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Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 20 - - V
ΔBVDSS/ΔTjBreakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA - 0.1 - V/℃
RDS(ON) Static Drain-Source On-Resistance2VGS=4.5V, ID=4A - 23 28 mΩ
VGS=2.5V, ID=2A - - 40 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 0.5 - - V
gfs Forward Transconductance VDS=10V, ID=4.6A - 9.7 - S
IDSS Drain-Source Leakage Current (Tj=25oC) VDS=20V, VGS=0V - - 1 uA
Drain-Source Leakage Current (Tj=70oC) VDS=20V ,VGS=0V - - 25 uA
IGSS Gate-Source Leakage VGS=--
nA
QgTotal Gate Charge2ID=4.6A - 12.5 - nC
Qgs Gate-Source Charge VDS=20V - 1 - nC
Qgd Gate-Drain ("Miller") Charge VGS=5V - 6.5 - nC
td(on) Turn-on Delay Time2VDS=10V - 7 - ns
trRise Time ID=1A - 14.5 - ns
td(off) Turn-off Delay Time RG=3.3Ω,VGS=5V - 19 - ns
tfFall Time RD=10Ω-12-ns
Ciss Input Capacitance VGS=0V - 355 - pF
Coss Output Capacitance VDS=20V - 190 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 85 - pF
Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
ISContinuous Source Current ( Body Diode ) VD=VG=0V,VS=1.2V - - 0.83 A
VSD Forward On Voltage2Tj=25℃,IS=1.25A,VGS=0V - - 1.2 V
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse width <300us , duty cycle <2%.
3.Surface mounted on 1 in2 copper pad of FR4 board ; 208℃/W when mounted on Min. copper pad.
AP9926O
± 8V ±100