480
1
PC122F
2 5 7 8
6
34
K2M
AG SK15
ORDERING CODE
APPLICATIONS
FEATURES
Y
Y
Y
SPARK GAPS
OPERATING TEMP. K30VJ85C
AG
6
[V]
48
F
G
M500
M800
[mm]
H3D
L3N
K2M
K2U
K4M
K4U
H
K
K
K
K
6.4
6.4
5.0
5.0
6.4
6.4
5.0M0.8
24
20
5.0M1
20
5.0M1
0.65
0.65
0.60
0.60
0.60
0.60
2
15
20
P
3
5
[VDC]
7
YCRT
Q=
QE20 f g
SE15 f g
BE15
Q=
Q
C
122 1200
492 4900
YVery safe due to self-extinguishing resin
YLeakage current is very small.
YElectrostatic capacitance is very small.
YUsed to absorb abnormal voltages in the periphery of a CRT
AG Spark gaps
Type Coating conditions
6
48
Lead configuration[mm]
H3D
L3N
K2M
K2U
K4M
K4U
Lead type
H-formed
Straight
K-formed
K-formed
K-formed
K-formed
Lead space
6.4
6.4
5.0
5.0
6.4
6.4
Length
5.0M0.8
24Min.
20Min.
5.0M1
20Min.
5.0M1
Diameter
0.65
0.65
0.60
0.60
0.60
0.60
2
External dimension
15
20
P Alkyd resin
3
Resin material
76
Packaging
QEType 20, bulk
SEType 15, bulk
BEType 15, taped
Q=Blank space
Qwithout resin cap
C with resin cap
1
Type by external
dimension
122 1200
492 4900
Nominal discharge
starting voltage[VDC]
Discharge voltage
Tolerance [V]
F
G
M500
M800
Q=Blank space
5
1
SURGE ABSORBERS
8
481
P.481
Part Numbers
Electrical Characteristics
Packaging
Reliability Data
Precautions
P.482 P.483 P.484 P.486
Selection Guide
P.14
etc
EXTERNAL DIMENSIONS
H Formed
H3D
AG20
AG15
K Formed
K2M,K2U,K4M,K4U
Straight
L3N
Type
Lead type
PART NUMBERS
GR
GPlease specify the coating condition code and Z the discharge starting voltage code and R the tolerance code and G the packaging code and the
lead configuration code.
fgUL94V-0UL1410fphase ll g
NoteDThe material used is a self-extinguishing resin conforming to UL94V-0 and UL1410fphase ll regulationg
I1 AG15AG20DC500V20
Thickness of bodyD4M0.5
Thickness of bodyD4M0.5
UnitDmmfinchg
E
Capless
Capped
Thickness of bodyD3.5max
f0.138maxgf0.157M0.020gf0.157M0.020g
Thickness of bodyD4M0.5
f0.157M0.020g
Thickness of bodyD4.7M0.5
f0.184M0.020g
Thickness of bodyD4.7M0.5
f0.184M0.020g
I1 Values of AG15,AG20 are set at DC500V within 20 seconds.
Type
Discharge starting voltage fDCg
Nominal value[V]
120015002000
2500
120015002000
2500
Tolerance[V]
M 500
M 800
M 500
M 800
Insulation
resistance
[ME]I1
10000min
10000min
Lead configuration
K K Formed
H
Straight ,H Formed
AG15PGRG E
AG20PGR E
EHS
(Environmental
Hazardous
Substances)
RoHS
RoHS
482
特性図 ELECTRICAL CHARACTERISTICS
SURGE ABSORBERS
8
483
梱包 PACKAGING
最小受注単位数 Minimum Quantity
Type
AG15
AG20
袋詰め Bulk
1000
500
テーピング Taped
1300F
------
最小受注単位数 Minimum Quantity [pcs]
※K2Mタイプのみ
記号
Symbol
A
B
T
P
P0
P1
P2
F
W
W0
W1
W2
H
H0
BD0
L
b
t
Qh1
Qh2
d
6.8M0.5 f0.268M0.020g
7.0M0.5 f0.276M0.020g
4.0M0.5 f0.157M0.020g
12.7M1.0 f0.500M0.039g
12.7M0.3 f0.500M0.012g
3.85M0.5 f0.152M0.020g
6.35M1.3 f0.250M0.051g
5.0M0.5 f0.197M0.020g
18.0 f0.709 g
12.0min f0.472ming
9.0 f0.354 g
3.0max f0.118maxg
19.6M0.5 f0.772M0.020g
16.0M0.5 f0.630M0.020g
4.0M0.3 f0.157M0.012g
11.0max f0.433maxg
2.0max f0.079maxg
0.75M0.2 f0.030M0.008g
2.0max f0.079maxg
0.6M0.05 f0.024M0.002g
寸法
Dimensions
J0.039
K0.020
J0.75
K 0.5
J1.0
K0.5
J0.030
K 0.020
テーピング寸法 fK2Mタイプg Taping DimensionsfK2M Typeg
※Available for K2M type only
UnitDmmfinchg
SURGE ABSORBERS
8
485
RELIABILITY DATA
SPARK GAPS
Specified Value
Item Test Methods and Remarks
1.Operating Temperature
Range
2.Operating Humidity Range
3.Storage Temperature
Range
4.Discharge Voltage
5.Insulation Resistance
6.Capacitance
7.Discharge
Life
8.
Damp Heat
9.Terminal
Strength Tensile
Torsional
No damage
No damage
K30CVJ85C
95%RH max. fNo dew condensationg
K40CVJ85C
Within the specified tolerance
10,000 ME min.
1pFmax.
With the Circuit 1 shown below, conduct measure-
ment with voltage application.
Applied voltageD500VDC
DurationDWithin 20 sec.
Measuring frequencyD1M0.1MHz
Measuring voltageD0.5V5.0Vrms
Bias applicationDNone
With the Circuit 2 shown below, repeat discharge
with specified voltage, followed by the measurement
within 2 to 5 hrs.
Number of dischargeD10,000 times
TemperatureD40M2C
HumidityD90V95LRH
DurationD250 hrs
RecoveryD2 to 5 hrs of recovery under the standard
condition after the removal from test chamber.
Apply the tensile force in the direction to draw terminal.
Applied forceD9.8N
Apply the bending force to incline the body to right and left
through angle of 90°
Applied forceD4.9N
Circuit 2Circuit 1
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20M2C
of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
Discharge
Voltage
Change
Insulation
Resistance
Discharge
Voltage
Change
Insulation
Resistance
L
5000ME
5000ME
L
K35
J20
K30
J50
AG15、AG20
RD20ME
CD10000pF
EDRefer to individual specification
AG15、AG20
RD20ME
CD2000pF
PRECAUTIONS
SURGE ABSORBERS
8
487
1/2
Technical considerationsStages Precautions
Precautions on the use of Spark Gaps
1. Circuit Design SVerification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear re-
actors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any Spark Gaps to be
used in such equipment may require higher safety and/or reli-
ability considerations and should be clearly differentiated from
components used in general purpose applications.
SVerification of Rated voltage (DC rated voltage)
1. Spark Gaps has determined electric discharge voltage be-
tween metaled Electrode using the insulation resistance of air.
Therefore, since a life changes with the energies of input serge,
please give me examination enough in the case of use.
2. Since between the Electrode will be in a short state at the time
of electric discharge, when using it for a low impedance cir-
cuit, the Follow Current occurs and reduce the life of Spark
Gaps remarkably. In such a case, please connect low resis-
tance or a capacitive varistor in series.
3. Since the voltage which starts electric discharge when the
early serge of a standup is actually impressed, since electric
discharge delay generates Spark Gaps may become higher
than the specified electric discharge start voltage, cautions
are required.
4. Since Spark Gaps was developed for serge with small en-
ergy, when using it as an object for guidance thunder absorp-
tion with the big energy generated on a commercial power
supply line, telephone / communication line, etc., it requires
cautions enough.
SOperating Environment precautions
1. Spark Gaps should not be used in the following environments:
(1)Environmental conditions to avoid
a. exposure to water or salt water.
b. exposure to moisture or condensation.
c. exposure to corrosive gases (such as hydrogen sulfide, sulfu-
rous acid, chlorine, and ammonia)
2. PCB Design 1. When Spark Gaps are mounted onto a PC board, hole dimen-
sions on the board should match the lead pitch of the compo-
nent, if not it will cause breakage of the terminals or cracking
of terminal roots covered with resin as excess stress travels
through the terminal legs. As a result, humidity resistance
performance would be lost and may lead to a reduction in
insulation resistance and cause a withstand voltage failure.
3. Considerations for automatic
insertion
SAdjustment Automatic Insertion machines (leaded components)
1. When inserting Spark Gaps in a PC board by auto-insertion
machines the impact load imposed on the capacitors should
be minimized to prevent the leads from chucking or clinching.
PRECAUTIONS
SURGE ABSORBERS
8
489
4. Soldering SSelection of Flux
1. When soldering Spark Gaps on the board, flux should be ap-
plied thinly and evenly.
2. Flux used should be with less than or equal to 0.1 wt% (equiva-
lent to Chroline) of halogenated content. Flux having a strong
acidity content should not be applied.
3. When using water-soluble flux, special care should be taken
to properly clean the boards.
SWave Soldering
1.Temperature, time, amount of solder, etc. are specified in
accordance with the following recommended conditions.
2. Do not immerse the entire Spark Gaps in the flux during the
soldering operation. Only solder the lead wires on the bottom
of the board.
1. Flux is used to increase solderability in wave soldering, but if too much is applied, a large
amount of flux gas may be emitted and may detrimentally affect solderability. To mini-
mize the amount of flux applied, it is recommended to use a flux-bubbling system.
2. With too much halogenated substance (Chlorine, etc.) content is used to activate the
flux, an excessive amount of residue after soldering may lead to corrosion of the terminal
electrodes or degradation of insulation resistance on the surface of the capacitors.
3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the
residue on the surface of capacitors in high humidity conditions may cause a degrada-
tion of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered
carefully when selecting water-soluble flux.
1. If Spark Gaps are used beyond the range of the recommended conditions, heat stresses
may cause cracks inside the Spark Gaps, and consequently degrade the reliability of the
Spark Gaps.
5. Cleaning SBoard cleaning
1. When cleaning the mounted PC boards, make sure that cleaning
conditions are consistent with prescribed usage conditions.
1. The resin material used for the outer coating of capacitors is occasionally a wax sub-
stance for moisture resistance which can easily be dissolved by some solutions. So
before cleaning, special care should be taken to test the component’s vulnerability to the
solutions used.
When using water-soluble flux please clean the PCB with purified water sufficiently and
dry thoroughly at the end of the process. Insufficient washing or drying could lower the
reliability of the capacitors.
6. Post-cleaning-process SApplication of resin molding, etc. to the PCB and components.
1. Please contact your local Taiyo Yuden sales office before per-
forming resin coating or molding on mounted capacitors.
Please verify on the actual application that the coating pro-
cess will not adversely affect the component quality.
2/2
1-1. The thermal expansion and coefficient of contraction of the molded resin are not neces-
sarily matched with those of the Spark Gaps. The Spark Gaps may be exposed to
stresses due to thermal expansion and contraction during and after hardening. This
may lower the specified characteristics and insulation resistance or cause reduced with-
stand voltage by cracking the ceramic or separating the coated resin from the ceramics.
1-2. With some types of mold resins, the resin's decomposition gas or reaction gas may
remain inside the resin during the hardening period or while left under normal condi-
tions, causing a deterioration of the capacitor's performance.
1-3. Some mold resins may have poor moisture proofing properties. Please verify the
contents of the resins before they are applied.
1-4. Please contact Taiyo Yuden before using if the hardening process temperature of the
mold resins is higher than the operating temperature of the Spark Gaps.
Technical considerationsStages Precautions
Precautions on the use of Spark Gaps
SMechanical considerations
1. Be careful not to subject the Spark Gaps to excessive me-
chanical shocks. Withstanding voltage failure may result.
2. If Spark Gaps are dropped onto the floor or a hard surface
they should not be used.
1. Because the Spark Gaps is made of ceramic, mechanical shocks applied to the board
may damage or crack the Spark Gaps.
2.Spark Gaps which are dropped onto the floor or a hard surface may develop defects and
have a higher risk of failure over time.
7. Handling
1. Under high temperature/high humidity conditions, the decrease in solderability due to
the oxidation of terminal electrodes and deterioration of taping and packaging character-
istics may be accelerated.
SStorage
1. To maintain the solderability of terminal electrodes and to keep
the packaging material in good condition, care must be taken
to control temperature and humidity in the storage area. Hu-
midity should especially be kept as low as possible. Recom-
mended conditions: Ambient temperature Below 40 C Humid-
ity Below 70% RH. Products should be used within 12 months
after delivery. After the above period, the solderability should
be checked before using the Spark Gaps.
2. Spark Gaps should not be kept in an environment filled with
decomposition gases such as (sulfurous hydrogen, sulfurous
acid, chlorine, ammonia, etc.)
3. Spark Gaps should not be kept in a location where they may
be exposed to moisture, condensation or direct sunlight.
8. Storage conditions
