Two-Lane and Four-Lane DisplayPort Passive
Switches with Separate AUX/HPD Control
MAX4998/MAX14998
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND, unless otherwise noted.)
VDD ..........................................................................-0.3V to +4V
SEL1, SEL2, COM_, NO_, NC_ (Note 1) .....-0.3V to +(VDD + 0.3)V
|VCOM_ - VNO_|, |VCOM_ - VNC_| (Note 1) ..................... 0 to +2V
Continuous Current (COM_ to NO_/NC_) ....................... Q70mA
Peak Current (COM_ to NO_/NC_)
(pulsed at 1ms, 10% duty cycle) ................................. Q70mA
Continuous Current (SEL1, SEL2) ................................... Q30mA
Peak Current (SEL1, SEL2)
(pulsed at 1ms, 10% duty cycle) ................................. Q70mA
Continuous Power Dissipation (TA = +70NC)
28-Pin TQFN (derate 28.6mW/NC above +70NC) .......2285mW
42-Pin TQFN (derate 34.5mW/NC above +70NC) .......2758mW
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Package Junction-to-Ambient Thermal Resistance (BJA) (Note 2)
28-Pin TQFN .................................................................35NC/W
42-Pin TQFN .................................................................29NC/W
Package Junction-to-Case Thermal Resistance (BJC) (Note 2)
28-Pin TQFN ................................................................2.7NC/W
42-Pin TQFN ...................................................................2NC/W
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VDD = +3.3V Q10%, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VDD = +3.3V, TA = +25NC, unless otherwise
noted.) (Note 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Signals on COM_, NO_, NC_, SEL1, and SEL2 exceeding VDD or GND are clamped by internal diodes. Limit forward-
diode current to the maximum current rating.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ANALOG SWITCH
Analog Signal Range VCOM_, VNO_,
VNC_
(VDD -
1.8) V
Voltage Between COM_ and
NO_/NC_
|VCOM_ - VNO_|,
|VCOM_ - VNC_|0 1.8 V
On-Resistance RON ICOM_ = 15mA;
VNO_, VNC_ = 0V, +1.2V 7I
On-Resistance Match
Between Pairs of Same
Channel
DRON VDD = +3.0V; ICOM_ = 15mA; VNO_,
VNC_ = 0V (Notes 4, 5) 0.1 2 I
On-Resistance Match
Between Channels DRON VDD = +3.0V; ICOM_ = 15mA; VNO_,
VNC_ = 0V (Notes 4, 5) 1.0 4 I
On-Resistance Flatness RFLAT(ON) VDD = +3.0V; ICOM_ = 15mA; VNO_,
VNC_ = 0V, +1.2V (Notes 5, 6) 0.3 1.5 I
NO_ or NC_ Off-Leakage
Current
INO_(OFF)
INC_(OFF)
VDD = +3.6V; VCOM_ = 0V, +1.2V;
VNO_ or VNC_ = +1.2V, 0V -1 1 FA
COM_ On-Leakage
Current ICOM_(ON) VDD = +3.6V; VCOM_ = 0V, +1.2V;
VNO_ or VNC_ = VCOM_ or unconnected -1 1 FA
DIGITAL SIGNALS
SEL1 and SEL2 to Switch
Turn-On Time tON_SEL VNO_ or VNC_ = +1.0V, RL = 50I,
CL = 100pF (Figure 1) 45 120 ns