XBB170 Dual Single-Pole, Normally Closed OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 100 50 Units VP mArms / mADC Features * * * * * * * * * * Description XBB170 is a dual 350V, 100mA, 50, normally closed (1-Form-B) relay that features low on-resistance. Using optically coupled MOSFET technology, it provides 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. 3750Vrms Input/Output Isolation Low Drive Power Requirements High Reliability Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount, Tape & Reel Version Available Dual single-pole OptoMOS relays provide a more compact design solution than discrete single-pole relays in a variety of applications. The dual relay configuration saves board space by incorporating both relays in a single 8-pin package. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: Certificate available on our website Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment-Patient/Equipment Isolation * Security * Aerospace * Industrial Controls Ordering Information Part # XBB170 XBB170P XBB170PTR XBB170S XBB170STR Description 8-Pin DIP (50/Tube) 8-Pin Flatpack (50/Tube) 8-Pin Flatpack (1000/Reel) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration + Control - Switch #1 - Control - Switch #1 + Control - Switch #2 - Control - Switch #2 AC/DC Configuration 1 8 2 7 3 6 4 5 Load - Switch #1 Load - Switch #1 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-XBB170-R05 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION XBB170 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / C Derate linearly 6.67 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous, AC/DC Configuration 1 Peak On-Resistance, AC/DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Symbol Min Typ Max Units t=10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 33 - 100 350 50 1 mArms / mADC mAP IF=5mA, VL=50V, f=1MHz ton toff COUT - 25 5 5 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.2 - 5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF IF=5mA, VL=10V A ms pF If both poles operate simultaneously, then the load current must be derated so as not to exceed the package power dissipation value. www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION XBB170 PERFORMANCE DATA* 25 20 15 10 5 1.17 15 10 5 Device Count (N) 15 10 5 0 0.75 0.83 0.91 0.99 1.06 Turn-On Time (ms) 0.50 0.56 0.62 0.69 LED Current (mA) 0.75 15 10 5 0.14 0.17 0.19 0.22 Turn-Off (ms) 0.25 0.28 Typical On-Resistance Distribution (N=50, IL=100mADC) 20 15 10 5 0 0.81 0.44 Device Count (N) 5 25 20 25 10 0.11 0 0.44 15 1.14 Typical IF for Switch Dropout (N=50, IL=100mADC) 25 20 20 0 0.67 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=100mADC) 25 Device Count (N) 20 0 0 Typical Turn-Off Time (N=50, IL=100mADC) 25 Device Count (N) Device Count (N) Device Count (N) 30 25 Typical Turn-On Time (N=50, IL=100mADC) Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) 0.50 0.56 0.62 0.69 LED Current (mA) 0.75 0.81 30.59 31.36 32.13 32.90 33.66 34.43 35.20 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=5mA) 20 15 10 5 0 424.0 429.3 434.5 439.7 444.9 450.1 455.4 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=100mADC) 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 80 Temperature (C) 100 120 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 Typical Turn-Off Time vs. LED Forward Current (IL=100mADC) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION XBB170 1.8 1.2 1.0 IF=20mA 0.6 0.4 0 20 40 60 80 Temperature (C) 100 0 -40 120 2 1 0 -40 -20 0 20 40 60 80 Temperature (C) 4 3 2 -40 100 120 120 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 450 120 100 80 60 40 20 0 0 20 40 60 Temperature (C) 80 100 120 -20 0 20 40 60 80 Temperature (C) 100 120 20 40 60 80 Temperature (C) 100 120 -4 -3 -2 -1 0 1 Load Voltage (V) 2 3 4 0.016 0.014 445 440 435 430 0.012 0.010 0.008 0.006 0.004 425 0.002 420 -40 0 Typical Leakage vs. Temperature Measured across Pins 4&6 Leakage (PA) Blocking Voltage (VP) 455 140 -20 Typical Blocking Voltage vs. Temperature (IF=5mADC) Maximum Load Current vs. Temperature 160 -20 Typical Load Current vs. Load Voltage 0 -40 20 100 120 20 40 60 80 Temperature (C) 1 0 30 Load Current (mA) 3 40 0 -20 5 4 50 10 Typical IF for Switch Dropout vs. Temperature (IL=100mADC) 6 LED Current (mA) LED Current (mA) IF=10mA 0.8 5 Load Current (mA) 60 1.4 0.2 -20 Typical On-Resistance vs. Temperature (IL=100mADC) 70 IF=5mA 1.6 Typical IF for Switch Operation vs. Temperature (IL=100mADC) 6 Typical Turn-Off Time vs. Temperature (IL=100mADC) On-Resistance (:) 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -40 Typical Turn-On Time vs. Temperature (IL=100mADC) Turn-Off Time (ms) Turn-On Time (ms) PERFORMANCE DATA* -40 -20 0 20 40 60 Temperature (C) 80 100 10s 100s 0 -40 -20 0 20 40 60 Temperature (C) 80 100 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION XBB170 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification XBB170 / XBB170S / XBB170P MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles XBB170 XBB170S XBB170P 250C 250C 260C 30 seconds 30 seconds 30 seconds 1 3 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION XBB170 Mechanical Dimensions XBB170 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 0.127 (0.100 0.005) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) Pin 1 PCB Hole Pattern 7.620 0.254 (0.300 0.010) 3.302 0.051 (0.130 0.002) 0.457 0.076 (0.018 0.003) 7.620 0.127 (0.300 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 7.620 0.127 (0.300 0.005) 0.254 0.0127 (0.010 0.0005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) XBB170S 9.652 0.381 (0.380 0.015) 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) Pin 1 3.302 0.051 (0.130 0.002) 0.635 0.127 (0.025 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 0.65 (0.0255) 4.445 0.127 (0.175 0.005) Dimensions mm (inches) 0.813 0.102 (0.032 0.004) XBB170P 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 0 MIN / 0.102 MAX (0 MIN / 0.004 MAX) 9.398 0.127 (0.370 0.005) Pin 1 9.652 0.381 (0.380 0.015) 7.620 0.254 (0.300 0.010) 2.286 MAX. (0.090 MAX.) 2.54 (0.10) 0.635 0.127 (0.025 0.005) 0.203 0.013 (0.008 0.0005) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 2.159 0.025 (0.085 0.001) 0.457 0.076 (0.018 0.003) 0.864 0.120 (0.034 0.004) 6 PCB Land Pattern Dimensions mm (inches) www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION XBB170 XBB170STR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=16.00 (0.63) Bo=10.30 (0.406) K0 =4.90 (0.193) Ao=10.30 (0.406) K1 =4.20 (0.165) Embossed Carrier Embossment P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 XBB170PTR Tape & Reel 2.00 (0.079) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) Embossment W = 16.00 (0.63) 7.50 (0.295) Bo = 10.30 (0.406) K0 = 2.70 (0.106) K1 = 2.00 (0.079) Embossed Carrier 4.00 (0.157) Ao = 10.30 (0.406) P1 = 12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-XBB170-R05 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/28/2018