SX-SDMAC-2830S (On-board Antenna)
SX-SDMAC-2831S (U.FL Antenna)
SX-SDMAC-2831C (U.FL Antenna)
Chipset
Host Interface
Baseband Specications
SDIO V 3.0 : WLAN
High Speed UART: Bluetooth
QCA9377-3
3.30 VDC +/- 5%
Diagram:
Specications:
Radio Specications 802.11b/g/n: 2.412 - 2.472GHz
802.11a/n/ac: 5.180 - 5.825 GHz
Bluetooth: 2.402 – 2.480 GHz
Operating Temperature -40 - +85 °C
Dimensions
Key Features:
CSMA/CA media access; DSSS, OFDM
Bluetooth Specications
Product Name
Operating Voltage
BT4.1 BR/EDR/BLE “Smart Ready”
SX-SDMAC-2830S: 19.0 x 30.0 x 2.4 mm
SX-SDMAC-2831S: 19.0 x 22.0 x 2.4 mm
SX-SDMAC-2831C: 24.0 x 24.0 x 4.8 mm
SX-SDMAC
802.11ac Plus Bluetooth SDIO Module
The Silex SX-SDMAC is a dual-band IEEE802.11a/b/g/n/ac WLAN
plus Bluetooth 4.1 BR/EDR/BLE “Smart Ready” SDIO module based
on the latest Qualcomm Atheros Technology. It integrates a
QCA9377 SoC with MAC, Baseband, RF, RF front end, and peripheral
circuitry. SX-SDMAC operates on a +3.3V main power supply and
selectable +1.8V/+3.3V IO power supply.
The SX-SDMAC comes in surface mount (SMT) and board to board
connector (B2B) form factors. The SX-SDMAC has a 50 ohm U.FL
connector as a connection interface for an external antenna. There
is also an option to use an onboard chip antenna for the surface
mount (SMT) version.
SX-SDMAC supports 802.11ac Wave 2 multi-user MIMO (MU-MIMO)
client which can increase the overall WLAN system performance.
SX-SDMAC provides an SDIO 3.0 interface for WLAN and a hi-speed
UART interface for BT.
The SX-SDMAC is a FCC/IC/CE/MIC certied module. In order to
expedite your product development process, Silex can provide
both hardware and software engineering services including
custom driver development, as well as turnkey product design and
manufacturing.
• Low Power Dual-Band 1x1 module for Wi-Fi & BT
• Based on the QCA9377-3 chipset
• 802.11 a/b/g/n/ac Wave 2 MU-MIMO
• Bluetooth 4.1 BR/EDR/LE Smart Ready
• SDIO 3.0 WLAN host interface
• On-chip Power Management Unit (PMU)
• Link Rate upto 433 Mbps
• On-board and u. antenna options
• Supports enterprise security, seamless roaming and CCX
• Fine tuned calibration per module
• FCC/IC/CE/MIC modular certication
• Connector mount, surface mount, and SDIO card form factor
PN: 141-20135-100
REV B. 20161113
5th Generation SDIO Wireless LAN plus Bluetooth Module
Connector Type SMT: Direct solder pad 60 pins
B2B: 40 pins
Antenna Conguration 1x1 mode (1T1R)