DATASHEET Board Level Cooling - 3745 BOARD LEVEL COOLING 3745 3745 is a series of square pin fin board level heat sinks designed to cool BGA and FPGA devices. Representative image only. ORDERING INFORMATION Part Number Device Type 374524B00032G 374524B60023G BGA, FPGA BGA, FPGA HEAT SINK DETAILS Property Details Property Details Material Finish Device Attachment Options: 374524B00032G Device Attachment Options: 374524B60023G Thermal Interface Material: 374524B00032G Thermal Interface Material: 374524B60023G Aluminum Black Anodize Heat Sink Width (mm) Heat Sink Length (mm) Heat Sink Height (mm) Heat Sink Mounting Direction 27.00 27.00 25.00 Horizontal, Vertical Tape Solder Anchor Clip T405R Chomerics Tape for Metal surfaces T766 Chomerics Phase Change for All Surfaces MECHANICAL & PERFORMANCE Drawing dimensions are shown in mm, (in) Part Number: 374524B00032G USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122 Board Level Cooling www.aavid.com DATASHEET Board Level Cooling - 3745 Part Number: 374524B60023G Mounting Details: USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122 Board Level Cooling www.aavid.com