2.5 V to 5.5 V, 250 μA, 2-Wire Interface,
Dual Voltage Output, 8-/10-/12-Bit DACs
AD5337/AD5338/AD5339
Rev. C
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FEATURES
AD5337
2 buffered 8-bit DACs in 8-lead MSOP
AD5338, AD5338-1
2 buffered 10-bit DACs in 8-lead MSOP
AD5339
2 buffered 12-bit DACs in 8-lead MSOP
Low power operation: 250 μA @ 3 V, 300 μA @ 5 V
2-wire (I2C-compatible) serial interface
2.5 V to 5.5 V power supply
Guaranteed monotonic by design over all codes
Power-down to 80 nA @ 3 V, 200 nA @ 5 V
3 power-down modes
Double-buffered input logic
Output range: 0 V to VREF
Power-on reset to 0 V
Simultaneous update of outputs (LDAC function)
Software clear facility
Data readback facility
On-chip rail-to-rail output buffer amplifiers
Temperature range: −40°C to +105°C
APPLICATIONS
Portable battery-powered instruments
Digital gain and offset adjustment
Programmable voltage and current sources
Programmable attenuators
Industrial process control
GENERAL DESCRIPTION
The AD5337/AD5338/AD5339 are dual 8-, 10-, and 12-bit
buffered voltage output DACs, respectively. Each part is housed
in an 8-lead MSOP package and operates from a single 2.5 V to
5.5 V supply, consuming 250 μA at 3 V. On-chip output amplifiers
allow rail-to-rail output swing with a slew rate of 0.7 V/μs. A 2-
wire serial interface operates at clock rates up to 400 kHz. This
interface is SMBus compatible at VDD < 3.6 V. Multiple devices
can be placed on the same bus.
The references for the two DACs are derived from one reference
pin. The outputs of all DACs can be updated simultaneously
using the software LDAC function. The parts incorporate a
power-on reset circuit to ensure that the DAC outputs power up
to 0 V and remain there until a valid write to the device takes
place. A software clear function resets all input and DAC
registers to 0 V. A power-down feature reduces the current
consumption of the devices to 200 nA @ 5 V (80 nA @ 3 V).
The low power consumption of these parts in normal operation
makes them ideally suited to portable battery-operated equip-
ment. The power consumption is typically 1.5 mW at 5 V and
0.75 mW at 3 V, reducing to 1 μW in power-down mode.
FUNCTIONAL BLOCK DIAGRAM
SCL BUFFER
BUFFER
LDAC
A0
SDA
GND
03756-001
INTERFACE
LOGIC
INPUT
REGISTER
INPUT
REGISTER
DAC
REGISTER
DAC
REGISTER
STRING
DAC A
STRING
DAC B
VOUTA
VOUTB
POWER-DOWN
LOGIC
AD5337/AD5338/AD5339
POWER-ON
RESET
REFIN
V
DD
Figure 1.
AD5337/AD5338/AD5339
Rev. C | Page 2 of 28
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AC Characteristics........................................................................ 5
Timing Characteristics ................................................................ 6
Absolute Maximum Ratings............................................................ 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
Terminology .................................................................................... 13
Theory of Operation ...................................................................... 15
Digital-to-Analog Converter Section ...................................... 15
Resistor String............................................................................. 15
DAC Reference Inputs ............................................................... 15
Output Amplifier........................................................................ 15
Power-on Reset ........................................................................... 15
Serial Interface............................................................................ 16
Write Operation.......................................................................... 17
Read Operation........................................................................... 18
Double-Buffered Interface ........................................................ 19
Power-Down Modes .................................................................. 19
Applications..................................................................................... 20
Typical Application Circuit....................................................... 20
Bipolar Operation....................................................................... 20
Multiple Devices on One Bus ................................................... 20
Product as a Digitally Programmable Window Detector ..... 21
Coarse and Fine Adjustment Capabilities............................... 21
Power Supply Decoupling ......................................................... 21
Outline Dimensions ....................................................................... 24
Ordering Guide .......................................................................... 24
REVISION HISTORY
9/07—Rev. B to Rev. C
Changes to Features.......................................................................... 1
Changes to Table 4............................................................................ 7
Changes to Ordering Guide .......................................................... 25
9/06—Rev. A to Rev. B
Updated Format..................................................................Universal
Changes to Figure 31...................................................................... 16
Changes to Table 6.......................................................................... 16
Changes to Table 10........................................................................ 23
Changes to Ordering Guide .......................................................... 25
10/04—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Added AD5338-1................................................................Universal
Changes to Specifications.................................................................4
Updated Outline Dimensions....................................................... 24
Changes to Ordering Guide.......................................................... 24
11/03—Rev. 0: Initial Version
AD5337/AD5338/AD5339
Rev. C | Page 3 of 28
SPECIFICATIONS
VDD = 2.5 V to 5.5 V; VREF = 2 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications TMIN to TMAX, unless otherwise noted.
Table 1.
A Grade1B Grade1
Parameter2Min Typ Max Min Typ Max Unit Conditions/Comments
DC PERFORMANCE3, 4
AD5337
Resolution 8 8 Bits
Relative Accuracy ±0.15 ±1 ±0.15 ±0.5 LSB
Differential Nonlinearity ±0.02 ±0.25 ±0.02 ±0.25 LSB Guaranteed monotonic by
design over all codes
AD5338
Resolution 10 10 Bits
Relative Accuracy ±0.5 ±4 ±0.5 ±2 LSB
Differential Nonlinearity ±0.05 ±0.5 ±0.05 ±0.50 LSB Guaranteed monotonic by
design over all codes
AD5339
Resolution 12 12 Bits
Relative Accuracy ±2 ±16 ±2 ±8 LSB
Differential Nonlinearity ±0.2 ±1 ±0.2 ±1 LSB Guaranteed monotonic by
design over all codes
Offset Error ±0.4 ±3 ±0.4 ±3 % of FSR
Gain Error ±0.15 ±1 ±0.15 ±1 % of FSR
Lower Deadband 20 60 20 60 mV Lower deadband exists
only if offset error is
negative
Offset Error Drift5 −12 −12 ppm of
FSR/°C
Gain Error Drift5 −5 −5 ppm of
FSR/°C
Power Supply Rejection Ratio5 −60 −60 dB ∆VDD = ±10%
DC Crosstalk5 200 200 μV RL = 2 kΩ to GND or VDD
DAC REFERENCE INPUTS5
VREF Input Range 0.25 VDD 0.25 VDD V
VREF Input Impedance 37 45 37 45 Normal operation
>10 >10 Power-down mode
Reference Feedthrough −90 −90 dB Frequency = 10 kHz
OUTPUT CHARACTERISTICS5
Minimum Output Voltage6 0.001 0.001 V Measure of the minimum
drive capabilities of the
output amplifier
Maximum Output Voltage6 VDD
0.001
VDD
0.001
V Measure of the maximum
drive capabilities of the
output amplifier
DC Output Impedance 0.5 0.5 Ω
Short-Circuit Current 25 25 mA VDD = 5 V
16 16 mA VDD = 3 V
Power-Up Time 2.5 2.5 μs Coming out of power-
down mode, VDD = 5 V
5 5 μs
Coming out of power-
down mode, VDD = 3 V
AD5337/AD5338/AD5339
Rev. C | Page 4 of 28
A Grade1B Grade1
Parameter2Min Typ Max Min Typ Max Unit Conditions/Comments
LOGIC INPUTS (A0)5
Input Current ±1 ±1 μA
Input Low Voltage (VIL) 0.8 0.8 V VDD = 5 V ± 10%
0.6 0.6 V VDD = 3 V ± 10%
0.5 0.5 V VDD = 2.5 V
Input High Voltage (VIH) 2.4 2.4 V VDD = 5 V ± 10%
2.1 2.1 V VDD = 3 V ± 10%
2.0 2.0 V VDD = 2.5 V
Pin Capacitance 3 3 pF
LOGIC INPUTS (SCL, SDA)5
Input High Voltage (VIH) 0.7 ×
VDD
VDD +
0.3
0.7 ×
VDD
VDD +
0.3
V SMBus compatible at
VDD < 3.6 V
Input Low Voltage (VIL) −0.3
+0.3
VDD
–0.3 +0.3
VDD
V SMBus compatible at
VDD < 3.6 V
Input Leakage Current (IIN) ±1 ±1 μA
Input Hysteresis (VHYST) 0.05 ×
VDD
0.05 ×
VDD
V
Input Capacitance (CIN) 8 8 pF
Glitch Rejection 50 50 ns Input filtering suppresses
noise spikes of less than
50 ns
LOGIC OUTPUT (SDA)5
Output Low Voltage (VOL) 0.4 0.4 V ISINK = 3 mA
0.6 0.6 V ISINK = 6 mA
Three-State Leakage Current ±1 ±1 μA
Three-State Output Capacitance 8 8 pF
POWER REQUIREMENTS
VDD 2.5 5.5 2.5 5.5 V
IDD (Normal Mode)7 V
IH = VDD and VIL = GND
VDD = 4.5 V to 5.5 V 300 375 300 375 μA
VDD = 2.5 V to 3.6 V 250 350 250 350 μA
IDD (Power-Down Mode) VIH = VDD and VIL = GND
VDD = 4.5 V to 5.5 V 0.2 1.0 0.2 1.0 μA IDD = 4 μA (max) during 0
readback on SDA
VDD = 2.5 V to 3.6 V 0.08 1.00 0.08 1.00 μA IDD = 1.5 μA (max) during 0
readback on SDA
1 Temperature range for A Version and B Version: −40°C to +105°C; typical at 25°C.
2 See the Terminology section for explanations of the specific parameters.
3 DC specifications tested with the outputs unloaded.
4 Linearity is tested using a reduced code range: AD5337 (Code 8 to Code 248), AD5338, AD5338-1 (Code 28 to Code 995), AD5339 (Code 115 to Code 3981).
5 Guaranteed by design and characterization; not production tested.
6 For the amplifier output to reach its minimum voltage, offset error must be negative; to reach its maximum voltage, VREF = VDD and offset plus gain error must be positive.
7 IDD specification is valid for all DAC codes. Interface inactive. All DACs active and excluding load currents.
AD5337/AD5338/AD5339
Rev. C | Page 5 of 28
AC CHARACTERISTICS
VDD = 2.5 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications TMIN to TMAX, unless otherwise noted.
Table 2.
A Version and B Version1
Parameter2, 3Min Typ Max Unit Conditions/Comments
Output Voltage Settling Time VREF = VDD = 5 V
AD5337 6 8 μs 1/4 scale to 3/4 scale change (0x40 to 0xC0)
AD5338 7 9 μs 1/4 scale to 3/4 scale change (0x100 to 0x300)
AD5339 8 10 μs 1/4 scale to 3/4 scale change (0x400 to 0xC00)
Slew Rate 0.7 V/μs
Major Code Transition Glitch Energy 12 nV-s 1 LSB change around major carry
Digital Feedthrough 1 nV-s
Digital Crosstalk 1 nV-s
DAC-to-DAC Crosstalk 3 nV-s
Multiplying Bandwidth 200 kHz VREF = 2 V ± 0.1 V p-p
Total Harmonic Distortion −70 dB VREF = 2.5 V ± 0.1 V p-p, frequency = 10 kHz
1 Temperature range for A version and B version: −40°C to +105°C; typical at 25°C.
2 Guaranteed by design and characterization; not production tested.
3 See the Terminology section for explanations of the specific parameters.
AD5337/AD5338/AD5339
Rev. C | Page 6 of 28
TIMING CHARACTERISTICS
VDD = 2.5 V to 5.5 V. All specifications TMIN to TMAX, unless otherwise noted.
Table 3.
Limit at TMIN, TMAX
Parameter A Version and B Version Unit Conditions/Comments
fSCL 400 kHz max SCL clock frequency
t1 2.5 μs min SCL cycle time
t2 0.6 μs min tHIGH, SCL high time
t3 1.3 μs min tLOW, SCL low time
t4 0.6 μs min tHD, STA, start/repeated start condition hold time
t5 100 ns min tSU, DAT, data setup time
t610.9 μs max tHD, DAT, data hold time
0 μs min tHD, DAT, data hold time
t7 0.6 μs min tSU, STA, setup time for repeated start
t8 0.6 μs min tSU, STO, stop condition setup time
t9 1.3 μs min tBUF, bus free time between a stop and a start condition
t10 300 ns max tR, rise time of SCL and SDA when receiving
0 ns min tR, rise time of SCL and SDA when receiving (CMOS compatible)
t11 250 ns max tF, fall time of SDA when transmitting
0 ns min tF, fall time of SDA when receiving (CMOS compatible)
300 ns max tF, fall time of SCL and SDA when receiving
20 + 0.1 CB2ns min tF, fall time of SCL and SDA when transmitting
CB 400 pF max Capacitive load for each bus line
1 A master device must provide a hold time of at least 300 ns for the SDA signal (referred to VIH min of the SCL signal) to bridge the undefined region of SCL’s falling edge.
2 CB is the total capacitance of one bus line in pF; tR and tF measured between 0.3 VDD and 0.7 VDD.
t
9
t
3
t
4
t
6
t
2
t
5
t
7
t
8
t
1
t
4
t
11
t
10
0
3756-002
SDA
SCL
START
CONDITION STOP
CONDITION
REPEATED
START
CONDITION
Figure 2. 2-Wire Serial Interface Timing Diagram
AD5337/AD5338/AD5339
Rev. C | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to GND −0.3 V to +7 V
SCL, SDA to GND −0.3 V to VDD + 0.3 V
A0 to GND −0.3 V to VDD + 0.3 V
Reference Input Voltage to GND −0.3 V to VDD + 0.3 V
VOUTA to VOUTB to GND −0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJ max) 150°C
MSOP Package
Power Dissipation (TJ max − TA) θJA
θJA Thermal Impedance 206°C/W
θJC Thermal Impedance 44°C/W
Lead Temperature JEDEC Industry Standard
Soldering J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Transient currents of up to 100 mA do not cause SCR latch-up.
ESD CAUTION
AD5337/AD5338/AD5339
Rev. C | Page 8 of 28
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
0
3756-003
V
DD 1
V
OUT
A
2
V
OUT
B
3
REFIN
4
A0
8
SCL
7
SDA
6
GND
5
TOP VIEW
(Not to Scale)
AD5337/
AD5338/
AD5339
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 VDD Power Supply Input. These parts can be operated from 2.5 V to 5.5 V, and the supply should be decoupled to GND.
2 VOUTA Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
3 VOUTB Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
4 REFIN Reference Input Pin for the Two DACs. It has an input range from 0.25 V to VDD.
5 GND Ground Reference Point for All Circuitry on the Parts.
6 SDA Serial Data Line. This is used in conjunction with the SCL line to clock data into or out of the 16-bit input shift
register. SDA is a bidirectional open-drain data line that should be pulled to the supply with an external pull-up resistor.
7 SCL Serial Clock Line. This is used in conjunction with the SDA line to clock data into or out of the 16-bit input shift
register. Clock rates of up to 400 kbps can be accommodated in the 2-wire interface.
8 A0 Address Input. Sets the least significant bit of the 7-bit slave address.
AD5337/AD5338/AD5339
Rev. C | Page 9 of 28
TYPICAL PERFORMANCE CHARACTERISTICS
INL ERROR (LSB)
–1.0
–0.5
0
0.5
1.0
0 50 100 150 200 250
CODE
TA= 25°C
VDD =5V
03756-006
Figure 4. AD5337 Typical INL Plot
–3
–2
–1
0
1
2
3
INL ERROR (LSB)
0 200 400 600 800 1000
CODE
TA= 25°C
VDD =5V
03756-007
Figure 5. AD5338 Typical INL Plot
–12
–8
–4
0
4
8
12
INL ERROR (LSB)
20001500500 10000 2500 3000 3500 4000
CODE
TA= 25°C
VDD =5V
03756-008
Figure 6. AD5339 Typical INL Plot
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
DNL ERROR (LSB)
0 50 100 150 200 250
CODE
TA= 25°C
VDD =5V
03756-009
Figure 7. AD5337 Typical DNL Plot
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
DNL ERROR (LSB)
0 200 400 600 800 1000
CODE
TA= 25°C
VDD =5V
03756-010
Figure 8. AD5338 Typical DNL Plot
DNL ERROR (LSB)
–1.0
–0.5
0
0.5
1.0
20001500500 10000 2500 3000 3500 4000
CODE
TA= 25°C
VDD =5V
03756-011
Figure 9. AD5339 Typical DNL Plot
AD5337/AD5338/AD5339
Rev. C | Page 10 of 28
ERROR (LSB)
–0.50
–0.25
0
0.25
0.50
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
V
REF
(V)
T
A
= 25°C
V
DD
=5V
MAX INL
MAX DNL
MIN DNL
MIN INL
03756-012
Figure 10. AD5337 INL and DNL Error vs. VREF
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
ERROR (LSB)
TEMPERATURE (°C)
0–40 40 80 120
VDD =5V
VREF =3V
MAX INL
MAX DNL
MIN DNL
MIN INL
03756-013
Figure 11. AD5337 INL and DNL Error vs. Temperature
ERROR (%)
–1.0
–0.5
0
0.5
1.0
TEMPERATURE (°C)
0–40 40 80 120
V
DD
=5V
V
REF
=2V
GAIN ERROR
OFFSET ERROR
03756-014
Figure 12. AD5337 Offset Error and Gain Error vs. Temperature
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
ERROR (%)
0
0.1
0.2
2301 45
V
DD
(V)
6
T
A
= 25°C
V
REF
=2V
GAIN ERROR
OFFSET ERROR
03756-015
Figure 13. Offset Error and Gain Error vs. VDD
0
1
2
3
4
5
V
OUT
(V)
2301 45
SINK/SOURCE CURRENT (mA)
6
5V SOURCE
3V SOURCE
5V SINK
3V SINK
03756-016
Figure 14. VOUT Source and Sink Current Capability
0
50
100
150
200
250
300
ZERO SCALE FULL SCALE
CODE
T
A
= 25°C
V
DD
=5V
V
REF
=2V
03756-017
I
DD
(µA)
Figure 15. Supply Current vs. Code
AD5337/AD5338/AD5339
Rev. C | Page 11 of 28
0
50
100
150
200
250
300
I
DD
(µA)
3.5 4.02.5 3.0 4.5 5.0 5.5
V
DD
(V)
+25°C
–40°C
+105°C
03756-018
Figure 16. Supply Current vs. Supply Voltage
0
0.1
0.2
0.3
0.4
0.5
I
DD
(µA)
3.5 4.02.5 3.0 4.5 5.0 5.5
V
DD
(V)
+25°C
–40°C
+105°C
03756-019
Figure 17. Power-Down Current vs. Supply Voltage
0
50
100
150
200
250
IDDA)
300
350
400
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
V
LOGIC
(V)
T
A
= 25°C
V
DD
=5V
V
DD
=3V
INCREASING
DECREASING
03756-020
Figure 18. Supply Current vs. Logic Input Voltage for SDA and SCL Voltage
Increasing and Decreasing
T
A
=25°C
V
DD
=5V
V
REF
=5V
V
OUT
A
SCL
CH1
CH1 1V, CH2 5V, TIME BASE = 1µs/DIV
CH2
03756-021
Figure 19. Midscale Settling (¼ to ¾ Scale Code Change)
T
A
= 25°C
V
DD
=5V
V
REF
=2V
V
OUT
A
V
DD
CH1
CH1 2V, CH2 200mV, TIME BASE = 200µs/DIV
CH2
03756-022
Figure 20. Power-On Reset to 0 V
T
A
= 25°C
V
DD
=5V
V
REF
=2V
V
OUT
A
SCL
CH1
CH1 500mV, CH2 5V, TIME BASE = 1µs/DIV
CH2
03756-023
Figure 21. Existing Power-Down to Midscale
AD5337/AD5338/AD5339
Rev. C | Page 12 of 28
V
DD
=5VV
DD
=3V
FREQUENCY
I
DD
(µA)
150 200 250 300
03756-024
Figure 22. IDD Histogram with VDD = 3 V and VDD = 5 V
VOUT (V)
2.47
2.49
2.48
2.50
1µs/DIV
03756-025
Figure 23. AD5339 Major Code Transition Glitch Energy
–60
–50
–40
–30
–20
–10
0
10
dB
1k 10k10 100 100k 1M 10M
FREQUENCY (Hz)
03756-026
Figure 24. Multiplying Bandwidth (Small-Signal Frequency Response)
FULL-SCALE ERROR (V)
–0.02
–0.01
0
0.01
0.02
2301 45
V
REF
(V)
6
T
A
= 25°C
V
DD
=5V
03756-027
Figure 25. Full-Scale Error vs. VREF
1mV/DI
V
50ns/DIV
03756-028
Figure 26. DAC-to-DAC Crosstalk
AD5337/AD5338/AD5339
Rev. C | Page 13 of 28
TERMINOLOGY
Relative Accuracy (Integral Nonlinearity, INL)
For the DAC, relative accuracy, or integral nonlinearity (INL),
is a measure, in LSBs, of the maximum deviation from a straight
line passing through the endpoints of the DAC transfer function.
Typical INL vs. code plots can be seen in Figure 4, Figure 5, and
Figure 6.
Differential Nonlinearity (DNL)
The difference between the measured change and the ideal
1 LSB change between any two adjacent codes. A specified
differential nonlinearity of ±1 LSB maximum ensures mono-
tonicity. This DAC is guaranteed monotonic by design. Typical
DNL vs. code plots can be seen in Figure 7, Figure 8, and
Figure 9.
Offset Error
A measure of the offset error of the DAC and the output
amplifier, expressed as a percentage of the full-scale range.
Gain Error
A measure of the span error of the DAC. It is the deviation in
slope of the actual DAC transfer characteristic from the ideal,
expressed as a percentage of the full-scale range.
Offset Error Drift
A measure of the change in offset error with changes in
temperature. It is expressed in (ppm of full-scale range)/°C.
Gain Error Drift
A measure of the change in gain error with changes in
temperature. It is expressed in (ppm of full-scale range)/°C.
Power Supply Rejection Ratio (PSRR)
This indicates how the output of the DAC is affected by changes
in the supply voltage. PSRR is the ratio of the change in VOUT to
a change in VDD for full-scale output of the DAC. It is measured
in dB. VREF is held at 2 V and VDD is varied ±10%.
DC Crosstalk
The dc change in the output level of one DAC at midscale in
response to a full-scale code change (all 0s to all 1s and vice
versa) and output change of another DAC. It is expressed in μV.
Reference Feedthrough
The ratio of the amplitude of the signal at the DAC output to
the reference input when the DAC output is not being updated.
It is expressed in dB.
Major Code Transition Glitch Energy
The energy of the impulse injected into the analog output when
the code in the DAC register changes state. Normally specified
as the area of the glitch in nV-s, it is measured when the digital
code is changed by 1 LSB at the major carry transition (011...11
to 100...00 or 100...00 to 011...11).
Digital Feedthrough
A measure of the impulse injected into the analog output of the
DAC from the digital input pins of the device when the DAC
output is not being updated. Specified in nV-s and measured
with a worst-case change on the digital input pins, such as
changing from all 0s to all 1s or vice-versa.
Digital Crosstalk
The glitch impulse transferred to the output of one DAC at
midscale in response to a full-scale code change (all 0s to all 1s,
or vice versa) in the input register of another DAC. It is
expressed in nV-s.
DAC-to-DAC Crosstalk
The glitch impulse transferred to the output of one DAC due to
a digital code change and subsequent output change of another
DAC. This includes both digital and analog crosstalk. It is
measured by loading one of the DACs with a full-scale code
change (all 0s to all 1s, or vice versa) with the LDAC bit set low
and monitoring the output of another DAC. The energy of the
glitch is expressed in nV-s.
Multiplying Bandwidth
The amplifiers within the DAC have a finite bandwidth. The
multiplying bandwidth is the frequency at which the output
amplitude falls to 3 dB below the input. A sine wave on the
reference (with full-scale code loaded to the DAC) appears on
the output.
Total Harmonic Distortion (THD)
The difference between an ideal sine wave and its attenuated
version using the DAC. The sine wave is used as the reference
for the DAC, and the THD is a measure of the harmonic
distortion present in the DAC output. It is measured in dB.
AD5337/AD5338/AD5339
Rev. C | Page 14 of 28
GAIN ERROR
PLUS
OFFSET ERROR
ACTUAL
IDEAL
DAC CODE
03756-004
OUTPUT
VOLTAGE
NEGATIVE
OFFSET
ERROR
DEADBAND CODES
AMPLIFIER
FOOTROOM
(1mV)
NEGATIVE
OFFSET
ERROR
Figure 27. Transfer Function with Negative Offset
GAIN ERROR
PLUS
OFFSET ERROR
DAC CODE
ACTUAL
IDEAL
03756-005
OUTPUT
VOLTAGE
POSITIVE
OFFSET
Figure 28. Transfer Function with Positive Offset
AD5337/AD5338/AD5339
Rev. C | Page 15 of 28
THEORY OF OPERATION
The AD5337/AD5338/AD5339 are dual resistor string DACs
fabricated on a CMOS process with resolutions of 8, 10, and
12 bits, respectively. Each part contains two output buffer
amplifiers and is written to via a 2-wire serial interface. The
DACs operate from single supplies of 2.5 V to 5.5 V, and the
output buffer amplifiers provide rail-to-rail output swing with
a slew rate of 0.7 V/μs. The two DACs share a single reference
input pin. Each DAC has three programmable power-down
modes that allow the output amplifier to be configured with
either a 1 kΩ load to ground, a 100 kΩ load to ground, or as
a high impedance three-state output.
DIGITAL-TO-ANALOG CONVERTER SECTION
The architecture of one DAC channel consists of a resistor-
string DAC followed by an output buffer amplifier. The voltage
at the REFIN pin provides the reference voltage for the DAC.
Figure 29 shows a block diagram of the DAC architecture.
Because the input coding to the DAC is straight binary, the ideal
output voltage is given by
N
REF
OUT
DV
V2
×
=
where:
D is the decimal equivalent of the binary code, which is loaded
to the DAC register
0 to 255 for AD5337 (8 bits)
0 to 1023 for AD5338 and AD5338-1 (10 bits)
0 to 4095 for AD5339 (12 bits)
N is the DAC resolution.
INPUT
REGISTER
REFIN
OUTPUT BUFFER
AMPLIFIER
V
OUT
A
RESISTOR
STRING
DAC
REGISTER
03756-029
Figure 29. DAC Channel Architecture
RESISTOR STRING
The resistor string portion is shown in Figure 30. It is simply a
string of resistors, each of value R. The digital code loaded to
the DAC register determines the node at which the voltage is
tapped off and fed into the output amplifier. The voltage is
tapped off by closing one of the switches that connects the
string to the amplifier. Because the DAC comprises a string
of resistors, it is guaranteed to be monotonic.
R
R
R
R
R
03756-030
TO OUTPUT
AMPLIFIER
Figure 30. Resistor String
DAC REFERENCE INPUTS
There is a single reference input pin for the two DACs. The
reference input is unbuffered. The user can have a reference
voltage as low as 0.25 V and as high as VDD, because there is no
restriction due to headroom and foot room of any reference
amplifier.
It is recommended to use a buffered reference in the external
circuit, for example, REF192. The input impedance is typically
45 kΩ.
OUTPUT AMPLIFIER
The output buffer amplifier is capable of generating rail-to-rail
voltages on its output, which gives an output range of 0 V to
VDD when the reference is VDD. The amplifier is capable of driving
a load of 2 kΩ to GND or VDD in parallel with 500 pF to GND
or VDD. The source and sink capabilities of the output amplifier
can be seen in the plot in Figure 14.
The slew rate is 0.7 V/μs with a half-scale settling time to
±0.5 LSB (at 8 bits) of 6 μs.
POWER-ON RESET
The AD5337/AD5338/AD5339 power on in a defined state via a
power-on reset function. The power-on state is normal operation,
with output voltage set to 0 V.
Both input and DAC registers are filled with zeros until a valid
write sequence is made to the device. This is particularly useful
in applications where it is important to know the state of the
DAC outputs while the device is powering on.
AD5337/AD5338/AD5339
Rev. C | Page 16 of 28
SERIAL INTERFACE
The AD5337/AD5338/AD5339 are controlled via an I2C®-
compatible serial bus. The DACs are connected to this bus as
slave devices, that is, no clock is generated by the AD5337/
AD5338/AD5339 DACs. This interface is SMBus compatible
at VDD < 3.6 V.
The AD5337/AD5338/AD5339 have a 7-bit slave address. The
six MSBs are 000110, and the LSB is determined by the state of
the A0 pin. The facility of making hardwired changes to A0
allows the use of one or two of these devices on one bus. The
AD5338-1 has a unique 7-bit slave address. The six MSBs are
010001, and the LSB is determined by the state of the A0 pin.
Using a combination of AD5338 and AD5338-1 allows the user
to accommodate four of these dual 10-bit devices (eight
channels) on the same bus.
The 2-wire serial bus protocol operates as follows:
1. The master initiates data transfer by establishing a start
condition when a high-to-low transition on the SDA line
occurs while SCL is high. The following byte is the address
byte, which consists of the 7-bit slave address, followed by
an R/W bit. (This bit determines whether data is read from
or written to the slave device.)
The slave with the address corresponding to the transmitted
address responds by pulling SDA low during the ninth
clock pulse (this is termed the acknowledge bit). At this
stage, all other devices on the bus remain idle while the
selected device waits for data to be written to or read from
its shift register.
2. Data is transmitted over the serial bus in sequences of nine
clock pulses (eight data bits, followed by an acknowledge
bit). The transitions on the SDA line must occur during the
low period of SCL and remain stable during the high period
of SCL.
3. When all data bits have been read from or written to, a stop
condition is established. In write mode, the master pulls
the SDA line high during the 10th clock pulse to establish a
stop condition. In read mode, the master issues a No
Acknowledge for the ninth clock pulse, that is, the SDA
line remains high. The master then brings the SDA line low
before the 10th clock pulse and high during the 10th clock
pulse to establish a stop condition.
Read/Write Sequence
For the AD5337/AD5338/AD5339, all write access sequences
and most read sequences begin with the device address (with
R/W = 0), followed by the pointer byte. This pointer byte specifies
which DAC is being accessed in the subsequent read/write
operation (see Figure 31). In a write operation, the data follows
immediately. In a read operation, the address is resent with
R/W = 1, and then the data is read back. However, it is also
possible to perform a read operation by sending only the
address with R/W = 1. The previously loaded pointer settings
are then used for the readback operation. See Figure 32 for a
graphical explanation of the interface.
0
XX
LSBMSB
0 DACB DACA
00
03756-031
Figure 31. Pointer Byte
Tabl e 6 explains the individual bits that make up the pointer byte.
Table 6. Pointer Byte Bits
Pointer Byte Bit Description
X Don’t care bits.
0 This bit is reserved and must be set to 0
DACB 1: The following data bytes are for DAC B.
DACA 1: The following data bytes are for DAC A.
Input Shift Register
The input shift register is 16 bits wide. Data is loaded into the
device as two data bytes on the serial data line, SDA, under the
control of the serial clock input, SCL. The timing diagram for this
operation is shown in Figure 2. The two data bytes consist of four
control bits followed by 8, 10, or 12 bits of DAC data, depending
on the device type. The first two bits loaded are Bit PD1 and
Bit PD0, which control the mode of operation of the device.
See the Power-Down Modes section for a complete description.
Bit 13 is CLR, Bit 12 is LDAC, and the remaining bits are left-
justified DAC data bits, starting with the MSB (see Figure 32).
Table 7. Input Shift Register
Register Setting Result
CLR 0 All DAC registers and input registers are
filled with 0s on completion of the write
sequence.
1 Normal operation.
LDAC 0 The two DAC registers and, therefore, all
DAC outputs, simultaneously updated on
completion of the write sequence.
1
Addressed input register only is updated.
There is no change in the contents of the
DAC registers.
AD5337/AD5338/AD5339
Rev. C | Page 17 of 28
Default Readback Condition
All pointer byte bits power up to 0. Therefore, if the user
initiates a readback without writing to the pointer byte first, no
single DAC channel has been specified. In this case, the default
readback bits are all 0s, except for the CLR bit, which is 1.
Multiple DAC Write Sequence
Because there are individual bits in the pointer byte for each
DAC, it is possible to write the same data and control bits to two
DACs simultaneously by setting the relevant bits to 1.
Multiple DAC Read Back Sequence
If the user attempts to read back data from more than one DAC
at a time, the part reads back the default, power-on reset
conditions, that is, all 0s except for CLR, which is 1.
WRITE OPERATION
When writing to the AD5337/AD5338/AD5339 DACs, the user
must begin with an address byte (R/W = 0), after which the
DAC acknowledges that it is prepared to receive data by pulling
SDA low. This address byte is followed by the pointer byte,
which is also acknowledged by the DAC. Two bytes of data are
then written to the DAC, as shown in Figure 33. A stop
condition follows.
PD0 CLR LDAC D7 D6 D5 D4
PD1
LSB
MSB
PD0 CLR LDAC D9 D8 D7 D6PD1
PD0 D11 D10 D9 D8PD1
MOST SIGNIFICANT DATA BYTE
8-BIT AD5337
LSB
MSB 10-BIT AD5338
LSB
MSB 12-BIT AD5339
CLR LDAC
LE
A
ST SIGNIFICANT DATA BYTE
8-BIT AD5337
D3 D2 D1 D0 X
D5 D4 D3 D2 D1 D0 X X
D7 D6 D5 D4 D3 D2 D1 D0
LSB
MSB
LSB
MSB 10-BIT AD5338
LSB
MSB 12-BIT AD5339
XXX
03756-032
Figure 32. Data Formats for Write and Read Back
000 11XX
SCL
SDA
SCL
SDA
0
03756-033
START
CONDITION
BY
MASTER
ADDRESS BYTE
A0 R/W
MSB
MOST SIGNIFICANT DATA BYTE
LSB
ACK
BY
AD533x
MSBACK
BY
AD533x POINTER BYTE
LSB
ACK
BY
AD533x
MSB
LEAST SIGNIFICANT DATA BYTE
LSB
ACK
BY
AD533x
STOP
CONDITION
BY
MASTER
Figure 33. Write Sequence
AD5337/AD5338/AD5339
Rev. C | Page 18 of 28
READ OPERATION
When reading data back from the AD5337/AD5338/AD5339
DACs, the user begins with an address byte (R/W = 0), after
which the DAC acknowledges that it is prepared to receive data
by pulling SDA low. This address byte is usually followed by the
pointer byte, which is also acknowledged by the DAC. Then, the
master initiates another start condition (repeated start) and the
address is resent with R/W = 1. This is acknowledged by the
DAC indicating that it is prepared to transmit data. Two bytes
of data are then read from the DAC as shown in Figure 34. A
stop condition follows.
Note that in a read sequence, data bytes are the same as those in
the write sequence, except that dont cares are read back as 0s.
However, if the master sends an ACK and continues clocking
SCL (no stop is sent), the DAC retransmits the same two bytes
of data on SDA. This allows continuous read back of data from
the selected DAC register. Alternatively, the user can send a
start followed by the address with R/W = 1. In this case, the
previously loaded pointer settings are used and read back of
data can begin immediately.
LEAST SIGNIFICANT DATA BYTE
000 11 X X
SCL
SDA
SCL
SDA 000 110A0
SCL
SDA
0
03756-034
START
CONDITION
BY
MASTER
ADDRESS BYTE
A0 R/W
MSBACK
BY
AD533x POINTER BYTE
LSB
ACK
BY
AD533x
ADDRESS BYTE
REPEATED
START
CONDITION
BY
MASTER
R/W
ACK
BY
AD533x
MSB
DATA BYTE
LSB
ACK
BY
MASTER
STOP
CONDITION
BY
MASTER
NO
ACK
BY
MASTER
LSBMSB
Figure 34. Read Sequence
AD5337/AD5338/AD5339
Rev. C | Page 19 of 28
DOUBLE-BUFFERED INTERFACE
The AD5337/AD5338/AD5339 DACs have a double-buffered
interface consisting of two banks of registers—an input register
and a DAC register per channel. The input register is directly
connected to the input shift register, and the digital code is
transferred to the relevant input register upon completion of a
valid write sequence. The DAC register contains the digital code
used by the resistor string.
Access to the DAC register is controlled by the LDAC bit.
When the LDAC bit is set high, the DAC register is latched
and therefore, the input register can change state without
affecting the DAC register. This is useful if the user requires
simultaneous updating of all DAC outputs. The user can write
to three of the input registers individually; by setting the LDAC
bit low when writing to the remaining DAC input register, all
outputs update simultaneously.
These parts contain an extra feature whereby the DAC register
is only updated if its input register has been updated since the
last time that LDAC was brought low, thereby removing
unnecessary digital crosstalk.
POWER-DOWN MODES
The AD5337/AD5338/AD5339 have very low power consumption,
typically dissipating 0.75 mW with a 3 V supply and 1.5 mW
with a 5 V supply. Power consumption can be further reduced
when the DACs are not in use by putting them into one of three
power-down modes, which are selected by Bit 15 and Bit 14
(PD1 and PD0) of the data byte. Table 8 shows how the state of
the bits corresponds to the mode of operation of the DAC.
Table 8. PD1/PD0 Operating Modes
PD1 PD0 Operating Mode
0 0 Normal operation
0 1 Power-down (1 kΩ load to GND)
1 0 Power-down (100 kΩ load to GND)
1 1 Power-down (three-state output)
When both bits are 0, the DAC works with its normal power
consumption of 300 μA at 5 V. However, for the three power-
down modes, the supply current falls to 200 nA at 5 V (80 nA
at 3 V). Not only does the supply current drop, but the output
stage is also internally switched from the output of the amplifier
to a resistor network of known values. This is advantageous in
that the output impedance of the part is known while the part is
in power-down mode, which provides a defined input condition
for whatever is connected to the output of the DAC amplifier.
There are three options. The output can be connected internally
to GND through a 1 kΩ resistor, a 100 kΩ resistor, or can be left
open-circuited (three-state). Resistor tolerance = ±20%. The
output stage is illustrated in Figure 35.
AMPLIFIER V
OUT
03756-035
RESISTOR
NETWORK
POWER-DOWN
CIRCUITRY
RESISTOR
STRING DAC
Figure 35. Output Stage During Power-Down
The bias generator, output amplifiers, resistor string, and all
other associated linear circuitry are shut down when power-
down mode is activated. However, the contents of the DAC
registers remain unchanged when power-down mode is activated.
The time to exit power-down is typically 2.5 μs for VDD = 5 V
and 5 μs when VDD = 3 V. This is the time from the rising edge
of the eighth SCL pulse to the time when the output voltage
deviates from its power-down voltage (see Figure 21 for a plot).
AD5337/AD5338/AD5339
Rev. C | Page 20 of 28
APPLICATIONS
TYPICAL APPLICATION CIRCUIT
The AD5337/AD5338/AD5339 can be used with a wide
range of reference voltages for full, one-quadrant multiplying
capability over a reference range of 0 V to VDD. More typically,
these devices are used with a fixed precision reference voltage.
Suitable references for 5 V operation are the AD780, the REF192,
and the ADR391 (2.5 V references). For 2.5 V operation, a
suitable external reference would be the AD589 or AD1580, a
1.23 V band gap reference. Figure 36 shows a typical setup for
the AD5337/AD5338/AD5339 when using an external reference.
Note that A0 can be high or low.
GND
SDA
0.1µF
REFIN
A0
10µF
1µF
SCL
V
OUT
A
V
OUT
B
03756-036
V
DD
=2.5
V
TO 5.5
V
AD780/REF192/ADR391
WITH V
DD
=5V OR
AD589/AD1580 WITH
V
DD
=2.5V
AD5337/
AD5338/
AD5339
SERIAL
INTERFACE
EXT
REF
V
IN
V
OUT
Figure 36. AD5337/AD5338/AD5339 Using External Reference
If an output range of 0 V to VDD is required, the simplest
solution is to connect the reference input to VDD. Because this
supply can be inaccurate and noisy, the AD5337/AD5338/
AD5339 can be powered from a reference voltage, for example,
using a 5 V reference such as the REF195, which provides a
steady output supply voltage. With no load on the DACs, the
REF195 is required to supply 600 μA supply current to the DAC
and 112 μA to the reference input. When the DAC outputs are
loaded, the REF195 also needs to supply the current to the loads;
therefore, the total current required with a 10 kΩ load on each
output is
712 μA + 2 × (5 V/10 kΩ) = 1.7 mA
The load regulation of the REF195 is typically 2 ppm/mA,
which results in an error of 3.4 ppm (17 μV) for the 1.7 mA
current drawn from it. This corresponds to a 0.0009 LSB error
at 8 bits and a 0.014 LSB error at 12 bits.
BIPOLAR OPERATION
The AD5337/AD5338/AD5339 are designed for single-supply
operation, but a bipolar output range is also possible using the
circuit in Figure 37. This circuit gives an output voltage range of
±5 V. Rail-to-rail operation at the amplifier output is achievable
using an AD820 or an OP295 as the output amplifier.
+5V
–5V
10µF
6V TO 12V
AD5339
0.1µF
R1 = 10k
±5V
R2 = 10k
A0
GND
AD1585
+5V
GND
1µF
03756-037
AD820/
OP295
2-WIRE
SERIAL
INTERFACE
SDA
SCL
REFIN V
OUT
B
V
OUT
A
V
DD
V
OUT
V
IN
Figure 37. Bipolar Operation with the AD5339
The output voltage for any input code can be calculated as
follows:
×
+
×
×=
R1
R2
REFIN
R1
R2R1D
REFINV N
OUT 2
where:
D is the decimal equivalent of the code loaded to the DAC.
N is the DAC resolution.
REFIN is the reference voltage input.
With REFIN = 5 V, R1 = R2 = 10 kΩ:
VOUT = (10 × D/2N) − 5
MULTIPLE DEVICES ON ONE BUS
Figure 38 shows two AD5339 devices on the same serial bus.
Each has a different slave address because the state of the A0 pin
is different. This allows each of four DACs to be written to or
read from independently.
PULL-UP
RESISTORS
SCL
SDA
AD5339
A0
AD5339
SCL
SDA
A0
V
DD
MICROCONTROLLER
03756-038
Figure 38. Multiple AD5339 Devices on One Bus
AD5337/AD5338/AD5339
Rev. C | Page 21 of 28
PRODUCT AS A DIGITALLY PROGRAMMABLE
WINDOW DETECTOR
Figure 39 shows a digitally programmable upper/lower limit
detector using the two DACs in the AD5337/AD5338/AD5339.
The upper and lower limits for the test are loaded into DAC A
and DAC B, which, in turn, set the limits on the CMP04. If the
signal at the VIN input is not within the programmed window,
an LED indicates the fail condition.
5
V
GND
REFIN
PASS/FAIL
1/6 74HC05
FAIL PASS
1k
0.1µF
SCL
SDA
SCL
DIN
1k
10µF
03756-039
V
REF
V
IN
1
ADDITIONAL PINS OMITTED FOR CLARITY.
AD5337/
AD5338/
AD5339
1
V
DD
V
OUT
A
V
OUT
B
1/2
CMP04
Figure 39. Window Detection
COARSE AND FINE ADJUSTMENT CAPABILITIES
The two DACs in the AD5337/AD5338/AD5339 can be paired
together to form a coarse and fine adjustment function, as
shown in Figure 40. DAC A is used to provide the coarse
adjustment while DAC B provides the fine adjustment. Varying
the ratio of R1 and R2 changes the relative effect of the coarse
and fine adjustments. With the resistor values and external
reference shown, the output amplifier has unity gain for the
DAC A output, thus, the output range is 0 V to 2.5 V − 1 LSB.
For DAC B, the amplifier has a gain of 7.6 × 10–3, giving DAC B
a range equal to 19 mV.
The circuit is shown with a 2.5 V reference, but reference
voltages up to VDD can be used. The op amps indicated allow
a rail-to-rail output swing.
1µF
REFIN
GND
V
OUT
B
0.1µF 10µF
V
OUT
GND
5V
0
3756-040
V
OUT
AD820/
OP295
R1
390
R2
51.2k
1
ADDITIONAL PINS OMITTED FOR CLARITY.
V
DD
=5
V
EXT
REF
V
IN
V
OUT
A
V
DD
AD5337/
AD5338/
AD5339
1
R4
390
R3
51.2k
AD780/REF192/ADR391
WITH V
DD
=5V
Figure 40. Coarse/Fine Adjustment
POWER SUPPLY DECOUPLING
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The printed circuit board on which the
AD5337/AD5338/AD5339 are mounted should be designed so
that the analog and digital sections are separated and confined
to certain areas of the board. If the AD5337/AD5338/AD5339
are in a system where multiple devices require an AGND-to-
DGND connection, the connection should be made at one
point only. The star ground point should be established as close
as possible to the device. The AD5337/AD5338/AD5339 should
have ample supply bypassing of 10 μF in parallel with 0.1 μF on
the supply located as close to the package as possible, ideally
right up against the device. The 10 μF capacitors are the tantalum
bead type. The 0.1 μF capacitor should have low effective series
resistance (ESR) and low effective series inductance (ESI) to
provide a low impedance path to ground at high frequencies to
handle transient currents due to internal logic switching. The
power supply lines of the AD5337/AD5338/AD5339 should use
as large a trace as possible to provide low impedance paths and
reduce the effects of glitches on the power supply line. Fast
switching signals such as clocks should be shielded with digital
ground to avoid radiating noise to other parts of the board, and
they should never be run near the reference inputs. A ground
line routed between the SDA and SCL lines helps to reduce
crosstalk between them. This is not required on a multilayer
board because there is a separate ground plane, but separating
the lines does help.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
reduces the effects of feedthrough on the board. Using a microstrip
technique is the best solution, but its use is not always possible
with a double-sided board. In this technique, the component
side of the board is dedicated to the ground plane, while signal
traces are placed on the solder side.
AD5337/AD5338/AD5339
Rev. C | Page 22 of 28
Table 9. Overview of All AD53xx Serial Devices
Part No. Resolution (Bits) No. of DACs DNL (LSBs) Interface Settling Time (μs) Package No. of Pins
Single
AD5300 8 1 ±0.25 SPI 4 SOT-23, MSOP 6, 8
AD5310 10 1 ±0.50 SPI 6 SOT-23, MSOP 6, 8
AD5320 12 1 ±1.00 SPI 8 SOT-23, MSOP 6, 8
AD5301 8 1 ±0.25 2-Wire 6 SOT-23, MSOP 6, 8
AD5311 10 1 ±0.50 2-Wire 7 SOT-23, MSOP 6, 8
AD5321 12 1 ±1.00 2-Wire 8 SOT-23, MSOP 6, 8
Dual
AD5302 8 2 ±0.25 SPI 6 MSOP 8
AD5312 10 2 ±0.50 SPI 7 MSOP 8
AD5322 12 2 ±1.00 SPI 8 MSOP 8
AD5303 8 2 ±0.25 SPI 6 TSSOP 16
AD5313 10 2 ±0.50 SPI 7 TSSOP 16
AD5323 12 2 ±1.00 SPI 8 TSSOP 16
AD5337 8 2 ±0.25 2-Wire 6 MSOP 8
AD5338 10 2 ±0.50 2-Wire 7 MSOP 8
AD5338-1 10 2 ±0.50 2-Wire 7 MSOP 8
AD5339 12 2 ±1.00 2-Wire 8 MSOP 8
Quad
AD5304 8 4 ±0.25 SPI 6 MSOP 10
AD5314 10 4 ±0.50 SPI 7 MSOP 10
AD5324 12 4 ±1.00 SPI 8 MSOP 10
AD5305 8 4 ±0.25 2-Wire 6 MSOP 10
AD5315 10 4 ±0.50 2-Wire 7 MSOP 10
AD5325 12 4 ±1.00 2-Wire 8 MSOP 10
AD5306 8 4 ±0.25 2-Wire 6 TSSOP 16
AD5316 10 4 ±0.50 2-Wire 7 TSSOP 16
AD5326 12 4 ±1.00 2-Wire 8 TSSOP 16
AD5307 8 4 ±0.25 SPI 6 TSSOP 16
AD5317 10 4 ±0.50 SPI 7 TSSOP 16
AD5327 12 4 ±1.00 SPI 8 TSSOP 16
Octal
AD5308 8 8 ±0.25 SPI 6 TSSOP 16
AD5318 10 8 ±0.50 SPI 7 TSSOP 16
AD5328 12 8 ±1.00 SPI 8 TSSOP 16
AD5337/AD5338/AD5339
Rev. C | Page 23 of 28
Table 10. Overview of AD53xx Parallel Devices
Additional Pin Functions
Part No. Resolution (Bits) DNL (LSBs)
No. of
VREF Pins
Settling
Time (μs) BUF GAIN HBEN CLR Package No. of Pins
Single
AD5300 8 ±0.25 1 6 * * * TSSOP 20
AD5331 10 ±0.50 1 7 * * TSSOP 20
AD5340 12 ±1.00 1 8 * * * TSSOP 24
AD5341 12 ±1.00 1 8 * * * * TSSOP 20
Dual
AD5332 8 ±0.25 2 6 * TSSOP 20
AD5333 10 ±0.50 2 7 * * * TSSOP 24
AD5342 12 ±1.00 2 8 * * * TSSOP 28
AD5343 12 ±1.00 1 8 * * TSSOP 20
Quad
AD5334 8 ±0.25 2 6 * * TSSOP 24
AD5335 10 ±0.50 2 7 * * TSSOP 24
AD5336 10 ±0.50 4 7 * * TSSOP 28
AD5344 12 ±1.00 4 8 TSSOP 28
Octal
AD5346 8 ±0.25 4 6 * * * TSSOP, LFCSP 38, 40
AD5347 10 ±0.50 4 7 * * * TSSOP, LFCSP 38, 40
AD5348 12 ±1.00 4 8 * * * TSSOP, LFCSP 38, 40
AD5337/AD5338/AD5339
Rev. C | Page 24 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0.95
0.85
0.75
Figure 41. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
AD5337ARM −40°C to +105°C 8-Lead MSOP RM-8 D23
AD5337ARM-REEL7 −40°C to +105°C 8-Lead MSOP RM-8 D23
AD5337ARMZ1−40°C to +105°C 8-Lead MSOP RM-8 D23#
AD5337ARMZ-REEL71−40°C to +105°C 8-Lead MSOP RM-8 D23#
AD5337BRM-REEL −40°C to +105°C 8-Lead MSOP RM-8 D20
AD5337BRM-REEL7 −40°C to +105°C 8-Lead MSOP RM-8 D20
AD5337BRMZ1−40°C to +105°C 8-Lead MSOP RM-8 D20#
AD5337BRMZ-REEL1−40°C to +105°C 8-Lead MSOP RM-8 D20#
AD5337BRMZ-REEL71−40°C to +105°C 8-Lead MSOP RM-8 D20#
AD5338ARM −40°C to +105°C 8-Lead MSOP RM-8 D24
AD5338ARMZ1−40°C to +105°C 8-Lead MSOP RM-8 D5F
AD5338ARMZ-REEL71−40°C to +105°C 8-Lead MSOP RM-8 D5F
AD5338ARMZ-11−40°C to +105°C 8-Lead MSOP RM-8 D57
AD5338ARMZ-1REEL71−40°C to +105°C 8-Lead MSOP RM-8 D57
AD5338BRM −40°C to +105°C 8-Lead MSOP RM-8 D21
AD5338BRM-REEL −40°C to +105°C 8-Lead MSOP RM-8 D21
AD5338BRM-REEL7 −40°C to +105°C 8-Lead MSOP RM-8 D21
AD5338BRMZ1−40°C to +105°C 8-Lead MSOP RM-8 D5H
AD5338BRMZ-11−40°C to +105°C 8-Lead MSOP RM-8 D58
AD5338BRMZ-1REEL71−40°C to +105°C 8-Lead MSOP RM-8 D58
AD5339ARM −40°C to +105°C 8-Lead MSOP RM-8 D25
AD5339ARMZ1−40°C to +105°C 8-Lead MSOP RM-8 D6P
AD5339ARMZ-REEL71−40°C to +105°C 8-Lead MSOP RM-8 D6P
AD5339BRM −40°C to +105°C 8-Lead MSOP RM-8 D22
AD5339BRM-REEL −40°C to +105°C 8-Lead MSOP RM-8 D22
AD5339BRM-REEL7 −40°C to +105°C 8-Lead MSOP RM-8 D22
AD5339BRMZ1−40°C to +105°C 8-Lead MSOP RM-8 D6R
AD5339BRMZ-REEL1−40°C to +105°C 8-Lead MSOP RM-8 D6R
AD5339BRMZ-REEL71−40°C to +105°C 8-Lead MSOP RM-8 D6R
1 Z = RoHS Compliant Part. # denotes lead-free product may be top or bottom marked.
AD5337/AD5338/AD5339
Rev. C | Page 25 of 28
NOTES
AD5337/AD5338/AD5339
Rev. C | Page 26 of 28
NOTES
AD5337/AD5338/AD5339
Rev. C | Page 27 of 28
NOTES
AD5337/AD5338/AD5339
Rev. C | Page 28 of 28
NOTES
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