Ceramic Resonators (Chip Type) Ceramic Resonators, Chip Type (For General Purpose) Type: Type: Type: P ( 2 to 13 MHz) D (13.1 to 20 MHz) L (30.1 to 50 MHz) n Recommended Applications n Features l Encased in ceramic package l High reliability against soldering heat and mechanical stress l Moisture-proof sealing l Low Profile Type (1.8 mm maximum in thickness) l Designed for reflow soldering l Flat-bottom plate for better mountings n Precautions for Safety (See Page 218 to 219) n Explanation of Part Numbers E F O 3 5 l Clock generator for microprocessers l Carrier between telecommunication equipment (Telephone to telephone, personal computer to printer) n Application Notes l Soldering Conditions Reflow soldering shall be done at 220 uC for less than 10 seconds, and peak temperature of 240 uC. (Remark) Flow soldering method and dip soldering method shall not be applied. 8 4 Design No. n Ratings and Characteristics Part Number Bulk Pack Embossed Taping Oscillation Frequency (fo) EFOP3584B5 EFOP3584E5 3.58 MHz 0.5 % EFOP4004B5 EFOP4004E5 4.00 MHz 0.5 % EFOP8004B5 EFOP8004E5 8.00 MHz 0.5 % EFOP1005B5 EFOP1005E5 10.00 MHz 0.5 % EFOP1205B5 EFOP1205E5 12.00 MHz 0.5 % EFOD1605B5 EFOD1605E5 16.00 MHz 0.5 % EFOD1695B5 EFOD1695E5 16.93 MHz 0.5 % EFOD2005B5 EFOD2005E5 20.00 MHz 0.5 % EFOL3205B5 EFOL3205E5 32.00 MHz 0.5 % EFOL3385B5 EFOL3385E5 33.868 MHz 0.5 % EFOL4005B5 EFOL4005E5 40.00 MHz 0.5 % l Operating Temperature Range: 20 to 80 uC Loop Gain (G) 10 dB min. 15 dB min. 15 dB min. 6 dB min. Temperature Characteristics Maximum frequency drift: 0.3 %, 20 to 80 C Maximum frequency drift: 1.0 %, 20 to 80 C Maximum frequency drift: 1.0 %, 20 to 80 C Maximum frequency drift: 0.3 %, 20 to 80 C Note: Also available are types other than above standard products in the frequency range of 3 to 50.0 MHz. Please contact us for more information. Ceramic Resonators (Chip Type) n Dimensions in mm (not to scale) l Bulk [Type P] EFOP1111B1 l Embossed Taping EFOP1111E1 Dim. A B W (mm) 3.7 8.3 16.00.3 Dim. (mm) [Type D] EFOD1111B1 P2 P0 2.00.1 4.00.1 F fD0 1.5 +0.1 0 E P1 7.50.1 1.750.10 8.00.1 t1 t2 0.6 max. 3.0 max. fC fD 1.55 1.0 EFOD1111E1 Dim. A B W (mm) 3.7 6.0 12.00.3 Dim. (mm) [Type L] EFOL1111B1 P2 P0 2.00.1 4.00.1 F fD0 1.5 +0.1 0 E P1 5.50.1 1.750.10 8.00.1 t1 t2 0.6 max. 3.0 max. EFOL1111E1 ,, ,, ,, + + Dim. A B W (mm) 4.1 4.9 12.00.3 Dim. (mm) P2 P0 2.00.1 4.00.1 fD0 1.5 +0.1 0 F E P1 5.50.1 1.750.10 8.00.1 t1 t2 0.6 max. 3.0 max. Ceramic Resonators (Chip Type) n Test Circuits Diagram Frequency IC 2.00 to 8.38 MHz 8.4 to 50 MHz n Typical Characteristics PD 4069UBC PD 74HCU04 n Recommended Land Dimensions (Type P/D/L) Temperature Characteristics a b c d Type P 2.5 0.9 to 1.2 3.8 to 4.7 N Type D 1.9 1.2 4.2 N Type L 1.7 0.8 to 1.0 4.2 to 5.1 1.0 to 1.2 (mm) n Packaging Specifications Supplied in bulk or taped & reel packing style l Standard Packing Quantity Type Embossed Taping Bulk P 2500 pcs./reel 500 pcs./bag D, L 1000 pcs./reel 500 pcs./bag l Dimensions for Reel in mm (not to scale) [Type P] Dim. fA (mm) 3305 Dim. W (mm) 16.4+2.0 0 fB C D E 80 min. 13.00.5 21.00.8 2.00.5 T t 22.4 max. 3 max. r 1.0 [Type D/L] Dim. fA (mm) 1805 Dim. (mm) W fB C D E 60 min. 13.00.5 21.00.8 2.00.5 T t 12.4+2.0 0 18.4 max. 3 max. r 1.0