ZXSDS2M832TA - Zetex Semiconductors

SEMICONDUCTORS

SUMMARY

Schottky Diode - VR= 60V; VF= 600mV(@1A); IC=1.65A

DESCRIPTION

Packaged in the new innovative 3x2 MLP (Micro Leaded Package) outline, this

combination dual comprises two 60V 0.9A Schottky barrier diodes. This excellent

combination provides users with highly efficient performance in applications

including DC-DC converters and charging circuits.

Additionally users gain several other key benefits:

Performance capability equivalent to much larger packages

Improved circuit efficiency & power levels

PCB area and device placement savings

Lower Package Height (0.9mm nom)

Reduced component count

FEATURES

•Extremely Low VF, fast switching Schottky

•IF= 1.65A Continuous Forward Current

•3mm x 2mm MLP

APPLICATIONS

•DC-DC Converters

•DC-DC Modules

•Mosfet gate drive circuits

•Charging circuits

•Mobile Phones

•Motor Control

DEVICE MARKING

•DS2

ZXSDS2M832

ISSUE 2 June 2003

MPPS™ Miniature Package Power Solutions

DUAL 60V, 1.65A SCHOTTKY DIODE COMBINATION

DEVICE REEL

SIZE TAPE

WIDTH QUANTITY

PER REEL

ZXSDS2M832TA 7” 8mm 3000 units

ZXSDS2M832TC 13” 8mm 10000 units

ORDERING INFORMATION

Bottom View

PINOUT

MLP832

ZXSDS2M832

SEMICONDUCTORS

ISSUE 2 June 2003

PARAMETER SYMBOL VALUE UNIT

Junction to Ambient (a)(f) R␪JA 83.3 °C/W

Junction to Ambient (b)(f) R␪JA 51 °C/W

Junction to Ambient (c)(f) R␪JA 125 °C/W

Junction to Ambient (d)(f) R␪JA 111 °C/W

Junction to Ambient (d)(g) R␪JA 73.5 °C/W

Junction to Ambient (e)(g) R␪JA 41.7 °C/W

NOTES

(a) For a dual device surface mounted on 8 sq. cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the center line into two separate areas with one half connected to each half of the dual device.

(b) Measured at t<5 secs for a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed

pads attached. The copper area is split down the centerline into two separate areas with one half connected to each half of the dual device.

(c) For a dual device surface mounted on 8 sq cm single sided 2oz copper FR4 PCB, in still air conditions with minimal lead connections only.

(d) For a dual device surface mounted on 10 sq cm single sided 1oz copper FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the centerline into two separate areas with one half connected to each half of the dual device.

(e) For a dual device surface mounted on 85 sq cm single sided 2oz copper FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the centerline into two separate areas with one half connected to each half of the dual device.

(f) For dual device with one active die.

(g) For dual device with 2 active die running at equal power.

(h) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph.

(i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in

the package dimensions data. The thermal resistance for a dual device mounted on 1.5mm thick FR4 board using minimum copper of 1 oz

weight, 1mm wide tracks and one half of the device active is Rth= 250°C/W giving a power rating of Ptot=400mW.

THERMAL RESISTANCE

PARAMETER SYMBOL LIMIT UNIT

Reverse Voltage VR60 V

Forward Voltage @ IF= 1000mA VF600 mV

Forward Current IF1.65 A

Average Forward Current D=50%, t<=300us IFAV 1.24 A

Non Repetitive Forward Current t<=100us

Non Repetitive Forward Current t<=10ms

IFSM 16.8

5.63

Power Dissipation at TA=25°C(a)(f)

Linear Derating Factor

PD1.2

mW/°C

Power Dissipation at TA=25°C(b)(f)

Linear Derating Factor

PD2

mW/°C

Power Dissipation at TA=25°C(c)(f)

Linear Derating Factor

PD0.8

mW/°C

Power Dissipation at TA=25°C(d)(f)

Linear Derating Factor

PD0.9

mW/°C

Power Dissipation at TA=25°C(d)(g)

Linear Derating Factor

PD1.36

13.6

mW/°C

Power Dissipation at TA=25°C(e)(g)

Linear Derating Factor

PD2.4

mW/°C

Storage Temp, Range Tstg -55 to+150 °C

Operating & Storage Temp, Range Tj -55 to+125 °C

ABSOLUTE MAXIMUM RATINGS

ZXSDS2M832

SEMICONDUCTORS

ISSUE 2 June 2003

TYPICAL CHARACTERISTICS

ZXSDS2M832

SEMICONDUCTORS

ISSUE 2 June 2003

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS

STATIC

Reverse Breakdown Voltage V(BR)R 60 80 V IR = 300µA*

Forward Voltage VF245

275

330

395

455

510

620

500

280

320

390

470

530

600

740

IF= 50mA*

IF= 100mA*

IF= 250mA*

IF= 500mA*

IF= 750mA*

IF= 1000mA*

IF= 1500mA*

IF= 1000mA*, TA= 100°C

Reverse Current IR50 100 µA VR= 45V

Diode Capacitance CD17 pF f = 1MHz, VR= 25V

Reverse Recovery Time trr 12 ns Switched from

IF= 500mA to IR= 500mA

Measured at IR= 50mA

ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated)

NOTES

* Measured under pulsed conditions

ZXSDS2M832

SEMICONDUCTORS

ISSUE 2 June 2003

TYPICAL CHARACTERISTICS

ZXSDS2M832

SEMICONDUCTORS

ISSUE 2 June 2003

Europe

Zetex plc

Fields New Road

Chadderton

Oldham, OL9 8NP

United Kingdom

Telephone (44) 161 622 4444

Fax: (44) 161 622 4446

hq@zetex.com

Zetex GmbH

Streitfeldstraße19

D-81673 München

Germany

Telefon: (49) 89 45 49 49 0

Fax: (49) 89 45 49 49 49

europe.sales@zetex.com

Americas

Zetex Inc

700 Veterans Memorial Hwy

Hauppauge, NY 11788

USA

Telephone: (1) 631 360 2222

Fax: (1) 631 360 8222

usa.sales@zetex.com

Asia Pacific

Zetex (Asia) Ltd

3701-04 Metroplaza Tower 1

Hing Fong Road

Kwai Fong

Hong Kong

Telephone: (852) 26100 611

Fax: (852) 24250 494

asia.sales@zetex.com

These offices are supported by agents and distributors in major countries world-wide.

This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced

for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company

reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.

For the latest product information, log on to www.zetex.com

DIM Millimetres Inches DIM Millimetres Inches

Min Max Min Max Min Max Min Max

A 0.80 1.00 0.031 0.039 e 0.65 REF 0.0256 BSC

A1 0.00 0.05 0.00 0.002 E 2.00 BSC 0.0787 BSC

A2 0.65 0.75 0.0255 0.0295 E2 0.43 0.63 0.017 0.0249

A3 0.15 0.25 0.006 0.0098 E4 0.16 0.36 0.006 0.014

b 0.24 0.34 0.009 0.013 L 0.20 0.45 0.0078 0.0157

b1 0.17 0.30 0.0066 0.0118 L2 - 0.125 0.00 0.005

D 3.00 BSC 0.118 BSC r 0.075 BSC 0.0029 BSC

D2 0.82 1.02 0.032 0.040 ␪0°12°0°12°

D3 1.01 1.21 0.0397 0.0476 - ----

PACKAGE DIMENSIONS

Controlling dimensions are in millimetres. Approximate conversions are given in inches

PACKAGE OUTLINE (3mm x 2mm Micro Leaded Package)