2SK1315(S) - Hitachi Semiconductor

2SK1315(L)(S), 2SK1316(L)(S)

Silicon N-Channel MOS FET

Application

High speed power switching

Features

• Low on-resistance

• High speed switching

• Low drive current

• No secondary breakdown

• Suitable for switching regulator, DC-DC converter and motor driver

Outline

LDPAK

1. Gate

2. Drain

3. Source

4. Drain

2SK1315(L)(S), 2SK1316(L)(S)

Absolute Maximum Ratings (Ta = 25°C)

Item Symbol Ratings Unit

Drain to source voltage 2SK1315 VDSS 450 V

2SK1316 500

Gate to source voltage VGSS ±30 V

Drain current ID8A

Drain peak current ID(pulse)*132 A

Body to drain diode reverse drain current IDR 8A

Channel dissipation Pch*260 W

Channel temperature Tch 150 °C

Storage temperature Tstg –55 to +150 °C

Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1%

2. Value at TC = 25°C

2SK1315(L)(S), 2SK1316(L)(S)

Electrical Characteristics (Ta = 25°C)

Item Symbol Min Typ Max Unit Test conditions

Drain to source 2SK1315 V(BR)DSS 450 — — V ID = 10 mA, VGS = 0

breakdown voltage 2SK1316 500

Gate to source breakdown

voltage V(BR)GSS ±30——V I

= ±100 µA, VDS = 0

Gate to source leak current IGSS ——±10 µAV

GS = ±25 V, VDS = 0

Zero gate voltage 2SK1315 IDSS — — 250 µAV

DS = 360 V, VGS = 0

drain current 2SK1316 VDS = 400 V, VGS = 0

Gate to source cutoff voltage VGS(off) 2.0 — 3.0 V ID = 1 mA, VDS = 10 V

Static Drain to source 2SK1315 RDS(on) — 0.55 0.7 ΩID = 4 A, VGS = 10 V *1

on state resistance 2SK1316 — 0.60 0.8

Forward transfer admittance |yfs| 4.5 7.5 — S ID = 4 A, VDS = 10 V *1

Input capacitance Ciss — 1150 — pF VDS = 10 V, VGS = 0,

Output capacitance Coss — 340 — pF f = 1 MHz

Reverse transfer capacitance Crss — 55 — pF

Turn-on delay time td(on) — 17 — ns ID = 4 A, VGS = 10 V,

Rise time tr— 55 — ns RL = 7.5 Ω

Turn-off delay time td(off) — 100 — ns

Fall time tf—45—ns

Body to drain diode forward

voltage VDF — 0.9 — V IF = 8 A, VGS = 0

Body to drain diode reverse

recovery time trr — 350 — ns IF = 8 A, VGS = 0,

diF/dt = 100 A/µs

Note: 1. Pulse test

See characteristic curves of 2SK1159, 2SK1160.

2SK1315(L)(S), 2SK1316(L)(S)

0 50 100 150

Case Temperature TC (°C)

Channel Dissipation Pch (W)

Power vs. Temperature Derating

Hitachi Code

JEDEC

EIAJ

Weight

(reference value)

LDPAK (L)

—

1.4 g

Unit: mm

10.2 ± 0.3

0.86

0.76 ± 0.1

2.54 ± 0.5

+ 0.2

– 0.1

1.2 ± 0.2

4.44 ± 0.2

1.3 ± 0.2

2.59 ± 0.2

0.4 ± 0.1

11.0 ± 0.5

8.6 ± 0.3

10.0

11.3 ± 0.5

+ 0.3

– 0.5

(1.4)

1.27 ± 0.2

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,

Hitachi bears no responsibility for problems that may arise with third party’s rights, including

intellectual property rights, in connection with use of the information contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you have

received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,

contact Hitachi’s sales office before using the product in an application that demands especially high

quality and reliability or where its failure or malfunction may directly threaten human life or cause risk

of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,

traffic, safety equipment or medical equipment for life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly

for maximum rating, operating supply voltage range, heat radiation characteristics, installation

conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used

beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable

failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-

safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other

consequential damage due to operation of the Hitachi product.

5. This product is not designed to be radiation resistant.

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written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor

products.

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