Picor Corporation • www.picorpower.com QPI-12 Data Sheet Rev. 1.6 Page 1 of 4
7 A V·I Chip EMI Filter
QPI-12
QUIETPOWER®
Features
• >40 dB CM attenuation at 1 MHz
• >60 dB DM attenuation at 1 MHz
• 80 Vdc (max input)
• 100 Vdc surge 100 ms
• 1,500 Vdc hipot hold off to shield plane
• 7 A rating
• 12.4 x 25 x 4.5 mm SiP (System-in-Package)
• Low profile LGA package
• -40° to +100°C PCB temperature (see Figure 6)
• Efficiency >99%
• TÜV Certified
Applications
• Telecom and ATCA boards
• V•I Chip input power filter
Bus+ Bus+ Out+
QPI-12
Out–
Bus–
Cbus
Shield Shield
Bus–
Cin
Cy2
Cy1
Vi– Vo–
Vo+ Vi+ Vo+
Vo–Vi–
Vi+
PRM VTM
Load
Cin: Recommended input capacitance per Vicor requirement.
Cy1 & Cy2: 4.7 nF, or recommended per Vicor requirement.
Cbus: 47 uF, 50 V electrolytic in parallel with 2.2 µF, 100 V ceramic.
Figure 2 – QPI-12 Typical application schematic
Figure 1 – QPI-12, less than 1/2 in2.
Figure 3 – QPI-12 network analyzer attenuation curves
Description
The QPI-12 EMI filter is specifically designed to
attenuate conducted common-mode (CM) and
differential-mode (DM) noise of Vicor’s V•I Chip
products to comply with the CISPR22 standard
requirements for conducted noise measurements. The
filter is designed to operate up to 80 Vdc and supports
7 A loads up to 60°C without derating.
Designed for the telecom bus range, the V•I Chip EMI
Filter supports the PICMG®3.0 specification for
filtering system boards to the EN55022 Class B limits.
®
Picor Corporation • www.picorpower.com QPI-12 Data Sheet Rev. 1.6 Page 2 of 4
Absolute Maximum Ratings – Exceeding these parameters may result in permanent damage to the product.
Electrical Characteristics – Parameter limits apply over the operating PCB temperature range unless otherwise noted
Pins Parameter Notes Min Max Units
Bus+ to Bus– Input voltage Continuous -80 80 Vdc
Bus+ to Bus– Input voltage 100 ms transient -100 100 Vdc
BUS+/BUS– to shield plane BUS inputs to shield hipot -1500 1500 Vdc
QPI+ to QPI– Input to output current Continuous @ 25°C 7 Adc
Package Power dissipation @ 25°C 1.50 W
Package Operating temperature PCB to filter interface 100 °C
Package Thermal resistance Free air 75 °C/W
Package Thermal resistance PCB Layout Fig. 7 30 °C/W
Package Storage temperature -55 125 °C
Package Reflow temperature 20 s exposure(1) 212 °C
All Pins ESD HBM -2 +2 kV
Parameter Notes Min Typ Max Units
Bus+ to Bus- input range Measured at 7 A 76 Vdc
Bus+ to Out+ voltage drop Measured at 7 A(2) 110 mVdc
Bus- to Out- voltage drop Measured at 7 A(2) 110 mVdc
Common mode attenuation VBUS = 48 V Frequency = 1.0 MHz 40 dB
Differential mode attenuation VBUS = 48 V Frequency = 1.0 MHz 60 dB
Input bias current at 80 V Input current from Bus+ to Bus- 10 µA
Note 1: RoHS compliant product maximum peak temperature is 245°C for 20 seconds.
Pad Description
SiP Package Outline
Pin
Number Name Description
8, 9 Bus+ Positive bus potential
1, 10 Bus– Negative bus potential
6, 7 Out+ Positive input to the converter
4, 5 Out– Negative input to the converter
2, 3 Shield Shield connects to system chassis or
safety ground.
Note 2: See Figure 6 for current derating curve.
Ordering Information
Part
Number Description
QPI-12L QPI-12 Land Grid Array Package
QPI-12LZ QPI-12 Land Grid Array Package, RoHS compliant
Picor Corporation • www.picorpower.com QPI-12 Data Sheet Rev. 1.6 Page 3 of 4
EMI Performance
Figure 4 – Total conducted noise of P048K048T24IF & V048K120T025 with QPI-12 connected as shown in Figure 2.
Output load = 170W: Cy1= Cy2= 4.7 nF & CBUS = 47 µF electrolytic in parallel with 2.2 µF ceramic.
Figure 5 –Total conducted noise of BCM (B048A120T20) with QPI-12.
Output load = 144 W. Same setup as in Figure 2, with the BCM replacing the VTM/PRM pair.
Figure 6 – Current vs. PCB temperature derating curve. Figure 7 – Typical QPI-12L polygon layout.
When laying out the QPI-12L, care must be taken such that the input and output signal polygons do not overlap each other on lower layers.
Picor Corporation • www.picorpower.com • QPI-12 Data Sheet Rev. 1.6 2/08
Vicor’s comprehensive line of power solutions includes high-density AC-DC & DC-DC modules and accessory components,
fully configurable AC-DC & DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. No license is
granted by implication or otherwise under any patent or patent rights of Vicor. Vicor components are not designed to be used in
applications, such as life support systems, wherein a failure or malfunction could result in injury or death. All sales are subject to Vicor’s
Terms and Conditions of Sale, which are available upon request.
Specifications are subject to change without notice.
Vicor Corporation
25 Frontage Road, Andover, MA, USA 01810
Tel: 800-735-6200 Fax: 978-475-6715
Email
Vicor Express: vicorexp@vicr.com
Technical Support: apps@vicr.com
QPI-12 PCB Layout Recommendations
Figure 5 – Recommended mounting on a 2 layer board
The filtering performance of the QPI-11 and –12 is
sensitive to capacitive coupling between its input and
output pins. Parasitic plane capacitance must be kept
below 1 pico-Farad between inputs and outputs using
the layout shown above and the recommendations
described below to achieve maximum conducted EMI
performance.
To avoid capacitive coupling between input and output
pins, there should not be any planes or large traces
that run under both input and output pins, such as a
ground plane or power plane. For example, if there
are two signal planes or large traces where one trace
runs under the input pins, and the other under the
output pins, and both planes over lap in another area,
they will cause capacitive coupling between input and
output pins. Also, planes that run under both input
and outputs pins, but do not cross, can cause capacitive
coupling if they are capacitively by-passed together.
Figure 5 shows the recommended pcb layout on a 2
layer board. Here, the top layer planes are duplicated
on the bottom layer so that there can be no over-
lapping of input and output planes. This method can
be used for boards of greater layer count.
Picor’s Z version QP SIPs are not hermetically sealed and
must not be exposed to liquid, including but not limited
to cleaning solvents, aqueous washing solutions or
pressurized sprays.
When soldering, it is recommended that no-clean flux
solder be used, as this will insure that potentially corrosive
mobile ions will not remain on, around, or under the
module following the soldering process.
Post Solder Cleaning
