1#
Product Family Data Sheet Rev. 1.1 2016.04.15
High Voltage LED Series
Chip on Board
LC026B
Gen.2
High efficacy COB LED package
well-suited for use in spotlight applications
Featur
es & Benefits
• Chip on Board (COB) solution makes it easy to design in
• Simple assembly reduces manufacturing cost
• Low thermal resistance
• InGaN/GaN MQW LED with long time reliability
• Completed 6,000 hours of LM-80 Testing
• ENEC certified: Integral LED Module
Applications
• Spotlight / Downlight
• LED Retrofit Bulbs
• Outdoor Illumination
2
Table of Contents
1. Characteristics ----------------------- 3
2. Product Code Information ----------------------- 6
3. Typical Characteristics Graphs ----------------------- 13
4. Outline Drawing & Dimension ----------------------- 18
5. Reliability Test Items & Conditions ----------------------- 19
6. Label Structure ----------------------- 20
7. Packing Structure ----------------------- 22
8. Precautions in Handling & Use ----------------------- 25
3
1. Characteristics
a) Absolute Maximum Rating
Item Symbol Rating Unit Condition
Ambient / Operating Temperature Ta -40 ~ +105 ºC -
Storage Temperature Tstg -40 ~ +120 ºC -
LED Junction Temperature Tj 150 ºC -
Case Temperature Tc 105 ºC *Note
Forward Current IF 1300 mA -
Power Dissipation PD 48.1 W -
ESD (HBM) - ±2 kV -
ESD (MM) - ±0.5 kV -
b) Electro-optical Characteristics (IF = 720 mA, Ta = 25 ºC)
Item Unit Rank Min. Typ. Max.
Forward Voltage (VF) V YH 32.5 35.5 38.5
Color Rendering Index (Ra) -
3 70 - -
5 80 - -
7 90 - -
8 95
Thermal Resistance (junction to chip point) ºC/W - 0.9 -
Beam Angle º
- 115 -
Nominal Power W 25.6
Eye Protection
Risk 1 - -
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = Ta = 25 °C)
2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1
3) Max Tc=105 ℃ (at max current) is for ENEC condition. Refer to the derating curve, ‘3. Typical Characteristics Graph’
designed within the range.
4
c) Luminous Flux Characteristics (IF = 720 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux
Bin
Sorting1) @ Tc = 25 °C (lm)
Calculated Flux2) @ Tc = 85 °C (lm)
Min. Max. Min. Max.
70
3000 3F 31 3266 3711 2939 3340
32 3711 4157 3340 3741
4000 3F 31 3429 3897 3086 3507
32 3897 4365 3507 3928
5000 3F 31 3462 3934 3116 3541
32 3934 4406 3541 3965
80
2700 2G 32 3550 3760 3231 3422
33 3760 3970 3422 3613
2H 33 3760 3970 3422 3613
3000 2G 31 3550 3770 3231 3431
32 3770 3990 3431 3631
2H 32 3770 3990 3431 3631
3500 2G 31 3660 3880 3331 3531
32 3880 4100 3531 3731
2H 32 3880 4100 3531 3731
4000 2G 31 3770 4000 3431 3640
32 4000 4230 3640 3849
2H 32 4000 4230 3640 3849
5000 2G 35 3820 4050 3476 3686
36 4050 4280 3686 3895
2H 36 4050 4280 3686 3895
5700 2G 35 3820 4050 3476 3686
36 4050 4280 3686 3895
2H 36 4050 4280 3686 3895
5
c) Luminous Flux Characteristics (IF = 720 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux
Bin Sorting1) @ Tc = 25 °C (lm) Calculated Flux2) @ Tc = 85 °C (lm)
Min. Max. Min. Max.
90
2700 2G 24 2815 3050 2562 2776
25 3050 3380 2776 3076
3000 2G 24 2870 3110 2612 2830
25 3110 3440 2830 3130
3500 2G 24 2955 3200 2689 2912
25 3200 3530 2912 3212
4000 2G 24 3035 3285 2762 2989
25 3285 3615 2989 3290
95
2700 2F 21 2321 2578 2112 2346
22 2578 2836 2346 2581
3000 2F 21 2392 2658 2177 2419
22 2658 2924 2419 2661
3500 2F 21 2440 2711 2221 2467
22 2711 2983 2467 2714
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = T a = 25 °C)
2) Calculated flux values are for reference only
3) Samsung maintains measurement toleran ce of: luminous flux = ±7 %, CRI = ±1
6
2. Product Code Information
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
S P H C W 1 H D N C 2 5 Y H R T 3 F
Digit PKG Information Code Specification
1 2 3 Samsung Package High Power SPH
4 5 Color WW Warm White (T/U/V/W Ranks)
CW Cool White (Q/R Ranks)
6 Product Version 1
7 8 Form Factor HD COB
9 Lens Type N No lens
10 Internal Code C LC026
11 Chip Type 2
12 CRI & Sorting Temperature
3 Min. 70
25 °C
5 Min. 80
7 Min. 90
8 Min 95
13 14 Forward Voltage (V) YH 32.5~38.5
15 CCT (K)
W 2700 K
Bin
Code:
WA,WB
(MacAdam Ellipse)
V 3000 K VA, VB
(MacAdam Ellipse)
VW, VX, VY, VZ
(ANSI bin)
U 3500 K UA, UB
(
MacAdam Ellipse)
T 4000 K TA, TB
(MacAdam Ellipse)
TW, TX , TY, TZ
(ANSI bin)
R 5000 K RA
(MacAdam Ellipse)
RW, RX, RY, RZ
(ANSI bin)
Q 5700 K
Q
W, QX, QY, QZ (ANSI bin)
16 MacAdam / ANSI
2 MacAdam 2-step
3 MacAdam 3-step
T ANSI bin
17 18 Lum i no us Flu x
2F
Bin
Code:
21, 22 (95 CRI)
2G 31, 32, 33, 35, 36 (80 CRI); 24, 25 (90 CRI)
2H 32, 33, 36 (80 CRI)
3F 31, 32 (70 CRI)
7
a) Binning Structure (IF = 720 mA , Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K) Product Code VF
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
70
3000 SPHWW1HDNC23YHVT3F YH VT VW, VX
VY, VZ 3F
31
32
4000 SPHWW1HDNC23YHTT3F YH TT TW, TX
TY, TZ 3F
31
32
5000 SPHCW1HDNC23YHRT3F YH RT RW, RX
RY, RZ 3F
31
32
80
2700
SPHWW1HDNC25YHW22G YH W2 WB 2G
32
33
SPHWW1HDNC25YHW32G YH W3 WA, WB 2G
32
33
SPHWW1HDNC25YHW22H
YH
W2
WB
2H
33
SPHWW1HDNC25YHW32H
YH
W3
WA, WB
2H
33
3000
SPHWW1HDNC25YHV22G YH V2 VB 2G
31
32
SPHWW1HDNC25YHV32G YH V3 VA, VB 2G
31
32
SPHWW1HDNC25YHV22H
YH
V2
VB
2H
32
SPHWW1HDNC25YHV32H
YH
V3
VA, VB
2H
32
3500
SPHWW1HDNC25YHU22G YH U2 UB 2G
31
32
SPHWW1HDNC25YHU32G YH U3 UA, UB 2G
31
32
SPHWW1HDNC25YHU22H
YH
U2
UB
2H
32
SPHWW1HDNC25YHU32H
YH
U3
UA, UB
2H
32
4000
SPHWW1HDNC25YHT22G YH T2 TB 2G
31
32
SPHWW1HDNC25YHT32G YH T3 TA, TB 2G
31
32
SPHWW1HDNC25YHT22H
YH
T2
TB
2H
32
SPHWW1HDNC25YHT32H
YH
T3
TA, TB
2H
32
5000
SPHCW1HDNC25YHR32G YH R3 RA 2G
35
36
SPHCW1HDNC25YHRT2G YH RT RW, RX,
RY, RZ 2G
35
36
SPHCW1HDNC25YHR32H
YH
R3
RA
2H
36
SPHCW1HDNC25YHRT2H YH RT RW, RX,
RY, RZ 2H 36 4050 ~ 4280
5700
SPHCW1HDNC25YHQT2G YH QT QW, QX
QY, QZ 2G
35
36
SPHCW1HDNC25YHQT2H YH QT QW, QX
QY, QZ 2H 36 4050 ~ 4280
8
a) Binning Structure (IF = 720 mA , Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K) Product Code VF
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
90
2700
SPHWW1HDNC27YHW22G YH W2 WB 2G 24 2815 ~ 3050
25 3050 ~ 3380
SPHWW1HDNC27YHW32G YH W3 WA, WB 2G 24 2815 ~ 3050
25 3050 ~ 3380
3000
SPHWW1HDNC27YHV22G YH V2 VB 2G 24 2870 ~ 3110
25 3110 ~ 3440
SPHWW1HDNC27YHV32G YH V3 VA, VB 2G 24 2870 ~ 3110
25 3110 ~ 3440
3500
SPHWW1HDNC27YHU22G YH U2 UB 2G 24 2955 ~ 3200
25 3200 ~ 35 30
SPHWW1HDNC27YHU32G YH U3 UA, UB 2G 24 2955 ~ 3200
25 3200 ~ 3530
4000
SPHWW1HDNC27YHT22G YH T2 TB 2G 24 3035 ~ 3285
25 3285 ~ 3615
SPHWW1HDNC27YHT32G YH T3 TA, TB 2\G 24 3035 ~ 3285
25 3285 ~ 3615
95
2700
SPHWW1HDNC28YHW22F YH W2 WB 2F 21 2321 ~ 2578
22 2578 ~ 2836
SPHWW1HDNC28YHW32F YH W3 WA,WB 2F 21 2321 ~ 2578
22 2578 ~ 2836
3000
SPHWW1HDNC28YHV22F YH V2 VB 2F 21 2392 ~ 2658
22 2658 ~ 2924
SPHWW1HDNC28YHV32F YH V3 VA,VB 2F 21 2392 ~ 2658
22 2658 ~ 2924
3500
SPHWW1HDNC28YHU22F YH U2 UB 2F 21 2440 ~ 2711
22 2711 ~ 2983
SPHWW1HDNC28YHU32F YH U3 UA,UB 2F 21 2440 ~ 2711
22 2711 ~ 2983
9
b) Chromaticity Region & Coordinates (IF = 720 mA, Ta = 25 ºC)
Region CIE x CIE y Region CIE x CIE y
Region CIE x CIE y Region CIE x CIE y
V rank (3000 K)
T rank (4000 K)
VW
0.4223 0.399
VY
0.4345 0.4033
TW
0.3736 0.3874
TY
0.3871 0.3959
0.4345 0.4033 0.4468 0.4077
0.3871 0.3959 0.4006 0.4044
0.4431 0.4213 0.4562 0.4260
0.3828 0.3803 0.3952 0.388
0.4299 0.4165 0.4431 0.4213
0.3703 0.3726 0.3828 0.3803
VX
0.4223 0.399
VZ
0.4260 0.3854
TX
0.3703 0.3726
TZ
0.3828 0.3803
0.4147 0.3814 0.4373 0.3893
0.3828 0.3803 0.3952 0.388
0.4260 0.3854 0.4468 0.4077
0.3784 0.3647 0.3898 0.3716
0.4345 0.4033 0.4345 0.4033
0.367 0.3578 0.3784 0.3647
R rank (5000 K)
Q rank (5700 K)
RW
0.3376 0.3616
RY
0.3463 0.3687
QW
0.3207 0.3462
QY
0.3290 0.3538
0.3463 0.3687 0.3551 0.3760
0.3290 0.3538 0.3376 0.3616
0.3451 0.3554 0.3533 0.3620
0.3290 0.3417 0.3371 0.3490
0.3371 0.3490 0.3451 0.3554
0.3215 0.3350 0.3290 0.3417
RX
0.3371 0.3490
RZ
0.3451 0.3554
QX
0.3215 0.3350
QZ
0.3290 0.3417
0.3451 0.3554 0.3533 0.3620
0.3290 0.3417 0.3371 0.3490
0.3440 0.3428 0.3515 0.3487
0.3290 0.3300 0.3366 0.3369
0.3366 0.3369 0.3440 0.3428
0.3222 0.3243 0.3290 0.3300
10
b) Chromaticity Region & Coordinates (IF = 720 mA, Ta = 25 ºC)
MacAdam Ellipse (WA, WB) MacAdam Ellipse (V A, VB)
Step C IE x C IE y θ a b Step CIE x C IE y θ a b
2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027
3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041
MacAdam Ellipse (UA, UB) MacAdam Ellipse (TA, TB)
Step C IE x C IE y θ a b Step CIE x C IE y θ a b
2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027
3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040
MacAdam Ellipse (RA)
Step C IE x C IE y θ a b
3-step 0.3447 0.3553 59.62 0.0082 0.0035
Note:
Samsung maintai ns me asur e ment t ole ran ce of: Cx, Cy = ±0.005
θ
CIE x,y
11
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 720 mA, Ta = 25 ºC)
CCT: 2700 K (80 CRI) CCT: 3000 K (80 CRI)
CCT: 3500 K (80 CRI) CCT: 4000 K (80 CRI)
CCT: 5000 K (80 CRI) CCT: 5700 K (80 CRI)
12
CCT: 2700 K (90 CRI) CCT: 3000 K (90 CRI)
CCT: 3500 K (90 CRI) CCT: 4000 K (90 CRI)
b) Forward Current Characteristics (Ta = 25 ºC)
80 CRI
13
90 CRI
c) Temperature Characteristics (IF = 720 mA)
80 CRI
90 CRI
14
d) Color Shift Characteristics Ta = 25 ºC IF = 720 mA
80 CRI
90 CRI
e) Derating Curve
15
f) Beam Angle Characteristics (IF = 720 mA, Ta = 25 ºC)
80 CRI 90 CRI
16
4. Outline Drawing & Dimension
Item Dimension Tolerance Unit
Length 21.50 ±0.15 mm
Width 21.50 ±0.15 mm
Height 1.50 ±0.20 mm
Light Emitting Surface (LES) Diameter 17 ±0.15 mm
Note: Denoted produ ct information above is only an example
( 26W8027 : 26W, CRI80+, 2700K )
Tc point
1. Unit: mm
2. Tolerance: ± 0.15 mm
1. Unit: mm
2. Tolerance: ± 0.2 mm
Note
17
5. Reliability Test Items & Conditions
a) Test Items
Test Item Test Condition Test Hour / Cycle
Room Temperature
Life Test 25 ºC, IF = max 1000 h
High Temperature
Humidity Life Test 85 ºC, 85 % RH, DC Derating, IF = max 1000 h
High Temperature
Life Test
105 ºC, DC Derating, IF = max 1000 h
Low Temperature
Life Test -40 ºC, DC 1300 mA 1000 h
High Temperature
Storage 120 ºC 1000 h
Low Temperature
Storage -40 ºC 1000 h
Thermal Shock -45 ºC / 15 min ↔ 125 ºC / 15 min
temperature change in 5 min 200 cycles
Temperature Cycle
On/Off Test -40 ºC / 85 ºC each 20 min, 100 min transfer
power on/ off each 5 min, DC 72 0 mA 100 cycles
Temperature Humidity
Storage Test -10 ºC ↔ 25 ºC, 95 % RH ↔ 85 ºC, 95 % RH
(24 h / cycle) 100 cycles
ESD (HBM)
R
1
: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
5 times
ESD (MM)
R
1
: 10 MΩ
R2: 0 kΩ
C: 200 pF
V: ±0.5 kV
5 times
Vibration Test 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer 4 times
Mechanical Shock Test 1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides) 5 times
Salt Spray Test 35 ºC, 5 % salt water
8 h spray, 16 h dwell 2 cycles
b) Criteria for Judging the Damage
Item Symbol Test Condition
(Tc = 25 ºC)
Limit
Min. Max.
Forward Voltage VF IF = 720 mA L.S.L. * 0.9 U.S.L. * 1.1
Lumino us Flu x Φv IF = 720 mA L.S.L * 0.7 U.S.L * 1.3
18
6. Label Structure
a) Label Structure
Note: Denoted rank code and product code above is only an example (see description on page 6)
Rank Code:
ⓐⓑ: Forward Voltage rank (refer to page 7-10)
ⓒⓓ: Chromaticity bin (refer to page 12-12)
ⓔⓕ: Luminous Flux bin (refer to page 7-10)
Aluminum Bag & Inner Box Outer Box
19
b) Lot Number
The lot number is composed of the following characters:
●◎◇◆□■△△△ / 1▲▲▲ / xxx PCS
● : Production site (S: Giheung, Korea, G: Tianjin, China)
◎ : L (LED)
◇
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
◆ : Year (Y: 2014, Z: 2015 , A: 2016, …)
□ : Month (1~9, A, B, C)
■ : Day (1~9, A, B~V)
△△△ : Product serial number (001 ~ 009)
▲▲▲
: Tray number (001 ~ 999)
20
7. Packing Structure
Packing material Max. quantity
in pcs of COB
Dimension (mm)
Length
Width
Height
Tolerance
Tray 40 322.6 135.9 10.8 1.0
Aluminum Bag 320 (8 trays) 450 230 - 10
PE Foam Pad - 280 130 10 2
Inner Box 320 (1 aluminum bag) 338 148 55 2
Outer Box 1,280 (4 i nn er bo xes) 351 308 120 5
Pallet 71,680 (56 outer boxes) 1000 1000 130 10
a) Packing Structure
BODY
TRAY
PE-
FOAM
8ea
0ea
6ea
1ea
4ea
2ea
2ea
3ea
Cover Tray(1pcs)
HUMIDITY INDIC ATOR
(Do not use Cobalt Dichloride.)
Body Tray(8pcs)
Taping (Taping Strength : feebly)
Material is PET(Antistatic) 10(5) ~ 10(9) ohm/sq
SILICA GEL(5g)
(Do not use Cobalt Dichloride.)
MBB bag
Heat Sealing
8body + 1cover tray / MBB bag
(MBB-BAG : Heat Sealing)
4 inner-box / Out-box
21
b) Tray
①
COVER
②
BODY
22
c) Aluminum Vinyl Pac k ing Bag
d) Silica Gel & Humidity Indicator Card inside Aluminum Vin yl Packing Bag
23
8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 mont hs at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show som e unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
About Samsung Electronics Co., Ltd.
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Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
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KOREA
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