Surface Mount Schottky Barrier Rectifier Diode NSD Series FEATURES VOLTAGE: 20 TO 60 VOLTS, CURRENT: 1.0 & 2.0 AMPERE CORRESPONDS TO 1N5817 THRU 1N5819 (1Amp) IN SURFACE MOUNT PACKAGE FLAT PACK - LOW PROFILE, FOR SURFACE MOUNT APPLICATIONS FAST RESPONSE AND LOW FORWARD VOLTAGE HIGH TEMPERATURE SOLDERING (250OC/10 SECONDS) EASY PICK AND PLACE CATHODE 1.32~1.47 SURFACE MOUNT * * * * * * 2.54~2.79 3.99~4.50 MECHANICAL DATA: SIZE: SMA/DO-214AC CASE: Molded epoxy TERMINALS: Solder plated Copper alloy POLARITY: Indicated by cathode band STANDARD PACKAGING: 12mm tape (EIA-RS-481) WEIGHT: 0.064 gram 4.93~5.28 1.98~2.29 0.76~1.27 0.1~0.2 .8~1.3 PART NUMBERING SYSTEM Dimensions (mm) 14 NSD TR -5K Reel qty: (3K & 5K) Tape and Reel Voltage & Current Designator (See ratings tables) Series MAXIMUM RATINGS (At TA=250C unless otherwise noted) Ratings Symbol NSD12 NSD13 NSD14 NSD15 NSD16 UNITS Maximum Recurrent Peak Reverse Voltage VRRM 20 30 40 50 60 Volts Maximum RMS Voltage VRMS 14 21 28 35 42 Volts Maximum DC Blocking Voltage VDC 20 30 40 50 60 Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) lo 1.0 Amps IFSM 30 Amps (Note 2) RqJL 25 o Maximum Thermal Resistance Volts C/W Typical Junction Capacitance (Note 1) CJ 110 80 Operating and Storage Temperature Range TJ, TSTG -65 to +125 -65 to +150 pF Typical Reverse Recovery Time TRR 15 o C nS ELECTRICAL CHARACTERISTICS (At TA=250C unless otherwise noted) Characteristics Symbol Maximum Forward Voltage at 1.0A DC VF Maximum DC Reverse Current at @TA=25C Rated DC Blocking Voltage (Note 3) @TA=100oC NOTES: IR NSD12 NSD13 NSD14 NSD15 0.50 NSD16 0.65 0.5 10.0 UNITS Volts mAmps 5.0 mAmps 1. Measured at 1.0 MHz and applied average voltage of 4.0VDC. 2. Thermal resistance junction to terminal, 5mm2 (0.013 mm Thick) copper land patterns. 3. Pulse width 300uS, 2% duty cycle. (R) 252 NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com Surface Mount Schottky Barrier Rectifier Diode NSD Series RATING AND CHARACTERISTIC CURVES (NSD12 THRU NSD16) FIG. 2 - MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 1.0 .8 NSD15, 16 .6 NSD12~14 .4 Single Phase Half Wave 60Hz Resistive or Inductive Load .2 0 PEAK FORWARD SURGE CURRENT, (A) 50 8.3ms Single Half Sine-Wave (JEDEC Method) T J=125OC 40 30 20 10 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE, (OC) 175 1 2 4 6 8 10 20 40 60 NUMBER OF CYCLES AT 60Hz 80 100 SURFACE MOUNT AVERAGE FORWARD RECTIFIED CURRENT, (A) FIG. 1 - FORWARD CURRENT DERATING CURVE NSD12~14 (R) NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com 253 Surface Mount Schottky Barrier Rectifier Diode NSD Series SURFACE MOUNT MAXIMUM RATINGS (At TA=250C unless otherwise noted) Ratings Symbol NSD22 NSD23 NSD24 NSD25 NSD26 UNITS Maximum Recurrent Peak Reverse Voltage VRRM 20 30 40 50 60 Volts Maximum RMS Voltage VRMS 14 21 28 35 42 Volts Maximum DC Blocking Voltage VDC 20 30 40 50 60 Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) lo 2.0 Amps IFSM 50 Amps 75.0 17.0 Typical Junction Capacitance (Note 1) Rth-JA Rth-JL CJ 220 180 Operating and Storage Temperature Range TJ/TSTG -65 to +125/-65 to +150 -65 to +150 Typical Reverse Recovery Time TRR Typical Thermal Resistance Volts C/W o pF C o 15 nS ELECTRICAL CHARACTERISTICS (At TA=250C unless otherwise noted) Characteristics Symbol Maximum Forward Voltage at 2.0A DC NSD22 VF Maximum DC Reverse Current at @TA=25C Rated DC Blocking Voltage @TA=100oC NSD23 NSD24 NSD25 0.50 NSD26 0.70 Volts 0.5 IR UNITS mAmps 20.0 10.0 mAmps NOTE: 1. Measured at 1.0 MHz and applied average voltage of 4.0VDC. Fig.1 - Derated Curve for Output Rectifier Current Average Forward Current Amperes 2.0 Fig.2 - Typcial Junction Capacitance 500 Resistive or Inductive Load TJ=25C f=1.0MHz Vsig=50mV p-p 1.5 NSD22 ~ NSD24 NSD22 & NSD24 100 1.0 NSD22 ~ NSD24 NSD25 ~ NSD26 PCB Mounted on 0.2x0.2"(5.0x5.0mm) Copper Pad Areas 0.5 10 0.1 1.0 10 100 Reverse Voltage, Volts 0 50 60 70 80 90 100 110 120 130 140 150 160 Lead Temperature,C 100 TA=125C CJ, Capacitnce, pF 10 1 TA=75C 0.1 Fig.4 - Maximum Non-Repetive Peak Forward Surge Current Peak Forward Surge Current Amperes Fig.3 - Typical Reverse Characteristics 50 8.3ms Single Half Sine-Wave (JEDEC Method) at Rated T L 40 Fig.5 - Typical Instantaneous Forward Characteristics 100 10 30 S Pulse Width=300 1% Duty Cycle 20 TJ=125C 10 0 TJ=25C 1 1 10 TJ=150C 100 Number of Cycles at 60Hz T A=75C 0.01 0.1 0.001 Percentage of Rated Peak Reverse Voltage, % 0.01 0 (R) 254 NIC COMPONENTS 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Instantanesous Forward Voltage, Volts www.niccomp.com www.lowESR.com www.RFpassives.com Surface Mount Diodes NRD And NSD Series TAPING AND MOUNTING SPECIFICATIONS d P0 P1 B W F P T D1 D1 SURFACE MOUNT A E C D W 1 RECOMMENDED LAND PATTERN REEL QUANTITIES Reel Size B Qty/Reel 13 inch (330mm) 3000, 5000 pcs A C A Dimensions (mm) A 1.2-1.8 B 1.5-2.2 C 2.7 max. Item Symbol Specifications (mm) Specifications (inch) Carrier Width A 3.2 max. .126 max. Carrier Length B 7.8 max. .307 max. Carrier Depth C 4.5 max. .177 max. Sprocket Hole d 1.5 0.1 .059 .004 Reel Outside Diameter D 178 2.0 7.00 .079 Reel Inner Diameter D1 50 min. 1.969 min. Feed Hole Diameter D2 13.0 0.5 .512 .020 Sprocket Hole Position E 1.75 0.1 .069 .004 Punch Hole Position F 5.5 0.1 .217 .004 Punch Hole Pitch P 4.0 0.1 .157 .004 Sprocket Hole Pitch P0 4.0 0.1 .157 .004 Embossment Center P1 2.0 0.05 .079 .002 Overall Tape Thickness T 1.1 max. .043 max. Tape Width W 12.0 0.3 .472 .012 Reel Width W1 18.4 max. .724 max. NOTE: Devices are packed in accordance with EIA standard RS-481-A and specifications given above. (R) NIC COMPONENTS www.niccomp.com www.lowESR.com www.RFpassives.com 255