© 2005 Fairchild Semiconductor Corporation DS01 1664 www.fairchildsemi.com
March 1994
Revised March 2005
74ABT240 Octal Buffer/Line Driver with 3-STATE Outputs
74ABT240
Octal Buffer/Line Driver with 3-STATE Outputs
General Descript ion
The ABT240 is an inverting octal buffer and line driver
designed to be employed as a memory address driver,
clock drive r and bu s oriented transmitter or receive r which
provide s imp rov ed PC boa rd densit y.
Features
Output sink capability of 64 mA, source capability of
32 mA
Guaranteed latchup protection
High impedance glitch free bus loading during entire
power up and power down cycle
Nondestructive hot insertion capability
Ordering Code:
Device a l s o av ailable in Tape and Reel. Specify by append ing suffix lette r “X” to the ordering co de.
Pb-Free package per JEDEC J-STD-020B.
Connection Diagram Pin Descriptions
Truth Tables
H
HIGH Voltage Leve l
L
LOW Voltage Lev el
X
Immaterial
Z
High Impedance
Order Number Package Number Package Description
74ABT240CSC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74ABT240CSJ M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74ABT240CMSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74ABT240CMTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pin Names Description
OE1, OE23-STATE Output
Enable Inputs
I0I7Inputs
O0O7Outputs
Inputs Outputs
OE1In(Pins 12, 14, 16, 18)
LL H
LH L
HX Z
Inputs Outputs
OE2In(Pins 3, 5, 7, 9)
LL H
LH L
HX Z
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74ABT240
Absolute Maximum Ratings(No te 1) Recommended Operating
Conditions
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under th es e conditi ons is not im plied.
Note 2: Either voltage limit or current l imit is sufficient to protect inputs.
DC Electrical Characteristics
Note 3: Guaranteed, but not tested.
Note 4: For 8 bits toggling, ICCD
0.8 mA/M Hz.
Storage Temperature
65
q
C to
150
q
C
Junction Temperature under Bias
55
q
C to
150
q
C
VCC Pin Potential to Ground Pin
0.5V to
7.0V
Input Voltage (Note 2)
0.5V to
7.0V
Input Curr en t (Note 2)
30 mA to
5.0 mA
Voltage Applied to Any Output
in the Disab led or
Power-Off State
0.5V to 5.5V
in the HIGH State
0.5V to VCC
Current Applied to Output
in LOW S tate (Max) twice the rated IOL (mA)
DC Latchup Source Current
(Across Comm Operating Range)
150 mA
Over Voltage Latchup (I/O) 10V
Free Air Ambient Temperature
40
q
C to
85
q
C
Supply Voltage
4.5V to
5.5V
Minimum Input Edge Rate (
'
V/
'
t)
Data Input 50 mV/ns
Enable Input 20 mV/ns
Symbol Parameter Min Typ Max Units VCC Conditions
VIH Input HIGH Voltage 2.0 V Recognized HIGH Signal
VIL Input LOW Voltage 0.8 V Recognized LOW Signal
VCD Input Clamp Diode Voltage
1.2 V Min IIN
18 mA
VOH Output HIGH Voltage 2.5 V Min IOH
3 mA
2.0 V Min IOH
32 mA
VOL Output LOW Voltage 0.55 V Min IOL
64 mA
IIH Input HIGH Current 1
P
AMax
VIN
2.7V (Note 3)
1V
IN
VCC
IBVI Input HIGH Current Breakdown Test 7
P
AMaxV
IN
7.0V
IIL Input LOW Current
1
P
AMax
VIN
0.5V (Note 3)
1V
IN
0.0V
VID Input Leakage Test 4.75 V 0.0 IID
1.9
P
A
All Other Pins Grounded
IOZH Output Leakage Current 10
P
A0
5.5V VOUT
2.7V; OEn
2.0V
IOZL Output Leakage Current
10
P
A0
5.5V VOUT
0.5V; OEn
2.0V
IOS Output Short-Circuit Current
100
275 mA Max VOUT
0.0V
ICEX Output HIGH Leakage Current 50
P
AMaxV
OUT
VCC
IZZ Bus Drainage Test 100
P
A0.0V
OUT
5.5V; All Others GND
ICCH Power Supply Current 50
P
A Max All Outputs HIGH
ICCL Power Supply Current 30 mA Max All Outputs LOW
ICCZ Power Supply Current 50
P
AMaxOE
n
VCC;
All Others at VCC or Ground
ICCT Additional ICC/Input Outputs Enabled 1.5 mA
Max
VI
VCC
2.1V
Outputs 3-STATE 1.5 mA Enable Input VI
VCC
2.1V
Outputs 3-STATE 50
P
A Data Input VI
VCC
2.1V
All Others at VCC or Ground
ICCD Dynamic ICC No Load mA/ Max Outputs Open
(Note 3) 0.1 MHz OEn
GND, (Note 4)
One Bit Toggling, 50% Duty Cycle
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74ABT240
AC Electrical Characteristics
Capacitance
Note 5: COUT is meas ured at frequency f
1 MHz, per MIL-STD-883, Method 3012.
TA
25
q
CT
A
55
q
C to
125
q
CT
A
40
q
C to
85
q
C
VCC
5V VCC
4.5V–5.5V VCC
4.5V–5.5V
Symbol Parameter CL
50 pF CL
50 pF CL
50 pF Units
Min Typ Max Min Max Min Max
tPLH Propagation Delay 1.0 4.8 0.8 5.5 1.0 4.8 ns
tPHL Data to Outputs 1.6 4.8 1.0 5.5 1.6 4.8
tPZH Output Enable 1.1 6.2 0.8 7.5 1.1 6.2 ns
tPZL Time 1.1 6.2 0.8 7.7 1.1 6.2
tPHZ Output Disable 1.8 6.4 1.0 7.5 1.8 6.4 ns
tPLZ Time 1.6 5.8 1.0 7.2 1.6 5.8
Symbol Parameter Typ Units Conditions
TA
25
q
C
CIN Input Capacitance 5.0 pF VCC
0V
COUT (Note 5) Output Capacitance 9.0 pF VCC
5.0V
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74ABT240
AC Loading
*Inclu des jig an d probe capac it anc e
Standard AC Test Load Test Input Signal Levels
Test Input Signal Requirements
AC W aveforms
Propagation Delay ,
Pulse W idth Waveforms
3-STATE Output HIGH
and LOW Enable and Disable Times
Propagation Delay Waveforms for
Inverting and Non-Inverting Functions
Setup Time, Hold Time
and Recovery Time Waveforms
Amplitude Rep. Rate tWtrtf
3.0V 1 MHz 500 ns 2.5 ns 2.5 ns
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74ABT240
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
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74ABT240
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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74ABT240
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
Package Numb er MSA20
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74ABT240 Octal Buffer/Line Driver wit h 3-STATE Output s
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does no t assume any responsibility for use of any circui try described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLI CY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life suppor t de vices o r systems a re devices or syste ms
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical compon ent in any componen t of a life support
device or system whose failure to perform can be rea-
sonabl y ex pect ed to cause the fa ilu re of the li fe su pp ort
device or system, or to affect its safety or effectiveness.
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