZQNR ACTIVE BGA
MICROSTAR
JUNIOR
ZQN 20 1000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 4-May-2012
Addendum-Page 3
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC244A :
•Automotive: SN74LVC244A-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC244ADBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74LVC244ADGVR TVSOP DGV 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC244ADWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74LVC244ADWRG4 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74LVC244AGQNR BGA MI
CROSTA
R JUNI
OR
GQN 20 1000 330.0 12.4 3.3 4.3 1.5 8.0 12.0 Q1
SN74LVC244ANSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
SN74LVC244APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74LVC244APWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74LVC244APWRG3 TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74LVC244APWRG4 TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74LVC244APWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74LVC244ARGYR VQFN RGY 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1
SN74LVC244AZQNR BGA MI
CROSTA
R JUNI
OR
ZQN 20 1000 330.0 12.4 3.3 4.3 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC244ADBR SSOP DB 20 2000 367.0 367.0 38.0
SN74LVC244ADGVR TVSOP DGV 20 2000 367.0 367.0 35.0
SN74LVC244ADWR SOIC DW 20 2000 366.0 364.0 50.0
SN74LVC244ADWRG4 SOIC DW 20 2000 367.0 367.0 45.0
SN74LVC244AGQNR BGA MICROSTAR
JUNIOR GQN 20 1000 340.5 338.1 20.6
SN74LVC244ANSR SO NS 20 2000 367.0 367.0 45.0
SN74LVC244APWR TSSOP PW 20 2000 367.0 367.0 38.0
SN74LVC244APWR TSSOP PW 20 2000 364.0 364.0 27.0
SN74LVC244APWRG3 TSSOP PW 20 2000 364.0 364.0 27.0
SN74LVC244APWRG4 TSSOP PW 20 2000 367.0 367.0 38.0
SN74LVC244APWT TSSOP PW 20 250 367.0 367.0 38.0
SN74LVC244ARGYR VQFN RGY 20 3000 367.0 367.0 35.0
SN74LVC244AZQNR BGA MICROSTAR
JUNIOR ZQN 20 1000 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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