Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 1 of 5 April 2007
AP504
DCS-band 4W HBT Amplifier Module
Product Features
1705 – 1790 MHz
31.5 dB Gain
+25 dBm CDMA2k 7fa Power
(-63 dBc ACPR)
+12 V Single Supply
Power Down Mode
Bias Current Adjustable
RoHS-compliant flange-mount pkg
Applications
Final stage amplifiers for Repeaters
Optimized for driver amplifier PA
mobile infrastructure
Product Description
The AP504 is a high dynamic range power amplifier in a
RoHS-compliant flange-mount package. The multi-stage
amplifier module has 31.5 dB gain. The module has been
internally optimized for linearity to provide +25 dBm (-63
dBc ACPR) linear power for 7-carrier CDMA2000
applications.
The AP504 uses a high reliability InGaP/GaAs HBT
process technology and does not require any external
matching components. The module operates off of a +12V
supply and does not requiring any negative biasing voltages;
an internal active bias allows the amplifier to maintain high
linearity over temperature. It has the added feature of a
+5V power down control pin. While the module has been
tuned for optimal performance for Class AB applications,
the quiescent current can also be adjusted for Class B
applications through an external resistor. A low-cost metal
housing allows the device to have a low thermal resistance
and achieves over 100 years MTTF. All devices are 100%
RF and DC tested.
The AP504 is targeted for use as a driver or final stage
amplifier in wireless infrastructure where high linearity and
high power is required. This combination makes the device
an excellent candidate for next generation multi-carrier 3G
base stations using the DCS1800 frequency band.
Functional Diagram
Top View
Pin No. Function
1 RF Output
2 / 4 Vcc
3 / 5 Vpd
6 RF Input
Case Ground
Specifications (1)
25 ºC, Vcc=12V, Vpd=5V, Icq=835mA, R7=0, 50 unmatched fixture
Parameter Units Min Typ Max Test Conditions
Operational Bandwidth MHz 1705 – 1790
Test Frequency MHz 1765
Adjacent Channel Power Ratio dBc -63.2 -61 CDMA2000 7fa 25 dBm Total Power, 885 kHz offset
Power Gain dB 30.5 31.5 35.5 Pout = +25 dBm
Input Return Loss dB 11
Output Return Loss dB 5
Output P1dB dBm +36
Output IP3 dBm +52 Pout = +23 dBm/tone, f = 1 MHz
Operating Current (2) mA 790 850 940 Pout = +25 dBm
Quiescent Current, Icq (2) mA 780 835 920
Device Voltage, Vcc V +12
Device Voltage, Vpd V +5 Pull-down voltage: 0V = “OFF”, 5V=”ON”
Load Stability VSWR 10:1
1. Test conditions unless otherwise noted: 25ºC.
2. The current can be adjusted through an external resistor from the 5V supply to the pull-down voltage pin (pin 3).
Absolute Maximum Rating
Parameter Rating
Operating Case Temperature -40 to +85 °C
Storage Temperature -55 to +150 °C
RF Input Power (continuous)
with output terminated in 50 +15 dBm
Operation of this device above any of these parameters may cause permanent damage.
Ordering Information
Part No. Description
AP504 DCS-band 4W HBT Amplifier Module
AP504-PCB Fully-Assembled Evaluation Board
(Class AB configuration, Icq=835mA)
1 2 3 4 5 6
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 2 of 5 April 2007
AP504
DCS-band 4W HBT Amplifier Module
Performance Graphs – Class AB Configuration (AP504-PCB)
The AP504-PCB and AP504 module is configured for Class AB by default. The resistor – R7 – which sets the current draw for
the amplifier is set at 0 in this configuration. Increasing that value will decrease the quiescent and operating current of the
amplifier module, as described on the next page.
Notes:
1. Please note that for reliable operation, the evaluation board will have
to be mounted to a much larger heat sink during operation and in
laboratory environments to dissipate the power consumed by the
device. The use of a convection fan is also recommended in
laboratory environments. Details of the mounting holes used in the
WJ heatsink are given on the last page of this datasheet.
2. The area around the module underneath the PCB should not contain
any soldermask in order to maintain good RF grounding.
3. For proper and safe operation in the laboratory, the power-on
sequencing should be followed:
1. Connect RF In and Out
2. Connect the voltages and ground pins as shown in the circuit.
3. Apply the RF signal
4. Power down with the reverse sequence
Gain
+25 °C, 12Vcc, Icq=850mA
28
29
30
31
32
33
1700 1720 1740 1760 1780 1800
Frequency (MHz)
G a in ( d B )
Return Loss
+25 °C, Vcc=12V, Icq=850mA
-25
-20
-15
-10
-5
0
1700 1720 1740 1760 1780 1800
Frequency (MHz)
M a g n it u d e ( d B )
S11 S22
Gain vs. Temp
1765 MHz, Vcc=12V, Icq=850mA
26
28
30
32
34
36
-40 -20 0 20 40 60 80
Temperature (°C)
G a in (d B )
ACPR vs. Output Power vs. Temp
CDMA2000 SR1, 7FA , fc=1765 MHz,
f=±885 kHz, Vcc=12V, Icq=850mA
-70
-65
-60
-55
-50
18 20 22 24 26 28
Total Output Power (dBm)
A C P R (d B c )
-40 °C
+25 °C
+85 °C
ACPR vs. Output Power vs. Temp
CDMA2000 SR1, 7FA , fc=1765 MHz,
f=±1.98 MHz, Vcc=12V, Icq=850mA
-70
-65
-60
-55
-50
18 20 22 24 26 28
Total Output Power (dBm)
A C P R (d B c )
-40 °C
+25 °C
+85 °C
ACPR vs. Frequency vs. Temp
CDMA2000 SR1, 7FA ,
f=±885 kHz, 25 dBm Pout, Vcc=12V, Icq=850mA
-70
-65
-60
-55
-50
1750 1760 1770 1780
Frequency (MHz)
A C P R (d B c )
-40 °C
+25 °C
+85 °C
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
0
0
0
0
10
µ
F
.01
µ
F
.01
µ
F
100pF
100pF
+12V
+12V
GND
+5V
6
5
4
2
3
1
RF IN RF OUT
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 3 of 5 April 2007
AP504
DCS-band 4W HBT Amplifier Module
Performance Graphs (cont’d)
ACPR vs. Output Power
CDMA2000 SR1, 1FA , fc=1765 MHz,
+25 °
°°
°C, Vcc=12V, Icq=850mA
-90
-80
-70
-60
18 20 22 24 26
Total Output Power (dBm)
A C P R (d B c )
1.98 MHz offset
885 kHz offset
Icc vs. Output Power
1765 MHz, Vcc=12V, Icq=850mA
760
780
800
820
840
860
18 20 22 24 26 28
Output Channel Power (dBm)
Icc (m A )
-40 °C +25 °C +85 °C
Icc / PAE vs. Output Power
1765 MHz, +25 °C, Vcc=12V, Icq=850mA
0
0.2
0.4
0.6
0.8
1
20 22 24 26 28 30 32 34
Output Power (dBm)
Icc (m A ) / P A E
PAE
Icc
Output Power / Gain vs. Input Power
1765 MHz, +25 °C, Vcc=12V, Icq=850mA
28
30
32
34
36
38
-4 -2 0 2 4 6
Input Power (dBm)
G a in ( d B ) / P o u t (d B m )
Pout
Gain
IMD vs. Output Power per tone
1765 MHz, +25 °C, Vcc=12V, Icq=850mA
-80
-70
-60
-50
-40
-30
18 20 22 24 26 28
Output Power per tone (dBm)
IM D (d B )
IMD3_Upper
IMD3_Lower
IMD5
OIP3 vs. Output Power per tone
1765 MHz, +25 °C, Vcc=12V, Icq=850mA
30
35
40
45
50
55
18 20 22 24 26 28
Output Power per tone (dBm)
O IP 3 (d B m )
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 4 of 5 April 2007
AP504
DCS-band 4W HBT Amplifier Module
MTTF Calculation
The MTTF of the AP504 can be calculated by first
determining how much power is being dissipated by the
amplifier module. Because the device’s intended application
is to be a power amplifier pre-driver or final stage output
amplifier, the output RF power of the amplifier will help
lower the overall power dissipation. In addition, the
amplifier can be biased with different quiescent currents, so
the calculation of the MTTF is custom to each application.
The power dissipation of the device can be calculated with
the following equation:
Pdiss = Vcc * Icc – (Output RF Power – Input RF Power),
Vcc = Operating supply voltage = 12V
Icc = Operating current
{The RF power is converted to Watts}
While the maximum recommended case temperature on the
datasheet is listed at 85 ˚C, it is suggested that customers
maintain an MTTF above 1 million hours. This would
convert to a derating curve for maximum case temperature vs.
power dissipation as shown in the plot below.
Maximum Recommended Case Temperature vs. Power Dissipation
to maintain 1 million hours MTTF
50
60
70
80
90
4 5 6 7 8 9 10 11 12
Power Dissipation (Watts)
Maximum Case Temperature (°C)
To calculate the MTTF for the module, the junction
temperature needs to be determined. This can be easily
calculated with the module’s power dissipation, the thermal
resistance value, and the case temperature of operation:
Tj = Pdiss * Rth + Tcase
Tj = Junction temperature
Pdiss = Power dissipation (calculated from above)
Rth = Thermal resistance = 9 ˚C/W
Tcase = Case temperature of module’s heat sink
From a numerical standpoint, the MTTF can be calculated
using the Arrhenius equation:
MTTF = A* e(Ea/k/Tj)
A = Pre-exponential Factor = 6.087 x 10-11 hours
Ea = Activation Energy = 1.39 eV
k = Boltzmann’s Constant = 8.617 x 10-5 eV/ ºK
Tj = Junction Temperature (ºK) = Tj (ºC) + 273
A graphical view of the MTTF can be shown in the plot
below.
MTTF vs. Junction Temperature
1.E+05
1.E+06
1.E+07
130 140 150 160 170 180
Junction Temperature (°C)
MTTF (hours)
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 5 of 5 April 2007
AP504
DCS-band 4W HBT Amplifier Module
Outline Drawing
2 3 4 56
1
AP504
Outline Drawing for the Heatsink with the
WJ Evaluation Board
Product Marking
The device will be marked with an “AP504” designator
with an alphanumeric lot code on the top surface of the
package noted as “ABCD” on the drawing. A
manufacturing date will also be printed as “XXYY”, where
the “XX” represents the week number from 1 – 52.
The product will be shipped in tubes in multiples of 15.
ESD / MSL Information
ESD Rating: Class 1C
Value: Passes at 1,000 to < 2,000 volts
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class III
Value: Passes 500 to < 1,000 volts
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101