Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5510
Rev. 4, 7/2014
© Freescale Semiconductor, Inc., 2007-2014. All rights reserved.
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
MPC5510
TBD
MAPBGA–225
15 mm x 15 mm
QFN12
##_mm_x_##mm
SOT-343R
##_mm_x_##mm
PKG-TBD
## mm x ## mm
MAPBGA–208
17 mm x 17 mm
LQFP–144
20 mm x 20 mm
LQFP–176
24 mm x 24 mm
MPC5510 Family Features
• Single issue, 32-bit CPU core complex (e200z1)
– Compliant with the Power Architecture™ embedded
category
– Includes an instruction set enhancement allowing
variable length encoding (VLE) for code size footprint
reduction. With the optional encoding of mixed 16-bit
and 32-bit instructions, it is possible to achieve
significant code size footprint reduction.
• Up to 1.5-Mbyte on-chip flash with flash control unit
(FCU)
• Up to 80 Kbytes on -chi p SRAM
• Memory protection unit (MPU ) with up to sixteen region
descriptors and 32-byte region granularity
• Interrupt controller (INTC) capable of handling
selectable-priority interrupt sources
• Frequency modulated Phase-locked loop (FMPLL)
• Crossbar switch architecture for concurrent access to
peripherals, flash, or RAM from multiple bus masters
• 16-channel enhanced direct memory access controller
(eDMA)
• Boot assist module (BAM) supports internal flash
programming via a serial link (CAN or SCI)
• T imer supports input/output channels providing a range of
16-bit input capture, outpu t co mpare, and pulse width
modulation functions (eMIOS200)
• Up to 40-channel 12-bit analog-to-digital converter (ADC)
• Up to four serial peripheral interface (DSPI) modules
• Media Local Bus (MLB) emulation logic (works with two
DSPIs, the e200z0, the eDMA, and system RAM to create
a 3-pin or 5-pin 256Fs MLB protocol)
• Up to eight serial communication interface (eSCI) modules
• Up to six enhanced full CAN (FlexCAN ) mo dules with
configurable buffers
• One inter IC communication interface (I2C) module
• Up to 144 configurable general pu rpose pins supporting
input and output operations and 3.0V through 5.5V supply
levels
• Real-time counter (RTC_API) with clock source from
external 32-kHz crystal oscillator, internal 32-kHz or
16-MHz oscillator and supporting wake-up with selectable
1-second resolution and > 1-hour timeout, or 1-millisecond
resolution with maximum timeout of one second
• Up to eight periodic interrupt timers (PIT) with 32-bit
counter resolution
• Nexus development interface (NDI) per IEEE-ISTO
5001-2003 Class Two Plus standard
• Device/board test support per Joint Test Action Group
(JTAG) of IEEE (IEEE 1149.1)
• On-chip voltage regulator (VREG) for regulation of 5V
input to 1.5V and 3.3V internal supply levels
• Optional e200z0, second Power Architecture based I/O
processor with VLE instruction set
• Optional FlexRAY controller
• Optional external bus interface (EBI) module
MPC5510 Microcontroller
Family Data Sheet
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor2
Table of Contents
1 Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .4
1.1 Signal Properties and Multiplexing Summary . . . . . . . . .4
1.2 Power and Ground Supply Summary . . . . . . . . . . . . . .15
1.3 Pinout – 144 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
1.4 Pinout – 176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
1.5 Pinout – 208 PBGA. . . . . . . . . . . . . . . . . . . . . . . . . . . .19
2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
2.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
2.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .21
2.2.1 General Notes for Specifications at Maximum
Junction Temperature . . . . . . . . . . . . . . . . . . . .21
2.3 ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .24
2.4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .25
2.5 Operating Current Specifications . . . . . . . . . . . . . .27
2.6 I/O Pad Current Specifications . . . . . . . . . . . . . . . . . . .29
2.7 Low Voltage Characteristics . . . . . . . . . . . . . . . . . . . . .30
2.8 Oscillators Electrical Characteristics. . . . . . . . . . . . . . .31
2.9 FMPLL Electrical Characteristics . . . . . . . . . . . . . . . . .33
2.10 eQADC Electrical Characteristics . . . . . . . . . . . . . . . . .34
2.11 Flash Memory Electrical Characteristics. . . . . . . . . . . .35
2.12 Pad AC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . .36
2.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
2.13.1 Reset and Boot Configuration Pins . . . . . . . . . .37
2.13.2 External Interrupt (IRQ) and Non-Maskable
Interrupt (NMI) Pins . . . . . . . . . . . . . . . . . . . . .37
2.13.3 JTAG (IEEE 1149.1) Interface . . . . . . . . . . . . . .38
2.13.4 Nexus Debug Interface . . . . . . . . . . . . . . . . . . .41
2.13.5 External Bus Interface (EBI) . . . . . . . . . . . . . . .43
2.13.6 Enhanced Modular I/O Subsystem (eMIOS) . . .46
2.13.7 Deserial Serial Peripheral Interface (DSPI) . . . .47
3 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
4 Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
4.1 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
List of Tables
Table 1. MPC5510 Signal Properties . . . . . . . . . . . . . . . . . . . . . . .4
Table 2. MPC5510 Power/Ground . . . . . . . . . . . . . . . . . . . . . . . .15
Table 3. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . .20
Table 4. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . .21
Table 5. ESD Ratings, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Table 6. DC Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . .25
Table 7. Operating Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Table 8. I/O Pad Average DC Current . . . . . . . . . . . . . . . . . . . . . .29
Table 9. Low Voltage Monitors . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Table 10. 3.3V High Frequency External Oscillator. . . . . . . . . . . .31
Table 11. 5V Low Frequency (32 kHz) External Oscillator . . . . . .31
Table 12. 5V High Frequency (16 MHz) Internal RC Oscillator . . .32
Table 13. 5V Low Frequency (32 kHz) Internal RC Oscillator . . . 32
Table 14. FMPLL Electrical Specifications . . . . . . . . . . . . . . . . . 33
Table 15. eQADC Conversion Specifications (Operating) . . . . . . 34
Table 16. Flash Program and Erase Specifications . . . . . . . . . . . 35
Table 17. Flash EEPROM Module Life (Full Temperature Range) 35
Table 18. Pad AC Specifications (VDDE = 3.0V - 5.5V) . . . . . . . 36
Table 19. Reset and Boot Configuration Timing . . . . . . . . . . . . . 37
Table 20. IRQ/NMI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 21. JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 22. Nexus Debug Port Timing . . . . . . . . . . . . . . . . . . . . . . 41
Table 23. External Bus Operation Timing . . . . . . . . . . . . . . . . . . 43
Table 24. eMIOS Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 25. DSPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 26. Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 27. Revision History of MPC5510 Data Sheet . . . . . . . . . . 53
List of Figures
Figure 1. MPC5510 Family Block Diagram . . . . . . . . . . . . . . . . . . 3
Figure 2. MPC5510 Pinout – 144 LQFP . . . . . . . . . . . . . . . . . . . 17
Figure 3. MPC5510 Pinout – 176 LQFP . . . . . . . . . . . . . . . . . . . 18
Figure 4. MPC5510 Pinout – 208 PBGA . . . . . . . . . . . . . . . . . . . 19
Figure 5. Pad Output Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 6. Reset and Boot Configuration Timing. . . . . . . . . . . . . . 37
Figure 7. IRQ and NMI Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 8. JTAG Test Clock Input Timing. . . . . . . . . . . . . . . . . . . . 38
Figure 9. JTAG Test Access Port Timing . . . . . . . . . . . . . . . . . . . 39
Figure 10. JTAG JCOMP Timing . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 11. JTAG Boundary Scan Timing . . . . . . . . . . . . . . . . . . . 40
Figure 12. Nexus Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 13. Nexus TDI, TMS, TDO Timing . . . . . . . . . . . . . . . . . . 42
Figure 14. CLKOUT Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 15. Synchronous Output Timing . . . . . . . . . . . . . . . . . . . . 44
Figure 16. Synchronous Input Timing . . . . . . . . . . . . . . . . . . . . . 45
Figure 17. Address Latch Enable (ALE) Timing . . . . . . . . . . . . . 46
Figure 18. DSPI Classic SPI Timing — Master, CPHA = 0 . . . . . 48
Figure 19. DSPI Classic SPI Timing — Master, CPHA = 1 . . . . . 48
Figure 20. DSPI Classic SPI Timing — Slave, CPHA = 0 . . . . . . 49
Figure 21. DSPI Classic SPI Timing — Slave, CPHA = 1 . . . . . . 49
Figure 22. DSPI Modified Transfer Format Timing — Master,
CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 23. DSPI Modified Transfer Format Timing — Master,
CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 24. DSPI Modified Transfer Format Timing — Slave, CPHA = 0
51
Figure 25. DSPI Modified Transfer Format Timing — Slave, CPHA = 1
51
Figure 26. DSPI PCS Strobe (PCSS) Timing . . . . . . . . . . . . . . . 51
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 3
Figure 1. MPC5510 Family Block Diagram
e200z1 Core
LEGEND
eSCI
Data BusInstruction Bus
Private
Instruction
Bus
Oscillators VREG
ADC
e200z0 Core
eMIOS200
DSPI
I2C
SIU
FlexCAN
BAM
PIT
ADC – Analog to Digital Converter modules
BAM – Boot Assist Module
EBI – External Bus Interface module
ECC – Error Correction Code
DSPI – Serial Peripherals Interface controller module
eDMA – enhanced Direct Memory Controller module
eMIOS200 – Timed Input Output module
eSCI – Serial Communications Interface modules
FCU – Flash Controller Unit
FlexCAN – Controller Area Network controller modules
FlexRay – Dual Channel FlexRay controller
FMPLL – Frequency Modulated Phase Locked Loop module
I2C – Inter IC Controller modules
INTC – Interrupt Controller module
JTAG – Joint Test Action Group interface
MLB – Media Local Bus emulation logic
NDI – Nexus Debug Interface module
PIT – Periodic Interrupt Timer module
SIU – System Integration module
VREG – Voltage Regulator
MPC5510
Integer
Execution
Unit
Instruction
Unit
PPC & VLE
Multiply
Unit
General Purpose
Registers
(32 x 32-bit)
Timers
Branch
Unit
Load/Store
Unit
JTAG
NDI
INTC
FlexRay
General Purpose
Registers
(32 x 32-bit)Integer
Execution
Unit
Instruction
Unit
VLE
Branch
Unit
Load/Store
Unit
Multiply
Unit
Crossbar Switch (XBAR)
Memory Protection Unit (MPU)
FCU
Flash
(ECC)
SRAM
(ECC)
EBI
RAM
Controller
Peripheral Bridge
FMPLL
eDMA
MLB
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Pin Assignments and Reset States
Freescale Semiconductor4
1 Pin Assignments and Reset States
1.1 Signal Properties and Multiplexing Summary
Table 1 shows the signal properties for each pin on the MPC5510. For all port pins, which have an associated pad configuration
register (SIU_PCRn register) to control its pin properties, the “Supported Pin Functions” column lists the functions associated
with the programming of the SIU_PCRn[PA] bit field in the fo llowing order: GPIO, Function1, Function2 and Function3. If
fewer than three functions plus GPIO are supporte d by a given pin, then the unused functions begin with Function3, then
Function2, then Function1. Note that the GPIO number is the same number as the corresponding pad configuration register
(SIU_PCRn) number.
Table 1. MPC5510 Signal Properties
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
Port A (16)
PA 0 0 PA0
AN0
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 9 9 E3
PA 1 1 PA1
AN1
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 8 8 E2
PA 2 2 PA2
AN2
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 7 7 E1
PA 3 3 PA3
AN3
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 6 6 D3
PA 4 4 PA4
AN4
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 5 5 D2
PA 5 5 PA5
AN5
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 4 4 D1
PA 6 6 PA6
AN6
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 3 3 C2
PA 7 7 PA7
AN7
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 2 2 C1
PA 8 8 PA8
AN8/ANW
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 143 175 A3
PA 9 9 PA9
AN9/ANX
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 142 174 C4
PA 1 0 1 0 PA 1 0
AN10/ANY
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 140 172 D5
PA 1 1 1 1 PA 1 1
AN11/ANZ
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 139 171 C5
PA 1 2 1 2 PA 1 2
AN12
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 138 170 B5
PA 1 3 1 3 PA 1 3
AN13
GPI
eQADC Analog Input
I
IVDDA AE + IH — — 137 169 A5
PA 1 4 1 4
PA 1 4
AN14
EXTAL326
GPI
eQADC Analog Input
32 kHz Crystal Oscillator Input
I
I
I
VDDA AE + IH — — 136 167 D6
Pin Assignments and Reset States
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 5
PA 1 5 1 5
PA 1 5
AN15
XTAL326
GPI
eQADC Analog Input
32 kHz Crystal Oscillator Output
I
I
O
VDDA AE + IH — — 135 165 C6
Port B (16)
PB0 16
PB0
AN28
eMIOS16
PCS_C5
GPIO
eQADC Analog Input7
eMIOS Channel
DSPI_C Peripheral Chip Select
I/O
I
O
O
VDDE1 A + SH — — 134 162 C7
PB1 17
PB1
AN29
eMIOS17
PCS_C4
GPIO
eQADC Analog Input7
eMIOS Channel
DSPI_C Peripheral Chip Select
I/O
I
O
O
VDDE1 A + SH — — 133 161 D7
PB2 18
PB2
AN30
eMIOS18
PCS_C3
GPIO
eQADC Analog Input7
eMIOS Channel
DSPI_C Peripheral Chip Select
I/O
I
O
O
VDDE1 A + SH — — 132 160 A8
PB3 19
PB3
AN31
PCS_C2
GPIO
eQADC Analog Input7
DSPI_C Peripheral Chip Select
I/O
I
O
VDDE1 A + SH — — 131 159 B8
PB4 20
PB4
AN32
PCS_C1
GPIO
eQADC Analog Input7
DSPI_C Peripheral Chip Select
I/O
I
O
VDDE1 A + SH — — 130 158 C8
PB5 21
PB5
AN33
PCS_C0
GPIO
eQADC Analog Input7
DSPI_C Peripheral Chip Select
I/O
I
I/O
VDDE1 A + SH — — 129 157 D8
PB6 22
PB6
AN34
SCK_C
GPIO
eQADC Analog Input7
DSPI_C Clock
I/O
I
I/O
VDDE1 A + SH — — 128 156 A9
PB7 23
PB7
AN35
SOUT_C
GPIO
eQADC Analog Input7
DSPI_C Data Output
I/O
I
O
VDDE1 A + SH — — 127 153 B9
PB8 24
PB8
AN36
SIN_C
GPIO
eQADC Analog Input7
DSPI_C Data Input
I/O
I
I
VDDE1 A + SH — — 126 152 C9
PB9 25
PB9
AN37
CNTX_D
PCS_B4
GPIO
eQADC Analog Input7
CAN_D Transmit
DSPI_B Peripheral Chip Select
I/O
I
O
O
VDDE1 A + SH — — 125 151 D9
PB10 26
PB10
AN38
CNRX_D
PCS_B3
GPIO
eQADC Analog Input7
CAN_D Receive
DSPI_B Peripheral Chip Select
I/O
I
I
O
VDDE1 A + SH — — 124 150 A10
PB11 27
PB11
AN39
eMIOS19
PCS_B5
GPIO
eQADC Analog Input7
eMIOS Channel
DSPI_B Peripheral Chip Select
I/O
I
O
O
VDDE1 A + SH — — 123 149 B10
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Pin Assignments and Reset States
Freescale Semiconductor6
PB12 28
PB12
TXD_G
PCS_B4
GPIO
SCI_G Transmit
DSPI_B Peripheral Chip Select
I/O
O
O
VDDE1 SH — — — 164 A7
PB13 29
PB13
RXD_G
PCS_B3
GPIO
SCI_G Receive
DSPI_B Peripheral Chip Select
I/O
I
O
VDDE1 SH — — — 163 B7
PB14 30 PB14
TXD_H
GPIO
SCI_H Transmit
I/O
OVDDE1 SH — — — 148 C10
PB15 31 PB15
RXD_H
GPIO
SCI_H Receive
I/O
IVDDE1 SH — — — 147 A11
Port C (16)
PC0 32
PC0
eMIOS0
FR_A_TX_EN
AD24
GPIO
eMIOS Channel
FlexRay Channel A Transmit Enable
EBI Muxed Address/Data
I/O
I/O
O
I/O
VDDE1 MH — — 122 146 B11
PC1 33
PC1
eMIOS1
FR_A_TX
AD16
GPIO
eMIOS Channel
FlexRay Channel A Transmit
EBI Muxed Address/Data
I/O
I/O
O
I/O
VDDE1 MH — — 121 145 C11
PC2 34
PC2
eMIOS2
FR_A_RX
TS
GPIO
eMIOS Channel
FlexRay Channel A Receive
EBI Transfer Start
I/O
I/O
I
I/O
VDDE1 MH — — 120 144 D11
PC3 35
PC3
eMIOS3
FR_DBG0
GPIO
eMIOS Channel
FlexRay Debug
I/O
I/O
O
VDDE1 MH — — 117 141 A12
PC4 36
PC4
eMIOS4
FR_DBG1
GPIO
eMIOS Channel
FlexRay Debug
I/O
I/O
O
VDDE1 SH — — 116 140 B12
PC5 37
PC5
eMIOS5
FR_DBG2
GPIO
eMIOS Channel
FlexRay Debug
I/O
I/O
O
VDDE1 SH — — 115 139 C12
PC6 38
PC6
eMIOS6
FR_DBG3
GPIO
eMIOS Channel
FlexRay Debug
I/O
I/O
O
VDDE1 SH — — 114 138 D12
PC7 39
PC7
eMIOS7
FR_B_RX
GPIO
eMIOS Channel
FlexRay Channel B Receive
I/O
I/O
I
VDDE1 SH — — 113 137 A13
PC8 40
PC8
eMIOS8
FR_B_TX
AD15
GPIO
eMIOS Channel
FlexRay Channel B Transmit
EBI Muxed Address/Data
I/O
I/O
O
I/O
VDDE1 MH — — 112 136 B13
PC9 41
PC9
eMIOS9
FR_B_TX_EN
AD14
GPIO
eMIOS Channel
FlexRay Channel B Transmit Enable
EBI Muxed Address/Data
I/O
I/O
O
I/O
VDDE1 MH — — 111 135 C13
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
Pin Assignments and Reset States
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 7
PC10 42
PC10
eMIOS10
PCS_C5
SCK_D
GPIO
eMIOS Channel
DSPI_C Peripheral Chip Select
DSPI_D Clock
I/O
I/O
O
I/O
VDDE1 SH — — 110 134 A14
PC11 43
PC11
eMIOS11
PCS_C4
SOUT_D
GPIO
eMIOS Channel
DSPI_C Peripheral Chip Select
DSPI_D Serial Out
I/O
I/O
O
O
VDDE1 SH — — 109 133 B14
PC12 44
PC12
eMIOS12
PSC_C3
SIN_D
GPIO
eMIOS Channel
DSPI_C Peripheral Chip Select
DSPI_D Serial In
I/O
I/O
O
I
VDDE1 SH — — 108 132 B16
PC13 45
PC13
eMIOS13
PCS_A5
PCS_D0
GPIO
eMIOS Channel
DSPI_A Peripheral Chip Select
DSPI_D Peripheral Chip Select
I/O
I/O
O
O
VDDE1 SH — — 107 131 C15
PC14 46
PC14
eMIOS14
PCS_A4
PCS_D1
GPIO
eMIOS Channel
DSPI_A Peripheral Chip Select
DSPI_D Peripheral Chip Select
I/O
I/O
O
O
VDDE1 SH — — 106 130 C16
PC15 47
PC15
eMIOS15
PCS_A3
PCS_D2
GPIO
eMIOS Channel
DSPI_A Peripheral Chip Select
DSPI_D Peripheral Chip Select
I/O
I/O
O
O
VDDE1 SH — — 105 129 D14
Port D (16)
PD0 48
PD0
CNTX_A
PCS_D3
GPIO
CAN_A Transmit
DSPI_D Peripheral Chip Select
I/O
O
O
VDDE1 SH — — 104 128 D15
PD1 49
PD1
CNRX_A
PCS_D4
GPIO
CAN_A Receive
DSPI_D Peripheral Chip Select
I/O
I
O
VDDE1 SH — — 103 127 D16
PD2 50
PD2
CNRX_B
eMIOS10
BOOTCFG
PCS_D5
GPIO
CAN_B Receive
eMIOS Channel
Boot Configuration
DSPI_D Peripheral Chip Select
I/O
I
O
I
O
VDDE1 SH BOOTCFG
(Pulldown)
GPI
(Pulldown) 102 126 E14
PD3 51
PD3
CNTX_B
eMIOS11
GPIO
CAN_B Transmit
eMIOS Channel
I/O
O
O
VDDE1 SH — — 101 125 E15
PD4 52
PD4
CNTX_C
eMIOS12
GPIO
CAN_C Transmit
eMIOS Channel
I/O
O
O
VDDE1 SH — — 100 124 E16
PD5 53
PD5
CNRX_C
eMIOS13
GPIO
CAN_C Receive
eMIOS Channel
I/O
I
O
VDDE1 SH — — 99 123 F13
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Pin Assignments and Reset States
Freescale Semiconductor8
PD6 54
PD6
TXD_A
eMIOS14
GPIO
SCI_A Transmit
eMIOS Channel
I/O
O
O
VDDE1 SH — — 98 122 F14
PD7 55
PD7
RXD_A
eMIOS15
GPIO
SCI_A Receive
eMIOS Channel
I/O
I
O
VDDE1 SH — — 97 121 F15
PD8 56
PD8
TXD_B
SCL_A
GPIO
SCI_B Transmit
I2C Serial Clock Line
I/O
O
I/O
VDDE1 SH — — 94 118 G13
PD9 57
PD9
RXD_B
SDA_A
GPIO
SCI_B Receive
I2C Serial Data Line
I/O
I
I/O
VDDE1 SH — — 93 117 F16
PD10 58
PD10
PCS_B2
CNTX_F
NMI0
GPIO
DSPI_B Peripheral Chip Select
CAN_F Transmit
NMI Input for Z1 Core
I/O
O
O
I
VDDE1 SH — — 92 116 G14
PD11 59
PD11
PCS_B1
CNRX_F
NMI1
GPIO
DSPI_B Peripheral Chip Select
CAN_F Receive
NMI Input for Z0 Core
I/O
O
I
I
VDDE1 SH — — 91 115 G15
PD12 60
PD12
PCS_B0
eMIOS9
GPIO
DSPI_B Peripheral Chip Select
eMIOS Channel
I/O
I/O
O
VDDE1 SH — — 90 114 H14
PD13 61
PD13
SCK_B
eMIOS8
GPIO
DSPI_B Clock
eMIOS Channel
I/O
I/O
O
VDDE1 SH — — 89 113 H15
PD14 62
PD14
SOUT_B
eMIOS7
GPIO
DSPI_B Data Output
eMIOS Channel
I/O
O
O
VDDE1 SH — — 88 110 J14
PD15 63
PD15
SIN_B
eMIOS6
GPIO
DSPI_B Data Input
eMIOS Channel
I/O
I
O
VDDE1 SH — — 87 107 K14
Port E (16)
PE0 64
PE0
PCS_A2
eMIOS5
MLBCLK
GPIO
DSPI_A Peripheral Chip Select
eMIOS Channel
MLB Clock
I/O
O
O
I
VDDE1 SH — — 86 106 K16
PE1 65
PE1
PCS_A1
eMIOS4
MLBSI /
MLBSIG
GPIO
DSPI_A Peripheral Chip Select
eMIOS Channel
MLB Signal In (5-pin) /
MLB Bi-directional Signal (3-pin)
I/O
O
O
I
I/O
VDDE1 MH — — 85 103 L14
PE2 66
PE2
PCS_A0
eMIOS3
MLBDI /
MLBDAT
GPIO
DSPI_A Peripheral Chip Select
eMIOS Channel
MLB Data In (5-pin) /
MLB Bi-directional Data (3-pin)
I/O
I/O
O
I
I/O
VDDE1 MH — — 84 101 L15
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
Pin Assignments and Reset States
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 9
PE3 67
PE3
SCK_A
eMIOS2
MLBSO /
MLBSIG_BUFEN
GPIO
DSPI_A Clock
eMIOS Channel
MLB Signal Out (5-pin) /
MLB Signal Level Shifter Enable (3-pin)
I/O
I/O
O
O
O
VDDE1 MH — — 83 100 M13
PE4 68
PE4
SOUT_A
eMIOS1
MLBDO /
MLBDAT_BUFEN
GPIO
DSPI_A Data Out
eMIOS Channel
MLB Data Out (5-pin) /
MLB Data Level Shifter Enable (3-pin)
I/O
O
O
O
O
VDDE1 MH — — 82 98 N14
PE5 69
PE5
SIN_A
eMIOS0
MLB_SLOT /
MLB_SIGOBS /
MLB_DATOBS
GPIO
DSPI_A Data In
eMIOS Channel
MLB Slot Debug /
MLB Clock Adjust Observe Signal /
MLB Clock Adjust Observe Data
I/O
I
O
O
O
O
VDDE1 MH — — 81 97 M15
PE6 70 PE6
CLKOUT
GPIO
System Clock Output
I/O
OVDDE3 MH — — 67 83 P13
PE7 71 PE7 GPIO I/O VDDE1 SH — — — — H13
PE8 72 PE8 GPIO I/O VDDE1 SH — — — — H16
PE9 72 PE9 GPIO I/O VDDE1 SH — — — — J13
PE10 74 PE10 GPIO I/O VDDE1 SH — — — 112 J16
PE11 75 PE11 GPIO I/O VDDE1 SH — — — 111 J15
PE12 76 PE12 GPIO I/O VDDE1 SH — — — 109 K13
PE13 77 PE13 GPIO I/O VDDE1 SH — — — 108 L13
PE14 78 PE14 GPIO I/O VDDE1 SH — — — 102 L16
PE15 79 PE15 GPIO I/O VDDE1 SH — — — 99 M14
Port F (16)
PF0 80
PF0
RD_WR
EVTI8
GPIO
EBI Read/Write
Nexus Event In
I/O
I/O
I
VDDE3 MH — — 66 82 N12
PF1 81
PF1
TA
MLBCLK
EVTO8
GPIO
EBI Transfer Acknowledge
MLB Clock
Nexus Event Out
I/O
I/O
I
O
VDDE3 MH — — 65 81 P12
PF2 82
PF2
AD8
ADDR8
MLBSI /
MLBSIG
MSEO8
GPIO
EBI Muxed Address/Data
EBI Non Muxed Address
MLB Signal In (5-pin) /
MLB Bi-Directional Signal (3-pin)
Nexus Message Start/End Out
I/O
I/O
O
I
I/O
O
VDDE3 MH — — 64 80 R12
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Pin Assignments and Reset States
Freescale Semiconductor10
PF3 83
PF3
AD9
ADDR9
MLBDI /
MLBDAT
MCKO8
GPIO
EBI Muxed Address/Data
EBI Non Muxed Address
MLB Data In (5-pin) /
MLB Bi-directional Data (3-pin)
Nexus Message Clock Out
I/O
I/O
O
I
I/O
O
VDDE3 MH — — 63 79 T12
PF4 84
PF4
AD10
ADDR10
MLBSO /
MLBSIG_BUFEN
MDO08
GPIO
EBI Muxed Address/Data
EBI Non Muxed Address
MLB Signal Out (5-pin) /
MLB Signal Level Shifter Enable (3-pin)
Nexus Message Data Out
I/O
I/O
O
O
O
O
VDDE3 MH — — 59 74 T10
PF5 85
PF5
AD11
ADDR11
MLBDO /
MLBDAT_BUFEN
MDO18
GPIO
EBI Muxed Address/Data
EBI Non Muxed Address
MLB Data Out (5-pin) /
MLB Data Level Shifter Enable (3-pin)
Nexus Message Data Out
I/O
I/O
O
O
O
O
VDDE3 MH — — 58 72 R9
PF6 86
PF6
AD12
ADDR12
MLB_SLOT /
MLB_SIGOBS /
MLB_DATOBS
MDO28
GPIO
EBI Muxed Address/Data
EBI Non Muxed Address
MLB Slot Debug /
MLB Clock Adjust Observe Signal /
MLB Clock Adjust Observe Data
Nexus Message Data Out
I/O
I/O
O
O
O
O
O
VDDE3 MH — — 57 68 T8
PF7 87
PF7
AD13
ADDR13
MDO38
GPIO
EBI Muxed Address/Data
EBI Non Muxed Address
Nexus Message Data Out
I/O
I/O
O
O
VDDE3 MH — — 56 66 P8
PF8 88
PF8
AD14
ADDR14
MDO48
GPIO
EBI Muxed Address/Data
EBI Non Muxed Address
Nexus Message Data Out
I/O
I/O
O
O
VDDE2 MH — — 55 65 N8
PF9 89
PF9
AD15
ADDR15
MDO58
GPIO
EBI Muxed Address/Data
EBI Non Muxed Address
Nexus Message Data Out
I/O
I/O
O
O
VDDE2 MH — — 54 64 T7
PF10 90
PF10
CS1
TXD_C
MDO68
GPIO
EBI Chip Select
SCI_C Transmit
Nexus Message Data Out
I/O
O
O
O
VDDE2 MH — — 52 62 R7
PF11 91
PF11
CS0
RXD_C
MDO78
GPIO
EBI Chip Select
SCI_C Receive
Nexus Message Data Out
I/O
O
I
O
VDDE2 MH — — 51 61 P7
PF12 92
PF12
TS
TXD_D
ALE
GPIO
EBI Transfer Start
SCI_D Transmit
EBI Address Latch Enable
I/O
I/O
O
O
VDDE2 MH — — 50 60 N7
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
Pin Assignments and Reset States
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 11
PF13 93
PF13
OE
RXD_D
GPIO
EBI Output Enable
SCI_D Receive
I/O
O
I
VDDE2 MH — — 49 59 R6
PF14 94
PF14
WE0
BDIP
CNTX_D
GPIO
EBI Write Enable
EBI Burst Data In Progress
CAN_D Transmit
I/O
O
O
O
VDDE2 MH — — 45 55 P6
PF15 95
PF15
WE1
TEA
CNRX_D
GPIO
EBI Write Enable
EBI Transfer Error Acknowledge
CAN_D Receive
I/O
O
I/O
I
VDDE2 MH — — 44 54 N6
Port G (16)
PG0 96
PG0
AD16
eMIOS16
GPIO
EBI Muxed Address/Data
eMIOS Channel
I/O
I/O
I/O
VDDE2 MH — — 43 51 P5
PG1 97
PG1
AD17
eMIOS17
SIN_C
GPIO
EBI Muxed Address/Data
eMIOS Channel
DSPI_C Serial In
I/O
I/O
I/O
I
VDDE2 MH — — 42 50 T4
PG2 98
PG2
AD18
eMIOS18
SOUT_C
GPIO
EBI Muxed Address/Data
eMIOS Channel
DSPI_C Serial Out
I/O
I/O
I/O
O
VDDE2 MH — — 41 49 R4
PG3 99
PG3
AD19
eMIOS19
SCK_C
GPIO
EBI Muxed Address/Data
eMIOS Channel
DSPI_C Serial Clock
I/O
I/O
I/O
I/O
VDDE2 MH — — 40 48 P4
PG4 100
PG4
AD20
eMIOS20
PCS_C0
GPIO
EBI Muxed Address/Data
eMIOS Channel
DSPI_C Peripheral Chip Select
I/O
I/O
I/O
I/O
VDDE2 MH — — 39 47 T3
PG5 101
PG5
AD21
eMIOS21
GPIO
EBI Muxed Address/Data
eMIOS Channel
I/O
I/O
I/O
VDDE2 MH — — 38 46 R3
PG6 102
PG6
AD22
eMIOS22
GPIO
EBI Muxed Address/Data
eMIOS Channel
I/O
I/O
I/O
VDDE2 MH — — 37 45 T2
PG7 103
PG7
AD23
eMIOS23
RXD_C
GPIO
EBI Muxed Address/Data
eMIOS Channel
SCI_C Receive
I/O
I/O
I/O
I
VDDE2 MH — — 36 44 R1
PG8 104
PG8
AD24
PCS_A4
GPIO
EBI Muxed Address/Data
DSPI_A Peripheral Chip Select
I/O
I/O
O
VDDE2 MH — — 35 43 P2
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Pin Assignments and Reset States
Freescale Semiconductor12
PG9 105
PG9
AD25
PCS_A3
TXD_C
GPIO
EBI Muxed Address/Data
DSPI_A Peripheral Chip Select
SCI_C Transmit
I/O
I/O
O
O
VDDE2 MH — — 34 42 N3
PG10 106
PG10
AD26
PCS_A2
GPIO
EBI Muxed Address/Data
DSPI_A Peripheral Chip Select
I/O
I/O
O
VDDE2 MH — — 30 38 N2
PG11 107
PG11
AD27
PCS_A1
GPIO
EBI Muxed Address/Data
DSPI_A Peripheral Chip Select
I/O
I/O
O
VDDE2 MH — — 29 37 N1
PG12 108
PG12
AD28
PCS_A0
GPIO
EBI Muxed Address/Data
DSPI_A Peripheral Chip Select
I/O
I/O
I/O
VDDE2 MH — — 28 36 M4
PG13 109
PG13
AD29
SCK_A
GPIO
EBI Muxed Address/Data
DSPI_A Clock
I/O
I/O
I/O
VDDE2 MH — — 27 35 M3
PG14 110
PG14
AD30
SOUT_A
GPIO
EBI Muxed Address/Data
DSPI_A Data Out
I/O
I/O
O
VDDE2 MH — — 26 34 M2
PG15 111
PG15
AD31
SIN_A
GPIO
EBI Muxed Address/Data
DSPI_A Data In
I/O
I/O
I
VDDE2 MH — — 25 33 M1
Port H (16)
PH0 112
PH0
AN27
eMIOS20
SCL_A
GPIO
eQADC Analog Input7
eMIOS Channel
I2C_A Serial Clock
I/O
I
O
I/O
VDDE2 A + SH — — 24 32 L3
PH1 113
PH1
AN26
eMIOS21
SDA_A
GPIO
eQADC Analog Input7
eMIOS Channel
I2C_A Serial Data
I/O
I
O
I/O
VDDE2 A + SH — — 23 31 L2
PH2 114
PH2
AN25
eMIOS22
CS3
GPIO
eQADC Analog Input7
eMIOS Channel
EBI Chip Select
I/O
I
O
O
VDDE2 A + MH — — 22 30 L1
PH3 115
PH3
AN24
eMIOS23
CS2
GPIO
eQADC Analog Input7
eMIOS Channel
EBI Chip Select
I/O
I
O
O
VDDE2 A + MH — — 21 29 K4
PH4 116
PH4
AN23
TXD_E
MA2
GPIO
eQADC Analog Input7
SCI_E Transmit
eQADC External Mux Address
I/O
I
O
O
VDDE2 A + SH — — 20 28 K3
PH5 117
PH5
AN22
RXD_E
MA1
GPIO
eQADC Analog Input7
SCI_E Receive
eQADC External Mux Address
I/O
I
I
O
VDDE2 A + SH — — 19 24 J3
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
Pin Assignments and Reset States
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 13
PH6 118
PH6
AN21
TXD_F
GPIO
eQADC Analog Input7
SCI_F Transmit
I/O
I
O
VDDE2 A + SH — — 18 23 J2
PH7 119
PH7
AN20
RXD_F
GPIO
eQADC Analog Input7
SCI_F Receive
I/O
I
I
VDDE2 A + SH — — 17 22 J1
PH8 120
PH8
AN19
CNTX_E
MA0
GPIO
eQADC Analog Input7
CAN_E Transmit
eQADC External Mux Address
I/O
I
O
O
VDDE2 A + SH — — 14 17 H1
PH9 121
PH9
AN18/ANT
CNRX_E
GPIO
eQADC Analog Input7
CAN_E Receive
I/O
I
I
VDDE2 A + SH — — 13 14 G2
PH10 122
PH10
AN17/ANS
CNRX_F
GPIO
eQADC Analog Input7
CAN_F Receive
I/O
I
I
VDDE2 A + SH — — 12 12 F4
PH11 123
PH11
AN16/ANR
CNTX_F
GPIO
eQADC Analog Input7
CAN_F Transmit
I/O
I
O
VDDE2 A + SH — — 11 11 F3
PH12 124 PH12
PCS_D5
GPIO
DSPI_D Peripheral Chip Select
I/O
OVDDE2 SH — — — — F2
PH13 125 PH13 GPIO I/O VDDE2 SH — — — — F1
PH14 126 PH14
WE2
GPIO
EBI Write Enable
I/O
OVDDE2 MH — — — 53 T5
PH15 127 PH15
WE3
GPIO
EBI Write Enable
I/O
OVDDE2 MH — — — 52 R5
Port J (16)
PJ0 128 PJ0
AD0
GPIO
EBI Muxed Address/Data
I/O
I/O VDDE3 MH — — — — N11
PJ1 129 PJ1
AD1
GPIO
EBI Muxed Address/Data
I/O
I/O VDDE3 MH — — — — P11
PJ2 130 PJ2
AD2
GPIO
EBI Muxed Address/Data
I/O
I/O VDDE3 MH — — — — N10
PJ3 131 PJ3
AD3
GPIO
EBI Muxed Address/Data
I/O
I/O VDDE3 MH — — — — R10
PJ4 132 PJ4
AD4
GPIO
EBI Muxed Address/Data
I/O
I/O VDDE3 MH — — — 75 P10
PJ5 133 PJ5
AD5
GPIO
EBI Muxed Address/Data
I/O
I/O VDDE3 MH — — — 73 T9
PJ6 134 PJ6
AD6
GPIO
EBI Muxed Address/Data
I/O
I/O VDDE3 MH — — — 69 P9
PJ7 135 PJ7
AD7
GPIO
EBI Muxed Address/Data
I/O
I/O VDDE3 MH — — — 67 R8
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Pin Assignments and Reset States
Freescale Semiconductor14
PJ8 136 PJ8
PCS_D4
GPIO
DSPI_D Peripheral Chip Select
I/O
I/O VDDE2 SH — — — 27 K2
PJ9 137 PJ9
PCS_D3
GPIO
DSPI_D Peripheral Chip Select
I/O
I/O VDDE2 SH — — — 26 K1
PJ10 138 PJ10
PCS_D2
GPIO
DSPI_D Peripheral Chip Select
I/O
I/O VDDE2 SH — — — 25 J4
PJ11 139 PJ11
PCS_D1
GPIO
DSPI_D Peripheral Chip Select
I/O
I/O VDDE2 SH — — — 19 H3
PJ12 140 PJ12
PCS_D0
GPIO
DSPI_D Peripheral Chip Select
I/O
I/O VDDE2 SH — — — 18 H2
PJ13 141 PJ13
SCK_D
GPIO
DSPI_D Clock
I/O
I/O VDDE2 SH — — — 16 G4
PJ14 142 PJ14
SOUT_D
GPIO
DSPI_D Serial Out
I/O
OVDDE2 SH — — — 15 G3
PJ15 143 PJ15
SIN_D
GPIO
DSPI_D Serial In
I/O
IVDDE2 SH — — — 13 G1
Port K (2)
PK0 144 PK0
EXTAL32
GPIO
32 kHz Crystal Oscillator Input
I
IVDDA AE + IH — — — 168 B6
PK1 145 PK1
XTAL32
GPIO
32 kHz Crystal Oscillator Output
I
OVDDA AE + IH — — — 166 A6
Miscellaneous Pins (9)
EXTAL — EXTAL
EXTCLK
Main Crystal Oscillator Input
External Clock Input
I
IVDDSYN AE EXTAL 75 91 N16
XTAL — XTAL Main Crystal Oscillator Output O VDDSYN AE XTAL 74 90 P16
TMS — TMS JTAG Test Mode Select Input I VDDE3 SH TMS (Pull Up) 72 88 T15
TCK — TCK JTAG Test Clock Input I VDDE3 IH TCK (Pull Down) 71 87 R14
TDO — TDO JTAG Test Data Output O VDDE3 MH TDO (Pull Up9)7086T14
TDI — TDI JTAG Test Data Input I VDDE3 IH TDI (Pull Up) 69 85 R13
JCOMP — JCOMP JTAG Compliancy I VDDE3 IH JCOMP (Pull Down) 68 84 T13
TEST10 — TEST Test Mode Select I VDDE3 IH TEST 62 78 R11
RESET — RESET External Reset I/O VDDE2 SH RESET (Pull Up) 10 10 E4
1The GPIO number is the same as the corresponding pad configuration register (SIU_PCRn) number.
2This column lists the functions associated with the programming of the SIU_PCRn[PA] bit field in the following order: GPIO, function
1, function 2, and function 3. The unused functions by a given pin begin with function 3, then function 2, then function 1.
3These are nominal voltages. Each segment provides the power and ground for the given set of I/O pins.
4Pad types: SH - Bi-directional slow speed pad with input hysteresis; MH - Bi-directional medium speed pad with input hysteresis; IH
- Input only pad with input hysteresis; AE/A - Analog pad.
5A dash for the function in this column denotes the input and output buffer are turned off.
Table 1. MPC5510 Signal Properties (continued)
Pin
Name
GPIO
(PCR)
Num1
Supported
Functions2Description I/O
Type Voltage3Pad4
Type
Status
During
Reset5
Status
After
Reset5
Package Pin
Locations
144 176 208
Pin Assignments and Reset States
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 15
1.2 Power and Ground Supply Summary
6Port A[14:15]—EXTAL32 and XTAL32 functions only apply on the 144LQFP. These functions are on PortK[0:1] for the 176LQFP and
208BGA. In the 176 LQFP and 208 BGA packages, activity on PA14 should be minimized if the 32kHz XTAL is enabled.
7This analog input pin has reduced analog-to-digital conversion accuracy compared to PA0–PA15. See eQADC spec #11 (Total
Unadjusted Error for single ended conversions with calibration) for further notes on this.
8The NEXUS function is selected when the JTAG TAP controller is enabled via the JCOMP pin and the appropriate bits in the NP
PCR register. The value of the PA field in the associated PCR register has no effect on the pin function when the NEXUS function
is selected.
9Pullup is enabled only when JCOMP is negated.
10 Always connect the TEST pin to Ground (Vss).
Table 2. MPC5510 Power/Ground
Pin
Name Function Description Voltage1
1These are nominal voltages.
Package Pin Locations
144 176 208
VDDR Voltage Regulator Supply 5.0 V 46 56 T6
VDDA Analog Power 5.0 V 144 176 A2
VRH2
2VRH is shorted to VDDA in the 144LQFP and 176 LQFP packages.
eQADC Voltage Reference High 5.0 V B3
VSSA Analog Ground –141 173 A4
VRL3eQADC Voltage Reference Low – B4
REFBYPC eQADC Reference Bypass Capacitor VSSA 11B1
VPP4Flash Program/Erase Power 5.0 V 78 94 P15
VDDSYN5Clock Synthesizer Power 3.3 V 73 89 R16
VSSSYN Clock Synthesizer Ground – 76 92 M16
VDDE1
External I/O Power 3.3 V –
5.0 V
96,119 105,120,
143,155
A15,D10,E13,
G16,K15
VDDE2 16,33,48 21,41,58 H4,L4,N5,P1
VDDE3 61 71,77 N9,T11
VSSE1
External I/O Ground –
95,118 104,119,
142,154
Shorted to VSS in
the package
VSSE2 15,32,47 20,40,57 Shorted to VSS in
the package
VSSE3 60 70,76 Shorted to VSS in
the package
VDD3353.3 V I/O Power 3.3 V 77 93 N15
VFLASH5, 6 Flash Read Power
VDD5Internal Logic Power
1.5 V
31,53,79 39,63,95 A1,A16,B2,B15,
R2,R15,T1,T16
VDDF5Flash Internal Logic Power 79 95 Shorted to VDD in
the package
VSS Ground
–80 96
C3,C14,D4,D13,
G7-G10,H7-H10,
J7-J10,K7-K10,
N4,N13,P3,P14
VSSF Flash Internal Logic Ground Shorted to VSS in
the package
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Pin Assignments and Reset States
Freescale Semiconductor16
3VRL is shorted to VSSA in the 144LQFP and 176 LQFP packages.
4VPP requires 5V for program/erase operations, but may be 0-5V otherwise. VPP should not go high
or low when the device is in Sleep mode.
5Voltage generated from internal voltage regulator and no external connection or load allowed
except the required bypass capacitors.
6VFLASH is shorted to VDD33 in the package.
Pin Assignments and Reset States
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 17
1.3 Pinout – 144 LQFP
Figure 2. MPC5510 Pinout – 144 LQFP
PE0/PCS_A2/eMIOS5/MLBCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
REFBYPC
AN7/PA7
AN6/PA6
AN5/PA5
AN4/PA4
AN3/PA3
AN1/PA1
AN0/PA0
RESET
CNTX_F/AN16/ANR/PH11
CNRX_F/AN17/ANS/PH10
CNRX_E/AN18/ANT/PH9
MA0/CNTX_E/AN19/PH8
V
SSE2
V
DDE2
RXD_F/AN20/PH7
TXD_F/AN21/PH6
MA1/RXD_E/AN22/PH5
MA2/TXD_E/AN23/PH4
CS2/eMIOS23/AN24/PH3
CS3/eMIOS22/AN25/PH2
SDA_A/eMIOS21/AN26/PH1
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
PC12/eMIOS12/PCS_C3/SIN_D
PC13/eMIOS13/PCS_A5/PCS_D0
PC14/eMIOS14/PCS_A4/PCS_D1
PC15/eMIOS15/PCS_A3/PCS_D2
PD0/CNTX_A/PCS_D3
PD1/CNRX_A/PCS_D4
PD2/CNRX_B/eMIOS10/BOOTCFG*/PCS_D5
PD3/CNTX_B/eMIOS11
PD4/CNTX_C/eMIOS12
PD5/CNRX_C/eMIOS13
PD6/TXD_A/eMIOS14
PD7/RXD_A/eMIOS15
V
DDE1
V
SSE1
PD8/TXD_B/SCL_A
PD9/RXD_B/SDA_A
PD10/PCS_B2/CNTX_F/NMI0
PD11/PCS_B1/CNRX_F/NMI1
PD12/PCS_B0/eMIOS9
PD13/SCK_B/eMIOS8
PD14/SOUT_B/eMIOS7
PE1/PCS_A1/eMIOS4/MLBSI
PE2/PCS_A0/eMIOS3/MLBDI
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
V
DDA
/V
RH
PA8/AN8/ANW
PA9/AN9/ANX
V
SSA
/V
RL
PA10/AN10/ANY
PA11/AN11/ANZ
PA12/AN12
PA13/AN13
PA14/AN14/EXTAL32
PA15/AN15/XTAL32
PB0/AN28/eMIOS16/PCS_C5
PB1/AN29/eMIOS17/PCS_C4
PB2/AN30/eMIOS18/PCS_C3
PB3/AN31/PCS_C2
PB4/AN32/PCS_C1
PB5/AN33/PCS_C0
PB6/AN34/SCK_C
PB7/AN35/SOUT_C
PB8/AN36/SIN_C
PB9/AN37/CNTX_D/PCS_B4
PB10/AN38/CNRX_D/PCS_B3
PB11/AN39/eMIOS19/PCS_B5
PC0/eMIOS0/FR_A_TX_EN/AD24
PC1/eMIOS1/FR_A_TX/AD16
PC2/eMIOS2/FR_A_RX/TS
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
eMIOS22/AD22/PG6
eMIOS21/AD21/PG5
PCS_C0/eMIOS20/AD20/PG4
SCK_C/eMIOS19/AD19/PG3
SOUT_C/eMIOS18/AD18/PG2
SIN_C/eMIOS17/AD17/PG1
eMIOS16/AD16/PG0
CNRX_D/TEA/WE1/PF15
CNTX_D/BDIP/WE0/PF14
V
DDR
V
SSE2
V
DDE2
RXD_D/OE/PF13
ALE/TXD_D/TS/PF12
MDO7/RXD_C/CS0/PF11
MDO6/TXD_C/CS1/PF10
MDO5/ADDR15/AD15/PF9
MDO4/ADDR14/AD14/PF8
MDO3/ADDR13/AD13/PF7
MDO2/MLB_SLOT/ADDR12/AD12/PF6
MDO1/MLBDO/ADDR11/AD11/PF5
MDO0/MLBSO/ADDR10/AD10/PF4
V
SSE3
V
DDE3
SCL_A/eMIOS20/AN27/PH0
AN2/PA2
PD15/SIN_B/eMIOS6
26
27
28
29
30
31
32
33
34
35
36
SIN_A/AD31/PG15
SOUT_A/AD30/PG14
SCK_A/AD29/PG13
PCS_A0/AD28/PG12
PCS_A1/AD27/PG11
PCS_A2/AD26/PG10
V
SSE2
V
DDE2
TXD_C/PCS_A3/AD25/PG9
PCS_A4/AD24/PG8
RXD_C/eMIOS23/AD23/PG7
83
82
81
80
79
78
77
76
75
74
73
PE3/SCK_A/eMIOS2//MLBSO
PE4/SOUT_A/eMIOS1/MLBDO
PE5/SIN_A/eMIOS0/MLB_SLOT
V
SS
/V
SSF
V
DD
/V
DDF
V
PP
V
DD33
/V
FLASH
V
SSSYN
EXTAL/EXTCLK
XTAL
V
DDSYN
62
63
64
65
66
67
68
69
70
71
72
MCKO/MLBDI/ADDR9/AD9/PF3
MSEO/MLBSI/ADDR8/AD8/PF2
EVTO/MLBCLK/TA/PF1
EVTI/RD_WR/PF0
CLKOUT/PE6
JCOMP
TDI
TDO
TCK
TMS
119
118
117
116
115
114
113
112
111
110
109
V
DDE1
V
SSE1
PC3/eMIOS3/FR_DBG0
PC4/eMIOS4/FR_DBG1
PC5/eMIOS5/FR_DBG2
PC6/eMIOS6/FR_DBG3
PC7/eMIOS7/FR_B_RX
PC8/eMIOS8/FR_B_TX/AD15
PC9/eMIOS9/FR_B_TX_EN/AD14
PC10/eMIOS10/PCS_C5/SCK_D
PC11/eMIOS11/PCS_C4/SOUT_D
Denotes active during RESET only*
V
DD
V
DD
TEST
144 LQFP
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Pin Assignments and Reset States
Freescale Semiconductor18
1.4 Pinout – 176 LQFP
Figure 3. MPC5510 Pinout – 176 LQFP
PE0/PCS_A2/eMIOS5/MLBCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
REFBYPC
AN7/PA7
AN6/PA6
AN5/PA5
AN4/PA4
AN3/PA3
AN1/PA1
AN0/PA0
RESET
CNTX_F/AN16/ANR/PH11
CNRX_F/AN17/ANS/PH10
CNRX_E/AN18/ANT/PH9
MA0/CNTX_E/AN19/PH8
V
SSE2
V
DDE2
RXD_F/AN20/PH7
TXD_F/AN21/PH6
MA1/RXD_E/AN22/PH5
MA2/TXD_E/AN23/PH4
CS2/eMIOS23/AN24/PH3
CS3/eMIOS22/AN25/PH2
SDA_A/eMIOS21/AN26/PH1
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
PC12/eMIOS12/PCS_C3/SIN_D
PC13/eMIOS13/PCS_A5/PCS_D0
PC14/eMIOS14/PCS_A4/PCS_D1
PC15/eMIOS15/PCS_A3/PCS_D2
PD0/CNTX_A/PCS_D3
PD1/CNRX_A/PCS_D4
PD2/CNRX_B/eMIOS10/BOOTCFG*/PCS_D5
PD3/CNTX_B/eMIOS11
PD4/CNTX_C/eMIOS12
PD5/CNRX_C/eMIOS13
PD6/TXD_A/eMIOS14
PD7/RXD_A/eMIOS15
V
DDE1
V
SSE1
PD8/TXD_B/SCL_A
PD9/RXD_B/SDA_A
PD10/PCS_B2/CNTX_F/NMI0
PD11/PCS_B1/CNRX_F/NMI1
PD12/PCS_B0/eMIOS9
PD13/SCK_B/eMIOS8
PD14/SOUT_B/eMIOS7
PE1/PCS_A1/eMIOS4/MLBSI
PE2/PCS_A0/eMIOS3/MLBDI
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
V
DDA
/V
RH
PA8/AN8/ANW
PA9/AN9/ANX
V
SSA
/V
RL
PA10/AN10/ANY
PA11/AN11/ANZ
PA12/AN12
PA13/AN13
PA14/AN14
PA15/AN15
PB0/AN28/eMIOS16/PCS_C5
PB1/AN29/eMIOS17/PCS_C4
PB2/AN30/eMIOS18/PCS_C3
PB3/AN31/PCS_C2
PB4/AN32/PCS_C1
PB5/AN33/PCS_C0
PB6/AN34/SCK_C
PB7/AN35/SOUT_C
PB8/AN36/SIN_C
PB9/AN37/CNTX_D/PCS_B4
PB10/AN38/CNRX_D/PCS_B3
PB11/AN39/eMIOS19/PCS_B5
PC0/eMIOS0/FR_A_TX_EN/AD24
PC1/eMIOS1/FR_A_TX/AD16
PC2/eMIOS2/FR_A_RX/TS
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
CNTX_D/BDIP/WE0/PF14
V
DDR
V
SSE2
V
DDE2
RXD_D/OE/PF13
ALE/TXD_D/TS/PF12
MDO7/RXD_C/CS0/PF11
MDO6/TXD_C/CS1/PF10
MDO5/ADDR15/AD15/PF9
MDO4/ADDR14/AD14/PF8
MDO3/ADDR13/AD13/PF7
MDO2/MLB_SLOT/ADDR12/AD12/PF6
MDO1/MLBDO/ADDR11/AD11/PF5
MDO0/MLBSO/ADDR10/AD10/PF4
V
SSE3
V
DDE3
SCL_A/eMIOS20/AN27/PH0
AN2/PA2
PD15/SIN_B/eMIOS6
26
27
28
29
30
31
32
33
34
35
36
SIN_A/AD31/PG15
SOUT_A/AD30/PG14
SCK_A/AD29/PG13
PCS_A0/AD28/PG12
PCS_A1/AD27/PG11
PCS_A2/AD26/PG10
V
SSE2
V
DDE2
TXD_C/PCS_A3/AD25/PG9
PCS_A4/AD24/PG8
RXD_C/eMIOS23/AD23/PG7
PE3/SCK_A/eMIOS2//MLBSO
PE4/SOUT_A/eMIOS1/MLBDO
PE5/SIN_A/eMIOS0/MLB_SLOT
V
SS
/V
SSF
V
DD
/V
DDF
V
PP
V
DD33
/V
FLASH
V
SSSYN
EXTAL/EXTCLK
XTAL
V
DDSYN
78
79
80
81
82
83
84
85
86
87
88
MCKO/MLBDI/ADDR9/AD9/PF3
MSEO/MLBSI/ADDR8/AD8/PF2
EVTO/MLBCLK/TA/PF1
EVTI/RD_WR/PF0
CLKOUT/PE6
JCOMP
TDI
TDO
TCK
TMS
151
150
149
148
147
146
145
144
143
142
141
V
DDE1
V
SSE1
PC3/eMIOS3/FR_DBG0
PC4/eMIOS4/FR_DBG1
PC5/eMIOS5/FR_DBG2
PC6/eMIOS6/FR_DBG3
PC7/eMIOS7/FR_B_RX
PC8/eMIOS8/FR_B_TX/AD15
PC9/eMIOS9/FR_B_TX_EN/AD14
PC10/eMIOS10/PCS_C5/SCK_D
PC11/eMIOS11/PCS_C4/SOUT_D
Denotes active during RESET only*
V
DD
V
DD
VSUP/TEST
176 LQFP
37
38
39
40
41
42
43
44
140
139
138
137
136
135
134
133
45
46
47
48
49
50
51
52
eMIOS22/AD22/PG6
eMIOS21/AD21/PG5
PCS_C0/eMIOS20/AD20/PG4
SCK_C/eMIOS19/AD19/PG3
SOUT_C/eMIOS18/AD18/PG2
SIN_C/eMIOS17/AD17/PG1
eMIOS16/AD16/PG0
CNRX_D/TEA/WE1/PF15
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
132
131
130
129
128
127
126
125
SIN_D/PJ15
SOUT_D/PJ14
SCK_D/PJ13
PCS_D0/PJ12
PCS_D1/PJ11
PCS_D2/PJ10
PCS_D3/PJ9
PCS_D4/PJ8
WE3/PH15
WE2/PH14
AD7/PJ7
AD6/PJ6
AD5/PJ5
AD4/PJ4
V
DDE3
V
SSE3
PE10
PE11
PE12
PE13
V
DDE1
V
SSE1
PE14
PE15
PB15/RXD_H
PB14/TXD_H
V
DDE1
V
SSE1
PK0/EXTAL32
PK1/XTAL32
PB12/TXD_G/PCS_B4
PB13/RXD_G/PCS_B3
Pin Assignments and Reset States
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 19
1.5 Pinout – 208 PBGA
Figure 4. MPC5510 Pinout – 208 PBGA
V
DD
12345678910111213141516
V
DDA
PA8 V
SSA
PB2 PB6 PC3 PC7 PC10 V
DDE1
V
DD
A
REF V
DD
V
RH
V
RL
PA12 PK0 PB3 PB7 PC0 PC4 PC8 PC11 V
DD
PC12
B
V
SS
PA9 PA11 PA15 PB4 PB8 PB14 PC1 PC5 PC9 V
SS
PC13 PC14
C
V
SS
PA10 PA14 PB5 V
DDE1
V
SS
PC15 PD0 PD1
D
V
DDE1
PD2 PD3 PD4
E
PD6 PD7 PD9
F
PD8
GV
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
PE8
H
V
SS
V
SS
V
SS
V
SS
PE9 PD14 PE11 PE10
J
PE12 PD15 V
DDE1
PE0
K
PE13 PE1 PE14
L
PE3
M
V
SS
V
DDE2
PF0 V
SS
N
V
SS
PG3 PF1
PF3
V
SS
V
PP
XTAL
P
V
DD
PG5 PF2 TDI TCK V
DD
R
V
DD
PG6
PE6
JCOMP V
DD
T
A
B
C
D
E
F
G
H
J
K
L
M
12345678910111213141516
PA13
208 PBGA Ball Map
(as viewed from top through the package)
N
P
R
T
PB10
PB11
PD10 PD11 V
DDE1
PF15
PG4
PA6
PA3
RESET
PK1
PA7
PA5 PB9
PD13PD12PE7
PA4
PA0
PH10
PG7
EXTAL
PF14
TMS
PC6
PD5
PE2
PE15 PE5
V
SSSYN
PE4 V
DD33
PJ0PJ2V
DDE3
PF8PF12
PA1PA2
PH11PH12PH13
PJ13PJ14PH9PJ15
V
DDE2
PJ11PJ12PH8
PJ10PH5PH6PH7
PH3PH4PJ8PJ9
V
DDE2
PH0PH1PH2
PG12PG13PG14PG15
PG9PG10PG11
PG8V
DDE2
PG0 PJ1PJ4PF7PF11 PJ6
PG2 PF13PH15 TESTPJ3PJ7PF10 PF5
PG1 V
DDR
PH14 V
DDE3
PF4PF6PF9 PJ5 TDO
V
DDSYN
PB12
PB13
PB15
PB0
PC2
PB1
BYPC
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor20
2 Electrical Characteristics
This section contains detailed inform at ion on power considerations, DC/AC electrical characteristics, and AC timing
specifications for the MCU.
2.1 Maximum Ratings
Table 3. Absolute Maximum Ratings1
1Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device reliability or
cause permanent damage to the device.
Num Characteristic Symbol Min Max2
2Absolute maximum voltages are currently maximum burn–in voltages. Absolute maximum specifications for device stress have
not yet been determined.
Unit
1 5.0V Voltage Regulator Reference Voltage VDDR – 0.3 6.5 V
2 5.0V Analog Supply Voltage (reference to VSSA)V
DDA – 0.3 6.5 V
3 5.0V Flash Program/Erase Voltage VPP – 0.3 6.5 V
4 3.3V – 5.0V External I/O Supply Voltage 3
3All functional non-supply I/O pins are clamped to VSS and VDDE.
VDDE14
VDDE24
VDDE34
4VDDE1, VDDE2, and VDDE3 are separate power segments and may be powered independently with no differential voltage
constraints between the power segments.
– 0.3
– 0.3
– 0.3
6.5
6.5
6.5
V
5 DC Input Voltage 5
5AC signal over and undershoot of the input voltages of up to +/– 2.0 volts is permitted for a cumulative duration of 60 hours
over the complete lifetime of the device (injection current does not need to be limited for this duration).
VIN –1.06
6Internal structures will hold the input voltage above -1.0 volt if the injection current limit of 2mA is met.
6.57
7Internal structures hold the input voltage below this maximum voltage on all pads powered by VDDE supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDE is within Operating Voltage specifications.
V
6V
REF Differential Voltage VRH – VRL – 0.3 5.5 V
7V
RH to VDDA Differential Voltage VRH – VDDA – 5.5 5.5 V
8V
RL to VSSA Differential Voltage VRL – VSSA – 0.3 0.3 V
9V
DDR to VDDA Differential Voltage VDDR – VDDA – VDDA 0.3 V
10 Maximum DC Digital Input Current 8 (per pin, applies to all
digital MH, SH, and IH pins)
8Total injection current for all pins (including both digital and analog) must not exceed 25mA.
IMAXD –2 2 mA
11 Maximum DC Analog Input Current 9 (per pin, applies to all
analog AE and A pins)
9Total injection current for all analog input pins must not exceed 15mA.
IMAXA –3 3 mA
12 Storage Temperature Range TSTG – 55.0 150.0 oC
13 Maximum Solder Temperature 10
10 Solder profile per CDF-AEC-Q100.
TSDR — 260.0 oC
14 Moisture Sensitivity Level 11
11 Moisture sensitivity per JEDEC test method A112.
MSL — 3
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 21
2.2 Thermal Characteristics
2.2.1 General Notes for Specifications at Maximum Junction Temperature
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJA PD)Eqn. 1
where:
TA = ambient temperature for the package (oC) Eqn. 2
RJA = junction to ambient thermal resistance (oC/W) Eqn. 3
PD = power dissipation in the package (W) Eqn. 4
The supplied thermal resistances are provided based on JEDEC JESD51 series of standards to provide consistent values for
estimations and comparisons. The difference between the values determined on the single-layer (1s) board and on the four -layer
board with two signal layers and a power and a ground plane (2s2p) clearly demonstrate that the ef fective thermal resistance of
Table 4. Thermal Characteristics
Num Characteristic Symbol Unit
Value
208 MAPBGA 176 LQFP 144 LQFP
1 Junction to Ambient 1, 2
Natural Convection
(Single layer board)
1Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
RJA °C/W 44 38 43
2 Junction to Ambient 1, 3
Natural Convection
(Four layer board 2s2p)
3Per JEDEC JESD51-6 with the board horizontal.
RJA °C/W 27 31 34
3 Junction to Ambient 1, 3
(@200 ft./min., Single layer board)
RJMA °C/W 35 30 34
4 Junction to Ambient 1, 3
(@200 ft./min., Four layer board 2s2p)
RJMA °C/W 24 25 28
5 Junction to Board 4
4Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RJB °C/W 16 20 22
6 Junction to Case 5
5Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RJC °C/W 8 6 7
7 Junction to Package Top 6
Natural Convection
6Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
JT °C/W 2 2 2
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor22
the component is not a constant. It depends on the construction of the application board (number of planes), the effective size
of the board which cools the component, how well the component is thermally and electrically connected to the planes, and the
power being dissipated by adjacent components.
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package
to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance
between through vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.
As a general rule, the value obtained on a single layer board is appropriate for the tightly packed printed circuit board. The value
obtained on the board with the internal planes is usually appropriat e if the application board has one oz (35 micron nominal
thickness) internal planes, the components are well separated, and the overall power dissip ation on the board is less than 0.02
W/cm2.
The thermal performance of any component depends strongly on the power dissipation of surrounding components. In addition,
the ambient temperature varies widely within the application. For many natural convection and especially closed box
applications, the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature
near the device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description
of the local ambient conditions that determine the temperature of the device.
At a known board temperature, the junctio n temperature is estimated using the following equation:
TJ = TB + (RJB PD)Eqn. 5
where:
TJ = junction temperature (oC) Eqn. 6
TB = board temperature at the package perimeter (oC/W) Eqn. 7
RJB = junction to board thermal resistance (oC/W) per JESD51-8 Eqn. 8
PD = power dissipation in the package (W) Eqn. 9
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction temperature can be made.
The application board should be similar to the thermal test condition, with the component soldered to a board with internal
planes.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal resistance and a case
to ambient thermal resistance:
RJA = RJC + RCA Eqn. 10
where:
RJA = junction to ambient thermal resistance (oC/W) Eqn. 11
RJC = junction to case thermal resistance (oC/W) Eqn. 12
RCA = case to ambient thermal resistance (oC/W) Eqn. 13
RJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case to
ambient thermal resistance, RCA. For instance, the user can chan ge the air flow around the device, a dd a heat sink, change the
mounting arrangement on printed circu it board, or change the thermal dissipation on the printed circuit board surrounding the
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 23
device. This description is most useful for packages with heat sinks where some 90% of the heat flow is through the case to the
heat sink to ambient. For most packages, a better model is required.
A more accurate two-resistor thermal model can be constructed from the junction to board thermal resistance and the junction
to case thermal resistance. The junction to case covers the situation where a heat sink will be used or where a substantial amount
of heat is dissipated from the top of the package. The junction to board thermal resistance describes the thermal performance
when most of the heat is conducted to the printed circuit board. This model can be used for either hand estimations or for a
computational fluid dynamics (CFD) thermal model.
To determine the junction temperature of the device in the application after prototypes are available, the Thermal
Characterization Parameter (JT) can be used to determine the junction temperature with a measurement of the temperature at
the top center of the package case using the following equation:
TJ = TT + (JT PD)Eqn. 14
where:
TT = thermocouple temperature on top of the package (oC) Eqn. 15
JT = thermal characterization parameter (oC/W) Eqn. 16
PD = power dissipation in the package (W) Eqn. 17
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling ef fects
of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
805 East Middlefield Rd
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modelin g of a PBGA for Air-Cooled Applications,” Electron ic
Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application
in Thermal Modeling,” Proceedings of Sem iTherm , San Diego, 1999, pp. 212 –220.
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor24
2.3 ESD Characteristics
Table 5. ESD Ratings1, 2
1All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits.
2A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device specification
requirements. Complete DC parametric and functional testing shall be performed per applicable device specification at room
temperature followed by hot temperature, unless specified otherwise in the device specification
Characteristic Symbol Value Unit
ESD for Human Body Model (HBM) 2000 V
HBM Circuit Description R1 1500 Ohm
C100 pF
ESD for Field Induced Charge Model (FDCM) 500 (all pins)
V
750 (corner pins)
Number of Pulses per pin:
Positive Pulses (HBM)
Negative Pulses (HBM)
—
—
1
1
—
—
Interval of Pulses — 1 second
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 25
2.4 DC Electrical Specifications
Table 6. DC Electrical Specifications
Num Characteristic Symbol Min Max Unit
1a C parts
Operating junction temperature range
Operating ambient temperature range1
TJ
TA
– 40
– 40
105
85
oC
oC
1b V parts
Operating junction temperature range
Operating ambient temperature range1
TJ
TA
– 40
– 40
120
105
oC
oC
1c M parts2
Operating junction temperature range
Operating ambient temperature range1
TJ
TA
– 40
– 40
145
125
oC
oC
2 5.0V Voltage Regulator Reference Voltage VDDR 4.5 5.25 V
3 5.0V Analog Supply Voltage VDDA 4.5 5.25 V
4 5.0V Flash Program/Erase Voltage 3VPP 4.5 5.25 V
5 3.3V – 5.0V External I/O Supply Voltage
VDDE14,5
VDDE24
VDDE34
3.0
3.0
3.0
5.5
5.5
5.5
V
6 Pad (SH/MH/IH) Input High Voltage VIH 0.65 VDDE VDDE + 0.3 V
7 Pad (SH/MH/IH) Input Low Voltage VIL VSS – 0.3 0.35 VDDE V
8 Pad (SH/MH/IH) Input Hysteresis VHYS 0.1 VDDE 0.2 VDDE V
9 Analog (AE/A) Input Voltage VINDC VSSA – 0.3 VDDA + 0.3
see note5
V
10 Slow/Medium I/O Output High Voltage
IOH = –1.0 mA
IOH = –0.2 mA
VOH
0.80 VDDE
0.95 VDDE
—
V
11 Slow/Medium I/O Output Low Voltage
IOL = 1.0 mA
IOH = 0.2 mA
VOL
—0.20 VDDE
0.05 VDDE
V
12 Input Capacitance (Digital Pins: Pad type MH,SH, IH with no A or AE) CIN —7pF
13 Input Capacitance (Analog Pins: Pad type A, AE, and AE+IH) CIN_A —10pF
14 Input Capacitance (Shared digital and analog pins: A with SH or MH) CIN_M —12pF
15 Slow/Medium I/O Weak Pull Up/Down Absolute Current 6IACT 10 170 A
16 I/O Input Leakage Current 7IINACT_D – 1.5 1.5 A
17 DC Injection Current (per pin) IIC – 2.0 2.0 mA
18 Analog Input Current, Channel Off 8 (Analog pins AE and AE+IH) IINACT_A – 200 200 nA
19 Analog Input Current (Shared digital and analog pins: A with SH or
MH)
IINACT_AD –1.5 1.5 A
20 VRH to VDDA Differential Voltage VRH – VDDA – 100 100 mV
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor26
21 VRL to VSSA Differential Voltage VRL – VSSA – 100 100 mV
22 VSS to VSSA Differential Voltage VSS – VSSA – 100 100 mV
23 VSSSYN to VSS Differential Voltage VSSSYN – VSS –50 50 mV
24 VDDR to VDDA Differential Voltage VDDR – VDDA – 100 100 mV
25 Slew rate on VDDA, VDDR, and VDDE power supply pins9Vramp 1 100 V/ms
26 Capactive Supply Load
VDD
VDD33
VDDSYN
Vload
800
200
200
—
—
nF
1Please refer to Section 2.2.1, “General Notes for Specifications at Maximum Junction Temperature” for more details about the
relation between ambient temperature TA and device junction temperature TJ.
2M parts can’t go above 66 MHz.
3VPP can drop to 0 volts during read-only operations and before entry to Sleep mode, to reduce power consumption.
4VDDE1, VDDE2, and VDDE3 are separate power segments and may be powered independently with no differential voltage
constraints between the power segments.
5If VDDE1 is below VDDA than the analog input limits (spec #9 (Analog (AE/A) Input Voltage) in Ta b l e 6 ) will be based on the
VDDE1 voltage level.
6Absolute value of current, measured at VIL and VIH.
7Weak pull up/down inactive. Measured at VDDE = 5.25 V. Applies to pad types: SH and MH.
8Maximum leakage occurs at maximum operating temperature. Leakage current decreases by approximately one-half for each
8 to 12 oC, in the ambient temperature range of 50 to 125 oC. Applies to pad types: A and AE.
9This applies to the ramp up rate from 0.3 volts to 3.0 volts.
Table 6. DC Electrical Specifications (continued)
Num Characteristic Symbol Min Max Unit
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 27
2.5 Operating Current Specifications
Table 7. Operating Currents
Num Characteristic Symbol Typ1
25C
Ambient
1Typ - Nominal voltage levels and functional activity. Max - Maximum voltage levels and functional activity.
Typ1
70C
Ambient
Max1
-40–145C
Junction
Unit
Equations ITOTAL = IDDE + IPP + IDDA + IDDR
IDDE = IDDE1 + IDDE2 + IDDE3
1V
DDE(1,2,3) Current
VDDE(1,2,3) @ 3.0V - 5.5V
Static2, or when in SLEEP or STOP
Dynamic3
2Static state of pins is when input pins are disabled or not being toggled and driven to a valid input level, output
pins are not toggling or driving against any current loads, and internal pull devices are disabled or not pulling
against any current loads.
3Dynamic current from pins is application specific and depends on active pull devices, switching outputs, output
capacitive and current loads, and switching inputs. Refer to Ta bl e 8 for more information.
IDDE
1
Note 3
3
Note 3
30
Note 3
µA
mA
2V
PP Current
VPP @ 0V (All modes)
VPP @ 5.25V
SLEEP mode
STOP mode
RUN mode
IPP
1
15
15
1
1
20
20
1
1
30
30
25
µA
µA
µA
mA
3V
DDA Current
VDDA @ 4.5V - 5.25V
RUN mode4
SLEEP/STOP5 mode with 32KIRC
SLEEP/STOP5 mode with 32KOSC
SLEEP/STOP5 mode with 16MIRC
4RUN mode is a typical application with the ADC, 16MIRC, 32KIRC running.
5SLEEP/STOP mode means that only the listed peripherals are on. All others are diabled.
IDDA
5
12
12
111
5
16
16
165
10
26
28
225
mA
µA
µA
µA
4V
DDR Current
VDDR@ 4.5V - 5.25V
SLEEP mode
with XOSC6 (additonal)
with RTC/API (additonal)
each 8K RAM block (additional)
STOP mode
with XOSC6 (additonal)
RUN mode (Using 16 MHz IRC)
RUN mode (Maximum @ 48 MHz)7
RUN mode (Maximum @ 66 MHz)8
RUN mode (Maximum @ 80MHz)9
6XOSC: optionally enabled in SLEEP and STOP modes (oscillator remains running from crystal but XOSC clock
output disabled).
7RUN mode condition includes PLL selected as source of system clock, XOSC enabled with 40MHz crystal, all
peripherals enabled, both cores running, and running a typical application using both SRAM and flash.
IDDR
20
500
1
0.8
170
500
30
50
105
120
25
600
1
7
600
600
35
75
110
130
360
900
3
45
1500
900
40
90
120
135
µA
µA
µA
µA
µA
µA
mA
mA
mA
mA
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor28
8RUN mode condition includes PLL selected as source of system clock, XOSC enabled with 40MHz crystal; all
peripheral and cores enabled and running a typical application using both SRAM and flash. Be sure to calculate
the junction temperature, as the maximum current at maximum ambient temperature can exceed the maximum
junction temperature.
9RUN mode condition includes PLL selected as source of system clock, XOSC enabled with 40MHz crystal, all
peripheral and cores enabled and running a typical application using both SRAM and flash. Only for 208
MAPBGA and only 120C junction or lower. Be sure to calculate the junction temperature, as the maximum current
at maximum ambient temperature can exceed the maximum junction temperature
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 29
2.6 I/O Pad Current Specifications
The power consumption of an I/O segment depends on the usage of the pins on a particular segment. The power consumption
is the sum of all output pin currents for a particular segment . The outp ut pi n current can be calculated from Table 8 based on
the voltage, frequency, and load on the pin. Use linear scaling to calculate pin currents for voltage, frequency, and load
parameters that fall outside the values given in Table 8.
Table 8. I/O Pad Average DC Current1
1These values are estimated from simulation and are not tested. Currents apply to output pins only.
Num Pad Type Symbol Frequency
(MHz)
Load2
(pF)
2All loads are lumped.
Voltage (V) Slew Rate
Control Current (mA)
1Slow
(Pad Type SH)
IDRV_SH 25 50 5.25 11 8.0
210505.25013.2
3 2 50 5.25 00 0.7
4 2 200 5.25 00 2.4
5Medium
(Pad Type MH)
IDRV_MH 50 50 5.25 11 17.3
620505.25016.5
7 3.33 50 5.25 00 1.1
8 3.33 200 5.25 00 3.9
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor30
2.7 Low Voltage Characteristics
Table 9. Low Voltage Monitors
Num Characteristic Symbol Min Typical Max Unit
1 Power-on-Reset Assert Level 1VPOR —0.70— V
2 Low Voltage Monitor 1.5V 1
Assert Level
De-assert Level
1Monitors VDD
VLV1 5 A
VLV15D
—
—
1.40
1.45
—
—
V
3 Low Voltage Monitor 3.3V 2
Assert Level
De-assert Level
2Monitors VDD33
VLV3 3 A
VLV33D
—
—
3.05
3.10
—
—
V
4 Low Voltage Monitor Synthesizer 3
Assert Level
De-assert Level
3Monitors VDDSYN
VLVSYNA
VLVSYND
—
—
3.05
3.10
—
—
V
5 Low Voltage Monitor 5.0V Low Threshold 4
Assert Level
De-assert Level
4Monitors VDDA
VLV5 L A
VLV5LD
3.30
3.35
3.35
3.40
3.40
3.45
V
6 Low Voltage Monitor 5.0V 4
Assert Level
De-assert Level
VLV5 A
VLV5 D
4.50
4.55
4.55
4.60
4.70
4.75
V
7 Low Voltage Monitor 5.0V High Threshold 4
Assert Level
De-assert Level
VLV5 H A
VLV5HD
4.70
4.75
4.75
4.80
4.80
4.85
V
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 31
2.8 Oscillators Electrical Characteristics
Table 10. 3.3V High Frequency External Oscillator
Num Characteristic Symbol Min.
Value
Max.
Value Unit
1 Frequency Range1
1Since this is an amplitude controlled oscillator the use of overtone oscillators is not recommended. Only use fundamental
frequency oscillators.
fref 4
2
2When PLL frequency modulation is active, reference frequencies less than 8MHz will distort the modulated waveform and the
effects of this on emissions is not characterized.
40 MHz
2 Duty Cycle of reference tdc 40 60 %
3 EXTAL Input High Voltage
External crystal mode 3
External clock mode
3This parameter is meant for those who do not use quartz crystals or resonators, but CAN osc, in crystal mode. In that case,
Vextal – Vxtal 400mV criteria has to be met for oscillator’s comparator to produce output clock.
VIHEXT
VXTAL + 0.4
0.65 x VDDSYN
VDDSYN + 0.3
VDDSYN + 0.3
V
4 EXTAL Input Low Voltage
External crystal mode 3
External clock mode
VILEXT
VDDSYN – 0.3
VDDSYN – 0.3
VXTAL – 0.4
0.35 x VDDSYN
V
5 XTAL Current 4
4Ixtal is the oscillator bias current out of the XTAL pin with both EXTAL and XTAL pins grounded.
IXTAL 26mA
6 Total On-chip stray capacitance on XTAL CS_XTAL —3pF
7 Total On-chip stray capacitance on EXTAL CS_EXTAL —3pF
8 Crystal manufacturer’s recommended
capacitive load
CLSee crystal
specification
See crystal
specification
pF
9 Discrete load capacitance to be connected
to EXTAL
CL_EXTAL —2CL – CS_EXTAL –
CPCB_EXTAL5
5CPCB_EXTAL and CPCB_XTAL are the measured PCB stray capacitances on EXTAL and XTAL, respectively
pF
10 Discrete load capacitance to be connected
to XTAL
CL_XTAL —2CL – CS_XTAL –
CPCB_XTAL5
pF
11 Startup Time tstartup —10ms
Table 11. 5V Low Frequency (32 kHz) External Oscillator
Num Characteristic Symbol Min.
Value
Max.
Value Unit
1 Frequency Range fref32 32 38 kHz
2 Duty Cycle of reference tdc32 40 60 %
3 XTAL32 Current 1
1Ixtal32 is the oscillator bias current out of the XTAL32 pin with both EXTAL32 and XTAL32 pins grounded.
IXTAL32 0.5 3 A
4 Crystal manufacturer’s recommended
capacitive load
CL32 See crystal
specification
See crystal
specification
pF
5 Startup Time tstartup —2s
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor32
Table 12. 5V High Frequency (16 MHz) Internal RC Oscillator
Num Characteristic Symbol Min Typ Max Unit
1Frequency before trim1
1Across process, voltage, and temperature
Fut 12.8 16 22.3 MHz
2Frequency after loading factory trim2
2Across voltage and temperature
Ft15.1 16 16.9 MHz
3Application trim resolution3
3Fixed voltage and temperature
Ts——
05%
4Application frequency trim step3Fs—300 —kHz
5 Start up time St— — 500 ns
Table 13. 5V Low Frequency (32 kHz) Internal RC Oscillator
Num Characteristic Symbol Min Typ Max Unit
1Frequency before trim1
1Across process, voltage, and temperature
Fut32 20.8 32.0 43.2 kHz
2Frequency after loading factory trim2
2Across voltage and temperature
Ft32 26 32.0 38 kHz
3Application trim resolution3
3Fixed voltage and temperature
Ts32 ——
2%
4Application frequency trim step3Fs32 —1—kHz
5 Start up time St32 — — 100 s
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 33
2.9 FMPLL Electrical Characteristics
Table 14. FMPLL Electrical Specifications 1
1VDDSYN = 3.0V to 3.6 V, VSSSYN = 0 V, TA = TL to TH
Num Characteristic Symbol Min.
Value
Max.
Value Unit
1 System frequency2
-40 oC TJ 120 oC
-40 oC TJ 145 oC
2The maximum value is without frequency modulation turned on. If frequency modulation is turned on, the maximum value
(average frequency) must be de-rated by the percentage of modulation enabled.
fsys
375
375
80000 3
66000
380 MHz is only available in the 208 pin package.
kHz
2 PLL Reference Frequency (output of predivider) fpllref 410MHz
3 VCO Frequency4
4Optimum performance is achieved with the highest VCO frequency feasible based on the highest ERFD that results in the desired
PLL frequency.
fvco 250 500 MHz
4 PLL Frequency 5
-40 oC TJ 120 oC
-40 oC TJ 145 oC
5The VCO frequency range is higher than the maximum allowable PLL frequency. The synthesizer control register 2’s enchanced
reduced frequency divider (FMPLL_SYNCR2[ERFD]) in enhanced operation mode must be programmed to divide the VCO
frequency within the PLL frequency range.
fpll
3
3
80 3
66
MHz
5 Loss of Reference Frequency 6
6Loss of reference frequency is the reference frequency detected by the PLL which then transitions into self clocked mode.
fLOR 100 1000 kHz
6 Self Clocked Mode Frequency 7
7Self clocked mode frequency is the frequency that the PLL operates at when the reference frequency falls below fLOR.
fSCM 13 35 MHz
7 PLL Lock Time 8
8This specification applies to the period required for the PLL to relock after changing the enhanced multiplication factor divider
(EMFD) bits in the synthesizer control register 1 (SYNCR1) in enhanced operation mode.
tlpll —750s
8 Frequency un-LOCK Range fUL – 4.0 4.0 % fsys
9 Frequency LOCK Range fLCK – 2.0 2.0 % fsys
10 CLKOUT Cycle-to-cycle Jitter,9, 10
9Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fsys.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the PLL circuitry via VDDSYN and VSSSYN and variation in crystal oscillator frequency increase the jitter percentage
for a given interval. CLKOUT divider set to divide-by-2.
10 Values are with frequency modulation disabled. If frequency modulation is enabled, jitter is the sum of Cjitter + Cmod.
Cjitter – 5 5 % fclkout
10a CLKOUT Jitter at 10 µs period 9,10, 11
11 The PLL % jitter reduces with more cycles. 10 µs was picked for a reference point for LIN (100 Kbits), slower speeds will have
even less % jitter.
Cjitter – 0.05 0.05 % fclkout
11 Frequency Modulation Depth 1% Setting 12,13
(fsysMax must not be exceeded)
12 Modulation depth selected must not result in fsys value greater than the fsys maximum specified value.
13 These depth ranges are obtained by filtering the raw cycle-to-cycle clock frequency data to eliminate the presence of the the
normal clock jitter riding on top of the FM waveform. The allowable modulation rates are 400 kHz to 1 MHz.
Cmod 0.5 2 %fsys
12 Frequency Modulation Depth 2% Setting 12,13
(fsysMax must not be exceeded)
Cmod 13%f
sys
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor34
2.10 eQADC Electrical Characteristics
Table 15. eQADC Conversion Specifications (Operating)
Num Characteristic Symbol Min Max Unit
1 ADC Clock (ADCLK) Frequency1
1Conversion characteristics vary with FADCLK rate. Reduced conversion accuracy occurs at maximum FADCLK rate. The
maximum value is based on 800KS/s and the minimum value is based on 20MHz oscillator clock frequency divided by a
maximum 16 factor.
FADCLK 112MHz
2 Conversion Cycles CC 14+2 (or 16) 14+128 (or 142) ADCLK
cycles
3 Stop Mode Recovery Time2
2The specified value is for the case when the 100nF capacitor is not connected to the REFBYPC pin. When the capacitor is
connected to the REFBPYC pin, the recovery time is 10ms.
TSR 20 — s
4 Resolution — 1.25 — mV
5 INL: 12 MHz ADC Clock3
3At VRH – VRL = 5.12 V, one lsb = 1.25 mV = one count.
INL12 — 10 Counts
6 DNL: 12 MHz ADC Clock3DNL12 — 10 Counts
7 Offset Error with Calibration3OFFWC — 10 Counts
8 Full Scale Gain Error with Calibration GAINWC — 10 Counts
9 Disruptive Input Injection Current 4, 5, 6, 7
4Below disruptive current conditions, the channel being stressed has conversion values of 0x3FF for analog inputs greater than
VRH and 0x000 for values less than VRL. This assumes that VRH VDDA and VRL VSSA due to the presence of the sample
amplifier. Other channels are not affected by non-disruptive conditions.
5Exceeding limit may cause conversion error on stressed channels and on unstressed channels. Transitions within the limit do
not affect device reliability or cause permanent damage.
6Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate
resistance values using VPOSCLAMP = VDDA + 0.5V and VNEGCLAMP = – 0.3 V, then use the larger of the calculated values.
7Condition applies to two adjacent pads on the internal pad.
IINJ —±1mA
10 Incremental Error due to injection current. All channels have
same 10k < Rs <100k8
Channel under test has Rs=10k,
IINJ=IINJMAX,IINJMIN
8At VRH – VRL = 5.12 V, one lsb = 1.25 mV = one count. This count error is in addition to the TUE count error.
EINJ — ±6 Counts
11 Total Unadjusted Error for single ended conversions with
calibration3, 9, 10, 11, 12
9The TUE specification will always be better than the sum of the INL, DNL, offset, and gain errors due to canceling errors.
10 TUE includes all internal device error such as internal reference variation (75% Ref, 25% Ref)
11 Depending on the customer input impedance, the Analog Input Leakage current (DC Electrical specification) may affect the
actual TUE measured on analog channels shared digital pins.
12 It is possible to see up to one additional count added for the 144 pin packages since the VRL and VRH functions are shared
with the VSSA and VDDA, respectively. On Analog pins above PA15, the accuracy effects from adjacent digital port pin activity
is application dependent because of frequency, level, noise, etc.
TUE — ±10 Counts
12 Source Impedance13
13 If RS is greater than 1 k Ohm, be sure to calculate the affect of pin leakage and use the proper sampling time, to ensure that
you get the accuracy required.
RS— 100k Ohm
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 35
2.11 Flash Memory Electrical Characteristics
Table 16. Flash Program and Erase Specifications1
1Typical program and erase times assume nominal supply values and operation at 25 oC.
Num Characteristic Symbol Min Typ Initial
Max2
2Initial factory condition: 100program/erase cycles, nomial supply values and operation at 25 oC.
Max3
3The maximum time is at worst case conditions after the specified number of program/erase cycles. This maximum value is
characterized but not guaranteed.
Unit
1 Double Word (64 bits) Program Time 4
4This does not include software overhead.
Tdwprogram — 10 — 500 s
2 Page (128 bits) Program Time 4Tpprogram — 15 44 500 s
3 16 Kbyte Block Pre-program and Erase Time T16kpperase — 325 525 5000 ms
4 64 Kbyte Block Pre-program and Erase Time T64kpperase — 525 675 5000 ms
5 128 Kbyte Block Pre-program and Erase Time T128kpperase — 675 1800 7500 ms
6 Minimum operating frequency for program and erase
operations
—25———MHz
7 Wait States Relative to System Frequency
PFCRPn[RWSC] = 0b000; PFCRPn[WWSC] = 0b01
PFCRPn[RWSC] = 0b001; PFCRPn[WWSC] = 0b01
PFCRPn[RWSC] = 0b010; PFCRPn[WWSC] = 0b01
Trwsc
—
—
—
—
—
—
—
—
—
25
50
80
MHz
8Recovery Time
Stop mode exit or STOP bit negated
Sleep mode exit (with CRP_RECPTR[FASTREC]=1) 5
5If CRP_RECPTR[FASTREC]=0, then hardware will wait 2340 system clocks before exiting from Sleep mode to account for the
flash recovery time. The default system clock source after Sleep is the 16MIRC. A nominal frequency of 16MHz equates to a
hardware wait of 146s.
Trecover
—
—
—
—
—
—
20
120
s
s
Table 17. Flash EEPROM Module Life (Full Temperature Range)
Num Characteristic Symbol Min Typical1
1Typical endurance is evaluated at 25C. Product qualification is performed to the minimum specification. For additional
information on the Freescale definition of Typical Endurance, please refer to Engineering Bulletin EB619 “Typical Endurance
for Nonvolatile Memory.”
Unit
1 Number of Program/Erase cycles per block over the operating
temperature range (TJ)
16 Kbyte and 64 Kbyte blocks
128 Kbyte blocks
P/E
100,000
1000
—
100,000
cycles
2 Data retention
Blocks with 0 – 1,000 P/E cycles
Blocks with 1,001 – 100,000 P/E cycles
Retention
20
5
—years
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor36
2.12 Pad AC Specifications
Figure 5. Pad Output Delay
Table 18. Pad AC Specifications (VDDE = 3.0V - 5.5V)1
1These are worst case values that are estimated from simulation and not tested. The values in the table are simulated at VDDE
= 3.0V to 5.5V, TA = TL to TH.
Num Pad Type SRC Out Delay2, 3
(ns)
2This parameter is supplied for reference and is not tested. Add a maximum of one system clock to the output delay for delay
with respect to system clock.
3Delay and rise/fall are measured to 20% or 80% of the respective signal.
Rise/Fall3, 4
(ns)
4This parameter is guaranteed by characterization before qualification rather than 100% tested.
Load Drive
(pF)
1 Slow (SH) 11 39 23 50
120 87 200
01 101 52 50
188 111 200
00 507 248 50
597 312 200
2 Medium (MH) 11 23 12 50
64 44 200
01 50 22 50
90 50 200
00 261 123 50
305 156 200
4 Pull Up/Down (3.6V max) — — 7500 50
5 Pull Up/Down (5.5V max) — — 9500 50
VDD/2
VOH
VOL
Rising
Edge
Out
Delay
Falling
Edge
Out
Delay
Pad
Internal Data Input Signal
Pad
Output
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 37
2.13 AC Timing
2.13.1 Reset and Boot Configuration Pins
Figure 6. Reset and Boot Configuration Timing
2.13.2 External Interrupt (IRQ) and Non-Maskable Interrupt (NMI) Pins
Figure 7. IRQ and NMI Timing
Table 19. Reset and Boot Configuration Timing
Num Characteristic Symbol Min Max Unit
1 RESET Pulse Width tRPW 150 — ns
2 BOOTCFG Setup Time after RESET Valid tRCSU —100s
3 BOOTCFG Hold Time from RESET Valid tRCH 0—s
Table 20. IRQ/NMI Timing
Num Characteristic Symbol Min Max Unit
1 IRQ/NMI Pulse Width Low tIPWL 3—t
SYS
2 IRQ/NMI Pulse Width High TIPWH 3—t
SYS
3 IRQ/NMI Edge to Edge Time1
1Applies when IRQ/NMI pins are configured for rising edge or falling edge events, but not both.
tICYC 6—t
SYS
1RESET
3
BOOTCFG
2
IRQ/NMI
1,2 1,2
3
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor38
2.13.3 JTAG (IEEE 1149.1) Interface
Figure 8. JTAG Test Clock Input Timing
Table 21. JTAG Interface Timing1
1These specifications apply to JTAG boundary scan only. JTAG timing specified at VDDE = 3.0V to 5.5V, TA = TL to TH, and CL
= 30pF with SRC = 0b11.
Num Characteristic Symbol Min Max Unit
1TCK Cycle Time t
JCYC 100 — ns
2 TCK Clock Pulse Width (Measured at VDDE/2) tJDC 40 60 ns
3 TCK Rise and Fall Times (40% – 70%) tTCKRISE —3ns
4 TMS, TDI Data Setup Time tTMSS, tTDIS 5—ns
5 TMS, TDI Data Hold Time tTMSH, tTDIH 25 — ns
6 TCK Low to TDO Data Valid tTDOV —20ns
7 TCK Low to TDO Data Invalid tTDOI 0—ns
8 TCK Low to TDO High Impedance tTDOHZ —20ns
9 JCOMP Assertion Time tJCMPPW 100 — ns
10 JCOMP Setup Time to TCK Low tJCMPS 40 — ns
11 TCK Falling Edge to Output Valid tBSDV —50ns
12 TCK Falling Edge to Output Valid out of High Impedance tBSDVZ —50ns
13 TCK Falling Edge to Output High Impedance tBSDHZ —50ns
14 Boundary Scan Input Valid to TCK Rising Edge tBSDST 50 — ns
15 TCK Rising Edge to Boundary Scan Input Invalid tBSDHT 50 — ns
TCK
1
2
3
3
2
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 39
Figure 9. JTAG Test Access Port Timing
Figure 10. JTAG JCOMP Timing
TCK
4
5
6
78
TMS, TDI
TDO
TCK
JCOMP
9
10
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor40
Figure 11. JTAG Boundary Scan Timing
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 41
2.13.4 Nexus Debug Interface
Figure 12. Nexus Output Timing
Table 22. Nexus Debug Port Timing1
1JTAG specifications in this table apply when used for debug functionality. All Nexus timing relative to MCKO is measured from
50% of MCKO and 50% of the respective signal. Nexus timing specified at VDDE = 3.0V to 5.5V, TA = TL to TH, and CL = 30pF
with SRC = 0b11.
Num Characteristic Symbol Min Max Unit
1 MCKO Cycle Time tMCYC 40 — ns
2 MCKO Duty Cycle tMDC 40 60 %
3 MCKO Low to MDO Data Valid2
2MDO, MSEO, and EVTO data is held valid until next MCKO low cycle.
tMDOV –2 4.0 ns
4 MCKO Low to MSEO Data Valid2tMSEOV –2 4.0 ns
5 MCKO Low to EVTO Data Valid2tEVTOV –2 4.0 ns
6 EVTI Pulse Width tEVTIPW 4.0 — tTCYC
7 EVTO Pulse Width tEVTOPW 1t
MCYC
8 TCK Cycle Time3
3The system clock frequency needs to be three times faster that the TCK frequency.
tTCYC 40 — ns
9 TCK Duty Cycle tTDC 40 60 %
10 TDI, TMS Data Setup Time tNTDIS, tNTMSS 8—ns
11 TDI, TMS Data Hold Time tNTDIH, tNTMSH 4—ns
12 TCK Low to TDO Data Valid tJOV 08ns
1
2
3
4
5
MCKO
MDO
MSEO
EVTO
Output Data Valid
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor42
Figure 13. Nexus TDI, TMS, TDO Timing
TDO
10
11
TMS, TDI
12
TCK
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 43
2.13.5 External Bus Interface (EBI)
Figure 14. CLKOUT Timing
Table 23. External Bus Operation Timing1
1EBI timing specified at VDDE = 3.0V to 5.5V, TA = TL to TH, and CL = 50pF with SIU_PCRn[SRC] = 0b11.
Num Characteristic Symbol Min Max Unit
1 CLKOUT Period2
2Initialize SIU_ECCR[EBDF] to meet maximum external bus frequency.
TC40.0 — ns
2 CLKOUT duty cycle tCDC 45% 55% TC
3 CLKOUT rise time tCRT ——
3
3Refer to Medium High Voltage (MH) pad AC specification in Ta b l e 1 8 .
ns
4 CLKOUT fall time tCFT ——
3ns
5 CLKOUT Positive Edge to Output Signal Invalid or High Z (Hold Time) tCOH 2.0 — ns
6 CLKOUT Positive Edge to Output Signal Valid (Output Delay) tCOV — 10.0 ns
7 Input Signal Valid to CLKOUT Posedge (Setup Time) tCIS 20.0 — ns
8 CLKOUT Posedge to Input Signal Invalid (Hold Time) tCIH 0—ns
9 ALE Pulse Width High Time tALEPWH 20 — ns
10 ALE Fall to AD Invalid tALEAD 2—ns
1
2
2
3
4
CLKOUT
VDDE/2
Vol_f
Voh_f
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor44
Figure 15. Synchronous Output Timing
6
5
5
CLKOUT
BUS
5
OUTPUT
SIGNAL
OUTPUT
VDDE/2
VDDE/2
VDDE/2
VDDE/2
6
5
VDDE/2
6
AD[0:31]
BDIP
CS[0:3]
OE
RD_WR
TA
TEA
TS
WE[0:3]
ADDR[8:15]
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 45
Figure 16. Synchronous Input Timing
7
8
CLKOUT
INPUT
BUS
7
8
INPUT
SIGNAL
VDDE/2
VDDE/2
VDDE/2
AD[0:31]
RD_WR
TA
TEA
TS
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor46
Figure 17. Address Latch Enable (ALE) Timing
2.13.6 Enhanced Modular I/O Subsystem (eMIOS)
Table 24. eMIOS Timing
Num Characteristic Symbol Min Max Unit
1 eMIOS Input Pulse Width tMIPW 4—t
CYC
2 eMIOS Output Pulse Width tMOPW 1—t
CYC
10
CLKOUT
VDDE/2
VDDE/2
AD[0:31]
TS
9
VDDE/2
ALE
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 47
2.13.7 Deserial Serial Peripheral Interface (DSPI)
Table 25. DSPI Timing1
1DSPI timing specified at VDDE = 3.0V to 5.5V, TA = TL to TH, and CL = 50pF with SRC = 0b11.
Num Characteristic Symbol
66 MHz
Unit
Min Max
1 SCK Cycle TIme2,3
2The minimum SCK Cycle Time restricts the baud rate selection for given system clock rate. These numbers are calculated
based on two MPC55xx devices communicating over a DSPI link.
3The actual minimum SCK Cycle Time is limited by pad performance.
tSCK 60 — ns
2 PCS to SCK Delay4
4The maximum value is programmable in DSPI_CTARx[PSSCK] and DSPI_CTARx[CSSCK]
tCSC 20 — ns
3 After SCK Delay5
5The maximum value is programmable in DSPI_CTARx[PASC] and DSPI_CTARx[ASC]
tASC 20 — ns
4 SCK Duty Cycle tSDC tSCK/2
–2ns
tSCK/2
+ 2ns
ns
5Slave Access Time
(SS active to SOUT driven)
tA—25 ns
6 Slave SOUT Disable Time
(SS inactive to SOUT High-Z or invalid)
tDIS —25 ns
7 PCSx to PCSS time tPCSC 4—ns
8PCSS to PCSx time tPASC 5—ns
9 Data Setup Time for Inputs
Master (MTFE = 0)
Slave
Master (MTFE = 1, CPHA = 0)6
Master (MTFE = 1, CPHA = 1)
6This number is calculated assuming the SMPL_PT bit field in DSPI_MCR is set to 0b10.
tSUI
35
5
5
35
—
—
—
—
ns
ns
ns
ns
10 Data Hold Time for Inputs
Master (MTFE = 0)
Slave
Master (MTFE = 1, CPHA = 0)6
Master (MTFE = 1, CPHA = 1)
tHI
–4
10
26
–4
—
—
—
—
ns
ns
ns
ns
11 Data Valid (after SCK edge)
Master (MTFE = 0)
Slave
Master (MTFE = 1, CPHA=0)
Master (MTFE = 1, CPHA=1)
tSUO
—
—
—
—
15
35
30
15
ns
ns
ns
ns
12 Data Hold Time for Outputs
Master (MTFE = 0)
Slave
Master (MTFE = 1, CPHA = 0)
Master (MTFE = 1, CPHA = 1)
tHO
–15
5.5
0
–15
—
—
—
—
ns
ns
ns
ns
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor48
Figure 18. DSPI Classic SPI Timing — Master, CPHA = 0
Figure 19. DSPI Classic SPI Timing — Master, CPHA = 1
Data Last Data
First Data
First Data Data Last Data
SIN
SOUT
PCSx
SCK Output
4
9
12
1
11
10
4
SCK Output
(CPOL=0)
(CPOL=1)
3
2
Data Last Data
First Data
SIN
SOUT
12 11
10
Last Data
Data
First Data
SCK Output
SCK Output
PCSx
9
(CPOL=0)
(CPOL=1)
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 49
Figure 20. DSPI Classic SPI Timing — Slave, CPHA = 0
Figure 21. DSPI Classic SPI Timing — Slave, CPHA = 1
Last Data
First Data
3
4
1
Data
Data
SIN
SOUT
SS
4
5 6
9
11
10
12
SCK Input
First Data Last Data
SCK Input
2
(CPOL=0)
(CPOL=1)
5 6
9
12
11
10
Last Data
Last Data
SIN
SOUT
SS
First Data
First Data
Data
Data
SCK Input
SCK Input
(CPOL=0)
(CPOL=1)
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor50
Figure 22. DSPI Modified Transfer Format Timing — Master, CPHA = 0
Figure 23. DSPI Modified Transfer Format Timing — Master, CPHA = 1
PCSx
3
1
4
10
4
9
12 11
SCK Output
SCK Output
SIN
SOUT
First Data Data Last Data
First Data Data Last Data
2
(CPOL=0)
(CPOL=1)
PCSx
10
9
12 11
SCK Output
SCK Output
SIN
SOUT
First Data Data Last Data
First Data Data Last Data
(CPOL=0)
(CPOL=1)
Electrical Characteristics
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 51
Figure 24. DSPI Modified Transfer Format Timing — Slave, CPHA = 0
Figure 25. DSPI Modified Transfer Format Timing — Slave, CPHA = 1
Figure 26. DSPI PCS Strobe (PCSS) Timing
Last Data
First Data
3
4
1
Data
Data
SIN
SOUT
SS
4
5 6
9
11
10
SCK Input
First Data Last Data
SCK Input
2
(CPOL=0)
(CPOL=1)
12
5 6
9
12
11
10
Last Data
Last Data
SIN
SOUT
SS
First Data
First Data
Data
Data
SCK Input
SCK Input
(CPOL=0)
(CPOL=1)
PCSx
78
PCSS
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Package Information
Freescale Semiconductor52
3 Package Information
The latest package outline drawings are avail a ble on the prod uct summary pages on our web site:
http://www.freescale.com/powerpc. The following table lists the package case number per device. Use these numbers in the web
page’s “keyword” search engine to find the latest package outline drawings.
4 Product Documentation
Documentation is available from a local Freescale distributor, a Freescale sales office, the Freescale Literature Distribution
Center, or through the Freescale world-wide web address at http://www.freescale.com/powerpc.
Table 26. Package Information
Package Package Case Number
144 LQFP 98ASS23177W
176 LQFP 98ASS23479W
208 MAPBGA 98ARS23882W
Product Documentation
MPC5510 Microcontroller Family Data Sheet, Rev. 4
Freescale Semiconductor 53
4.1 Revision History
Table 27 summarizes revisions to this docum ent.
Table 27. Revision History of MPC5510 Data Sheet
Revision Date Substantive Changes
Rev. 0 9/2007 Initial Release. Preliminary content.
Rev. 1 6/2008 (Note: Change descriptions refer to locations in Rev. 0.)
Changed MPC5516 to MPC5510 Family where appropriate.
Modified Figure 1. MPC5510 Family Block Diagram.
Deleted Table 1. MPC5510 Family Comparison, Maximum Feature Set
Deleted Table 2. MPC5510 Peripheral Multiplexing Examples
Corrected PK0 and PK1 pin assignments on 208 MAPBGA (Table 3 and Figure 4).
Modified Table 4, footnote 4.
Modified Table 8. DC Electrical Specifications and table footnotes.
Modified Table 9. Operating Currents and table footnotes.
Modified Table 12. 3.3V High Frequency External Oscillator, row 5.
Modified Table 14. 5V High Frequency (16 MHz) Internal RC Oscillator, row 2.
Modified Table 16. FMPLL Electrical Specifications, row 4.
Modified Table 17. eQADC Conversion Specifications (Operating) and table footnotes.
Modified Table 18. Flash Program and EraseSpecifications, row 5.
Modified Table 19. Flash EEPROM Module Life (Full Temperature Range), row 1
Modified Table 28. Package Information.
Rev. 2 12/2008 (Note: Change descriptions refer to locations in Rev. 1.)
Modified Table 1. MPC5510 Signal Properties: added note to TEST signal.
Modified Table 6. DC Electrical Specifications: rows 1b, 5, 8, 9, 10, 11, 16, 19, 25, and footnotes.
Modified Table 7. Operating Currents: Max column header, rows 1, 2, 3, 4, and footnotes.
Modified Table 9. Low Voltage Monitors: rows 2, 3, 4, 6.
Modified Table 10. 3.3V High Frequence External Oscillator: row 1 added footnote, removed
duplicate footnote #3.
Modified Table 11. 5V Low Frequency (32 kHz) External Oscillator: row 1.
Modified Table 12. 5V High Frequency (16 MHz) Internal RC Oscillator: row 2.
Modified Table 13. 5V Low Frequency (32 kHz) Internal RC Oscillator: row 2.
Modified Table 14. FMPLL Electrical Specifications: rows 1 and 4; added two new rows.
Modified Table 15. eQADC Conversion Specifications (Operating): rows 5, 6, 7, 8, 10, 11, and
footnotes.
Modified Figure 5. Pad Output Delay: moved the dashed horizontal line up so that it crosses the
signal midway between top and bottom.
Rev. 3 3/2009 (Note: Change descriptions refer to locations in Rev. 2.)
Modified Table 4. Thermal Characteristics: all values in 208 MAPBGA column.
Modified Table 6. DC Electrical Specifications: spec #1c, added footnote; spec #25, added
footnote.
Modified Table 7. Operating Currents; spec #5.
Modified Table 9. Low Voltage Monitors; spec #1.
Modified Table 14. FMPLL Electrical Specifications: updated footnote 3; added spec #10a.
Modified Table 15. eQADC Conversion Specifications (Operating): added another footnote.
Modified Table 16: Flash Program and Erase Specifications: updated spec #7.
Modified Figure 5: Pad Output Delay: adjusted lower timing diagram.
Modified Figure 8: JTAG Test Clock Input Timing; updated so that it matches the spec definitions.
Rev. 4 7/2014 Updated the VCO Min. value from 192 to 250 MHz in Table 14., “FMPLL Electrical Specifications.
Document Number: MPC5510
Rev. 4
7/2014
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