1
2
3
45
6
7
8
+In B
–In B
Out B
V+
V–
+In A
–In A
Out A
OPA2348
D PACKAGE
(TOP VIEW)
1
2
3
4
5
6
78
9
10
11
12
13
14
OPA4348
PW PACKAGE
(TOP VIEW)
Out D
–In D
+In D
V–
+In C
–In C
Out C
Out A
–In A
_In A
V+
+In B
–In B
Out B
OPA2348-Q1
OPA4348-Q1
www.ti.com
SBOS465A JANUARY 2009REVISED MARCH 2010
1-MHz 45-µA CMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIER
Check for Samples: OPA2348-Q1,OPA4348-Q1
1FEATURES
Qualified for Automotive Applications
Low Quiescent Current (IQ): 45 µA (Typ)
Low Cost
Rail-to-Rail Input and Output
Single Supply: 2.1 V to 5.5 V
Input Bias Current: 0.5 pA (Typ)
High Speed:Power With Bandwidth: 1 MHz
APPLICATIONS
Portable Equipment
Battery-Powered Equipment
Smoke Alarms
CO Detectors
Medical Instrumentation
DESCRIPTION
The OPAx348 series amplifiers are single-supply low-power CMOS operational amplifiers. Featuring an extended
bandwidth of 1 MHz and a supply current of 45 µA, the OPAx348 is useful for low-power applications on single
supplies of 2.1 V to 5.5 V.
Low supply current of 45 µA and an input bias current of 0.5 pA make the OPAx348 an optimal candidate for
low-power high-impedance applications such as smoke detectors and other sensors.
The OPA2348 is available in the SOIC-8 (D) package, and the OPA4348 is available in the TSSOP-14 (PW)
package. The automotive temperature range of –40°C to 125°C over all supply voltages offers additional design
flexibility.
ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING
SOIC D Reel of 2500 OPA2348AQDRQ1 2348Q
–40°C to 125°C TSSOP PW Reel of 2000 OPA4348AQPWRQ1 OP4348Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2009–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
OPA2348-Q1
OPA4348-Q1
SBOS465A JANUARY 2009REVISED MARCH 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VSSupply voltage, V– to V+ 7.5 V
VIN Input voltage, signal input terminals(2) (V– 0.5 V) to (V+ + 0.5 V)
IIN Input current, signal input terminals(2) 10 mA
Output short-circuit duration(3) Continuous
D package 97.1°C/W
qJA Thermal impedance, junction to free air(4) PW package 100°C/W
TAOperating free-air temperature –40°C to +150°C
TSTG Storage temperature –65°C to +150°C
TJOperating virtual-junction temperature 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current-limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
(4) The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT
VSSupply voltage, V– to V+ 2.1 5.5 V
TAOperating free-air temperature –40 125 °C
2Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA2348-Q1 OPA4348-Q1
OPA2348-Q1
OPA4348-Q1
www.ti.com
SBOS465A JANUARY 2009REVISED MARCH 2010
ELECTRICAL CHARACTERISTICS
VS= 2.5 V to 5.5 V, RL= 100 kconnected to VS/2, VOUT = VS/2 (unless otherwise noted)
PARAMETER TEST CONDITIONS TA(1) MIN TYP MAX UNIT
25°C 1 5
VOS Input offset voltage VS= 5 V, VCM = (V–) + 0.8 V mV
Full range 6
ΔVOS/ Offset voltage drift over Full range 4 µV/°C
ΔT temperature
25°C 60 175
Offset voltage drift vs power
PSRR VS= 2.5 V to 5.5 V, VCM < (V+) 1.7 V µV/V
supply Full range 300
dc 25°C 0.2 µV/V
Offset voltage channel
separation f = 1 kHz 25°C 134 dB
Input common-mode
VCM 25°C (V–) 0.2 (V+) + 0.2 V
voltage range
25°C 70 82
(V–) 0.2 V < VCM < (V+) 1.7 V Full range 66
Input common-mode
CMRR dB
rejection ratio VS= 5.5 V, (V–) 0.2 V < VCM < (V+) + 0.2 V 25°C 60 71
VS= 5.5 V, (V–) < VCM < (V+) Full range 56
IBInput bias current 25°C ±0.5 ±10 pA
IOS Input offset current 25°C ±0.5 ±10 pA
Differential 1013||3
ZIInput impedance 25°C ||pF
Common-mode 1013||3
Input voltage noise VCM < (V+) 1.7 V, f = 0.1 Hz to 10 Hz 25°C 10 µVPP
VnInput voltage noise density VCM < (V+) 1.7 V, f = 1 kHz 25°C 35 nV/Hz
InInput current noise density VCM < (V+) 1.7 V, f = 1 kHz 25°C 4 fA/Hz
25°C 94 108
VS= 5 V, RL= 100 k, 0.025 V < VO< 4.975 V Full range 90
AOL Open-loop voltage gain dB
25°C 90 98
VS= 5V, RL= 5 k, 0.125 V < VO< 4.875 V Full range 88
25°C 18 25
RL = 100 k, AOL > 94 dB Full range 25
Voltage output swing from mV
rail 25°C 100 125
RL = 5 k, AOL > 90 dB Full range 125
ISC Output short-circuit current 25°C ±10 mA
CLOAD Capacitive load drive See Typical Characteristics 25°C
GBW Gain-bandwidth product CL= 100 pF 25°C 1 MHz
SR Slew rate CL= 100 pF, G = +1 25°C 0.5 V/µs
0.1% 5
tsSettling time CL= 100 pF, VS= 5.5 V, 2V- step, G = +1 25°C µs
0.01% 7
Overload recovery time VIN × Gain > VS25°C 1.6 µs
Total harmonic distortion
THD+N CL= 100 pF, VS= 5.5 V, VO= 3 VPP, G = +1, f = 1 kHz 25°C 0.0023 %
plus noise
25°C 45 65
IQQuiescent current Per amplifier µA
Full range 75
(1) Full range TA= –40°C to 125°C
Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): OPA2348-Q1 OPA4348-Q1
PSRR AND CMRR vs FREQUENCY
10
PSRR, CMRR (dB)
Frequency (Hz)
100 1k 10k 100k 1M 10M
100
80
60
40
20
0
PSRR
CMRR
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
Output Voltage (Vp-p)
Frequency (Hz)
1k 10k 1M100k 10M
6
5
4
3
2
1
0
V
S
= 5.5V
V
S
= 5V
V
S
= 2.5V
CHANNEL SEPARATION vs FREQUENCY
10
Channel Separation (dB)
Frequency (Hz)
100 1k 10k 100k 1M 10M
140
120
100
80
60
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
0
Output Voltage Swing (V)
Output Current (mA)
5 10
–40°C
–40°C
+125°C
+125°C
+25°C
VS= ±2.5V
+25°C
15 20
2.5
2
1.5
1
0.5
0
–0.5
–1
–1.5
–2
–2.5
Sourcing Current
Sinking Current
OPEN-LOOP GAIN AND PHASE vs FREQUENCY
0.1
Open-Loop Gain (dB)
0
–45
–90
–135
–180
Phase (°)
Frequency (Hz)
1 10010 10k1k 100k 1M 10M
140
120
100
80
60
40
20
0
–20
Gain
Phase
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE
2
Quiescent Current (µA)
13
10
7
4
1
Short-Circuit Current (mA)
Supply Voltage (V)
2.5 3 3.5 4 4.5 5 5.5
65
55
45
35
25
IQ
ISC
OPA2348-Q1
OPA4348-Q1
SBOS465A JANUARY 2009REVISED MARCH 2010
www.ti.com
TYPICAL CHARACTERISTICS
TA= 25°C, RL= 100 kconnected to VS/2, VOUT = VS/2 (unless otherwise noted)
4Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA2348-Q1 OPA4348-Q1
OPEN-LOOP GAIN AND PSRR vs TEMPERATURE
–75
Open-Loop Gain and
Power Supply Rejection (dB)
Temperature (°C)
–50 –25 0 25 50 75 100 125 150
130
120
110
100
90
80
70
60
A
OL
, R
L
= 100k
A
OL
, R
L
= 5k
PSRR
OFFSET VOLTAGE DRIFT MAGNITUDE
PRODUCTION DISTRIBUTION
Percentage of Amplifiers (%)
Offset Voltage Drift (µV/°C)
1 2 3 4 5 6 7 8 9 10 11 12
25
20
15
10
5
0
Typical production
distribution of
packaged units.
COMMON-MODE REJECTION vs TEMPERATURE
–75
Common-Mode Rejection (dB)
Temperature (°C)
–50 –25 0 25 50 75 100 125 150
100
90
80
70
60
50
V– < VCM < (V+) 1.7V
V– < VCM < V+
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs TEMPERATURE
Quiescent Current (µA)
Temperature (°C)
ISC
IQ
75
65
55
45
35
25
15
Short-Circuit Current (mA)
16
14
12
10
8
6
4
–75 –50 –25 0 25 50 75 100 125 150
INPUT BIAS (IB) CURRENT vs TEMPERATURE
Input Bias Current (pA)
10k
1k
100
10
1
0.1
–75
Temperature (°C)
–50 –25 0 25 50 75 100 125 150
–6 –5 –4 –3 –2 –1 0 1 2 3 4 5 6
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Offset Voltage (mV)
20
18
16
14
12
10
8
6
4
2
0
Percent of Amplifiers (%)
Typical production
distribution of
packaged units.
OPA2348-Q1
OPA4348-Q1
www.ti.com
SBOS465A JANUARY 2009REVISED MARCH 2010
TYPICAL CHARACTERISTICS (continued)
TA= 25°C, RL= 100 kconnected to VS/2, VOUT = VS/2 (unless otherwise noted)
Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): OPA2348-Q1 OPA4348-Q1
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
10
Small-Signal Overshoot (%)
Load Capacitance (pF)
100 1k 10k
60
50
40
30
20
10
0
G = +1V/V, RL= 100kW
G = –1V/V, RFB = 5kW
G = –1V/V, RFB = 100kW
PERCENT OVERSHOOT vs LOAD CAPACITANCE
Overshoot (%)
Load Capacitance (pF)
10 100 1k 10k
60
50
40
30
20
10
0
G = ±5V/V, R FB = 100kW
SMALL-SIGNAL STEP RESPONSE
G = +1V/V, R L= 100kW, CL= 100pF
20mV/div
2µs/div
LARGE-SIGNAL STEP RESPONSE
G = +1V/V, R L= 100kW, CL= 100pF
500mV/div
10µs/div
INPUT CURRENT AND VOLTAGE NOISE
SPECTRAL DENSITY vs FREQUENCY
1
Voltage Noise (nV/ Hz)
Current Noise (fA Hz)
Frequency (Hz)
10 100 1k 10k 100k
10k
1k
100
10
1k
100
10
1
VN
IN
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
10
Total Harmonic Distortion + Noise (%)
Frequency (Hz)
100 1k 10k 100k
1.000
0.100
0.010
0.001
OPA2348-Q1
OPA4348-Q1
SBOS465A JANUARY 2009REVISED MARCH 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TA= 25°C, RL= 100 kconnected to VS/2, VOUT = VS/2 (unless otherwise noted)
6Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA2348-Q1 OPA4348-Q1
5V
1V/div
0V
G = +1V/V, V
S
= +5V
20µs/div
Output (Inverted on Scope)
OPA2348-Q1
OPA4348-Q1
www.ti.com
SBOS465A JANUARY 2009REVISED MARCH 2010
APPLICATION INFORMATION
OPA2348 op amps are unity-gain stable and suitable for a wide range of general-purpose applications.
The OPA2348 features wide bandwidth and unity-gain stability with rail-to-rail input and output for increased
dynamic range. Figure 1 shows the input and output waveforms for the OPA2348 in unity-gain configuration.
Operation is from a single 5-V supply with a 100-kload connected to VS/2. The input is a 5-VPP sinusoid.
Output voltage is approximately 4.98 VPP.
Power-supply pins should be bypassed with 0.01-µF ceramic capacitors.
Figure 1. Rail-to-Rail Input/Output
Operating Voltage
OPA2348 op amps are fully specified and tested from 2.5 V to 5.5 V. However, supply voltage may range from
2.1 V to 5.5 V. Parameters are tested over the specified supply range, a unique feature of the OPA2348. In
addition, all temperature specifications apply from –40°C to 125°C. Most behavior remains virtually unchanged
throughout the full operating voltage range. Parameters that vary significantly with operating voltages or
temperature are shown in the Typical Characteristics.
Common-Mode Voltage Range
The input common-mode voltage range of the OPA2348 extends 200 mV beyond the supply rails. This is
achieved with a complementary input stage—an N-channel input differential pair in parallel with a P-channel
differential pair. The N-channel pair is active for input voltages close to the positive rail, typically (V+) 1.2 V to
300 mV above the positive supply, while the P-channel pair is on for inputs from 300 mV below the negative
supply to approximately (V+) 1.4 V. There is a small transition region, typically (V+) 1.4 V to (V+) 1.2 V, in
which both pairs are on. This 200-mV transition region, shown in Figure 2, can vary ±300 mV with process
variation. Thus, the transition region (both stages on) can range from (V+) 1.7 V to (V+) 1.5 V on the low end,
up to (V+) 1.1 V to (V+) 0.9 V on the high end. Within the 200-mV transition region, PSRR, CMRR, offset
voltage, offset drift, and THD may be degraded compared to operation outside this region.
Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): OPA2348-Q1 OPA4348-Q1
0.5
Offset Voltage (mV)
Common-Mode Voltage (V)
OFFSET VOLTAGE
vs FULL COMMON-MODE VOLTAGE RANGE
0
V–
0.5 1.51 2.52 3.53 4.5 54 5.5
2
1.5
1
0.5
0
–0.5
–1
1.5
–2
V+
5V
1V/div
0V
G = +1V/V, V S= +5V
10µs/div
VIN
VOUT
5kW
1/2
OPA2348
10mA max
+5V
V
IN
V
OUT
I
OVERLOAD
OPA2348-Q1
OPA4348-Q1
SBOS465A JANUARY 2009REVISED MARCH 2010
www.ti.com
Figure 2. Behavior of Typical Transition Region at Room Temperature
Rail-to-Rail Input
The input common-mode range extends from (V–) 0.2 V to (V+) + 0.2 V. For normal operation, inputs should
be limited to this range. The absolute maximum input voltage is 500 mV beyond the supplies. Inputs greater than
the input common-mode range but less than the maximum input voltage, while not valid, do not cause any
damage to the op amp. Unlike some other op amps, if input current is limited the inputs may go beyond the
power supplies without phase inversion, as shown in Figure 3.
Figure 3. No Phase Inversion With Inputs Greater Than Power-Supply Voltage
Normally, input currents are 0.5 pA. However, large inputs (greater than 500 mV beyond the supply rails) can
cause excessive current to flow in or out of the input pins. Therefore, as well as keeping the input voltage below
the maximum rating, it is also important to limit the input current to less than 10 mA. This is easily accomplished
with an input voltage resistor, as shown in Figure 4.
Figure 4. Input Current Protection for Voltages Exceeding the Supply Voltage
8Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA2348-Q1 OPA4348-Q1
RI
1/2
OPA2348
VIN
VOUT
RF
CFB
CIN
CL
OPA2348-Q1
OPA4348-Q1
www.ti.com
SBOS465A JANUARY 2009REVISED MARCH 2010
Rail-to-Rail Output
A class AB output stage with common-source transistors is used to achieve rail-to-rail output. This output stage is
capable of driving 5-kloads connected to any potential between V+ and ground. For light resistive loads
(>100 k), the output voltage can typically swing to within 18 mV from supply rail. With moderate resistive loads
(10 kto 50 k), the output voltage can typically swing to within 100 mV of the supply rails while maintaining
high open-loop gain (see the typical characteristic "Output Voltage Swing vs Output Current").
Capacitive Load and Stability
The OPA2348 in a unity-gain configuration can directly drive up to 250-pF pure capacitive load. Increasing the
gain enhances the amplifier’s ability to drive greater capacitive loads (see the typical characteristic "Small-Signal
Overshoot vs Capacitive Load"). In unity-gain configurations, capacitive load drive can be improved by inserting a
small (10 to 20 ) resistor, RS, in series with the output, as shown in Figure 5. This significantly reduces
ringing while maintaining dc performance for purely capacitive loads. However, if there is a resistive load in
parallel with the capacitive load, a voltage divider is created, introducing a direct current (dc) error at the output
and slightly reducing the output swing. The error introduced is proportional to the ratio RS/RLand is generally
negligible.
Figure 5. Series Resistor in Unity-Gain Buffer Configuration Improves Capacitive Load Drive
In unity-gain inverter configuration, phase margin can be reduced by the reaction between the capacitance at the
op amp input and the gain setting resistors, thus degrading capacitive load drive. Best performance is achieved
by using small-valued resistors. For example, when driving a 500-pF load, reducing the resistor values from
100 kto 5 kdecreases overshoot from 55% to 13% (see the typical characteristic "Small-Signal Overshoot
vs. Load Capacitance"). However, when large valued resistors cannot be avoided, a small (4 pF to 6 pF)
capacitor, CFB, can be inserted in the feedback, as shown in Figure 6. This significantly reduces overshoot by
compensating the effect of capacitance, CIN, which includes the amplifier's input capacitance and PC board
parasitic capacitance.
Figure 6. Improving Capacitive Load Drive
Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): OPA2348-Q1 OPA4348-Q1
ADS7822
12-Bit A/D
DCLOCK
DOUT
CS/SHDN
1/2
OPA2348
+5V
VIN
V+
2
+In
3
–In
VREF
8
4GND
Serial
Interface
1
0.1µF 0.1µF
7
6
5
NOTE: A/D Input = 0 to V REF
VIN = 0 V to 5 V for
0-V to 5-V output.
RC network filters high-frequency noise.
500W
3300pF
C
3
33pF
V+
GND
3
18
4
5
6
7
–IN
+IN
2
C
2
DCLOCK
Serial
Interface
1000pF
R
1
1.5kW
R
4
20kW
R
5
20kW
R
6
100k
R
8
150kW
R
9
510kW
R
7
51kW
D
OUT
V
REF
V+ = +2.7V to 5V
CS/SHDN
C1
1000pF
Electret
Microphone
(1)
G = 100
Passband 300Hz to 3kHz
R
3
1MW
R
2
1MW
(1) Electret microphone powered by R .
1
ADS7822
12-Bit A/D
1/2
OPA2348
1/2
OPA2348
OPA2348-Q1
OPA4348-Q1
SBOS465A JANUARY 2009REVISED MARCH 2010
www.ti.com
Driving Analog-to-Digital Converters (ADCs)
The OPA2348 op amps are optimized for driving medium-speed sampling ADCs. The OPA2348 op amps buffer
the ADC input capacitance and resulting charge injection while providing signal gain.
Figure 7 shows the OPA2348 in a basic noninverting configuration driving the ADS7822. The ADS7822 is a
12-bit, micropower sampling converter in the MSOP-8 package. When used with the low-power miniature
packages of the OPA348, the combination is ideal for space-limited, low-power applications. In this configuration,
an RC network at the ADC input can be used to provide for anti-aliasing filter and charge injection current.
Figure 7. Noninverting Configuration Driving ADS7822
The OPA2348 can also be used in noninverting configuration driving ADS7822 in limited low-power applications.
In this configuration, an RC network at the ADC input can be used to provide for antialiasing filter and charge
injection current. See Figure 7 for the OPA2348 driving an ADS7822 in a speech bandpass filtered data
acquisition system. This small low-cost solution provides the necessary amplification and signal conditioning to
interface directly with an electret microphone. This circuit operates with VS= 2.7 V to 5 V with less than 250-µA
typical quiescent current.
Figure 8. Speech Bandpass Filtered Data Acquisition System
10 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA2348-Q1 OPA4348-Q1
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
OPA2348AQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA4348AQPWRQ1 ACTIVE TSSOP PW 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA2348-Q1, OPA4348-Q1 :
Catalog: OPA2348,OPA4348
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2010
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA2348AQDRQ1 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA4348AQPWRQ1 TSSOP PW 14 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2348AQDRQ1 SOIC D 8 2500 367.0 367.0 35.0
OPA4348AQPWRQ1 TSSOP PW 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated