1
Features
•Fast Read Access Time – 70 ns
•5-volt Only Reprogramming
•Sector Program Operation
– Single Cycle Reprogram (Erase and Program)
– 1024 Sectors (256 Bytes/Sector)
– Internal Address and Data Latches for 256 Bytes
•Internal Program Control and Timer
•Hardware and Software Data Protection
•Two 8K Bytes Boot Blocks with Lockout
•FastSectorProgramCycleTime–10ms
•DATA Polling for End of Program Detection
•Low Power Dissipation
– 40mAActiveCurrent
– 100 µA CMOS Standby Current
•Typical Endurance > 10,000 Cycles
•Single 5V ±10% Supply
•CMOS and TTL Compatible Inputs and Outputs
•Commercial and Industrial Temperature Ranges
Description
The AT29C020 is a 5-volt-only in-system Flash programmable and erasable read-only
memory (PEROM). Its 2 megabits of memory is organized as 262,144 bytes. Manu-
factured with Atmel’s advanced nonvolatile CMOS technology, the device offers
access times to 70 ns with power dissipation of just 220 mW over the commercial tem-
perature range. When the device is deselected, the CMOS standby current is less
than 100 µA. Device endurance is such that any sector can typically be written to in
excess of 10,000 times.
2-megabit
(256K x 8)
5-volt Only
Flash Memory
AT29C020
Rev. 0291N–FLASH–07/02
Pin Configurations
Pin Name Function
A0 - A17 Addresses
CE Chip Enable
OE Output Enable
WE Write Enable
I/O0 - I/O7 Data Inputs/Outputs
NC No Connect
DIP Top View
PLCC Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
NC
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
VCC
WE
A17
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
4
3
2
1
32
31
30
14
15
16
17
18
19
20
I/O1
I/O2
GND
I/O3
I/O4
I/O5
I/O6
A12
A15
A16
NC
VCC
WE
A17
TSOP Top View
Type 1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A11
A9
A8
A13
A14
A17
WE
VCC
NC
A16
A15
A12
A7
A6
A5
A4
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
2AT29C020
0291N–FLASH–07/02
To allow for simple in-system reprogrammability, the AT29C020 does not require high input
voltages for programming. Five-volt-only commands determine the operation of the device.
Reading data out of the device is similar to reading from an EPROM. Reprogramming the
AT29C020 is performed on a sector basis; 256 bytes of data are loaded into the device and
then simultaneously programmed.
During a reprogram cycle, the address locations and 256 bytes of data are internally latched,
freeing the address and data bus for other operations. Following the initiation of a program
cycle, the device will automatically erase the sector and then program the latched data using
an internal control timer. The end of a program cycle can be detected by DATA polling of I/O7.
Once the end of a program cycle has been detected, a new access for a read or program can
begin.
Block Diagram
Device
Operation
READ: TheAT29C020isaccessedlikeanEPROM.WhenCEand OE are low and WE is
high, the data stored at the memory location determined by the address pins is asserted on
the outputs. The outputs are put in the high impedance state whenever CE or OE is high. This
dual-line control gives designers flexibility in preventing bus contention.
BYTE LOAD: Byte loads are used to enter the 256 bytes of a sector to be programmed or
the software codes for data protection. A byte load is performed by applying a low pulse on the
WE or CE input with CE or WE low (respectively) and OE high. The address is latched on the
falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of
CE or WE.
PROGRAM: The device is reprogrammed on a sector basis. If a byte of data within a sector
is to be changed, data for the entire sector must be loaded into the device. Any byte that is not
loaded during the programming of its sector will be indeterminate. Once the bytes of a sector
are loaded into the device, they are simultaneously programmed during the internal program-
ming period. After the first data byte has been loaded into the device, successive bytes are
entered in the same manner. Each new byte to be programmed must have its high-to-low tran-
sition on WE (or CE) within 150 µs of the low-to-high transition of WE (or CE) of the preceding
byte. If a high-to-low transition is not detected within 150 µs of the last low-to-high transition,
the load period will end and the internal programming period will start. A8 to A17 specify the
sector address. The sector address must be valid during each high-to-low transition of WE (or
CE). A0 to A7 specify the byte address within the sector. The bytes may be loaded in any
order; sequential loading is not required. Once a programming operation has been initiated,
and for the duration of tWC, a read operation will effectively be a polling operation.
3
AT29C020
0291N–FLASH–07/02
SOFTWARE DATA PROTECTION: A software controlled data protection feature is avail-
able on the AT29C020. Once the software protection is enabled a software algorithm must be
issued to the device before a program may be performed. The software protection feature may
be enabled or disabled by the user; when shipped from Atmel, the software data protection
feature is disabled. To enable the software data protection, a series of three program com-
mands to specific addresses with specific data must be performed. After the software data
protection is enabled the same three program commands must begin each program cycle in
order for the programs to occur. All software program commands must obey the sector pro-
gram timing specifications. Once set, the software data protection feature remains active
unless its disable command is issued. Power transitions will not reset the software data pro-
tection feature; however, the software feature will guard against inadvertent program cycles
during power transitions.
After setting SDP, any attempt to write to the device without the 3-byte command sequence
will start the internal write timers. No data will be written to the device; however, for the dura-
tion of tWC, a read operation will effectively be a polling operation.
After the software data protection’s 3-byte command code is given, a sector of data is loaded
into the device using the sector program timing specifications.
HARDWARE DATA PROTECTION: Hardware features protect against inadvertent pro-
grams to the AT29C020 in the following ways: (a) VCC sense –if VCC is below 3.8V (typical),
the program function is inhibited; (b) VCC power on delay –once VCC has reached the VCC
sense level, the device will automatically time out 5 ms (typical) before programming; (c) Pro-
gram inhibit –holding any one of OE low, CE high or WE high inhibits program cycles; and (d)
Noise filter –pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a pro-
gram cycle.
PRODUCT IDENTIFICATION: The product identification mode identifies the device and
manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware
operation mode can be used by an external programmer to identify the correct programming
algorithm for the Atmel product. In addition, users may wish to use the software product identi-
fication mode to identify the part (i.e. using the device code), and have the system software
use the appropriate sector size for program operations. In this manner, the user can have a
common board design for 256K to 4-megabit densities and, with each density’ssectorsizein
a memory map, have the system software apply the appropriate sector size.
For details, see Operating Modes (for hardware operation) or Software Product Identification.
The manufacturer and device code is the same for both modes.
DATA POLLING: The AT29C020 features DATA polling to indicate the end of a program
cycle. During a program cycle an attempted read of the last byte loaded will result in the com-
plement of the loaded data on I/O7. Once the program cycle has been completed, true data is
valid on all outputs and the next cycle may begin. DATA polling may begin at any time during
the program cycle.
TOGGLE BIT: In addition to DATA polling the AT29C020 provides another method for deter-
mining the end of a program or erase cycle. During a program or erase operation, successive
attempts to read data from the device will result in I/O6 toggling between one and zero. Once
the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examin-
ing the toggle bit may begin at any time during a program cycle.
OPTIONAL CHIP ERASE MODE: The entire device can be erased by using a 6-byte soft-
ware code. Please see Software Chip Erase application note for details.
4AT29C020
0291N–FLASH–07/02
BOOT BLOCK PROGRAMMING LOCKOUT: The AT29C020 has two designated memory
blocks that have a programming lockout feature. This feature prevents programming of data in
the designated block once the feature has been enabled. Each of these blocks consists of 8K
bytes; the programming lockout feature can be set independently for either block. While the
lockout feature does not have to be activated, it can be activated for either or both blocks.
These two 8K memory sections are referred to as
boot blocks
. Secure code which will bring up
a system can be contained in a boot block. The AT29C020 blocks are located in the first 8K
bytes of memory and the last 8K bytes of memory. The boot block programming lockout fea-
ture can therefore support systems that boot from the lower addresses of memory or the
higher addresses. Once the programming lockout feature has been activated, the data in that
block can no longer be erased or programmed; data in other memory locations can still be
changed through the regular programming methods. To activate the lockout feature, a series
of seven program commands to specific addresses with specific data must be performed.
Please see Boot Block Lockout Feature Enable Algorithm.
If the boot block lockout feature has been activated on either block, the chip erase function will
be disabled.
BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine
whether programming of either boot block section is locked out. See Software Product Identifi-
cation Entry and Exit sections. When the device is in the software product identification mode,
a read from location 00002H will show if programming the lower address boot block is locked
out while reading location 3FFF2H will do so for the upper boot block. If the data is FE, the cor-
responding block can be programmed; if the data is FF, the program lockout feature has been
activated and the corresponding block cannot be programmed. The software product identifi-
cation exit mode should be used to return to standard operation.
Absolute Maximum Ratings*
Temperature Under Bias ................................ -55°Cto+125°C*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings”may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Storage Temperature ..................................... -65°Cto+150°C
All Input Voltages (including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to VCC +0.6V
Voltage on OE
with Respect to Ground ...................................-0.6V to +13.5V
5
AT29C020
0291N–FLASH–07/02
Notes: 1. X can be VIL or VIH.
2. Refer to AC Programming Waveforms.
3. VH= 12.0V ±0.5V.
4. Manufacturer Code: 1F, Device Code: DA.
5. See details under Software Product Identification Entry/Exit.
DC and AC Operating Range
AT29C020-70 AT29C020-90 AT29C020-10 AT29C020-12 AT29C020-15
Operating
Temperature (Case)
Com. 0°C-70°C0°C-70°C0°C-70°C0°C-70°C 0°C-70°C
Ind. -40°C-85°C-40°C-85°C-40°C-85°C-40°C-85°C-40°C-85°C
VCC Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%
Note: Not recommended for New Designs.
Operating Modes
Mode CE OE WE Ai I/O
Read VIL VIL VIH Ai DOUT
Program(2) VIL VIH VIL Ai DIN
5V Chip Erase VIL VIH VIL Ai
Standby/Write Inhibit VIH X(1) XXHighZ
Program Inhibit X X VIH
Program Inhibit X VIL X
Output Disable X VIH XHighZ
Product Identification
Hardware VIL VIL VIH A1 - A17 = VIL,A9=V
H,(3) A0 = VIL Manufacturer Code(4)
A1 - A17 = VIL,A9=V
H,A0=V
IH Device Code(4)
Software(5) A0 = VIL Manufacturer Code(4)
A0 = VIH Device Code(4)
DC Characteristics
Symbol Parameter Condition Min Max Units
ILI Input Load Current VIN =0VtoV
CC 10 µA
ILO Output Leakage Current VI/O =0VtoV
CC 10 µA
ISB1 VCC Standby Current CMOS CE =V
CC -0.3VtoV
CC Com. 100 µA
Ind. 300 µA
ISB2 VCC Standby Current TTL CE =2.0VtoV
CC 3mA
ICC VCC Active Current f = 5 MHz; IOUT = 0 mA 40 mA
VIL Input Low Voltage 0.8 V
VIH Input High Voltage 2.0 V
VOL Output Low Voltage IOL =2.1mA 0.45 V
VOH1 Output High Voltage IOH =-400µA 2.4 V
VOH2 Output High Voltage CMOS IOH =-100µA;V
CC =4.5V 4.2 V
6AT29C020
0291N–FLASH–07/02
AC Read Waveforms(1)(2)(3)(4)
Notes: 1. CE may be delayed up to tACC -t
CE after the address transition without impact on tACC.
2. OE may be delayed up to tCE -t
OE after the falling edge of CE without impact on tCE or by tACC -t
OE after an address change
without impact on tACC.
3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF).
4. This parameter is characterized and is not 100% tested.
AC Read Characteristics
Symbol Parameter
AT29C020-90 AT29C020-90 AT29C020-10 AT29C020-12 AT29C020-15
UnitsMin Max Min Max Min Max Min Max Min Max
tACC Address to Output Delay 0 70 0 90 100 120 150 ns
tCE(1) CE to Output Delay 70 90 100 120 150 ns
tOE(2) OE to Output Delay 0 40 0 40 050 0 50 070 ns
tDF
(3)(4) CE or OE to Output Float 0 25 0 25 025 0 30 040 ns
tOH Output Hold from OE,CE
or Address, whichever
occurred first
000 0 0 ns
Note: Not recommended for New Designs.
7
AT29C020
0291N–FLASH–07/02
Input Test Waveforms and Measurement Level
Output Test Load
Note: 1. This parameter is characterized and is not 100% tested.
tR,t
F<5ns
Pin Capacitance
f=1MHz,T=25°C(1)
Symbol Typ Max Units Conditions
CIN 46pFV
IN =0V
COUT 812pFV
OUT =0V
8AT29C020
0291N–FLASH–07/02
AC Byte Load Waveforms
WE Controlled
CE Controlled
AC Byte Load Characteristics
Symbol Parameter Min Max Units
tAS,t
OES Address, OE Set-up Time 0 ns
tAH Address Hold Time 50 ns
tCS Chip Select Set-up Time 0 ns
tCH Chip Select Hold Time 0 ns
tWP Write Pulse Width (WE or CE)90ns
tDS Data Set-up Time 50 ns
tDH,t
OEH Data, OE Hold Time 0 ns
tWPH Write Pulse Width High 100 ns
9
AT29C020
0291N–FLASH–07/02
Program Cycle Waveforms(1)(2)(3)
Notes: 1. A8 through A17 must specify the sector address during each high-to-low transition of WE (or CE).
2. OE must be high when WE and CE arebothlow.
3. All words that are not loaded within the sector being programmed will be indeterminate.
Program Cycle Characteristics
Symbol Parameter Min Max Units
tWC WriteCycleTime 10 ms
tAS Address Set-up Time 0 ns
tAH Address Hold Time 50 ns
tDS Data Set-up Time 50 ns
tDH Data Hold Time 0 ns
tWP Write Pulse Width 90 ns
tBLC Byte Load Cycle Time 150 µs
tWPH Write Pulse Width High 100 ns
10 AT29C020
0291N–FLASH–07/02
Software Data Protection Enable Algorithm()
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA A0
TO
ADDRESS 5555
LOAD DATA
TO
PAGE (128 BYTES)(4)
WRITES ENABLED
ENTER DATA
PROTECT STATE(2)
Software Data Protection Disable Algorithm()
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 80
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 20
TO
ADDRESS 5555
LOAD DATA
TO
PAGE (128 BYTES)(4)
EXIT DATA
PROTECT STATE(3)
Notes: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex).
2. Data Protect state will be activated at end of program cycle.
3. Data Protect state will be deactivated at end of program period.
4. 256 bytes of data MUST BE loaded.
Software Protected Program Cycle Waveform(1)(4)(5)
Notes: 1. A8 through A17 must specify the sector address during each high-to-low transition of WE (or CE) after the software code
has been entered.
4. OE must be high when WE and CE are both low.
5. All bytes that are not loaded within the sector being programmed will be indeterminate.
11
AT29C020
0291N–FLASH–07/02
Notes: 1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
Data Polling Waveforms
Notes: 1. These parameters are characterized and not 100% tested.
2. See tOE spec in AC Read Characteristics.
Toggle Bit Waveforms(1)(2)(3)
Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit.
2. Beginning and ending state of I/O6 may vary.
3. Any address location may be used but the address should not vary.
Data Polling Characteristics(1)
Symbol Parameter Min Typ Max Units
tDH Data Hold Time 10 ns
tOEH OE Hold Time 10 ns
tOE OE to Output Delay(2) ns
tWR Write Recovery Time 0 ns
Toggle Bit Characteristics(1)
Symbol Parameter Min Typ Max Units
tDH Data Hold Time 10 ns
tOEH OE Hold Time 10 ns
tOE OE to Output Delay(2) ns
tOEHP OE High Pulse 150 ns
tWR Write Recovery Time 0 ns
12 AT29C020
0291N–FLASH–07/02
Software Product Identification Entry(1)
Software Product Identification Exit(1)
Notes: 1. Data Format: I/O15 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. A1 - A17 = VIL.
Manufacturer Code is read for A0 = VIL;
Device Code is read for A0 = VIH.
3. The device does not remain in identification mode
if powered down.
4. The device returns to standard operation mode.
5. Manufacturer Code is 1F. The Device Code is DA.
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 90
TO
ADDRESS 5555
PAUSE 10 mS ENTER PRODUCT
IDENTIFICATION
MODE(2)(3)(5)
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA F0
TO
ADDRESS 5555
PAUSE 10 mS EXIT PRODUCT
IDENTIFICATION
MODE(4)
Boot Block Lockout
Feature Enable Algorithm(1)
Notes: 1. Data Format: I/O7 - I/O0 (Hex);
Address Format: A14 - A0 (Hex).
2. Lockout feature set on lower address boot block.
3. Lockout feature set on higher address boot block.
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 80
TO
ADDRESS 5555
LOAD DATA AA
TO
ADDRESS 5555
LOAD DATA 55
TO
ADDRESS 2AAA
LOAD DATA 40
TO
ADDRESS 5555
LOAD DATA 00
TO
ADDRESS 00000H(2)
PAUSE 20 mS
LOAD DATA FF
TO
ADDRESS 3FFFFH(3)
PAUSE 20 mS
13
AT29C020
0291N–FLASH–07/02
Ordering Information
tACC
(ns)
ICC (mA)
Ordering Code Package Operation RangeActive Standby
70 40 0.1 AT29C020-70JC
AT29C020-70PC
AT29C020-70TC
32J
32P6
32T
Commercial
(0°to 70°C)
40 0.1 AT29C020-70JI
AT29C020-70PI
AT29C020-70TI
32J
32P6
32T
Industrial
(-40°to 85°C)
90 40 0.1 AT29C020-90JC
AT29C020-90PC
AT29C020-90TC
32J
32P6
32T
Commercial
(0°to 70°C)
40 0.1 AT29C020-90JI
AT29C020-90PI
AT29C020-90TI
32J
32P6
32T
Industrial
(-40°to 85°C)
100 40 0.1 AT29C020-10JC
AT29C020-10PC
AT29C020-10TC
32J
32P6
32T
Commercial
(0°to 70°C)
40 0.3 AT29C020-10JI
AT29C020-10PI
AT29C020-10TI
32J
32P6
32T
Industrial
(-40°to 85°C)
120 40 0.1 AT29C020-12JC
AT29C020-12PC
AT29C020-12TC
32J
32P6
32T
Commercial
(0°to 70°C)
40 0.3 AT29C020-12JI
AT29C020-12PI
AT29C020-12TI
32J
32P6
32T
Industrial
(-40°to 85°C)
150 40 0.1 AT29C020-15JC
AT29C020-15PC
AT29C020-15TC
32J
32P6
32T
Commercial
(0°to 70°C)
40 0.3 AT29C020-15JI
AT29C020-15PI
AT29C020-15TI
32J
32P6
32T
Industrial
(-40°to 85°C)
Note: Not recommended for New Designs.
Package Type
32J 32-lead, Plastic J-leaded Chip Carrier (PLCC)
32P6 32-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP)
32T 32-lead, Thin Small Outline Package (TSOP)
14 AT29C020
0291N–FLASH–07/02
Packaging Information
32J–PLCC
DRAWING NO. REV.
2325 Orchard Parkway
San Jose, CA 95131
R
TITLE
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC) B
32J
10/04/01
1.14(0.045) X 45˚ PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.51(0.020)MAX
0.318(0.0125)
0.191(0.0075)
A2
45˚ MAX (3X)
A
A1
B1 E2
B
e
E1 E
D1
D
D2
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
A 3.175 – 3.556
A1 1.524 – 2.413
A2 0.381 – –
D 12.319 – 12.573
D1 11.354 – 11.506 Note 2
D2 9.906 – 10.922
E 14.859 – 15.113
E1 13.894 – 14.046 Note 2
E2 12.471 – 13.487
B 0.660 – 0.813
B1 0.330 – 0.533
e 1.270 TYP
15
AT29C020
0291N–FLASH–07/02
32P6 –PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
32P6, 32-lead (0.600"/15.24 mm Wide) Plastic Dual
Inline Package (PDIP) B
32P6
09/28/01
PIN
1
E1
A1
B
REF
E
B1
C
L
SEATING PLANE
A
0º ~ 15º
D
e
eB
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A––4.826
A1 0.381 ––
D 41.783 –42.291 Note 1
E 15.240 –15.875
E1 13.462 –13.970 Note 1
B 0.356 –0.559
B1 1.041 –1.651
L 3.048 –3.556
C 0.203 –0.381
eB 15.494 –17.526
e 2.540 TYP
Note: 1. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
16 AT29C020
0291N–FLASH–07/02
32T –TSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline
Package, Type I (TSOP) B
32T
10/18/01
PIN 1
D1 D
Pin 1 Identifier
b
e
EA
A1
A2
0º ~ 8º c
L
GAGE PLANE
SEATING PLANE
L1
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
Notes: 1. This package conforms to JEDEC reference MO-142, Variation BD.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
A––1.20
A1 0.05 –0.15
A2 0.95 1.00 1.05
D 19.80 20.00 20.20
D1 18.30 18.40 18.50 Note 2
E 7.90 8.00 8.10 Note 2
L 0.50 0.60 0.70
L1 0.25 BASIC
b 0.17 0.22 0.27
c 0.10 – 0.21
e 0.50 BASIC
Printed on recycled paper.
0291N–FLASH–07/02 /xM
© Atmel Corporation 2002.
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