SPARK GAPS OPERATING TEMP. K30VJ85C FEATURES YVery safe due to self-extinguishing resin YLeakage current is very small. YElectrostatic capacitance is very small. Y Y Y APPLICATIONS YUsed to absorb abnormal voltages in the periphery of a CRT YCRT ORDERING CODE 1 4 6 8 [V] [mm] AG Q C 2 F G M500 M800 Q= 15 20 5 7 [VDC] 122 492 3 1200 4900 QE SE BE 20 f g 15 f g 15 H3D L3N K2M K2U K4M K4U 6.4 6.4 5.0 5.0 6.4 6.4 H K K K K 0.65 0.65 0.60 0.60 0.60 0.60 5.0M0.8 24 20 5.0M1 20 5.0M1 Q= P A G 1 5 P C 1 2 2 F S K K 2 M 1 2 3 6 7 8 1 4 6 8 Type Coating conditions Discharge voltage Tolerance [V] Lead configuration[mm] AG Spark gaps Q C 2 without resin cap with resin cap F G Q=Blank space External dimension 15 20 Type by external dimension 3 Resin material P 480 5 4 Alkyd resin M500 M800 5 7 Nominal discharge starting voltage[VDC] Packaging 122 492 1200 4900 QE SE BE 6 Type 20, bulk Type 15, bulk Type 15, taped Q=Blank space H3D L3N K2M K2U K4M K4U Lead type H-formed Straight K-formed K-formed K-formed K-formed Lead space 6.4 6.4 5.0 5.0 6.4 6.4 Diameter 0.65 0.65 0.60 0.60 0.60 0.60 Length 5.0M0.8 24Min. 20Min. 5.0M1 20Min. 5.0M1 EXTERNAL DIMENSIONS AG20 Type AG15 K Formed Straight H Formed Lead type K2M,K2U,K4M,K4U L3N H3D Capless Thickness of bodyD3.5max f0.138maxg Thickness of bodyD4M0.5 f0.157M0.020g Thickness of bodyD4M0.5 f0.157M0.020g Capped E Thickness of bodyD4M0.5 f0.157M0.020g SURGE ABSORBERS 8 Thickness of bodyD4.7M0.5 f0.184M0.020g Thickness of bodyD4.7M0.5 f0.184M0.020g UnitDmmfinchg PART NUMBERS Type EHS (Environmental Discharge starting voltage fDCg Insulation resistance Lead configuration Hazardous Substances) Nominal value[V] AG15PGRG E RoHS AG20PGR E RoHS 1200 1500 Tolerance[V] [ME]I1 2000 1200 1500 M 500 M 800 2500 2000 M 500 10000min K K Formed 10000min H Straight ,H Formed M 800 2500 GR GPlease specify the coating condition code and Z the discharge starting voltage code and R the tolerance code and G the packaging code and the lead configuration code. fgUL94V-0UL1410fphase ll g NoteDThe material used is a self-extinguishing resin conforming to UL94V-0 and UL1410fphase ll regulationg I1 AG15AG20DC500V20 Selection Guide P.14 Part Numbers P.481 I1 Values of AG15,AG20 are set at DC500V within 20 seconds. Electrical Characteristics P.482 Packaging P.483 Reliability Data Precautions P.484 P.486 etc 481 ELECTRICAL CHARACTERISTICS 482 PACKAGING Minimum Quantity Type Minimum Quantity [pcs] Bulk Taped AG15 1000 1300F AG20 500 ------ K2M Available for K2M type only fK2Mg Taping DimensionsfK2M Typeg 8 SURGE ABSORBERS Symbol Dimensions A 6.8M0.5 f0.268M0.020g B 7.0M0.5 f0.276M0.020g T 4.0M0.5 f0.157M0.020g P 12.7M1.0 f0.500M0.039g P0 12.7M0.3 f0.500M0.012g P1 3.85M0.5 f0.152M0.020g P2 6.35M1.3 f0.250M0.051g F W W0 W1 W2 5.0M0.5 f0.197M0.020g J1.0 18.0 K0.5 J0.039 f0.709 K0.020 g 12.0min f0.472ming 9.0 J0.75 K 0.5 3.0max J0.030 f0.354 K 0.020 g f0.118maxg H 19.6M0.5 f0.772M0.020g H0 16.0M0.5 f0.630M0.020g BD0 4.0M0.3 f0.157M0.012g L 11.0max f0.433maxg b 2.0max f0.079maxg t Qh1 Qh2 d 0.75M0.2 f0.030M0.008g 2.0max f0.079maxg 0.6M0.05 f0.024M0.002g UnitDmmfinchg 483 RELIABILITY DATA SPARK GAPS Item Test Methods and Remarks Specified Value 1.Operating Temperature K30CVJ85C Range 2.Operating Humidity Range 95%RH max. fNo dew condensationg 3.Storage Temperature K40CVJ85C Range 4.Discharge Voltage Within the specified tolerance 5.Insulation Resistance 10,000 ME min. With the Circuit 1 shown below, conduct measurement with voltage application. Applied voltageD500VDC DurationDWithin 20 sec. 6.Capacitance 1pFmax. Measuring frequencyD1M0.1MHz Measuring voltageD0.5V5.0Vrms 8 Bias applicationDNone Life Discharge Voltage with specified voltage, followed by the measurement J20 K35 L Change Insulation within 2 to 5 hrs. Number of dischargeD10,000 times 5000ME Resistance 8.Damp Heat TemperatureD40M2C Discharge Voltage J50 L K30 Change 9.Terminal Strength DurationD250 hrs RecoveryD2 to 5 hrs of recovery under the standard condition after the removal from test chamber. Insulation Resistance HumidityD90V95LRH SURGE ABSORBERS With the Circuit 2 shown below, repeat discharge 7.Discharge 5000ME No damage Apply the tensile force in the direction to draw terminal. Applied forceD9.8N Tensile No damage Apply the bending force to incline the body to right and left through angle of 90 Torsional Applied forceD4.9N Circuit 1 Circuit 2 AG15AG20 AG15AG20 RD20ME RD20ME CD2000pF CD10000pF EDRefer to individual specification Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." 485 1/2 PRECAUTIONS Precautions on the use of Spark Gaps Stages 1. Circuit Design Precautions Technical considerations SVerification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any Spark Gaps to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. SVerification of Rated voltage (DC rated voltage) 1. Spark Gaps has determined electric discharge voltage between metaled Electrode using the insulation resistance of air. Therefore, since a life changes with the energies of input serge, please give me examination enough in the case of use. 2. Since between the Electrode will be in a short state at the time of electric discharge, when using it for a low impedance circuit, the Follow Current occurs and reduce the life of Spark Gaps remarkably. In such a case, please connect low resis- early serge of a standup is actually impressed, since electric discharge delay generates Spark Gaps may become higher than the specified electric discharge start voltage, cautions are required. 4. Since Spark Gaps was developed for serge with small energy, when using it as an object for guidance thunder absorption with the big energy generated on a commercial power supply line, telephone / communication line, etc., it requires cautions enough. SURGE ABSORBERS tance or a capacitive varistor in series. 3. Since the voltage which starts electric discharge when the 8 SOperating Environment precautions 1. Spark Gaps should not be used in the following environments: (1)Environmental conditions to avoid a. exposure to water or salt water. b. exposure to moisture or condensation. c. exposure to corrosive gases (such as hydrogen sulfide, sulfurous acid, chlorine, and ammonia) 2. PCB Design 1. When Spark Gaps are mounted onto a PC board, hole dimensions on the board should match the lead pitch of the component, if not it will cause breakage of the terminals or cracking of terminal roots covered with resin as excess stress travels through the terminal legs. As a result, humidity resistance performance would be lost and may lead to a reduction in insulation resistance and cause a withstand voltage failure. 3. Considerations for automatic insertion SAdjustment Automatic Insertion machines (leaded components) 1. When inserting Spark Gaps in a PC board by auto-insertion machines the impact load imposed on the capacitors should be minimized to prevent the leads from chucking or clinching. 487 2/2 PRECAUTIONS Precautions on the use of Spark Gaps Stages 4. Soldering Precautions SSelection of Flux 1. When soldering Spark Gaps on the board, flux should be applied thinly and evenly. 2. Flux used should be with less than or equal to 0.1 wt% (equivalent to Chroline) of halogenated content. Flux having a strong acidity content should not be applied. 3. When using water-soluble flux, special care should be taken to properly clean the boards. Technical considerations 1. Flux is used to increase solderability in wave soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 2. With too much halogenated substance (Chlorine, etc.) content is used to activate the flux, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. SWave Soldering 1.Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions. 1. If Spark Gaps are used beyond the range of the recommended conditions, heat stresses may cause cracks inside the Spark Gaps, and consequently degrade the reliability of the Spark Gaps. 2. Do not immerse the entire Spark Gaps in the flux during the soldering operation. Only solder the lead wires on the bottom of the board. 8 5. Cleaning SBoard cleaning conditions are consistent with prescribed usage conditions. 6. Post-cleaning-process SApplication of resin molding, etc. to the PCB and components. 1. Please contact your local Taiyo Yuden sales office before performing resin coating or molding on mounted capacitors. Please verify on the actual application that the coating process will not adversely affect the component quality. 7. Handling SMechanical considerations 1. Be careful not to subject the Spark Gaps to excessive mechanical shocks. Withstanding voltage failure may result. 2. If Spark Gaps are dropped onto the floor or a hard surface 1-1. The thermal expansion and coefficient of contraction of the molded resin are not necessarily matched with those of the Spark Gaps. The Spark Gaps may be exposed to stresses due to thermal expansion and contraction during and after hardening. This may lower the specified characteristics and insulation resistance or cause reduced withstand voltage by cracking the ceramic or separating the coated resin from the ceramics. 1-2. With some types of mold resins, the resin's decomposition gas or reaction gas may remain inside the resin during the hardening period or while left under normal conditions, causing a deterioration of the capacitor's performance. 1-3. Some mold resins may have poor moisture proofing properties. Please verify the contents of the resins before they are applied. 1-4. Please contact Taiyo Yuden before using if the hardening process temperature of the mold resins is higher than the operating temperature of the Spark Gaps. SURGE ABSORBERS 1. When cleaning the mounted PC boards, make sure that cleaning 1. The resin material used for the outer coating of capacitors is occasionally a wax substance for moisture resistance which can easily be dissolved by some solutions. So before cleaning, special care should be taken to test the component's vulnerability to the solutions used. When using water-soluble flux please clean the PCB with purified water sufficiently and dry thoroughly at the end of the process. Insufficient washing or drying could lower the reliability of the capacitors. 1. Because the Spark Gaps is made of ceramic, mechanical shocks applied to the board may damage or crack the Spark Gaps. 2.Spark Gaps which are dropped onto the floor or a hard surface may develop defects and have a higher risk of failure over time. they should not be used. 8. Storage conditions SStorage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken 1. Under high temperature/high humidity conditions, the decrease in solderability due to the oxidation of terminal electrodes and deterioration of taping and packaging characteristics may be accelerated. to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions: Ambient temperature Below 40 C Humidity Below 70% RH. Products should be used within 12 months after delivery. After the above period, the solderability should be checked before using the Spark Gaps. 2. Spark Gaps should not be kept in an environment filled with decomposition gases such as (sulfurous hydrogen, sulfurous acid, chlorine, ammonia, etc.) 3. Spark Gaps should not be kept in a location where they may be exposed to moisture, condensation or direct sunlight. 489