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conga-BM57 | Block diagram
C-D
A-B
Intel®
Gigabit Ethernet
PHY 82577LM
Hardware Monitoring
and Fan Control Circuitry
SATA to IDE
Chip
Mobile Intel® HM55
Express Chipset
Intel® BD82HM55 PCH
RTC
Board Controller
Atmel
ATmega168
Watchdog
BIOS
(Flash)
TPM
(optional)
Processor
Intel® Core™ i7
Intel® Core™ i5
Intel® Core™ i3
Intel® Celeron™
CORE CORE
DDR3-SODIMM
Socket (top)
ECC memory support for conga-BE57
DDR3-SODIMM
Socket (bottom)
ECC memory support for conga-BE57
Graphics
CORE
Memory
Controller
8x USB 2.0
CRT
LCD I/F
(LVDS)
High Definition Audio (HDA) I/F
GPIs/GPOs
BC SPI
SPI
LPC Bus
PCI Bus
I2C
Fan
Control
Power Management and Control Signals
Gbit Ethernet
SM Bus
3x SATA
1x IDE
1x SATA
1x x1 PCIe Lane
5x x1 PCIe Lanes
DMI x4
(Direct Media
Interface)
Intel® FDI
(Flexible Display
Interface)
6x x1 PCIe
Memory Bus
(800 or 1066 or 1333MHz)
8 GByte Max. Total
Only
conga-BE57
supports ECC
memory
OR
1x SDVO
Digital Display
Interface
3x HDMI/DVI
3x DisplayPort (DP)
conga-BM57 | Order Information
Article PN Description
conga-BM57/i5-520M 046001 Intel® Core™ i5-520M processor with 2.4GHz | 3MB L2 cache and 1066MT/s dual channel DDR3 memory interface
conga-BM57/i7-620M 046002 Intel® Core™ i7-620M processor with 2.66GHz | 4MB L2 cache and 1066MT/s dual channel DDR3 memory interface
conga-BM57/P4500 046005 Intel® Celeron® P4500 processor with 1.86 GHz | 2MB L2 cache and 800MT/s dual channel DDR3 SODIMM memory interface
for up to 8GB
conga-BM57/CSP-HP-B 046022 Standard passive cooling solution for high performance COM Express module conga-BM57 with integrated heat pipes | 15mm
silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole
conga-BM57/CSP-HP-T 046023 Standard passive cooling solution for high performance COM Express module conga-BM57 with integrated heat pipes | 15mm
silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread
conga-BM57/CSA-HP-B 046024 Standard active cooling solution for high performance COM Express module conga-BM57 with integrated heat pipes | 15mm
silver fins
| 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
conga-BM57/CSA-HP-T 046025 Standard active cooling solution for high performance COM Express module conga-BM57 with integrated heat pipes | 15mm
silver fins
| 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread
conga-BM57/HSP-HP-B 046020 Standard heatspreader for high performance COM Express module conga-BM57 with integrated heat pipes. All standoffs are
with 2.7mm bore hole
conga-BM57/HSP-HP-T 046021 Standard heatspreader for high performance COM Express module conga-BM57 with integrated heat pipes. All standoffs are
M2.5mm thread
DDR3-SODIMM-1066 (1GB) 068750 DDR3 SODIMM memory module with 1066MT/s and 1GB RAM
DDR3-SODIMM-1066 (2GB) 068760 DDR3 SODIMM memory module with 1066MT/s and 2GB RAM
DDR3-SODIMM-1066 (4GB) 068765 DDR3 SODIMM memory module with 1066MT/s and 4GB RAM
Accessories
conga-CEVAL 065749 Evaluation Carrier Board for COM Express Type 2 modules
conga-Cdebug 047854 COM-Express debugging platform. Including cable for COM | PS/2 and VGA.
conga-LDVI/EPI 011115 LVDS to DVI converter board for digital flat panels with onboard EEPROM
conga-HDMI/Display Port adapter 4k 500030 The conga-DP/HDMI adapter 4k is used for evlauation of the DP/HDMI graphics interface of x86 Qseven and COM Express
modules in combination with the congatec evaluation carrier boards conga-QEVAL and conga-TEVAL. It supports full 4k display
resolution.
conga-FPA2 047250 Flatpanel prototype adapter to develop your own flatpanel adapter Including cables set.
COM-Express-carrierboard-Socket-5 400007 Connector for COM-Express carrier boards | height 5mm | packing unit 4 pieces
COM-Express-carrierboard-Socket-8 400004 Connector for COM-Express carrier boards | height 8mm | packing unit 4 pieces
© 2016 congatec AG. All rights reserved. All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. July 03, 2018 WME