○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
. 1/12
Datasheet
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
TSZ22111・14・001
www.rohm.com
Voltage Detector IC Series
Free Delay Time Setting
CMOS Voltage Detector IC Series
BD52Exxx series BD53Exxx series
●General Description
Rohm's BD52Exxx and BD53Exxx series are highly
accurate, low current consumption Voltage Detector
ICs with a capacitor controlled time delay. The line up
includes BD52Exxx devices with N-channel open drain
output and BD53Exxx devices with CMOS output. The
devices are available for specific detection voltages
ranging from 2.3V to 6.0V in increments of 0.1V.
●Features
Delay Time Controlled by external Capacitor
Two output types (N-channel open drain and CMOS
output)
Ultra-low current consumption
Very small, lightweight and thin package
Package SSOP5 is similar to SOT-23-5(JEDEC)
●Key Specifications
Detection voltage: 2.3V to 6.0V (Typ.)
0.1V steps
High accuracy detection voltage: ±1.0%
Ultra-low current consumption: 0.95µA (Typ.)
●Package
SSOP5: 2.90mm x 2.80mm x 1.25mm
●Applications
Circuits using microcontrollers or logic circuits that
require a reset.
●Typical Application Circuit
●Connection Diagram
SSOP5
●Pin Descriptions SSOP5
PIN No. Symbol Function
1 VOUT Reset Output
2 VDD Power Supply Voltage
3 GND GND
4 N.C. Unconnected Terminal
5 CT Capacitor connection terminal for
output delay time
Open Drain Output type
BD52Exxx Series
CMOS Output type
BD53Exxx Series
V
DD1
BD52Exxx
V
DD2
GND
C
L
(Capacitor for
noise filtering)
C
T
R
L
R
ST
Micro
controller
VDD1
BD53Exxx
GND
CT
C
L
(Capacitor for
noise filtering)
RST
Micro
controller
TOP VIEW
V
OUT
V
DD
GND
N.C.
C
T
Lot. No
Marking
Datasheet
2/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Ordering Information
●Lineup
Output Type
Open Drain
CMOS
Detection
Voltage
Marking
Part
Number
Marking
Part
Number
6.0V
Ph
BD52E60
Ud
BD53E60
5.9V
Pg
BD52E59
Uc
BD53E59
5.8V
Pf
BD52E58
Ub
BD53E58
5.7V
Pe
BD52E57
Ua
BD53E57
5.6V
Pd
BD52E56
Ry
BD53E56
5.5V
Pc
BD52E55
Rr
BD53E55
5.4V
Pb
BD52E54
Rp
BD53E54
5.3V
Pa
BD52E53
Rn
BD53E53
5.2V
Ny
BD52E52
Rm
BD53E52
5.1V
Nr
BD52E51
Rk
BD53E51
5.0V
Np
BD52E50
Rh
BD53E50
4.9V
Nn
BD52E49
Rg
BD53E49
4.8V
Nm
BD52E48
Rf
BD53E48
4.7V
Nk
BD52E47
Re
BD53E47
4.6V
Nh
BD52E46
Rd
BD53E46
4.5V
Ng
BD52E45
Rc
BD53E45
4.4V
Nf
BD52E44
Rb
BD53E44
4.3V
Ne
BD52E43
Ra
BD53E43
4.2V
Nd
BD52E42
Qy
BD53E42
4.1V
Nc
BD52E41
Qr
BD53E41
4.0V
Nb
BD52E40
Qp
BD53E40
3.9V
Na
BD52
E39
Qn
BD53E39
3.8V
My
BD52E38
Qm
BD53E38
3.7V
Mr
BD52E37
Qk
BD53E37
3.6V
Mp
BD52E36
Qh
BD53E36
3.5V
Mn
BD52E35
Qg
BD53E35
3.4V
Mm
BD52E34
Qf
BD53E34
3.3V
Mk
BD52E33
Qe
BD53E33
3.2V
Mh
BD52E32
Qd
BD53E32
3.1V
Mg
BD52E31
Qc
BD53E31
3.0V
Mf
BD52E30
Qb
BD53E30
2.9V
Me
BD52E29
Qa
BD53E29
2.8V
Md
BD52E28
Py
BD53E28
2.7V
Mc
BD52E27
Pr
BD53E27
2.6V
Mb
BD52E26
Pp
BD53E26
2.5V
Ma
BD52E25
Pn
BD53E25
2.4V
Ly
BD52E24
Pm
BD53E24
2.3V
Lr
BD52E23
Pk
BD53E23
(Unit : mm)
SSOP5
2.9±0.2
0.13
4°+6°
−4°
1.6
2.8±0.2
1.1±0.05
0.05±0.05 +0.2
−0.1
+0.05
−0.03
0.42+0.05
−0.04
0.95
54
1 2 3
1.25Max.
0.2Min.
0.1
Direction of feed
Reel ∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
( )
1pin
Part Output Type Reset Voltage Value Package Packaging and
Number 52 : Open Drain 23 : 2.3V G : SSOP5 forming specification
53 : CMOS 0.1V step TR : Embossed tape
60 : 6.0V and reel
RE x x xB D x x - T
Datasheet
3/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Absolute maximum ratings
Parameter Symbol Limits Unit
Power Supply Voltage V
DD
-GND -0.3 to +10 V
Output Voltage Nch Open Drain Output V
OUT
GND-0.3 to +10 V
CMOS Output GND-0.3 to V
DD
+0.3
Output Current Io 80 mA
Power
Dissipation SSOP5
*1*2
Pd 540 mW
Operating Temperature Topr -40 to +105 °C
Ambient Storage Temperature Tstg -55 to +125 °C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Parameter Symbol
Condition Limit Unit
Min. Typ. Max.
Detection Voltage V
DET
VDD=HL, RL=470kΩ
*1
VDET(T)
×0.99 VDET(T)
VDET(T)
×1.01
V
VDET=2.5V Ta=+25°C 2.475 2.5 2.525
Ta=-40°C to 85°C 2.418 - 2.584
Ta=85°C to 105°C 2.404 - 2.597
VDET=3.0V Ta=+25°C 2.970 3.0 3.030
Ta=-40°C to 85°C 2.901 - 3.100
Ta=85°C to 105°C 2.885 - 3.117
VDET=3.3V Ta=+25°C 3.267 3.3 3.333
Ta=-40°C to 85°C 3.191 - 3.410
Ta=85°C to 105°C 3.173 - 3.428
VDET=4.2V Ta=+25°C 4.158 4.2 4.242
Ta=-40°C to 85°C 4.061 - 4.341
Ta=85°C to 105°C 4.039 - 4.364
VDET=4.8V Ta=+25°C 4.752 4.8 4.848
Ta=-40°C to 85°C 4.641 - 4.961
Ta=85°C to 105°C 4.616 - 4.987
Circuit Current when ON IDD1 VDD=VDET-0.2V
V
DET
=2.3-3.1V - 0.80 2.40
µA
V
DET
=3.2-4.2V - 0.85 2.55
V
DET
=4.3-5.2V - 0.90 2.70
V
DET
=5.3-6.0V - 0.95 2.85
Circuit Current when OFF IDD2 VDD=VDET+2.0V
V
DET
=2.3-3.1V - 0.75 2.25
µA
V
DET
=3.2-4.2V - 0.80 2.40
V
DET
=4.3-5.2V - 0.85 2.55
V
DET
=5.3-6.0V - 0.90 2.70
Operating Voltage Range VOPL VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ 0.95 - - V
VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ 1.20 - -
‘Low’ Output Voltage (Nch) VOL VDD=1.5V, I
SINK
= 0.4 mA, VDET=2.3-6.0V - - 0.5 V
VDD=2.4V, I
SINK
= 2.0 mA, VDET=2.7-6.0V - - 0.5
‘High’ Output Voltage (Pch)
VOH VDD=4.8V, I
SOURCE
=0.7 mA, VDET(2.3V to 4.2V)
VDD-0.5
- - V VDD=6.0V, I
SOURCE
=0.9 mA, VDET(4.3V to 5.2V)
VDD-0.5
- -
VDD=8.0V, I
SOURCE
=1.1 mA, VDET(5.3V to 6.0V)
VDD-0.5
- -
VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
Datasheet
4/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued
Parameter Symbol
Condition Limit Unit
Min. Typ. Max.
Leak Current when OFF I
leak
VDD=VDS=10V
*1
- - 0.1 µA
C
T
pin Threshold Voltage VCTH
VDD=VDET×1.1, VDET=2.3-2.6V, RL=470kΩ VDD
×0.30 VDD
×0.40 VDD
×0.60
V
VDD=VDET×1.1, VDET=2.7-4.2V, RL=470kΩ VDD
×0.30 VDD
×0.45 VDD
×0.60
VDD=VDET×1.1, VDET=4.3-5.2V, RL=470kΩ VDD
×0.35 VDD
×0.50 VDD
×0.60
VDD=VDET×1.1, VDET=5.3-6.0V, RL=470kΩ VDD
×0.40 VDD
×0.50 VDD
×0.60
Output Delay Resistance RCT VDD=VDET×1.1 VCT=0.5V
*1
5.5 9 12.5 MΩ
C
T
pin Output Current ICT VCT=0.1V VDD=0.95V
*1
15 40 - µA
VCT=0.5V VDD=1.5V 150 240 -
Detection Voltage
Temperature coefficient VDET/∆T
Ta=-40°C to 105°C - ±100 ±360 ppm/°C
Hysteresis Voltage ∆ VDET VDD=LHL, RL=470kΩ VDET
×0.03 VDET
×0.05 VDET
×0.08 V
VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
Datasheet
5/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Block Diagrams
Vref
V
OUT
V
DD
GND CT
Vref
V
OUT
V
DD
GND CT
Figure.1 BD52Exxx Series
Figure.2 BD53Exxx Series
Datasheet
6/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves
Figure.3 Circuit Current
0.0
0.5
1.0
1.5
2.0
0 1 2 3 4 5 6 7 8 9 10
VDD SUPPLY VOLTAGE ：VDD[V]
CIRCUIT CURRENT ： IDD[µA]
【BD5242G/FVE
】
0
3
6
9
12
15
18
0.0 0.5 1.0 1.5 2.0 2.5
DRAIN-SOURCE VOLTAGE ： VDS[V]
"LOW" OUTPUT CURRENT ： IOL[mA]
【BD5242G/FVE
】
VDD=2.4V
VDD=1.2V
Figure.4 “Low” Output Current
0
5
10
15
20
25
30
35
40
45
0 1 2 3 4 5 6
DRAIN-SOURCE VOLTAGE ： V
DS
[V]
"HIGH" OUTPUT CURRENT ： I
OH
[mA]
【BD5342G/FVE
】
V
DD
=8.0V
V
DD
=6.0V
V
DD
=4.8V
Figure.5 “High” Output Current Figure.6 I/O Characteristics
0
1
2
3
4
5
6
7
8
9
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
VDD SUPPLY VOLTAGE ：VDD[V]
OUTPUT VOLTAGE
： VOUT[V]
【BD5242G/FVE
】
Ta=25℃
Ta=25℃
【BD52E42G】
【BD53E42G】
【BD53E42G】
【BD52E42G】
【BD53E42G】
【BD52E42G】
【BD53E42G】
Datasheet
7/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves – continued
0.0
0.2
0.4
0.6
0.8
1.0
0.0 0.5 1.0 1.5 2.0 2.5
VDD SUPPLY VOLTAGE ： VDD[V]
OUTPUT VOLTAGE
： VOUT[V]
【BD5242G/FVE
】
Figure.7 Operating Limit Voltage Figure.8 CT Terminal Current
0
50
100
150
200
250
300
350
400
450
012345
V
DD
SUPPLY VOLTAGE ： V
DD
[V]
CT OUTPUT CURRENT ： I
CT
[
µ
A]
【BD5242G/FVE】
3.2
3.6
4.0
4.4
4.8
5.2
5.6
-40 0 40 80
TEMPERATURE ： Ta[℃]
DETECTION VOLTAGE ： VDET[V]
Low to high(VDET+ΔVDET)
High to low(VDET)
【BD5242G/FVE
】
～
～
Figure.9 Detection Voltage
Release Voltage
0.0
0.5
1.0
1.5
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN ON ： IDD1 [µA]
【BD5242G/FVE】
Figure.10 Circuit Current when ON
【BD52E42G】
【BD53E42G】
【BD52E42G】
【BD53E42G】
【BD52E42G】
【BD53E42G】
【BD52E42G】
【BD53E42G】
Datasheet
8/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves – continued
0.0
0.5
1.0
1.5
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN OFF ： IDD2[µA]
【BD5242G/FVE】
Figure.11 Circuit Current when OFF
0.0
0.5
1.0
1.5
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
MINIMUM OPERATING VOLTAGE ： V
OPL
[V]
【BD5242G/FVE
】
Figure.12 Operating Limit Voltage
4
5
6
7
8
9
10
11
12
13
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
RESISTANCE OF C
T
： R
CT
[M]
【BD5242G/FVE】
Figure.13 C
T
Terminal Circuit Resistance
0.1
1
10
100
1000
10000
0.0001 0.001 0.01 0.1
CAPACITANCE OF CT ： CCT[F]
DELAY TIME ： tPLH[ms]
【BD5242G/FVE】
Figure.14 Delay Time (t
PLH
) and
C
T
Terminal External Capacitance
【BD52E42G】
【BD53E42G】
【BD52E42G】
【BD53E42G】
【BD52E42G】
【BD53E42G】
【BD52E42G】
【BD53E42G】
Datasheet
9/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Application Information
Explanation of Operation
For both the open drain type (Figure.15) and the CMOS output type (Figure.16), the detection and release voltages are
used as threshold voltages. When the voltage applied to the V
DD
pins reaches the applicable threshold voltage, the V
OUT
terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and
Electrical Characteristics for information on hysteresis. Because the BD52Exxx series uses an open drain output type, it is
necessary to connect a pull up resistor to V
DD
or another power supply if needed [The output “High” voltage (V
OUT
) in this
case becomes V
DD
or the voltage of the other power supply].
Figure.15 (BD52ExxxType Internal Block Diagram) Figure.16 (BD53ExxxType Internal Block Diagram)
Setting of Detector Delay Time
It is possible to set the delay time at the rise of VDD using a capacitor connected to the Ct terminal.
Delay time at the rise of V
DD
t
PLH
：Time until Vout rises to 1/2 of V
DD
after V
DD
rises beyond the release voltage(V
DET
+V
DET
)
t
PLH
= -C
CT
×R
CT
×ln
C
CT
: C
T
pin External Capacitance
R
CT
: C
T
pin Internal Impedance（Please refer to Electrical Characteristics.）
V
CTH
: C
T
pin Threshold Voltage（Please refer to Electrical Characteristics.）
ln : Natural Logarithm
Reference Data of Falling Time (tPHL) Output
Examples of Falling Time (t
PHL
) Output
Part Number t
PHL
[µs] -40°C t
PHL
[µs] ,+25°C t
PHL
[µs],+105°C
BD52E27G 30.8 30 28.8
BD53E27G 26.8 26 24.8
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
Timing Waveforms
Example: the following shows the relationship between the input voltage VDD, the C
T
Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in
Figure.15 and 16).
1
When the power supply is turned on, the output is unstable
from after over the operating limit voltage (VOPL) until tPHL.
Therefore it is possible that the reset signal is not outputted when
the rise time of V
DD
is faster than tPHL.
2
When VDD is greater than VOPL but less than the reset release
voltage (VDET+VDET), the C
T
terminal (VCT) and output (VOUT)
voltages will switch to L.
3
If VDD exceeds the reset release voltage (VDET+VDET), then
VOUT switches from L to H (with a delay due to the C
T
terminal).
4
If VDD drops below the detection voltage (VDET) when the
power supply is powered down or when there is a power supply
fluctuation, VOUT switches to L (with a delay of tPHL).
5
The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (VDET). The
system is designed such that the output does not toggle with
power supply fluctuations within this hysteresis width, preventing
malfunctions due to noise.
Vref
VDD
GND
CT
R1
R2
R3
Q3
Q1
VOUT RESET
RL
VDD
Vref
VDD
GND
CT
R1
R2
R3
Q3
Q2
VOUT
RESET
Q1
VDD
V
DD
-V
CTH
V
DD
V
DD
V
DET
+ΔV
DET
V
DET
V
OPL
0V
1/2 V
DD
t
PHL
①
t
PLH
t
PHL
t
PLH
②
③
④
V
CT
⑤
V
OUT
Figure.17 Timing Waveform
Datasheet
10/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Circuit Applications
1) Examples of a common power supply detection reset circuit
Application examples of BD52Exxx series (Open Drain
output type) and BD53Exxx series (CMOS output type)
are shown below.
CASE1: Power supply of the microcontroller (V
DD2
)
differs from the power supply of the reset detection
(V
DD1
).
Use an open drain output type (BD52Exxx) with a load
resistance R
L
attached as shown Figure.18.
CASE2: Power supply of the microcontroller (V
DD1
) is the
same as the power supply of the reset detection (V
DD1
).
Use a CMOS output type (BD53Exxx) device or open
drain output type (BD52Exxx) device with a pull up
resistor attached between the output and V
DD1
.
When a capacitance C
L
for noise filtering is connected to
the V
OUT
pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall of the output voltage (V
OUT
).
Please refer to Operational Notes for recommendations
on resistor and capacitor values.
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD52Exxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(V
DD3
) as shown in Fig. 20. By pulling-up to V
DD3
, output “High” voltage of micro-controller power supply is possible.
V
DD1
BD52Exxx
V
DD2
GND
C
L
（Noise-filtering
Capacitor）
C
T
R
L
R
ST
Micro
controller
Figure.18 Open Drain Output Type
C
L
（Noise-filtering
Capacitor）
V
DD1
BD53Exxx
C
T
GND
R
ST
Micro
controller
Figure.19 CMOS Output Type
VDD1 VDD3
GND
RST
microcontroller
CT
RL
VDD2
CT
BD52Exxx
NO.1 BD52Exxx
NO.2
Fig.20
Datasheet
11/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
3) Examples of the power supply with resistor dividers
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of
current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow
may cause malfunction in the systems operation such as output oscillations, etc.
Figure.21
When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to
oscillation.
Figure.22 IDD Peak Current vs. Power Supply Voltage
* This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
VOUT
R2
VDD
BD52Exxx
BD53Exxx
GND
R1
I1
V1
CIN
CL
IDD
VDD
VDET
0
Through
Current
V D D - ID D P eak C urrent T a=25°C
0.001
0.01
0.1
1
10
3 4 5 6 7 8 9 10
V D D [V ]
ID D -peak[m A ]
B D 52E xxx
B D 53E xxx
Datasheet
12/12
BD52Exxx series BD53Exxx series
TSZ02201-0R7R0G300080-1-
2
© 2013 ROHM Co., Ltd. All rights reserved.
22.May.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●
●●
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4) Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) The V
DD
line impedance might cause oscillation because of the detection current.
8) A V
DD
to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) External parameters
The recommended value of R
L
Resistor is 50k to 1M. The recommended value of C
T
Capacitor is over 100pF to
0.1µF. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using
practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the V
DD
rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
14) C
T
pin discharge
Due to the capabilities of the C
T
pin discharge transistor, the C
T
pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
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1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
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third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
