General Specifications.
Unless stated all values are typical.
Contact
Resistance: See test results below. Current Rating: 5.0 amps
Capacitance: 0.35pF max Material: Brass outer, beryllium copper inner.
*Plating: Outer; W30500TRC Nickel 2.5Um/Pure Tin 6.0Um
W30500T 60/40 tin/lead 2-3Um.
W30500G Nickel 2.5Um/Gold 0.1Um
W30500TTRC Nickel 2.5Um/Pure Tin 6.0Um
*Plating: Inner; W30500TRC Nickel 2.5Um/Gold 0.1Um
W30500T Nickel 2.5Um/Gold 0.1Um
W30500G Nickel 2.5Um/Gold 0.1Um
W30500TTRC Nickel 2.5Um/ Pure Tin 0.1Um
Note: Other plating specs available. Please contact sales@winslowadaptics.com with your requirements.
Insertion Force: 350 grams per pin 0.018” diameter
Withdrawal Force: 250 grams per pin 0.018” diameter.
Force to remove from moulding: 12lb minimum
Test Data and Results (Sockets Tested—W30524T)
WINSLOW ADAPTICs
Data Sheet – Screw Machined I.C. Sockets
W30500TRC - W30500T - W30500TTRC
W30500G (Gold Sleeve Product is Obsolete)
Test Conditions Result
Vibration 10 to 2,000Hz at 20g’s No mechanical damage to assembly or loss
of continuity
Shock 150g’s No mechanical damage to assembly or loss
of continuity
Thermal Shock -65 to +150 degrees
Centigrade
No change in insulation resistance, loss of
continuity or mechanical damage to assem-
bly.
Life vs Contact
Resistance
1,000 cycles insertion/
withdrawal of IC lead device.
Average: Before test; 5.8mOhms
After test; 6.9mOhms
Fungus Resistance
of Moulding
Non-Nutrient
Salt Spray Contact resistance remained 14mOhm. No
galvanic corrosion visible at 50X
Endurance & Exposure
to Ammonium Sulphide
Exposure after 10 insertions of
DIP IC.
New tin-plated contact resistance 11mOhms
Atmosphere (contact) Exposure after 10 insertions of
DIP IC
New gold-plated contact resistance 5mOhms
max.
Continuity of Soldered
Connectors
Resistance change was less than 10%