This document was generated on 07/14/2020
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number: 0736560000
Status: Active
Overview: HDM Backplane Connector System
Description: HDM Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 3
Circuits, Gold (Au) 0.76µm
Documents:
3D Model Application Specification AS-73656-1998-001 (PDF)
Drawing (PDF) Packaging Specification PK-70873-0819 (PDF)
3D Model (PDF) RoHS Certificate of Compliance (PDF)
Product Specification PS-73670-9999 (PDF)
Agency Certification
CSA LR19980
UL E29179
General
Product Family Backplane Connectors
Series 73656
Application Backplane
Comments Backplane Power Module
Component Type Power Header
Overview HDM Backplane Connector System
Product Name HDM
UPC 800754345361
Physical
Circuits (Loaded) 3
Circuits (maximum) 3
Color - Resin Black
Durability (mating cycles max) 250
First Mate / Last Break No
Flammability 94V-0
Guide to Mating Part No
Keying to Mating Part None
Material - Metal Beryllium Copper
Material - Plating Mating Gold
Material - Plating Termination Gold
Material - Resin High Temperature Thermoplastic
Net Weight 1.609/g
Number of Columns 1
Number of Pairs Open Pin Field
Number of Rows 3
Orientation Vertical
PC Tail Length 3.50mm
PCB Locator No
PCB Retention Yes
PCB Thickness - Recommended 2.50mm
Packaging Type Tube
Pitch - Mating Interface 3.70mm
Pitch - Termination Interface 2.00mm
Plating min - Mating 0.762µm
Plating min - Termination 0.051µm
Polarized to PCB No
Stackable Yes
Surface Mount Compatible (SMC) Yes
Temperature Range - Operating -55° to +105°C
Series image - Reference only
EU ELV
Not Relevant
EU RoHS China RoHS
Compliant
REACH SVHC
Not Contained Per -
D(2020)4578-DC (25
June 2020)
Halogen-Free
Status
Low-Halogen
For more information, please visit Contact US
China ROHS Green Image
ELV Not Relevant
RoHS Phthalates Not Contained
Search Parts in this Series
73656 Series
Mates With
73651 HDM Board-to-Board Daughterboard
Power Module
Application Tooling | FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Global
Description Product #
HDM Power Module
Removal Tool 621001100
Backplane Power
Module Loading
Heads
622005711
Termination Interface: Style Through Hole - Compliant Pin
Electrical
Current - Maximum per Contact 15.0A
Data Rate 1.0 Gbps
Voltage - Maximum 500V AC
Solder Process Data
Lead-freeProcess Capability N/A
Material Info
Reference - Drawing Numbers
Application Specification AS-73656-1998-001
Packaging Specification PK-70873-0819
Product Specification PS-73670-9999
Sales Drawing SDA-73656-X00X-001
This document was generated on 07/14/2020
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
