nExplanation of Part Numbers
E F O 3584
Design No.
Ceramic Resonators, Chip Type
(For General Purpose)
Type: P( 2 to 13 MHz)
Type: D(13.1 to 20 MHz)
Type: L(30.1 to 50 MHz)
nFeatures
lEncased in ceramic package
lHigh reliability against soldering heat and mechanical
stress
lMoisture-proof sealing
lLow Profile Type (1.8 mm maximum in thickness)
lDesigned for reflow soldering
lFlat-bottom plate for better mountings
nPrecautions for Safety (See Page 218 to 219)
nRecommended Applications
lClock generator for microprocessers
lCarrier between telecommunication equipment
(Telephone to telephone, personal computer to
printer)
Part Number Oscillation
Frequency Loop Gain Temperature
Bulk Pack Embossed Taping (fo) (G) Characteristics
EFOP3584B5 EFOP3584E5 3.58 MHz ±0.5 %
EFOP4004B5 EFOP4004E5 4.00 MHz ±0.5 % 10 dB min. Maximum frequency drift:
EFOP8004B5 EFOP8004E5 8.00 MHz ±0.5 % ±0.3 %, Ð20 to 80 ¡C
EFOP1005B5 EFOP1005E5 10.00 MHz ±0.5 % 15 dB min. Maximum frequency drift:
EFOP1205B5 EFOP1205E5 12.00 MHz ±0.5 % ±1.0 %, Ð20 to 80 ¡C
EFOD1605B5 EFOD1605E5 16.00 MHz ±0.5 % Maximum frequency drift:
EFOD1695B5 EFOD1695E5 16.93 MHz ±0.5 % 15 dB min. ±1.0 %, Ð20 to 80 ¡C
EFOD2005B5 EFOD2005E5 20.00 MHz ±0.5 %
EFOL3205B5 EFOL3205E5 32.00 MHz ±0.5 % Maximum frequency drift:
EFOL3385B5 EFOL3385E5 33.868 MHz ±0.5 % 6 dB min. ±0.3 %, Ð20 to 80 ¡C
EFOL4005B5 EFOL4005E5 40.00 MHz ±0.5 %
nRatings and Characteristics
Note:
Also available are types other than above standard products in the
frequency range of 3 to 50.0 MHz.
Please contact us for more information.
lOperating Temperature Range: Ð20 to 80 ûC
n Application Notes
lSoldering Conditions
Reflow soldering shall be done at 220 ûC for less
than 10 seconds, and peak temperature of 240 ûC.
(Remark) Flow soldering method and dip soldering
method shall not be applied.
Ceramic Resonators
(Chip Type)
nDimensions in mm (not to scale)
lBulk
[Type P] EFOP1111B1
lEmbossed Taping
EFOP1111E1
[Type D] EFOD1111B1EFOD1111E1
Dim. P2P0fD0t1t2fCfD
(mm) 2.0±0.1 4.0±0.1 1.5
0.6 max.
3.0 max.
1.55 1.0
+0.1
0
Dim. A B W F E P1
(mm) 3.7 8.3 16.0±0.3 7.5±0.1 1.75±0.10 8.0±0.1
Dim. P2P0fD0t1t2
(mm) 2.0±0.1 4.0±0.1 1.5
0.6 max. 3.0 max
.
+0.1
0
Dim. A B W F E P1
(mm) 3.7 6.0 12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1
±±
[Type L] EFOL1111B1
±
++
±
EFOL1111E1
Dim. P2P0fD0t1t2
(mm) 2.0±0.1 4.0±0.1 1.5
0.6 max. 3.0 max
.
+0.1
0
Dim. A B W F E P1
(mm) 4.1 4.9 12.0±0.3 5.5±0.1 1.75±0.10 8.0±0.1
,,
,,
,,
Ceramic Resonators
(Chip Type)
nTest Circuits Diagram
Frequency IC
2.00 to 8.38 MHz µPD 4069UBC
8.4 to 50 MHz µPD 74HCU04
Type P Type D Type L
a 2.5 1.9 1.7
b 0.9 to 1.2 1.2 0.8 to 1.0
c 3.8 to 4.7 4.2 4.2 to 5.1
d Ñ Ñ 1.0 to 1.2
nTypical Characteristics n
Recommended Land Dimensions
Temperature Characteristics
(mm)
(Type P/D/L)
nPackaging Specifications
Supplied in bulk or taped & reel packing style
lStandard Packing Quantity
Type Embossed Taping Bulk
P 2500 pcs./reel 500 pcs./bag
D, L 1000 pcs./reel 500 pcs./bag
lDimensions for Reel in mm (not to scale)
Dim. fAfBC D E
(mm) 330±5 80 min. 13.0±0.5 21.0±0.8 2.0±0.5
Dim. W T t r
(mm) 16.4
22.4 max.
3 max. 1.0
+2.0
0
[Type P]
Dim. fAfBC D E
(mm) 180±5 60 min. 13.0±0.5 21.0±0.8 2.0±0.5
Dim. W T t r
(mm) 12.4
18.4 max.
3 max. 1.0
+2.0
0
[Type D/L]
Ceramic Resonators
(Chip Type)
