ISL9000IRKCZ-T - Intersil Corporation

FN9217.4

ISL9000

Dual LDO with Low Noise, Very High

PSRR and Low IQ

ISL9000 is a high performance dual LDO capable of

sourcing 300mA current from each output. It has a low

standby current and very high PSRR and is stable with

output capacitance of 1µF to 10µF with ESR of up to 200mΩ.

The device integrates an individual Power-On-Reset (POR)

function for each output. The POR delay for VO2 can be

externally programmed by connecting a timing capacitor to

the CPOR pin. The POR delay for VO1 is internally fixed at

approximately 2ms. A reference bypass pin is also provided

for connecting a noise filtering capacitor for low noise and

high-PSRR applications.

The quiescent current is typicall y only 42µA with both LDOs

enabled and active. Separate enable pins control each

individual LDO output. When both enable pins are low, the

device is in shutdown, typically drawing less than 0.1µA.

Several combinations of voltage outputs are standard.

Output voltage options for each LDO range are from 1.5V to

3.3V. Other output voltage options may be available upon

request.

Pinout ISL9000

(10 LD 3X3 DFN)

TOP VIEW

Features

• Integrates two 300mA high performance LDOs

• Excellent transient response to large current steps

• ±1.8% accuracy over all operating conditions

• Excellent load regulation:

< 0.1% voltage change across full range of load current

• Low output noise: typically 30µVRMS @ 100µA (1.5V)

• Very high PSRR: 90dB @ 1kHz

• Extremely low quiescent current: 42µA (both LDOs active)

• Wide input voltage capability: 2.3V to 6.5V

• Low dropout voltage: typically 200mV @ 300mA

• Stable with 1µF to 10µF ceramic capacitors

• Separate enable and POR pins for each LDO

• Soft-start and staged turn-on to limit input current surge

during enable

• Current limit and overheat protection

• Tiny 10 Ld 3mmx3m m DF N package

• -40°C to +85°C operating temperature range

• Pb-free (RoHS compliant)

Applications

• PDAs, Cell Phones and Smart Phones

• Portable Instruments, MP3 Players

• Handheld Devices including Medical Handhelds

VIN

EN1

EN2

CBYP

CPOR

VO1

VO2

POR2

POR1

GND

Data Sheet March 11, 2008

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

NOT RECOMMENDED FOR NEW DESIGNS

RECOMMENDED REPLACEMENT PART

ISL9000A

2FN9217.4

March 11, 2008

Ordering Information

PART NUMBER

(Notes 1, 2, 3) PART MARKING VO1 VOLTAGE

(V) VO2 VOLTAGE

(V) TEMP RANGE (°C) PACKAGE

(Pb-Free) PKG DWG. #

ISL9000IRNNZ DCGA 3.3 3.3 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRNJZ DAAA 3.3 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRNFZ DBAA 3.3 2.5 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRNCZ DABH 3.3 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRMNZ DCHA 3.0 3.3 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRMMZ DSAA 3.0 3.0 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRMGZ DCJA 3.0 2.7 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRLLZ DRAA 2.9 2.9 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRKNZ DABF 2.85 3.3 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRKKZ DCAA 2.85 2.85 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRKJZ DDAA 2.85 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRKFZ DEAA 2.85 2.5 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRKPZ DABG 2.85 1.85 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRKCZ DHAA 2.85 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRJNZ DCKA 2.8 3.3 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRJMZ DPAA 2.8 3.0 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRJRZ DNAA 2.8 2.6 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRJCZ DMAA 2.8 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRJBZ DFAA 2.8 1.5 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRGPZ DABE 2.7 1.85 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRGCZ DLAA 2.7 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRFJZ DGAA 2.5 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRFDZ DCLA 2.5 2.0 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRFCZ DCMA 2.5 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRPLZ DKAA 1.85 2.9 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRPPZ DABJ 1.85 1.85 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRCJZ DCNA 1.8 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRCCZ DCPA 1.8 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRBLZ DABD 1.5 2.9 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRBJZ DJAA 1.5 2.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRBCZ DABC 1.5 1.8 -40 to +85 10 Ld 3x3 DFN L10.3x3C

ISL9000IRBBZ DABB 1.5 1.5 -40 to +85 10 Ld 3x3 DFN L10.3x3C

NOTES:

1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. For other output voltages, contact Intersil Marketing.

3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte

tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.

Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC

J STD-020.

ISL9000

3FN9217.4

March 11, 2008

Absolute Maximum Ratings Thermal Information

Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.1V

VO1, VO2 Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.6V

All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN + 0.3)V

Recommended Operating Conditions

Ambient Temperature Range (TA) . . . . . . . . . . . . . . .-40°C to +85°C

Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3V to 6.5V

Thermal Resistance (Notes 4, 5) θJA (°C/W) θJC (°C/W)

10 Ld 3x3 DFN Package . . . . . . . . . . . 50 10

Junction Temperature Range . . . . . . . . . . . . . . . . .-40°C to +125°C

Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C

Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and

result in failures not covered by warranty.

NOTES:

4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See

Tech Brief TB379.

5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.

Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature

range of the device as follows:

TA = -40°C to +85°C; VIN = (VO + 0.5V) to 6.5V with a minimum VIN of 2.3V; CIN = 1µF; CO = 1µF;

CBYP = 0.01µF; CPOR = 0.01µF.

PARAMETER SYMBOL TEST CONDITIONS MIN

(Note 8) TYP MAX

(Note 8) UNITS

DC CHARACTERISTICS

Supply Voltage VIN 2.3 6.5 V

Ground Current Quiescent condition: IO1 = 0µA; IO2 = 0µA

IDD1 One LDO active 25 32 µA

IDD2 Both LDO active 42 52 µA

Shutdown Current IDDS @ +25°C 0.1 1.0 µA

UVLO Threshold VUV+ 1.9 2.1 2.3 V

VUV- 1.6 1.8 2.0 V

Regulation V oltage Accuracy Initial accuracy at VIN = VO + 0.5V, IO = 10mA, TJ = +25°C -0.7 +0.7 %

VIN = VO + 0.5V to 5.5V, IO = 10µA to 300mA, TJ = +25°C -0.8 +0.8 %

VIN = VO + 0.5V to 5.5V, IO = 10µA to 300mA,

TJ = -40°C to +125°C -1.8 +1.8 %

Maximum Output Current IMAX Continuous 300 mA

Internal Current Limit ILIM 350 475 600 mA

Dropout Voltage (Note 7) VDO1 IO = 300mA; VO < 2.5V 300 500 mV

VDO2 IO = 300mA; 2.5V ≤ VO ≤ 2.8V 250 400 mV

VDO3 IO = 300mA; VO > 2.8V 200 325 mV

Thermal Shutdown Temperature TSD+ 145 °C

TSD- 110 °C

AC CHARACTERISTICS

Ripple Rejection (Note 6) IO = 10mA, VIN = 2.8V(min), VO = 1.8V, CBYP = 0.1µF

@ 1kHz 90 dB

@ 10kHz 70 dB

@ 100kHz 50 dB

Output Noise Voltage (Note 6) IO = 100µA, VO = 1.5V, TA = +25°C, CBYP = 0.1µF

BW = 10Hz to 100kHz 30 µVRMS

DEVICE START-UP CHARACTERISTICS

ISL9000

4FN9217.4

March 11, 2008

Device Enable Time tEN Time from assertion of the ENx pin to when the output

voltage reaches 95% of the VO(nom) 250 500 µs

LDO Soft- Start Ramp Rate tSSR Slope of linear portion of LDO output voltage ramp during

start-up 30 60 µs/V

EN1, EN2 PIN CHARACTERISTICS

Input Low Voltage VIL -0.3 0.5 V

Input High Voltage VIH 1.4 VIN +

0.3 V

Input Leakage Current IIL, IIH 0.1 µA

Pin Capacitance CPIN Informative 5 pF

POR1, POR2 PIN CHARACTERISTICS

POR1, POR2 Thresholds VPOR+ As a percentage of nominal output voltage 91 94 97 %

VPOR- 87 90 93 %

POR1 Delay tP1LH 1.0 2.0 3.0 ms

tP1HL 25 µs

POR2 Delay tP2LH CPOR = 0.01µF 100 200 300 ms

tP2HL 25 µs

POR1, POR2 Pin Output Low

Voltage VOL @IOL = 1.0mA 0.2 V

POR1, POR2 Pin Internal Pull-Up

Resistance RPOR 78 100 180 kΩ

NOTES:

6. Limits established by characterization and are not production tested.

7. VOx = 0.98*VOx(NOM); Valid for VOx greater than 1.85V.

8. Parts are 100% tested at +25°C. Temperature limits established by characterization and are not production tested.

Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature

range of the device as follows:

TA = -40°C to +85°C; VIN = (VO + 0.5V) to 6.5V with a minimum VIN of 2.3V; CIN = 1µF; CO = 1µF;

CBYP = 0.01µF; CPOR = 0.01µF. (Continued)

PARAMETER SYMBOL TEST CONDITIONS MIN

(Note 8) TYP MAX

(Note 8) UNITS

VPOR+ VPOR+

VPOR-

<tP1HL

tP2LH

tP1LH tP1HL

tP2HL

<tP2HL

VO1

VO2

POR1

POR2

EN2

tEN

VPOR-

FIGURE 1. TIMING PARAMETER DEFINITION

EN1

ISL9000

5FN9217.4

March 11, 2008

Typical Performance Curves

FIGURE 2. OUTPUT VOL TAGE vs INPUT VOLTAGE (3.3V

OUTPUT) FIGURE 3. OUTPUT VOLTAGE CHANGE vs LOAD CURRENT

FIGURE 4. OUTPUT VOLTAGE CHANGE vs TEMPERATURE FIGURE 5. OUTPUT VOL TAGE vs INPUT VOL TAGE (3.3V

OUTPUT)

FIGURE 6. OUTPUT VOL TAGE vs INPUT VOLTAGE (2.8V

OUTPUT) FIGURE 7. DROPOUT VOLTAGE vs LOAD CURRENT

OUTPUT VOLTAGE, VO (%)

INPUT VOLTAGE (V)

-0.6

-0.2

0.2

0.6

-0.8 3.8 4.2 6.25.8 6.63.4 4.6 5.0 5.4

-0.4

0.0

0.4

0.8 VO = 3.3V

+85°C

-40°C

+25°C

ILOAD = 0mA

0.04

0.06

-0.06

-0.10 100 200 300 4000LOAD CURRENT - IO (mA)

OUTPUT VOLTAGE CHANGE (%)

-0.02

0.00

0.02

0.08

0.10

-0.04

-0.08

50 150 250 350

VIN = 3.8V

VO = 3.3V

+85°C

-40°C

+25°C

0.04

0.06

-0.06

-0.10 -10 20 50 110-40 TEMPERATURE (°C)

OUTPUT VOLTAGE CHANGE (%)

-0.02

0.00

0.02

0.08

0.10

-0.04

-0.08

-25 5 35 8065 95 125

VIN = 3.8V

VO = 3.3V

ILOAD = 0mA

OUTPUT VOLTAGE, VO (V)

INPUT VOLTAGE (V)

3.0

3.1

3.2

3.3

3.4

2.9

2.8 3.1 3.6 4.1 4.6 5.1 6.15.6

IO = 300mA

IO = 150mA

IO = 0mA VO = 3.3V

6.5

2.5

2.6

2.7

2.8

2.9

2.4

2.32.63.13.64.14.65.1 6.1

INPUT VOLTAGE (V)

OUTPUT VOLTAGE, VO (V)

5.6

IO = 0mA

IO = 300mA

VO = 2.8V

IO = 150mA

6.5

200

250

300

350

150

100

050 100 150 200 250 300 350 4000OUTPUT LOAD (mA)

DROPOUT VOLTAGE, VDO (mV)

VO = 2.8V

VO = 3.3V

ISL9000

6FN9217.4

March 11, 2008

FIGURE 8. DROPOUT VOLTAGE vs LOAD CURRENT FIGURE 9. GROUND CURRENT vs INPUT VOLTAGE

FIGURE 10. GROUND CURRENT vs LOAD FIGURE 11. GROUND CURRENT vs TEMPERATURE

FIGURE 12. POWER-UP/POWER-DOWN FIGURE 13. POWER-UP/POWER-DOWN WITH POR SIGNALS

Typical Performance Curves (Continued)

200

250

300

350

150

100

050 100 150 200 250 300 350 4000OUTPUT LOAD (mA)

DROPOUT VOLTAGE, VDO (mV)

VO = 3.3V

+85°C +25°C -40°C

25 4.0 5.0 6.5

INPUT VOLTAGE (V)

GROUND CURRENT (µA)

3.0 3.5 4.58 5.5 6.0

IO(BOTH CHANNELS) = 0µA

VO1 = 3.3V

VO2 = 2.8V

-40°C

+25°C

+125°C

200

160

100

050 100 150 200 250 4000

LOAD CURRENT (mA)

GROUND CURRENT (µA)

350300

VO1 = 3.3V

VIN = 3.8V

VO2 = 2.8V

120

140

180

+85°C

-40°C

+25°C

25 -10 20 50 110-40 TEMPERATURE (°C)

GROUND CURRENT (µA)

-25 5 35 8065 95 125

VIN = 3.8V

VO = 3.3V

ILOAD = 0µA

BOTH OUTPUTS ON

25 -10 20 50 110-40 TEMPERATURE (°C)

GROUND CURRENT (µA)

-25 5 35 8065 95 125

VIN = 3.8V

VO = 3.3V

ILOAD = 0µA

BOTH OUTPUTS ON

1234567 10

TIME (s)

VOLTAGE (V)

VO2

VO1

VIN

VO1 = 3.3V

VO2 = 2.8V

IL1 = 300mA

IL2 = 300mA

1.5

2.0

2.5

3.0

1.0

0.5

0.5 1.0 1.5 2.0 2.5 3.0 3.5 5.00TIME (s)

VOLTAGE (V)

4.0 4.5

POR1

VO1

POR2

VO2

3.5 VO1 = 3.3V

VO2 = 2.8V

IL1 = 300mA

IL2 = 300mA

CPOR = 0.1µF

ISL9000

7FN9217.4

March 11, 2008

FIGURE 14. TURN ON/TURN OFF RESPONSE FIGURE 15. LINE TRANSIENT RESPONSE (3.3V OUTPUT)

FIGURE 16. LINE TRANSIENT RESPONSE (2.8V OUTPUT) FIGURE 17. LOAD TRANSIENT RESPONSE

FIGURE 18. PSRR vs FREQUENCY FIGURE 19. SPECTRAL NOISE DENSITY vs FREQUENCY

Typical Performance Curves (Continued)

100 200 300 400 500 600 700 8000

TIME (µs)

VO1 (V)VEN (V)

VO1 = 3.3V

VIN = 5.0V

IL1 = 300mA

CL1, CL2 = 1µF

CBYP = 0.01µF

900 1000

VO2 (10mV/DIV)

IL2 = 300mA

VO2 = 2.8V

400µs/DIV

VO = 3.3V

ILOAD = 300mA

3.6V

4.3V

10mV/DIV

CLOAD = 1µF

CBYP = 0.01µF

400µs/DIV

VO = 2.8V

ILOAD = 300mA

3.5V

4.2V

10mV/DIV

CLOAD = 1µF

CBYP = 0.01µF

100µs/DIV

VO (25mV/DIV)

ILOAD

300mA

100µA

VIN = 2.8V

VO = 1.8V

0.1k 1k 10k 100k 1M

FREQUENCY (Hz)

100

PSRR (dB)

VIN = 3.6V

VO = 1.8V

IO = 10mA

CBYP = 0.1µF

CLOAD = 1µF

SPECTRAL NOISE DENSITY (nV/√Hz)

1000

100

0.1

10 100 1k 10k 100k 1M

FREQUENCY (Hz)

VIN = 3.6V

VO = 1.8V

ILOAD = 10mA

CBYP = 0.1µF

CIN = 1µF

CLOAD = 1µF

ISL9000

8FN9217.4

March 11, 2008

Pin Description

Typical Application

NUMBER PIN

NAME TYPE DESCRIPTION

1 VIN Analog I/O Supply Voltage/LDO Input:

Connect a 1µF capacitor to GND.

2 EN1 Low Voltage Compatible

CMOS Input LDO-1 Enable.

3 EN2 Low Voltage Compatible

CMOS Input LDO-2 Enable.

4 CBYP Analog I/O Reference Bypass Capacitor Pin:

Optionally connect capacitor of value 0.01µF to 1µF between this pin and GND to tune in the

desired noise and PSRR performance.

5 CPOR Analog I/O POR2 Delay Setting Capacitor Pin:

Connect a capacitor between this pin and GND to delay the POR2 output release after LDO-2

output reaches 94% of its specified voltage level. (200ms delay per 0.01µF).

6 GND Ground GND is the connection to system ground. Connect to PCB Gr ound plane.

7POR1

Open Drain Output (1mA) Open-drain POR Output for LDO-1 (active-low):

Internally connected to VO1 through 100kΩ resistor.

8POR2

Open Drain Output (1mA) Open-drain POR Output for LDO-2 (active-low):

Internally connected to VO2 through 100kΩ resistor.

9VO2

Analog I/O LDO-2 Output:

Connect capacitor of value 1µF to 10µF to GND (1µF recommended).

10 VO1 Analog I/O LDO-1 Output:

Connect capacitor of value 1µF to 10µF to GND (1µF recommended).

C1, C4, C5: 1µF X5R ceramic capacitor

C2: 0.1µF X7R ceramic capacitor

ISL9000

VIN

EN1

EN2

CBYP

CPOR

VO1

VO2

POR2

POR1

GND

VIN (2.3 TO 6.5V)

ENABLE1

ENABLE2

VOUT 1

VOUT 2

RESET 1

RESET 2

C1 C2 C3 C4 C5

C3: 0.01µF X7R ceramic capacitor

OFF

(200ms delay,

C3 = 0.01µF)

(2ms delay)

VOUT 2 TOO LOW

VOUT 2 OK

VOUT 1 TOO LOW

VOUT 1 OK

ISL9000

9FN9217.4

March 11, 2008

Block Diagram

Functional Description

The ISL9000 contains two high performanc e LDOs. High

performance is achieved through a circuit that delivers fast

transient response to varying load conditions. In a quiescent

condition, the ISL9000 adjusts its biasing to achieve the

lowest standby current consumption.

The device also integrates current limit protection, smart

thermal shutdown protection, staged turn-on and soft-start.

Smart thermal shutdown protects the device against

overheating. Staged turn-on and soft-start minimize start-up

input current surg es w itho u t causing ex ces sive device

turn-on time.

Power Control

The ISL9000 has two separate enable pins, EN1 and EN2,

to individually control power to each of the LDO outputs.

When both EN1 and EN2 are low, the device is in shutdown

mode. During this condition, all on-chip circuits are off, and

the device draws minimum current, typically less than 0.1µA.

When one or both of the enable pi ns ar e asserted, the

device first polls the outpu t of th e UV LO detector to ensure

that VIN voltage is at least about 2.1V. Once verified, the

device initiates a start-up sequence. During the start-up

sequence, trim settings are first read and latched. Then,

sequentially, the bandgap, reference voltage and current

generation circuitry power-up. Once the references are

stable, a fast-start circuit quickly charges the external

reference bypass capacitor (connected to the CBYP pin) to

the proper operating voltage. After the bypass capacitor has

been charged, the LDOs power-up in their specified

sequence.

Soft-start circuitry integrated into each LDO limits the initial

ramp-up rate to about 30µs/V to minimize current surge.

VO2

LDO

ERROR

AMPLIFIER

IS1 1VQEN1

LDO-1

LDO-2

POR

COMPARATOR

VOK1

POR1

VREF

TRIM

VIN

VO1

VO2

POR2

POR1

GND

EN2

EN1 CONTROL

LOGIC POR2

DELAY

POR1

DELAY

VOLTAGE

REFERENCE

GENERATOR

BANDGAP AND

TEMPERATURE

SENSOR

UVLO

VOK2

VOK1

1.00V

0.94V

0.90V

IS1

IS2

QEN1

QEN2

VO1

VO2

100k100k

CPOR

CBYP

VO1

~1.0V

VOK2

POR2

ISL9000

10 FN9217.4

March 11, 2008

If EN1 is brought high, and EN2 goes high before the VO1

output stabilizes, the ISL9000 delays the VO2 turn-on until

the VO1 output reaches its target level.

If EN2 is brought high, and EN1 goes high before VO2 starts

its output ramp, then VO1 turns on first and, the ISL9000

delays the VO2 turn-on until the VO1 output reaches its

target level.

If EN2 is brought high, and EN1 goes high after VO2 starts

its output ramp, then the ISL9000 immediately starts to ramp

up the VO1 output.

If both EN1 and EN2 are brought high at the same time, the

VO1 output has priority, and is always powered up first.

During operation, whenever the VIN voltage drops below

about 1.8V, the ISL9000 immediately disables both LDO

outputs. When VIN rises back above 2.1V, the device

re-initiates its start-up sequence and LDO operation will

resume automatically.

Reference Generation

The reference generation circuitry includes a trimmed

bandgap, a trimmed voltage reference divide r, a trimmed

current reference generator , and an RC noise filter . The filter

includes the external capacitor connected to the CBYP pin.

A 0.01µF capacitor connected CBYP implements a 100Hz

lowpass filter, and is recommended for most high

performance applications. For the lowest noise application, a

0.1µF or greater CBYP capacitor should be used. This filters

the reference noise below the 10Hz to 1kHz frequency band,

which is crucial in many noise-sensitive applicatio ns.

The bandgap generates a zero temperature coefficient (TC)

voltage for the reference divider. The reference divider

provides the regulation reference, POR detection thresholds,

and other voltage references required for current generation

and over-temperature detection.

The current generator provides the references required for

adaptive biasing as well as references for LDO output

current limit and thermal shutdown determination.

LDO Regulation and Progr ammable Output Divider

The LDO Regulator is implemented with a high-gain

operational amplifier driving a PMOS pass transistor. The

design of the ISL9000 provides a regulator that has low

quiescent current, fast transient response, and overall

stability across all operating and load current conditions.

LDO stability is guaranteed for a 1µF to 10µF output

capacitor that has a tolerance better than 20% and ESR less

than 200mΩ. The design is performance-optimized for a 1µF

capacitor. Unless limited by the application, use of an output

capacitor value above 4.7µF is not normally needed as LDO

performance improvement is minimal.

Each LDO uses an independently trimmed 1V reference. An

internal resistor divider drops the LDO output voltage down

to 1V. This is compared to the 1V reference for regulation.

The resistor division ratio is programmed in the factory to

one of the following output voltages: 1.5V, 1.8V, 1.85V, 2.5V,

2.6V, 2.7V, 2.8V, 2.85V, 2.9V, 3.0V, and 3.3V.

Power-On Reset Generation

Each LDO has a separate Power-on Reset signal generation

circuit which outputs to the respective POR pins. T he POR

signal is generated as follows:

A POR comparator continuously monitors the output of each

LDO. The LDO enters a power-good state when the output

voltage is above 94% of the expected output voltage for a

period exceeding the LDO PGOOD entry delay time (see the

following). In the power-good state, the open-drain PORx

output is in a high-impedance state. An internal 100kΩ

pull-up resistor pulls the pin up to the respective LDO output

voltage. An external resistor can be added between the

PORx output and the LDO output for a faster rise time,

however, the PORx output should not connect through an

external resistor to a supply greater than the associated

LDO voltage.

The power-good state is exited when the LDO output falls

below 90% of the expected output voltage for a period longer

than the PGOOD exit delay time. While power-good is false,

the ISL9000 pulls the respective POR pin low.

For LDO-1, the PGOOD entry delay time is fixe d at about

2ms while the PGOOD exit delay is about 25µs. For LDO-2,

the PGOOD entry and exit delays are determined by the

value of the external capacitor connected to the CPOR pin.

For a 0.01µF capacitor, the entry and exit delays are 200ms

and 25µs respectively . Larger or smaller capacitor values will

yield proportionately longer or shorter delay times. The POR

exit delay should never be allowed to be less than 10µs to

ensure sufficient immunity against transient induced false

POR triggering.

Overheat Detection

The bandgap provides a proportional-to-temperature current

that is indicative of the temperature of the silicon. This

current is compared with references to determine if the

device is in danger of damage due to overheating. When the

die temperature reaches about +14 5°C, one or both of the

LDOs momentarily shut down until the die cools sufficiently.

In the overheat condition, only the LDO sourcing more than

50mA will be shut off. This does not affect the operation of

the other LDO. If both LDOs source more than 50mA and an

overheat condition occurs, both LDO outputs are disabled.

Once the die temperature falls back below about +110°C,

the disabled LDO(s) are re-enabled and soft-start

automatically takes place.

The ISL9000 provides short-circuit protection by limiting the

output current to about 475mA. If short circuited, an output

current of 475mA will cause die heating. If the short circuit

lasts long enough, the overheat detection circuit will turn off

the output.

ISL9000

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent rights of I nter sil or it s sub sidi aries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN9217.4

March 11, 2008

ISL9000

Dual Flat No-Lead Plastic Package (DFN)

NX (b)

SECTION "C-C"

FOR ODD TERMINAL/SIDE

TERMINAL TIP

(A1)

BOTTOM VIEW

AREA

INDEX

0.10

0.08

SIDE VIEW

0.10

C0.10

TOP

VIEW

AREA

INDEX

NX L

E2/2

REF.

(Nd-1)Xe

(DATUM A)

(DATUM B)

0.10

BAC

N-1

PLANE

SEATING

NX b

D2/2

NX k

L10.3x3C

10 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE

SYMBOL

MILLIMETERS

NOTESMIN NOMINAL MAX

A 0.85 0.90 0.95 -

A1 - - 0.05 -

A3 0.20 REF -

b 0.20 0.25 0.30 5, 8

D 3.00 BSC -

D2 2.33 2.38 2.43 7, 8

E 3.00 BSC -

E2 1.59 1.64 1.69 7, 8

e 0.50 BSC -

k0.20- - -

L 0.35 0.40 0.45 8

N102

Nd 5 3

Rev. 1 4/06

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd refers to the number of terminals on D.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located wi thin the zone indicated. The pin #1 identif ier may be

either a mold or mark feature.

7. Dimensions D2 and E2 are for the exposed pads which provide

improved electrical and thermal performance.

8. Nominal dimensions are provided to assist with PCB Land

Pattern Design efforts, see Intersil Technical Brief TB389.

9. COMPLIANT TO JEDEC MO-229-WEED-3 except for

dimensions E2 & D2.