ISL9000 GN S DESI T W E N R FO R T PA NDED LACEMEN E M M P RECO NDED RE 0A Data Sheet NO T E 0 0 M 9 M ISL RECO (R) March 11, 2008 FN9217.4 Dual LDO with Low Noise, Very High PSRR and Low IQ Features ISL9000 is a high performance dual LDO capable of sourcing 300mA current from each output. It has a low standby current and very high PSRR and is stable with output capacitance of 1F to 10F with ESR of up to 200m. * Excellent transient response to large current steps * Integrates two 300mA high performance LDOs The device integrates an individual Power-On-Reset (POR) function for each output. The POR delay for VO2 can be externally programmed by connecting a timing capacitor to the CPOR pin. The POR delay for VO1 is internally fixed at approximately 2ms. A reference bypass pin is also provided for connecting a noise filtering capacitor for low noise and high-PSRR applications. The quiescent current is typically only 42A with both LDOs enabled and active. Separate enable pins control each individual LDO output. When both enable pins are low, the device is in shutdown, typically drawing less than 0.1A. Several combinations of voltage outputs are standard. Output voltage options for each LDO range are from 1.5V to 3.3V. Other output voltage options may be available upon request. * 1.8% accuracy over all operating conditions * Excellent load regulation: < 0.1% voltage change across full range of load current * Low output noise: typically 30VRMS @ 100A (1.5V) * Very high PSRR: 90dB @ 1kHz * Extremely low quiescent current: 42A (both LDOs active) * Wide input voltage capability: 2.3V to 6.5V * Low dropout voltage: typically 200mV @ 300mA * Stable with 1F to 10F ceramic capacitors * Separate enable and POR pins for each LDO * Soft-start and staged turn-on to limit input current surge during enable * Current limit and overheat protection * Tiny 10 Ld 3mmx3mm DFN package * -40C to +85C operating temperature range Pinout * Pb-free (RoHS compliant) ISL9000 (10 LD 3X3 DFN) TOP VIEW Applications * PDAs, Cell Phones and Smart Phones VIN 1 10 VO1 * Portable Instruments, MP3 Players EN1 2 9 VO2 * Handheld Devices including Medical Handhelds EN2 3 8 POR2 CBYP 4 7 POR1 CPOR 5 6 GND 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2005, 2006, 2008. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL9000 Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING VO1 VOLTAGE (V) VO2 VOLTAGE (V) TEMP RANGE (C) PACKAGE (Pb-Free) PKG DWG. # ISL9000IRNNZ DCGA 3.3 3.3 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRNJZ DAAA 3.3 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRNFZ DBAA 3.3 2.5 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRNCZ DABH 3.3 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRMNZ DCHA 3.0 3.3 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRMMZ DSAA 3.0 3.0 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRMGZ DCJA 3.0 2.7 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRLLZ DRAA 2.9 2.9 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRKNZ DABF 2.85 3.3 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRKKZ DCAA 2.85 2.85 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRKJZ DDAA 2.85 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRKFZ DEAA 2.85 2.5 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRKPZ DABG 2.85 1.85 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRKCZ DHAA 2.85 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRJNZ DCKA 2.8 3.3 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRJMZ DPAA 2.8 3.0 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRJRZ DNAA 2.8 2.6 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRJCZ DMAA 2.8 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRJBZ DFAA 2.8 1.5 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRGPZ DABE 2.7 1.85 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRGCZ DLAA 2.7 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRFJZ DGAA 2.5 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRFDZ DCLA 2.5 2.0 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRFCZ DCMA 2.5 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRPLZ DKAA 1.85 2.9 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRPPZ DABJ 1.85 1.85 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRCJZ DCNA 1.8 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRCCZ DCPA 1.8 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRBLZ DABD 1.5 2.9 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRBJZ DJAA 1.5 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRBCZ DABC 1.5 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C ISL9000IRBBZ DABB 1.5 1.5 -40 to +85 10 Ld 3x3 DFN L10.3x3C NOTES: 1. Add "-T" suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. For other output voltages, contact Intersil Marketing. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2 FN9217.4 March 11, 2008 ISL9000 Absolute Maximum Ratings Thermal Information Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.1V VO1, VO2 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.6V All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN + 0.3)V Thermal Resistance (Notes 4, 5) Recommended Operating Conditions Ambient Temperature Range (TA) . . . . . . . . . . . . . . .-40C to +85C Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3V to 6.5V JA (C/W) JC (C/W) 10 Ld 3x3 DFN Package . . . . . . . . . . . 50 10 Junction Temperature Range . . . . . . . . . . . . . . . . .-40C to +125C Operating Temperature Range . . . . . . . . . . . . . . . . .-40C to +85C Storage Temperature Range . . . . . . . . . . . . . . . . . .-65C to +150C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379. 5. For JC, the "case temp" location is the center of the exposed metal pad on the package underside. Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40C to +85C; VIN = (VO + 0.5V) to 6.5V with a minimum VIN of 2.3V; CIN = 1F; CO = 1F; CBYP = 0.01F; CPOR = 0.01F. PARAMETER SYMBOL TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS 6.5 V DC CHARACTERISTICS Supply Voltage 2.3 VIN Ground Current Quiescent condition: IO1 = 0A; IO2 = 0A IDD1 One LDO active 25 32 A IDD2 Both LDO active 42 52 A Shutdown Current IDDS @ +25C 0.1 1.0 A UVLO Threshold VUV+ 1.9 2.1 2.3 V VUV- 1.6 1.8 2.0 V Regulation Voltage Accuracy Maximum Output Current IMAX Internal Current Limit ILIM Dropout Voltage (Note 7) Thermal Shutdown Temperature Initial accuracy at VIN = VO + 0.5V, IO = 10mA, TJ = +25C -0.7 +0.7 % VIN = VO + 0.5V to 5.5V, IO = 10A to 300mA, TJ = +25C -0.8 +0.8 % VIN = VO + 0.5V to 5.5V, IO = 10A to 300mA, TJ = -40C to +125C -1.8 +1.8 % Continuous 300 350 mA 475 600 mA VDO1 IO = 300mA; VO < 2.5V 300 500 mV VDO2 IO = 300mA; 2.5V VO 2.8V 250 400 mV VDO3 IO = 300mA; VO > 2.8V 200 325 mV TSD+ 145 C TSD- 110 C @ 1kHz 90 dB @ 10kHz 70 dB @ 100kHz 50 dB IO = 100A, VO = 1.5V, TA = +25C, CBYP = 0.1F BW = 10Hz to 100kHz 30 VRMS AC CHARACTERISTICS Ripple Rejection (Note 6) IO = 10mA, VIN = 2.8V(min), VO = 1.8V, CBYP = 0.1F Output Noise Voltage (Note 6) DEVICE START-UP CHARACTERISTICS 3 FN9217.4 March 11, 2008 ISL9000 Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40C to +85C; VIN = (VO + 0.5V) to 6.5V with a minimum VIN of 2.3V; CIN = 1F; CO = 1F; CBYP = 0.01F; CPOR = 0.01F. (Continued) PARAMETER SYMBOL MIN (Note 8) TEST CONDITIONS TYP MAX (Note 8) UNITS Device Enable Time tEN Time from assertion of the ENx pin to when the output voltage reaches 95% of the VO(nom) 250 500 s LDO Soft-Start Ramp Rate tSSR Slope of linear portion of LDO output voltage ramp during start-up 30 60 s/V EN1, EN2 PIN CHARACTERISTICS Input Low Voltage VIL -0.3 0.5 V Input High Voltage VIH 1.4 VIN + 0.3 V 0.1 A Input Leakage Current IIL, IIH Pin Capacitance CPIN Informative 5 pF POR1, POR2 PIN CHARACTERISTICS POR1, POR2 Thresholds VPOR+ POR1 Delay As a percentage of nominal output voltage 91 94 97 % VPOR- 87 90 93 % tP1LH 1.0 2.0 3.0 ms tP1HL POR2 Delay tP2LH 25 CPOR = 0.01F 100 VOL POR1, POR2 Pin Internal Pull-Up Resistance 300 25 tP2HL POR1, POR2 Pin Output Low Voltage 200 s @IOL = 1.0mA RPOR 78 100 ms s 0.2 V 180 k NOTES: 6. Limits established by characterization and are not production tested. 7. VOx = 0.98*VOx(NOM); Valid for VOx greater than 1.85V. 8. Parts are 100% tested at +25C. Temperature limits established by characterization and are not production tested. EN1 EN2 tEN VPOR+ VPOR- VPOR+ VPOR- <tP1HL VO1 VO2 <tP2HL tP1LH tP1HL tP2LH tP2HL POR1 POR2 FIGURE 1. TIMING PARAMETER DEFINITION 4 FN9217.4 March 11, 2008 ISL9000 Typical Performance Curves 0.10 0.8 VO = 3.3V ILOAD = 0mA 0.4 0.2 -40C 0.0 +25C -0.2 +85C -0.4 VIN = 3.8V VO = 3.3V 0.08 OUTPUT VOLTAGE CHANGE (%) OUTPUT VOLTAGE, VO (%) 0.6 -0.6 0.06 0.04 -40C 0.02 +25C 0.00 -0.02 +85C -0.04 -0.06 -0.08 -0.8 3.4 3.8 4.6 4.2 5.0 5.4 5.8 6.2 -0.10 6.6 0 50 100 FIGURE 2. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V OUTPUT) 250 300 400 350 FIGURE 3. OUTPUT VOLTAGE CHANGE vs LOAD CURRENT 0.10 3.4 VIN = 3.8V VO = 3.3V ILOAD = 0mA 0.08 0.06 0.04 0.02 0.00 -0.02 -0.04 VO = 3.3V IO = 0mA 3.3 OUTPUT VOLTAGE, VO (V) OUTPUT VOLTAGE CHANGE (%) 200 150 LOAD CURRENT - IO (mA) INPUT VOLTAGE (V) 3.2 IO = 150mA 3.1 IO = 300mA 3.0 -0.06 2.9 -0.08 -0.10 -40 2.8 -25 5 -10 20 35 50 65 TEMPERATURE (C) 80 95 3.1 110 125 4.1 4.6 5.1 5.6 6.1 6.5 INPUT VOLTAGE (V) FIGURE 4. OUTPUT VOLTAGE CHANGE vs TEMPERATURE FIGURE 5. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V OUTPUT) 2.9 350 VO = 2.8V IO = 0mA DROPOUT VOLTAGE, VDO (mV) 2.8 OUTPUT VOLTAGE, VO (V) 3.6 2.7 IO = 150mA 2.6 IO = 300mA 2.5 2.4 2.3 2.6 300 250 VO = 2.8V 200 VO = 3.3V 150 100 50 0 3.1 3.6 4.1 4.6 5.1 5.6 6.1 INPUT VOLTAGE (V) FIGURE 6. OUTPUT VOLTAGE vs INPUT VOLTAGE (2.8V OUTPUT) 5 6.5 0 50 100 150 200 250 OUTPUT LOAD (mA) 300 350 400 FIGURE 7. DROPOUT VOLTAGE vs LOAD CURRENT FN9217.4 March 11, 2008 ISL9000 Typical Performance Curves (Continued) 55 350 VO = 3.3V 50 GROUND CURRENT (A) DROPOUT VOLTAGE, VDO (mV) 300 250 +85C +25C -40C 200 150 100 +125C +25C 45 -40C 40 35 VO1 = 3.3V VO2 = 2.8V 30 50 IO(BOTH CHANNELS) = 0A 0 0 50 100 150 200 250 OUTPUT LOAD (mA) 300 350 25 400 3.0 3.5 4.58 4.0 5.5 5.0 6.0 6.5 INPUT VOLTAGE (V) FIGURE 8. DROPOUT VOLTAGE vs LOAD CURRENT FIGURE 9. GROUND CURRENT vs INPUT VOLTAGE 55 200 180 50 GROUND CURRENT (A) GROUND CURRENT (A) 160 +25C 140 +85C 120 -40C 100 80 60 40 VIN = 3.8V VO1 = 3.3V VO2 = 2.8V 20 50 100 150 200 250 300 40 35 VIN V IN = 3.8V V VO O = 3.3V ILOAD = 0A 30 BOTH OUTPUTS ON 0 0 45 25 -40 400 350 -25 -10 5 LOAD CURRENT (mA) FIGURE 10. GROUND CURRENT vs LOAD 20 35 50 65 TEMPERATURE (C) 80 95 110 125 FIGURE 11. GROUND CURRENT vs TEMPERATURE 3.5 VO1 = 3.3V VO2 = 2.8V IL1 = 300mA 5 VIN VO1 3 2 IL2 = 300mA 2.5 VOLTAGE (V) VOLTAGE (V) 4 3.0 IL2 = 300mA VO2 VO1 = 3.3V VO2 = 2.8V IL1 = 300mA POR1 POR2 CPOR = 0.1F 2.0 VO1 1.5 1 1.0 0 0.5 VO2 0 0 1 2 3 4 5 TIME (s) 6 7 8 FIGURE 12. POWER-UP/POWER-DOWN 6 9 10 0 0.5 1.0 1.5 2.0 2.5 3.0 TIME (s) 3.5 4.0 4.5 5.0 FIGURE 13. POWER-UP/POWER-DOWN WITH POR SIGNALS FN9217.4 March 11, 2008 ISL9000 Typical Performance Curves (Continued) VO = 3.3V ILOAD = 300mA VO2 (10mV/DIV) 2 VO1 (V) CLOAD = 1F CBYP = 0.01F VIN = 5.0V VO1 = 3.3V VO2 = 2.8V IL1 = 300mA IL2 = 300mA CL1, CL2 = 1F CBYP = 0.01F 3 1 4.3V 3.6V 0 VEN (V) 5 10mV/DIV 0 0 100 200 300 400 500 600 700 800 900 1000 400s/DIV TIME (s) FIGURE 14. TURN ON/TURN OFF RESPONSE FIGURE 15. LINE TRANSIENT RESPONSE (3.3V OUTPUT) VO = 2.8V ILOAD = 300mA CLOAD = 1F CBYP = 0.01F VO (25mV/DIV) 4.2V 3.5V VO = 1.8V VIN = 2.8V 300mA 10mV/DIV ILOAD 100A 100s/DIV 400s/DIV FIGURE 16. LINE TRANSIENT RESPONSE (2.8V OUTPUT) 100 1000 80 CBYP = 0.1F 70 PSRR (dB) SPECTRAL NOISE DENSITY (nV/Hz) VIN = 3.6V VO = 1.8V IO = 10mA 90 CLOAD = 1F 60 50 40 30 20 10 0 0.1k FIGURE 17. LOAD TRANSIENT RESPONSE 1k 10k FREQUENCY (Hz) 100k FIGURE 18. PSRR vs FREQUENCY 7 1M 100 10 VIN = 3.6V VO = 1.8V ILOAD = 10mA 1 CBYP = 0.1F CIN = 1F CLOAD = 1F 0.1 10 100 1k 10k FREQUENCY (Hz) 100k 1M FIGURE 19. SPECTRAL NOISE DENSITY vs FREQUENCY FN9217.4 March 11, 2008 ISL9000 Pin Description PIN NUMBER PIN NAME TYPE 1 VIN Analog I/O 2 EN1 Low Voltage Compatible CMOS Input LDO-1 Enable. 3 EN2 Low Voltage Compatible CMOS Input LDO-2 Enable. 4 CBYP Analog I/O Reference Bypass Capacitor Pin: Optionally connect capacitor of value 0.01F to 1F between this pin and GND to tune in the desired noise and PSRR performance. 5 CPOR Analog I/O POR2 Delay Setting Capacitor Pin: Connect a capacitor between this pin and GND to delay the POR2 output release after LDO-2 output reaches 94% of its specified voltage level. (200ms delay per 0.01F). 6 GND Ground 7 POR1 Open Drain Output (1mA) Open-drain POR Output for LDO-1 (active-low): Internally connected to VO1 through 100k resistor. 8 POR2 Open Drain Output (1mA) Open-drain POR Output for LDO-2 (active-low): Internally connected to VO2 through 100k resistor. 9 VO2 Analog I/O LDO-2 Output: Connect capacitor of value 1F to 10F to GND (1F recommended). 10 VO1 Analog I/O LDO-1 Output: Connect capacitor of value 1F to 10F to GND (1F recommended). DESCRIPTION Supply Voltage/LDO Input: Connect a 1F capacitor to GND. GND is the connection to system ground. Connect to PCB Ground plane. Typical Application ISL9000 1 VIN (2.3 TO 6.5V) ON 2 ENABLE1 OFF ON ENABLE2 OFF 3 4 5 C1 C2 10 VIN VOUT 1 VO1 9 EN1 VO2 VOUT 2 VOUT 2 OK 8 EN2 POR2 RESET 2 VOUT 2 TOO LOW (200ms delay, C3 = 0.01F) VOUT 1 OK 7 CBYP POR1 CPOR GND 6 C3 C4 C5 RESET 1 VOUT 1 TOO LOW (2ms delay) C1, C4, C5: 1F X5R ceramic capacitor C2: 0.1F X7R ceramic capacitor C3: 0.01F X7R ceramic capacitor 8 FN9217.4 March 11, 2008 ISL9000 Block Diagram VIN VO1 VO2 LDO VO1 ERROR AMPLIFIER ~1.0V VO2 VREF TRIM IS1 POR COMPARATOR QEN1 VOK1 1V POR1 LDO-1 POR2 QEN2 VO1 100k QEN1 IS2 LDO-2 IS1 VOK2 EN1 CONTROL LOGIC EN2 POR2 VOK2 POR2 DELAY CBYP VO2 BANDGAP AND TEMPERATURE SENSOR VOLTAGE REFERENCE GENERATOR 100k UVLO 1.00V VOK1 0.94V POR1 0.90V CPOR Functional Description The ISL9000 contains two high performance LDOs. High performance is achieved through a circuit that delivers fast transient response to varying load conditions. In a quiescent condition, the ISL9000 adjusts its biasing to achieve the lowest standby current consumption. The device also integrates current limit protection, smart thermal shutdown protection, staged turn-on and soft-start. Smart thermal shutdown protects the device against overheating. Staged turn-on and soft-start minimize start-up input current surges without causing excessive device turn-on time. Power Control The ISL9000 has two separate enable pins, EN1 and EN2, to individually control power to each of the LDO outputs. When both EN1 and EN2 are low, the device is in shutdown 9 POR1 DELAY GND mode. During this condition, all on-chip circuits are off, and the device draws minimum current, typically less than 0.1A. When one or both of the enable pins are asserted, the device first polls the output of the UVLO detector to ensure that VIN voltage is at least about 2.1V. Once verified, the device initiates a start-up sequence. During the start-up sequence, trim settings are first read and latched. Then, sequentially, the bandgap, reference voltage and current generation circuitry power-up. Once the references are stable, a fast-start circuit quickly charges the external reference bypass capacitor (connected to the CBYP pin) to the proper operating voltage. After the bypass capacitor has been charged, the LDOs power-up in their specified sequence. Soft-start circuitry integrated into each LDO limits the initial ramp-up rate to about 30s/V to minimize current surge. FN9217.4 March 11, 2008 ISL9000 If EN1 is brought high, and EN2 goes high before the VO1 output stabilizes, the ISL9000 delays the VO2 turn-on until the VO1 output reaches its target level. The resistor division ratio is programmed in the factory to one of the following output voltages: 1.5V, 1.8V, 1.85V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, and 3.3V. If EN2 is brought high, and EN1 goes high before VO2 starts its output ramp, then VO1 turns on first and, the ISL9000 delays the VO2 turn-on until the VO1 output reaches its target level. Power-On Reset Generation If EN2 is brought high, and EN1 goes high after VO2 starts its output ramp, then the ISL9000 immediately starts to ramp up the VO1 output. If both EN1 and EN2 are brought high at the same time, the VO1 output has priority, and is always powered up first. During operation, whenever the VIN voltage drops below about 1.8V, the ISL9000 immediately disables both LDO outputs. When VIN rises back above 2.1V, the device re-initiates its start-up sequence and LDO operation will resume automatically. Reference Generation The reference generation circuitry includes a trimmed bandgap, a trimmed voltage reference divider, a trimmed current reference generator, and an RC noise filter. The filter includes the external capacitor connected to the CBYP pin. A 0.01F capacitor connected CBYP implements a 100Hz lowpass filter, and is recommended for most high performance applications. For the lowest noise application, a 0.1F or greater CBYP capacitor should be used. This filters the reference noise below the 10Hz to 1kHz frequency band, which is crucial in many noise-sensitive applications. The bandgap generates a zero temperature coefficient (TC) voltage for the reference divider. The reference divider provides the regulation reference, POR detection thresholds, and other voltage references required for current generation and over-temperature detection. The current generator provides the references required for adaptive biasing as well as references for LDO output current limit and thermal shutdown determination. LDO Regulation and Programmable Output Divider The LDO Regulator is implemented with a high-gain operational amplifier driving a PMOS pass transistor. The design of the ISL9000 provides a regulator that has low quiescent current, fast transient response, and overall stability across all operating and load current conditions. LDO stability is guaranteed for a 1F to 10F output capacitor that has a tolerance better than 20% and ESR less than 200m. The design is performance-optimized for a 1F capacitor. Unless limited by the application, use of an output capacitor value above 4.7F is not normally needed as LDO performance improvement is minimal. Each LDO uses an independently trimmed 1V reference. An internal resistor divider drops the LDO output voltage down to 1V. This is compared to the 1V reference for regulation. 10 Each LDO has a separate Power-on Reset signal generation circuit which outputs to the respective POR pins. The POR signal is generated as follows: A POR comparator continuously monitors the output of each LDO. The LDO enters a power-good state when the output voltage is above 94% of the expected output voltage for a period exceeding the LDO PGOOD entry delay time (see the following). In the power-good state, the open-drain PORx output is in a high-impedance state. An internal 100k pull-up resistor pulls the pin up to the respective LDO output voltage. An external resistor can be added between the PORx output and the LDO output for a faster rise time, however, the PORx output should not connect through an external resistor to a supply greater than the associated LDO voltage. The power-good state is exited when the LDO output falls below 90% of the expected output voltage for a period longer than the PGOOD exit delay time. While power-good is false, the ISL9000 pulls the respective POR pin low. For LDO-1, the PGOOD entry delay time is fixed at about 2ms while the PGOOD exit delay is about 25s. For LDO-2, the PGOOD entry and exit delays are determined by the value of the external capacitor connected to the CPOR pin. For a 0.01F capacitor, the entry and exit delays are 200ms and 25s respectively. Larger or smaller capacitor values will yield proportionately longer or shorter delay times. The POR exit delay should never be allowed to be less than 10s to ensure sufficient immunity against transient induced false POR triggering. Overheat Detection The bandgap provides a proportional-to-temperature current that is indicative of the temperature of the silicon. This current is compared with references to determine if the device is in danger of damage due to overheating. When the die temperature reaches about +145C, one or both of the LDOs momentarily shut down until the die cools sufficiently. In the overheat condition, only the LDO sourcing more than 50mA will be shut off. This does not affect the operation of the other LDO. If both LDOs source more than 50mA and an overheat condition occurs, both LDO outputs are disabled. Once the die temperature falls back below about +110C, the disabled LDO(s) are re-enabled and soft-start automatically takes place. The ISL9000 provides short-circuit protection by limiting the output current to about 475mA. If short circuited, an output current of 475mA will cause die heating. If the short circuit lasts long enough, the overheat detection circuit will turn off the output. FN9217.4 March 11, 2008 ISL9000 Dual Flat No-Lead Plastic Package (DFN) L10.3x3C 2X 0.10 C A A 10 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE D MILLIMETERS 2X 0.10 C B E SYMBOL MIN NOMINAL MAX NOTES A 0.85 0.90 0.95 - A1 - - 0.05 - A3 6 INDEX AREA b 0.20 REF 0.20 D TOP VIEW B D2 // A C SEATING PLANE D2 6 INDEX AREA 0.08 C 7 8 D2/2 1 2.33 2.38 2.43 7, 8 1.69 7, 8 3.00 BSC 1.59 e 1.64 - 0.50 BSC - k 0.20 - - - L 0.35 0.40 0.45 8 N 10 2 Nd 5 3 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. NX k 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. E2 E2/2 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. NX L N N-1 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX b e (Nd-1)Xe REF. BOTTOM VIEW 5 0.10 M C A B (A1) 9 L 5 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. CL NX (b) 5, 8 Rev. 1 4/06 2 (DATUM A) 8 0.30 3.00 BSC E E2 A3 SIDE VIEW (DATUM B) 0.10 C 0.25 - 9. COMPLIANT TO JEDEC MO-229-WEED-3 except for dimensions E2 & D2. e SECTION "C-C" C C TERMINAL TIP FOR ODD TERMINAL/SIDE All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 FN9217.4 March 11, 2008