Data Sheet
Broadcom AV02-3793EN
October 25, 2018
Description
This family of SMT LEDs packaged in the form of PLCC-6
with separate heat path for each LED dice, enabling it to be
driven at higher current.
Individually addressable pin-outs give higher flexibility in
circuitry design. With closely matched radiation pattern
along the package’s X-axis, these LEDs are suitable for
indoor full color display applications. The black top surface
of the LED provides better contrast enhancement.
For easy pick-and-place, the LEDs are shipped in tape and
reel. Every reel is shipped from a single intensity and color
bin for better uniformity.
These LEDs are compatible with reflow soldering process.
Features
Standard PLCC-6 package (Plastic Leaded Chip
Carrier) with individual addressable pin-out for higher
flexibility of driving configuration
LED package with diffused silicone encapsulation
Using AlInGaP and InGaN dice technologies
Typical viewing angle 120°
Compatible with reflow soldering process
JEDEC MSL 3
Water-Resistance (IPX6, see note) per IEC 60529:2001
NOTE: The test is conducted on the component level by
mounting the components on the PCB with proper
potting to protect the leads. It is strongly
recommended that customers perform the
necessary tests on the components for their final
application.
Applications
Full color display
CAUTION! These LEDs are Class 1C ESD sensitive. Observe appropriate precautions during handling and processing.
For additional details, refer to Broadcom® Application Note AN-1142.
CAUTION! The customer is advised to keep the LED in the MBB when not in use as prolonged exposure to environment
might cause the silver-plated leads to tarnish, which might cause difficulties in soldering.
ASMT-YTB7-0AA02
Tricolor PLCC6 Black Surface LED
Broadcom AV02-3793EN
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ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Package Dimensions
Lead Configuration
NOTE:
1. All dimensions are in millimeter (mm).
2. Unless otherwise specified, tolerance is ± 0.20 mm.
3. Encapsulation = silicone.
4. Terminal finish = silver plating.
Pin Description
1 Cathode (Blue)
2 Cathode (Green)
3 Cathode (Red)
4 Anode (Red)
5 Anode (Green)
6 Anode (Blue)
0.50
1.80
0.90
0.20
4 3
Red
5 2
Green
6 1
Blue
Package
Marking
5
6
43
2
1
2.30
3.40
3.00
2.30
2.80
Broadcom AV02-3793EN
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ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Table 1: Absolute Maximum Ratings (TJ = 25°C)
Parameter Red Green and Blue Units
DC forward currenta
a. Derate linearly as shown in Figure 7 to Figure 10.
50 25 mA
Peak forward currentb
b. Duty factor = 10%, frequency = 1 kHz.
100 100 mA
Power dissipation 125 90 mW
Maximum junction temperature Tj max 110 °C
Operating temperature range - 40 to + 100 °C
Storage temperature range - 40 to + 100 °C
Table 2: Optical Characteristics (TJ = 25°C)
Color
Luminous Intensity, IV (mcd)
at IF = 20 mAa
a. Luminous intensity, IV is measured at the mechanical axis of the LED package at a single current pulse condition. The actual peak of the
spatial radiation pattern may not be aligned with the axis.
Dominant Wavelength, d (nm)
at IF = 20 mAb
b. Dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
Peak
Wavelength,
P (nm) at
IF = 20 mA
Viewing
Angle, 2θ½
(°)c
c. θ1/2 is the off-axis angle where the luminous intensity is ½ of the peak intensity.
Test
Current
(mA)
Min. Typ. Max. Min. Typ. Max. Typ. Typ.
Red 560 650 1125 617 623 627 630 120 20
Green 1400 1900 2850 525 529 537 522 120
Blue 285 384 560 465 469 475 465 120
Table 3: Electrical Characteristics (TJ = 25°C)
Color
Forward Voltage, VF (V) @ IF = 20 mAa
a. Tolerance = ±0.1V.
Reverse
Voltage, VR (V)
@ IR = 100 µAb
b. Indicates product final testing condition. Long-term reverse bias is not recommended.
Reverse
Voltage, VR (V)
@ IR = 10 µAbThermal Resistance, RθJ-S (°C/W)
Min. Typ. Max. Min. Min. 1 chip on 3 chips on
Red 1.8 2.1 2.5 4.0 -- 280 330
Green 2.6 3.1 3.4 -- 4.0 240 357
Blue 2.6 3.1 3.4 -- 4.0 240 357
Broadcom AV02-3793EN
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ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Part Numbering System
ASMT - YTB7 - 0AA0 2
x1x2x3x4x5
Code Description Option
x1Package type B Black surface
x2Minimum intensity bin A Red: bin U2 Red: bin U2,V1,V2
Green: bin W2 Green: bin W2, X1, X2
Blue: bin T1 Blue: bin T1, T2, U1
x3Number of intensity bins A 3 intensity bins from minimum
x4 Color bin combination 0 Red: full distribution
Green: bin A, B, C
Blue: bin A, B, C, D
x5Test option 2 Test current = 20 mA
ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Broadcom AV02-3793EN
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Bin Information
Tolerance: ± 12%.
Tolerance: ± 1 nm.
Tolerance: ± 1 nm.
Tolerance: ± 1 nm.
Table 4: Intensity Bins (CAT)
Bin ID
Luminous intensity (mcd)
Min. Max.
T1 285 355
T2 355 450
U1 450 560
U2 560 715
V1 715 900
V2 900 1125
W1 1125 1400
W2 1400 1800
X1 1800 2240
X2 2240 2850
Table 5: Color Bins (BIN) – Blue
Bin ID
Dominant Wavelength
(nm)
Chromaticity Coordinate
(for Reference)
Min. Maz. Cx Cy
A 465.0 469.0 0.1355 0.0399
0.1751 0.0986
0.1680 0.1094
0.1267 0.0534
B 467.0 471.0 0.1314 0.0459
0.1718 0.1034
0.1638 0.1167
0.1215 0.0626
C 469.0 473.0 0.1267 0.0534
0.1680 0.1094
0.1593 0.1255
0.1158 0.0736
D 471.0 475.0 0.1215 0.0626
0.1638 0.1167
0.1543 0.1361
0.1096 0.0868
Table 6: Color Bins (BIN) – Green
Bin ID
Dominant Wavelength
(nm)
Chromaticity Coordinate
(for Reference)
Min. Max. Cx Cy
A 525.0 531.0 0.1142 0.8262
0.1624 0.7178
0.2001 0.6983
0.1625 0.8012
B 528.0 534.0 0.1387 0.8148
0.1815 0.7089
0.2179 0.6870
0.1854 0.7867
C 531.0 537.0 0.1625 0.8012
0.2001 0.6983
0.2353 0.6747
0.2077 0.7711
Table 7: Color Bins (BIN) – Red
Bin ID
Dominant Wavelength
(nm)
Chromaticity Coordinate
(for reference)
Min. Max. Cx Cy
— 617.0 627.0 0.6850 0.3149
0.6815 0.3150
0.7000 0.2966
0.7037 0.2962
Broadcom AV02-3793EN
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ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Figure 1: Relative Intensity vs. Wavelength Figure 2: Forward Current – mA vs. Forward Voltage
0.0
0.2
0.4
0.6
0.8
1.0
WAVELENGTH - nm
RELATIVE INTENSITY
380 480 580 680
Red
Green
Blue
Red
Green/Blue
0
20
40
60
80
100
012345
FORWARD CURRENT - mA
FORWARD VOLTAGE - V
Figure 3: Relative Intensity vs. Forward Current Figure 4: Dominant Wavelength Shift vs. Forward Current
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 1020304050
RELATIVE INTENSITY
FORWARD CURRENT - mA
Green
Blue
Red
Figure 5: Relative Intensity vs. Junction Temperature Figure 6: Forward Voltage vs. Junction Temperature
-40 -20 0 20 40 60 80 100 120
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
FORWARD VOLTAGE SHIFT - V
Blue
Green
Red
T
J
- JUNCTION TEMPERATURE - qC
Broadcom AV02-3793EN
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ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Figure 7: Maximum Forward Current vs. Temperature for Red
(1 Chip On)
Figure 8: Maximum Forward Current vs. Temperature for Red
(3 Chips On)
0
10
20
30
40
50
60
0 20 40 60 80 100 120
MAXIMUM FORWARD CURRENT - mA
TEMPERATURE (°C)
Ts
TA
0
10
20
30
40
50
60
0 20 40 60 80 100 120
TA
Ts
MAXIMUM FORWARD CURRENT - mA
TEMPERATURE (°C)
Figure 9: Maximum Forward Current vs. Temperature for
Green and Blue (1 Chip On)
Figure 10: Maximum Forward Current vs. Temperature for
Green and Blue (3 Chips On)
0
5
10
15
20
25
30
0 20 40 60 80 100 120
TA
MAXIMUM FORWARD CURRENT - mA
TEMPERATURE (°C)
Ts
NOTE: Maximum forward current graphs based on
ambient temperature, TA are with reference to
thermal resistance RθJ-A as follows. For more
details, see Thermal Management.
Condition
Thermal Resistance from LED Junction to
Ambient, RθJ-A (°C/W)
Red Green and Blue
1 chip on 450 410
3 chips on 630 690
Broadcom AV02-3793EN
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ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Figure 11: Radiation Pattern along X-axis of the Package Figure 12: Radiation Pattern along Y-axis of the Package
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
0.0
0.2
0.4
0.6
0.8
1.0
NORMALIZED INTENSITY
Red
Green
Bl u e
0.0
0.2
0.4
0.6
0.8
1.0
NORMALIZED INTENSITY
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
Red
Green
Bl ue
Figure 13: Illustration of Package Axis for Radiation Pattern
XX
Y
Y
Figure 14: Recommended Soldering Land Pattern
Maximize the size of copper pad of PIN 1, PIN 4, PIN5
for better heat dissipation.
Copper pad Solder mask
0.40
0.50
2.30
1.35
1.60
4.55
Broadcom AV02-3793EN
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ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Figure 15: Carrier Tape Dimensions
Figure 16: Reeling Orientation
Package Marking
8.00 +0.30
-0.10
1.00 +0.10
0
1.50 +0.10
0
2.00 ±0.05
4.00 ±0.10
4.00 ±0.10
3.05 ±0.10
1.75 ±0.10
2.29 ±0.10
0.229 ±0.01
3.81 ±0.10
3.50 ±0.05
PACKAGE MARKING
USER FEED DIRECTION
PRINTED LABEL
Broadcom AV02-3793EN
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ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Figure 17: Reel Dimensions
Packing Label
Standard Label (Attached on Moisture Barrier Bag)
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
20.20 MIN.
(0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020)
5.0 ± 0.5
(0.197 ± 0.020)
13.1 ± 0.5
(0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
Ø
Ø
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant Halogen Free
e4 Max Temp 260C MSL3
ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Broadcom AV02-3793EN
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Baby Label (Attached on Plastic Reel)
Figure 18: Example of Luminous Intensity (Iv) Bin Information
on Label
Figure 19: Example of Color Bin Information on Label
NOTE: There is no color bin ID for Red color as there is only 1 range, as stated in Table 7.
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
(1T) TAPE DATE:
QUANTITY: Packing Quantity
D/C: Date Code VF:
CAT: INTENSITY BIN
BIN: COLOR BIN
BABY LABEL COSB001B V0.0
(9D): DATE CODE:
CAT: U2 T1
Intensity bin for Blue: T1
Intensity bin for Green: W2
Intensity bin for Red: U2
W2 BIN: A B
Color bin for Blue: B
Color bin for Green: A
Broadcom AV02-3793EN
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ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Soldering
Recommended reflow soldering condition:
Figure 20: Leaded Reflow Soldering Figure 21: Lead-Free Reflow Soldering
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
-6°C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
Reflow soldering must not be done more than twice.
Observe necessary precautions of handling
moisture-sensitive devices as stated in the following
section.
Recommended board reflow direction is as follows.
Figure 22: Board Reflow Direction
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand
soldering for rework only if unavoidable but it must be
strictly controlled to the following conditions:
– Soldering iron tip temperature = 320°C maximum
– Soldering duration = 3 seconds maximum
– Number of cycle = 1 only
– Power of soldering iron = 50W maximum
Do not touch the LED body with the hot soldering iron
except the soldering terminals as it may cause damage
to the LED.
For de-soldering, use a double flat tip.
Confirm beforehand whether the functionality and
performance of the LED is affected by hand soldering.
REFLOW DIRECTION
ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Broadcom AV02-3793EN
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Precautionary Notes
Handling Precautions
The encapsulation material of the LED is made of silicone
for better product reliability. Compared to epoxy
encapsulant that is hard and brittle, silicone is softer and
flexible. Special handling precautions need to be observed
during assembly of silicone encapsulated LED products.
Failure to comply might lead to damage and premature
failure of the LED. Refer to Application Note AN5288,
Silicone Encapsulation for LED: Advantages and Handling
Precautions for more information.
Do not poke sharp objects into the silicone encapsulant.
Sharp objects, such as tweezers or syringes, might
apply excessive force or even pierce through the
silicone and induce failures to the LED die or wire bond.
Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only
by the body.
Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
The surface of the silicone material attracts dust and
dirt easier than epoxy due to its surface tackiness. To
remove foreign particles on the surface of silicone, use
a cotton bud with isopropyl alcohol (IPA). During
cleaning, rub the surface gently without putting much
pressure on the silicone. Ultrasonic cleaning is not
recommended.
For automated pick-and-place, Broadcom has tested
the following nozzle size to work well with this LED.
However, due to the possibility of variations in other
parameters, such as pick and place machine maker/
model and other settings of the machine, verify that the
nozzle selected will not cause damage to the LED.
Figure 23: Nozzle Size
Handling of Moisture-Sensitive Devices
This product has a Moisture Sensitive Level 3 rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
Before use
– An unopened moisture barrier bag (MBB) can be
stored at < 40°C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required, it is safe to reflow the LEDs per the original
MSL rating.
– Do not open the MBB prior to assembly (such as for
IQC).
Control after opening the MBB
– Read the HIC immediately upon opening of an MBB.
– The LEDs must be kept at < 30°C/60% RH at all
times and all high temperature related processes,
including soldering, curing or rework, must be
completed within 168 hours.
Control for unfinished reel
Store unused LEDs in a sealed MBB with desiccant or
desiccator at <5% RH.
Control of assembled boards
If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, store the PCB in a
sealed MBB with desiccant or desiccator at <5% RH to
ensure that all LEDs have not exceeded their floor life of
168 hours.
Baking is required if:
– The HIC indicator is not BROWN at 10% and is
AZURE at 5%.
– The LEDs are exposed to condition of >30°C/60%
RH at any time.
– The LED floor life exceeded 168 hours.
– The recommended baking condition is: 60°C ±5 ºC
for 20 hours.
– Baking should only be done once.
Storage
The soldering terminals of these Broadcom LEDs are
silver plated. If the LEDs are exposed in ambient
environments for too long, the silver plating might be
oxidized, thus affecting its solderability performance. As
such, keep unused LEDs in a sealed MBB with
desiccant or in desiccator at <5% RH.
ID
OD
ID = 1.7mm
OD = 3.5mm
ASMT-YTB7-0AA02 Data Sheet Tricolor PLCC6 Black Surface LED
Broadcom AV02-3793EN
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Application Precautions
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated
in the data sheet. Constant current driving is
recommended to ensure consistent performance.
LED is not intended for reverse bias. Use other
appropriate components for such purposes. When
driving the LED in matrix form, ensure that the reverse
bias voltage does not exceed the allowable limit of the
LED.
Do not use the LED in the vicinity of material with sulfur
content, in environments of high gaseous sulfur
compound and corrosive elements. Examples of
materials that may contain sulfur are rubber gaskets,
RTV (room temperature vulcanizing) silicone rubber,
rubber gloves, and so on. Prolonged exposure to such
environments may affect the optical characteristics and
product life.
Avoid rapid changes in ambient temperature, especially
in high humidity environment, as this will cause
condensation on the LED.
Although the LED is rated as IPx6 according to
IEC60529: Degree of protection provided by enclosure,
the test condition may not represent actual exposure
during application. If the LED is intended to be used in
outdoor or harsh environments, protect the LED against
damages caused by rain water, dust, oil, corrosive
gases, external mechanical stress, and so on.
Thermal Management
Optical, electrical, and reliability characteristics of LED are
affected by temperature. The junction temperature (TJ) of
the LED must be kept below allowable limit at all times. TJ
can be calculated as follows:
TJ = TA + RθJ-A × IF × VFmax
where;
TA = Ambient temperature (°C)
RθJ-A = Thermal resistance from LED junction to
ambient (°C/W)
IF = Forward current (A)
VFmax = Maximum forward voltage (V)
The complication of using this formula lies in TA and RJ-A.
Actual TA is sometimes subjective and hard to determine.
RJ-A varies from system to system depending on design
and is usually not known.
Another way of calculating TJ is by using solder point
temperature TS as follows:
TJ = TS + RθJ-S × IF × VFmax
where;
TS = LED solder point temperature as shown in the
following figure (°C)
RθJ-S = thermal resistance from junction to solder point
(°C/W)
Figure 24: TS Point
TS can be measured easily by mounting a thermocouple on
the soldering joint as shown in the preceding figure, while
RθJ-S is provided in the data sheet. Verify the TS of the LED
in the final product to ensure that the LEDs are operated
within all maximum ratings stated in the data sheet.
Eye Safety Precautions
LEDs may pose optical hazards when in operation. Do not
look directly at operating LEDs as it may be harmful to the
eyes. For safety reasons, use appropriate shielding or
personal protective equipment.
Ts point - pin 5
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