NPN General Purpose Amplifier
This device is for use as a medium power amplifier and
switch requiring collector currents up to 500 mA. Sourced
from Process 19.
Absolute Maximum Ratings* TA = 25°C unless otherwise noted
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Symbol Parameter Value Units
VCEO Collector-Em itter Vol t age 40 V
VCBO Collector-Base Voltage 75 V
VEBO Emitter-Base Voltage 6.0 V
ICCollector Current - Continuous 1.0 A
TJ, Tstg Operating and Storage Junction Temperature Range -55 to +150 °C
1998 Fairchild Semiconductor Corporation
Thermal Characteristics TA = 25°C unless otherwise noted
Symbol Characteristic Max Units
PN2222A *MMBT2222A **PZT2222A
PDTotal Device Dissipation
Derate above 25°C625
5.0 350
2.8 1,000
8.0 mW
mW/°C
RθJC Thermal Resi stance, Junction to Case 83. 3 °C/W
RθJA Thermal Resi stance, Junction to Ambient 200 357 125 °C/W
*Device mounted on FR-4 PCB 1.6" X 1.6" X 0.06."
**Device mounted on FR-4 PCB 36 mm X 18 mm X 1.5 mm; mounting pad for the collector lead min. 6 cm2.
PN2222A
CBETO-92
MMBT2222A
C
B
E
SOT-23
Mark: 1P
PZT2222A
BC
C
SOT-223
E
PN2222A / MMBT2222A / PZT2222A
Electrical Characteristics TA = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Max Units
OFF CHARACTERISTICS
ON CHARACTERISTICS
SMALL SIGNAL CHARACTERISTICS
fTCurrent Gain - Bandwidth Product IC= 20 mA , VCE= 20 V, f= 100 MHz 300 MHz
Cobo Output Capacitance VCB = 10 V, I E = 0, f = 100 kHz 8.0 pF
Cibo Input Capacitance VEB = 0.5 V, IC = 0, f = 100 kHz 25 pF
rb’CCCollector Base Ti me Constant IC= 20 mA, VCB= 20 V, f= 31.8 MHz 150 pS
NF Noise Figure IC = 100 µA, VCE = 10 V,
RS = 1.0 kΩ, f = 1.0 kHz 4.0 dB
Re(hie)Real Part of Com mon-Em i t ter
High Frequency Input I mpedance IC = 20 mA, V CE = 20 V,
f = 300 MHz 60 Ω
SWITCHING CHARACTERISTICS
*Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
Spice Model
V(BR)CEO Col lector-Emit t er Breakdown Voltage* IC = 10 mA, IB = 0 40 V
V(BR)CBO Collector-Base Breakdown Voltage IC = 10
µ
A, IE = 0 75 V
V(BR)EBO Emitter-Base Breakdown Voltage IE = 10
µ
A, IC = 0 6.0 V
ICEX Collector Cutoff Current VCE = 60 V, VEB(OFF) = 3.0 V 10 nA
ICBO Collector Cutoff Current VCB = 60 V, IE = 0
VCB = 60 V, IE = 0, TA = 150 °C0.01
10
µ
A
µ
A
IEBO Emitter Cutoff Curre n t VEB = 3.0 V, IC = 0 10 nA
IBL Base Cuto ff Current VCE = 60 V, VEB(OFF) = 3.0 V 20 nA
hFE DC Current Gain IC = 0.1 mA, VCE = 10 V
IC = 1.0 mA , VCE = 10 V
IC = 10 mA, V CE = 10 V
IC = 10 mA, V CE = 10 V, TA = -55°C
IC = 150 mA, V CE = 10 V *
IC = 150 mA, V CE = 1. 0 V *
IC = 500 mA, V CE = 10 V*
35
50
75
35
100
50
40
300
VCE(sat)Collec t or-Emitter S aturation
Voltage* IC = 150 mA, IB = 15 mA
IC = 500 mA, IB = 50 mA 0.3
1.0 V
V
VBE(sat)Base-Emitter Saturati on Voltage* IC = 150 m A, IB = 15 mA
IC = 500 mA, IB = 50 mA 0.6 1.2
2.0 V
V
tdDelay Time VCC = 30 V, VBE(OFF) = 0.5 V, 10 ns
trRise Time IC = 150 mA, IB1 = 15 mA 25 ns
tsStorage Time VCC = 30 V, IC = 150 mA, 225 ns
tfFa ll Time IB1 = IB2 = 15 mA 60 ns
NPN (Is=14.34f Xti=3 Eg=1.1 1 V af=74.03 Bf=255.9 Ne=1.307 Ise=14.34f Ikf=.2847 Xtb=1.5 Br=6.092 Nc=2 Isc=0
Ikr=0 Rc=1 Cjc=7.306p Mjc=.3416 Vjc=.75 Fc=.5 Cje=22.01p Mje=.377 Vje=.75 Tr=46.91n Tf=411.1p Itf=.6
Vtf=1.7 Xtf=3 Rb=10)
NPN General Purpose Amplifier
(continued)
PN2222A / MMBT2222A / PZT2222A
Dimensions are in millimeter
Pkg type
A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
SOT-23
(8mm)
3.15
+/-0.10 2.77
+/-0.10 8.0
+/-0.3 1.55
+/-0.05 1.125
+/-0.125 1.75
+/-0.10 6.25
min 3.50
+/-0.05 4.0
+/-0.1 4.0
+/-0.1 1.30
+/-0.10 0.228
+/-0.013 5.2
+/-0.3 0.06
+/-0.02
Dimensions are in inches and millimeters
Tape Size Reel
Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
8mm 7" Dia 7.00
177.8 0.059
1.5 512 +0.020/-0. 008
13 +0.5/-0.2 0.795
20.2 2.165
55 0.331 +0.059/-0.000
8.4 +1.5/0 0.567
14.4 0.311 – 0.429
7.9 – 10.9
8m m 13" Dia 13.00
330 0.059
1.5 512 +0.020/-0. 008
13 +0.5/-0.2 0.795
20.2 4.00
100 0.331 +0.059/-0.000
8.4 +1.5/0 0.567
14.4 0.311 – 0.429
7.9 – 10.9
See detail AA
Dim A
max
13" Diameter Option
7" Diameter Option
Dim A
Max
See detail AA
W3
W2 max Measured at Hub
W1 Measured at Hub
Dim N
Dim D
min
Dim C
B Min
DETAIL AA
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum component rotation
0.5mm
maximum
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
Typical
component
cavity
center line
20 deg maximum
Typical
component
center line
B0
A0
Sketch B (Top View)
Component Rotation
Sketch A (Si de or Front Sectional Vi ew)
Component Rotation
User Direction of Feed
SOT-23 Embossed Carrier Tape
Configuration: Figure 3.0
SOT-23 Reel Configuration: Figure 4.0
P1 A0
D1
FW
E1
E2
Tc
Wc
K0
T
B0
D0P0 P2
SOT-23 Tape and Reel Data, continued
September 1999, Rev . C
Dimensions are in millimeter
Pkg type A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
SOT-223
(12mm) 6.83
+/-0.10 7.42
+/-0.10 12.0
+/-0.3 1.55
+/-0.05 1.50
+/-0.10 1.75
+/-0.10 10.25
min 5.50
+/-0.05 8.0
+/-0.1 4.0
+/-0.1 1.88
+/-0.10
0.292
+/-
0.0130
9.5
+/-0.025 0.06
+/-0.02
P1
A0 D1
P0
F
W
E1
D0
E2
B0
Tc
Wc
K0
T
Dimensions are in inches and millimeters
Tape Size Reel
Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
12m m 7" Dia 7.00
177.8 0.059
1.5 512 +0.020/-0.008
13 +0.5/-0.2 0.795
20.2 5.906
150 0.488 +0.078/-0.000
12.4 + 2/0 0.724
18.4 0.469 – 0.606
11.9 – 15.4
12m m 13" Dia 13.00
330 0.059
1.5 512 +0.020/-0.008
13 +0.5/-0.2 0.795
20.2 7.00
178 0.488 +0.078/-0.000
12.4 + 2/0 0.724
18.4 0.469 – 0.606
11.9 – 15.4
See detail AA
Dim A
max
13" Diameter Option
7" Diameter Option
Dim A
Max
See detail AA
W3
W2 max Measured at Hub
W1 Measured at Hub
Dim N
Dim D
min
Dim C
B Min
DETAIL AA
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum component rotation
0.5mm
maximum
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
Typical
component
cavity
center line
20 deg maximum
Typical
component
center line
B0
A0
Sketch B (Top View)
Component Rotation
Sketch A (Si de or Front Sectional View)
Component Rotation
User Direction of Feed
SOT-223 Embossed Carrier Tape
Configuration: Figure 3.0
SOT-223 Reel Configur at io n: Figure 4.0
SOT-223 Tape and Reel Data, continued
July 1999, Rev . B
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The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
DISCLAIMER
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NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PA TENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
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