Filterless High Efficiency Mono 3 W Class-D Audio Amplifier SSM2311 The SSM2311 features a high efficiency, low noise modulation scheme that does not require any external LC output filters. The modulation continues to provide high efficiency even at low output power. It operates with 90% efficiency at 1.4 W into 8 or 85% efficiency at 3 W into 3 from a 5.0 V supply and has an SNR that is better than 98 dB. Spread-spectrum pulse density modulation is used to provide lower EMI-radiated emissions compared with other Class-D architectures. FEATURES Filterless Class-D amplifier with - modulation No sync necessary when using multiple Analog Devices, Inc., Class-D amplifiers 3 W into 3 load and 1.4 W into 8 load at 5.0 V supply with less than 10% total harmonic distortion (THD) 90% efficiency at 5.0 V, 1.4 W into 8 speaker Better than 98 dB signal-to-noise ratio (SNR) Single-supply operation from 2.5 V to 5.5 V 20 nA ultralow shutdown current Short-circuit and thermal protection Available in 9-ball, 1.5 mm x 1.5 mm WLCSP Pop-and-click suppression Built-in resistors reduce board component count Default fixed 18 dB or user-adjustable gain setting The SSM2311 has a micropower shutdown mode with a typical shutdown current of 20 nA. Shutdown is enabled by applying a logic low to the SD pin. The device also includes pop-and-click suppression circuitry. This minimizes voltage glitches at the output during turn-on and turnoff, thus reducing audible noise on activation and deactivation. APPLICATIONS The fully differential input of the SSM2311 provides excellent rejection of common-mode noise on the input. Input coupling capacitors can be omitted if the dc input common-mode voltage is approximately VDD/2. Mobile phones MP3 players Portable gaming Portable electronics Educational toys The default gain of SSM2311 is 18 dB, but users can reduce the gain by using a pair of external resistors (see the Gain section). GENERAL DESCRIPTION The SSM2311 is a fully integrated, high efficiency, Class-D audio amplifier. It is designed to maximize performance for mobile phone applications. The application circuit requires a minimum of external components and operates from a single 2.5 V to 5.5 V supply. It is capable of delivering 3 W of continuous output power with less than 1% THD + N driving a 3 load from a 5.0 V supply. The SSM2311 is specified over the industrial temperature range (-40C to +85C). It has built-in thermal shutdown and output short-circuit protection. It is available in a 9-ball, 1.5 mm x 1.5 mm wafer level chip scale package (WLCSP). FUNCTIONAL BLOCK DIAGRAM VBATT 2.5V TO 5.0V 10F 0.1F SSM2311 22nF1 AUDIO IN+ AUDIO IN- REXT IN+ 300k VDD 37.5k OUT+ 22nF1 REXT FET DRIVER MODULATOR IN- OUT- 37.5k 300k SHUTDOWN GAIN = BIAS OSCILLATOR POP-AND-CLICK SUPPRESSION GND 300k (37.5k + R EXT ) 1 INPUT CAPS ARE OPTIONAL IF INPUT DC COMMON-MODE VOLTAGE IS APPROXIMATELY VDD/2. 06161-001 SD Figure 1. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2008 Analog Devices, Inc. All rights reserved. SSM2311 TABLE OF CONTENTS Features .............................................................................................. 1 Typical Application Circuits ......................................................... 13 Applications....................................................................................... 1 Application Notes ........................................................................... 15 General Description ......................................................................... 1 Overview ..................................................................................... 15 Functional Block Diagram .............................................................. 1 Gain.............................................................................................. 15 Revision History ............................................................................... 2 Pop-and-Click Suppression ...................................................... 15 Specifications..................................................................................... 3 Layout .......................................................................................... 15 Absolute Maximum Ratings............................................................ 4 Input Capacitor Selection.......................................................... 16 Thermal Resistance ...................................................................... 4 Proper Power Supply Decoupling ............................................ 16 ESD Caution.................................................................................. 4 Outline Dimensions ....................................................................... 17 Pin Configuration and Function Descriptions............................. 5 Ordering Guide .......................................................................... 17 Typical Performance Characteristics ............................................. 6 REVISION HISTORY 1/08--Revision 0: Initial Version Rev. 0 | Page 2 of 20 SSM2311 SPECIFICATIONS VDD = 5.0 V, TA = 25oC, RL = 8 , unless otherwise noted. Table 1. Parameter DEVICE CHARACTERISTICS Output Power Symbol Conditions PO RL = 8 , THD = 1%, f = 1 kHz, 20 kHz BW, VDD = 5.0 V RL = 8 , THD = 1%, f = 1 kHz, 20 kHz BW, VDD = 3.6 V RL = 8 , THD = 10%, f = 1 kHz, 20 kHz BW, VDD = 5.0 V RL = 8 , THD = 10%, f = 1 kHz, 20 kHz BW, VDD = 3.6 V RL = 4 , THD = 1%, f = 1 kHz, 20 kHz BW, VDD = 5.0 V RL = 4 , THD = 1%, f = 1 kHz, 20 kHz BW, VDD = 3.6 V RL = 4 , THD = 10%, f = 1 kHz, 20 kHz BW, VDD = 5.0 V RL = 4 , THD = 10%, f = 1 kHz, 20 kHz BW, VDD = 3.6 V RL = 3 , THD = 1%, f = 1 kHz, 20 kHz BW, VDD = 5.0 V RL = 3 , THD = 1%, f = 1 kHz, 20 kHz BW, VDD = 3.6 V RL = 3 , THD = 10%, f = 1 kHz, 20 kHz BW, VDD = 5.0 V RL = 3 , THD = 10%, f = 1 kHz, 20 kHz BW, VDD = 3.6 V POUT = 1.4 W, 8 , VDD = 5.0 V PO = 3 W into 3 , f = 1 kHz, VDD = 5.0 V PO = 1 W into 8 , f = 1 kHz, VDD = 5.0 V Efficiency Total Harmonic Distortion + Noise THD + N Input Common-Mode Voltage Range Common-Mode Rejection Ratio Average Switching Frequency Differential Output Offset Voltage POWER SUPPLY Supply Voltage Range Power Supply Rejection Ratio VCM CMRRGSM fSW VOOS VDD PSRR PSRRGSM Min Typ Max 1.2 0.615 1.53 0.77 2 1.4 2.3 1.6 3 1.8 3.3 2.5 89 0.5 0.2 1.0 VCM = 2.5 V 100 mV at 217 Hz input referred VDD - 1.0 60 800 2.0 G = 18 dB ISD GAIN CONTROL Closed-Loop Gain Differential Input Impedance Av ZIN SD = VDD 18 37.5 dB k SHUTDOWN CONTROL Input Voltage High Input Voltage Low Turn-On Time Turn-Off Time Output Impedance VIH VIL tWU tSD ZOUT ISY 1 mA ISY 300 nA SD rising edge from GND to VDD SD falling edge from VDD to GND SD = GND 1.2 0.5 30 5 >100 V V ms s k NOISE PERFORMANCE Output Voltage Noise en VDD = 3.6 V, f = 20 Hz to 20 kHz, inputs are ac grounded, AV = 18 dB, A weighting POUT = 1.4 W, RL = 8 35 V 98 dB ISY Shutdown Current Signal-to-Noise Ratio SNR Rev. 0 | Page 3 of 20 5.0 W W W W W W W W W W W W % % % V dB kHz mV Guaranteed from PSRR test VDD = 2.5 V to 5.0 V, dc input floating/ground VRIPPLE = 100 mV at 217 Hz, inputs ac GND, CIN = 0.1 F VIN = 0 V, no load, VDD = 5.0 V VIN = 0 V, no load, VDD = 3.6 V VIN = 0 V, no load, VDD = 2.5 V SD = GND Supply Current 2.5 70 12.0 Unit 85 60 V dB dB 5.5 4.5 4.0 20 mA mA mA nA SSM2311 ABSOLUTE MAXIMUM RATINGS Absolute maximum ratings apply at 25C, unless otherwise noted. THERMAL RESISTANCE Table 2. JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Parameter Supply Voltage Input Voltage Common-Mode Input Voltage Storage Temperature Range Operating Temperature Range Junction Temperature Range Lead Temperature (Soldering, 60 sec) Rating 6V VDD VDD -65C to +150C -40C to +85C -65C to +165C 300C Table 3. Thermal Resistance Package Type 9-Ball, 1.5 mm x 1.5 mm WLCSP 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Referencing the JEDEC thermal standard. ESD CAUTION Rev. 0 | Page 4 of 20 PCB 1S0P1 2S0P1 JA 162 76 JB 38.5 21 Unit C/W C/W SSM2311 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS BALL A1 CORNER 1 2 3 A B C 06161-002 SSM2311 TOP VIEW (BALL SIDE DOWN) Not to Scale Figure 2. SSM2311 WLCSP Pin Configuration Table 4. Pin Function Descriptions Pin No. 2C 1A 1C 3C 1B 2A, 3B 3A 2B Mnemonic SD IN+ IN- OUT- VDD GND OUT+ PVDD Description Shutdown Input. Active low digital input. Noninverting Input. Inverting Input. Inverting Output. Power Supply. Ground. Noninverting Output. Power Supply. Rev. 0 | Page 5 of 20 SSM2311 TYPICAL PERFORMANCE CHARACTERISTICS 100 100 RL = 8, 33H GAIN = 18dB VDD = 2.5V 10 GAIN = 6dB RL = 4, 33H 10 1 0.1 THD + N (%) THD + N (%) VDD = 2.5V VDD = 3.6V 1 0.1 VDD = 3.6V VDD = 5V 0.01 0.1 1 10 OUTPUT POWER (W) 0.001 0.0001 100 VDD = 2.5V 10 10 10 VDD = 2.5V 1 THD + N (%) THD + N (%) 1 GAIN = 18dB RL = 3, 33H 10 1 0.1 0.1 Figure 6. THD + N vs. Output Power into 4 , AV = 6 dB RL = 8, 33H GAIN = 6dB 10 0.01 OUTPUT POWER (W) Figure 3. THD + N vs. Output Power into 8 , AV = 18 dB 100 0.001 06161-030 0.01 06161-031 0.001 06161-027 0.001 0.0001 VDD = 5V 06161-032 0.01 VDD = 3.6V 0.1 VDD = 3.6V VDD = 5V 0.01 0.01 0.001 0.0001 0.001 0.01 0.1 1 10 OUTPUT POWER (W) 06161-028 VDD = 5V 0.001 0.0001 0.01 0.1 1 OUTPUT POWER (W) Figure 4. THD + N vs. Output Power into 8 , AV = 6 dB 100 0.001 Figure 7. THD + N vs. Output Power into 3 , AV = 18 dB 100 GAIN = 18dB RL = 4, 33H 10 RL = 3, 33H GAIN = 6dB VDD = 2.5V 10 1 THD + N (%) THD + N (%) VDD = 2.5V VDD = 3.6V 0.1 0.01 1 VDD = 3.6V 0.1 0.001 VDD = 5V 0.001 0.01 0.1 1 OUTPUT POWER (W) 10 0.001 0.0001 06161-029 0.001 0.0001 VDD = 5V 0.001 0.01 0.1 1 OUTPUT POWER (W) Figure 5. THD + N vs. Output Power into 4 , AV = 18 dB Figure 8. THD + N vs. Output Power into 3 , AV = 6 dB Rev. 0 | Page 6 of 20 SSM2311 100 VDD = 5V GAIN = 18dB RL = 8, 33H 10 1 THD + N (%) THD + N (%) 10 VDD = 3.6V GAIN = 18dB RL = 8, 33H 1W 0.1 0.5W 0.01 1 0.5W 0.1 0.01 0.25W 0.125W 0.25W 100 1k 10k 100k FREQUENCY (Hz) 0.001 10 06161-033 0.001 10 10k 100k Figure 12. THD + N vs. Frequency, VDD = 3.6 V, RL = 8 , AV = 18 dB 100 VDD = 5V GAIN = 18dB RL = 4, 33H 10 VDD = 3.6V GAIN = 18dB RL = 4, 33H 10 1 2W THD + N (%) THD + N (%) 1k FREQUENCY (Hz) Figure 9. THD + N vs. Frequency, VDD = 5.0 V, RL = 8 , AV = 18 dB 100 100 06161-036 100 0.1 1 1W 0.1 0.5W 1W 0.01 0.5W 100 1k 0.25W 10k 100k FREQUENCY (Hz) 0.001 10 06161-034 0.001 10 10k 100k Figure 13. THD + N vs. Frequency, VDD = 3.6 V, RL = 4 , AV = 18 dB 100 VDD = 5V GAIN = 18dB RL = 3, 33H 10 VDD = 3.6V GAIN = 18dB RL = 3, 33H 10 1 THD + N (%) THD + N (%) 1k FREQUENCY (Hz) Figure 10. THD + N vs. Frequency, VDD = 5.0 V, RL = 4 , AV = 18 dB 100 100 06161-037 0.01 3W 0.1 1.5W 1 0.1 0.75W 1.5W 0.01 0.01 0.75W 1k 10k 100k FREQUENCY (Hz) Figure 11. THD + N vs. Frequency, VDD = 5.0 V, RL = 3 , AV = 18 dB 0.001 10 100 1k 10k 100k FREQUENCY (Hz) Figure 14. THD + N vs. Frequency, VDD = 3.6 V, RL = 3 , AV = 18 dB Rev. 0 | Page 7 of 20 06161-038 100 0.38W 06161-035 0.001 10 SSM2311 5.2 VDD = 2.5V GAIN = 18dB RL = 8, 33H 10 4.8 1 SUPPLY CURRENT (mA) 0.25W 0.1 0.125W 0.01 4.6 4.4 4.2 4.0 3.8 3.9 1k 10k 100k FREQUENCY (Hz) 3.2 2.5 06161-039 100 SHUTDOWN CURRENT (mA) THD + N (%) 0.5W 0.01 5.5 8 VDD = 5V 6 VDD = 3.6V 4 VDD = 2.5V 2 0.125W 0.25W 1k 10k 100k 0 06161-040 100 FREQUENCY (Hz) 0.1 0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 SHUTDOWN VOLTAGE (V) Figure 16. THD + N vs. Frequency, VDD = 2.5 V, RL = 4 , AV = 18 dB Figure 19. Shutdown Current vs. Shutdown Voltage 2.0 VDD = 2.5V GAIN = 18dB RL = 3, 33H 1.8 10 1.6 OUTPUT POWER (W) 0.75W THD + N (%) 5.0 10 0.1 1 0.1 0.38W 0.01 f = 1kHz GAIN = 18dB RL = 8, 33H 1.4 10% 1.2 1.0 1% 0.8 0.6 0.4 0.2 0.2W 100 1k 10k 100k FREQUENCY (Hz) Figure 17. THD + N vs. Frequency, VDD = 2.5 V, RL = 3 , AV = 18 dB 0 2.5 06161-041 0.001 10 4.5 12 VDD = 2.5V GAIN = 18dB RL = 4, 33H 1 100 4.0 Figure 18. Supply Current vs. Supply Voltage, No Load 10 0.001 10 3.5 SUPPLY VOLTAGE (V) Figure 15. THD + N vs. Frequency, VDD = 2.5 V, RL = 8 , AV = 18 dB 100 3.0 06161-042 3.4 0.075W 0.001 10 06161-043 THD + N (%) NO LOAD 5.0 3.0 3.5 4.0 SUPPLY VOLTAGE (V) 4.5 5.0 06161-044 100 Figure 20. Maximum Output Power vs. Supply Voltage, RL = 8 , AV = 18 dB Rev. 0 | Page 8 of 20 SSM2311 3.5 2.5 10% 2.0 1% 1.5 1.0 3.5 4.0 4.5 5.0 4.0 4.5 5.0 10% 1% 2.0 1.5 3.0 2.5 1.0 0.5 0.5 3.5 4.0 4.5 5.0 SUPPLY VOLTAGE (V) 1% 1.5 1.0 3.0 10% 2.0 0 2.5 3.0 3.5 4.0 4.5 5.0 SUPPLY VOLTAGE (V) Figure 22. Maximum Output Power vs. Supply Voltage, RL = 3 , AV = 18 dB 06161-049 OUTPUT POWER (W) 3.5 2.5 Figure 25. Maximum Output Power vs. Supply Voltage, RL = 3 , AV = 6 dB 2.0 100 f = 1kHz GAIN = 6dB RL = 8, 33H 90 80 10% 1.0 1% 0.8 50 40 0.6 30 0.4 20 0.2 10 3.5 4.0 SUPPLY VOLTAGE (V) 4.5 5.0 0 06161-047 3.0 VDD = 2.5V 60 RL = 8, 33H 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 OUTPUT POWER (W) Figure 23. Maximum Output Power vs. Supply Voltage, RL = 8 , AV = 6 dB Rev. 0 | Page 9 of 20 Figure 26. Efficiency vs. Output Power into 8 1.8 2.0 06161-050 1.2 VDD = 5V VDD = 3.6V 70 EFFICIENCY (%) 1.4 0 2.5 3.5 f = 1kHz GAIN = 6dB RL = 3, 33H 4.0 3.0 1.6 3.0 4.5 f = 1kHz GAIN = 18dB RL = 3, 33H 06161-046 OUTPUT POWER (W) 1.0 Figure 24. Maximum Output Power vs. Supply Voltage, RL = 4 , AV = 6 dB 3.5 1.8 1% 1.5 SUPPLY VOLTAGE (V) 4.5 0 2.5 10% 0 2.5 06161-045 3.0 Figure 21. Maximum Output Power vs. Supply Voltage, RL = 4 , AV = 18 dB OUTPUT POWER (W) 2.0 0.5 SUPPLY VOLTAGE (V) 4.0 2.5 06161-048 0.5 0 2.5 f = 1kHz GAIN = 6dB RL = 4, 33H 3 OUTPUT POWER (W) OUTPUT POWER (W) 3.0 3.5 f = 1kHz GAIN = 18dB RL = 4, 33H SSM2311 100 0.30 VDD = 2.5V 90 0.25 VDD = 5V 70 60 VDD = 3.6V 50 40 30 20 0.20 0.15 0.10 0.05 10 0.2 0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 OUTPUT POWER (W) 0 Figure 27. Efficiency vs. Output Power into 4 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 OUTPUT POWER (W) Figure 30. Power Dissipation vs. Output Power into 4 at VDD = 5.0 V 100 0.6 VDD = 2.5V 90 0.5 70 POWER DISSIPATION (W) 80 EFFICIENCY (%) VDD = 5V RL = 4, 33H 06161-052 RL = 4, 33H 06161-073 0 VDD = 5V 60 VDD = 3.6V 50 40 30 20 0.4 0.3 0.2 0.1 10 3.6 OUTPUT POWER (W) 0 06161-051 3.4 3.2 3.0 2.8 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.6 0.8 0.4 0 0.2 2.6 RL = 3, 33H 0 Figure 28. Efficiency vs. Output Power into 3 VDD = 5V RL = 3, 33H 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 OUTPUT POWER (W) 06161-053 EFFICIENCY (%) POWER DISSIPATION (W) 80 Figure 31. Power Dissipation vs. Output Power into 3 at VDD = 5.0 V 0.10 0.14 VDD = 5V RL = 8, 33H 0.08 0.06 0.04 1.5 1.4 1.3 1.2 06161-074 OUTPUT POWER (W) 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0 0.3 0.04 0.2 0.02 0.1 0.06 Figure 29. Power Dissipation vs. Output Power into 8 at VDD = 5.0 V VDD = 3.6V RL = 8, 33H 0 0.1 0.2 0.3 0.4 0.5 0.6 OUTPUT POWER (W) 0.7 0.8 0.9 06161-054 POWER DISSIPATION (W) 0.08 0.10 0 POWER DISSIPATION (W) 0.12 Figure 32. Power Dissipation vs. Output Power into 8 at VDD = 3.6 V Rev. 0 | Page 10 of 20 SSM2311 600 0.24 VDD = 3.6V 0.22 R = 4, 33H L 500 VDD = 3.6V 0.18 400 0.16 0.14 ISY (mA) POWER DISSIPATION (W) 0.20 0.12 0.10 VDD = 5V VDD = 2.5V 300 200 0.08 0.06 100 0.04 0.02 2.4 06161-057 OUTPUT POWER (W) RL = 4, 33H 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 06161-058 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 0 06161-055 0 0 ISY (mA) 500 0.20 1.2 1.4 1.6 1.8 2 2.2 300 0.10 200 0.05 100 0 0 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 OUTPUT POWER (W) VDD = 3.6V VDD = 5V 400 0.15 06161-072 POWER DISSIPATION (W) 0.25 0.4 1 700 600 0.2 0.8 800 0.30 0 0.6 Figure 36. Supply Current vs. Output Power into 4 VDD = 3.6V RL = 3, 33H 0.35 0.4 OUTPUT POWER (W) Figure 33. Power Dissipation vs. Output Power into 4 at VDD = 3.6 V 0.40 0.2 VDD = 2.5V RL = 3, 33H OUTPUT POWER (W) Figure 37. Supply Current vs. Output Power into 3 Figure 34. Power Dissipation vs. Output Power into 3 at VDD = 3.6 V 0 350 -10 300 -20 VDD = 3.6V 200 PSRR (dB) -30 VDD = 5V VDD = 2.5V 150 -40 -50 -60 -70 100 -80 50 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 OUTPUT POWER (W) 1.6 -100 10 100 1k 10k FREQUENCY (Hz) Figure 38. Power Supply Rejection Ratio vs. Frequency Figure 35. Supply Current vs. Output Power into 8 Rev. 0 | Page 11 of 20 100k 06161-059 0 -90 RL = 8, 33H 06161-056 ISY (mA) 250 SSM2311 0 7 RL = 8, 33H 6 -10 5 SD INPUT 4 -30 VOLTAGE (V) -40 -50 3 2 1 -60 OUTPUT 0 -70 100 1k 10k 100k FREQUENCY (Hz) -2 -10 06161-060 -80 10 0 10 -20 30 40 50 60 70 80 90 180 TIME (ms) Figure 39. Common-Mode Rejection Ratio vs. Frequency 0 20 06161-062 -1 06161-063 CMRR (dB) -20 Figure 41. Turn-On Response 7 VDD = 3.6V VRIPPLE = 1V rms RL = 8, 33H OUTPUT 6 5 SD INPUT VOLTAGE (V) 4 -60 -80 3 2 1 -100 0 -120 -140 10 -1 100 1k 10k FREQUENCY (Hz) 100k 06161-061 CROSSTALK (dB) -40 Figure 40. Crosstalk vs. Frequency -2 -20 0 20 40 60 80 100 120 TIME (ms) Figure 42. Turn-Off Response Rev. 0 | Page 12 of 20 140 160 SSM2311 TYPICAL APPLICATION CIRCUITS VBATT 2.5V TO 5.0V 10F 0.1F SSM2311 22nF1 AUDIO IN+ IN+ 300k 37.5k OUT+ FET DRIVER MODULATOR IN- AUDIO IN- VDD OUT- 37.5k 22nF1 300k SHUTDOWN SD BIAS OSCILLATOR POP/CLICK SUPPRESSION 06161-019 GND 1 INPUT CAPS ARE OPTIONAL IF INPUT DC COMMON-MODE VOLTAGE IS APPROXIMATELY VDD/2. Figure 43. Differential Input Configuration VBATT 2.5V TO 5.0V 10F 0.1F SSM2311 22nF1 AUDIO IN+ IN+ 300k VDD 37.5k OUT+ FET DRIVER MODULATOR IN- OUT- 37.5k 22nF1 300k SHUTDOWN SD BIAS OSCILLATOR POP/CLICK SUPPRESSION 1 INPUT CAPS ARE OPTIONAL IF INPUT DC COMMON-MODE VOLTAGE IS APPROXIMATELY VDD/2. Figure 44. Single-Ended Input Configuration Rev. 0 | Page 13 of 20 06161-020 GND SSM2311 VBATT 2.5V TO 5.0V 10F 0.1F SSM2311 AUDIO IN+ AUDIO IN- 22nF1 R EXT IN+ 300k 37.5k OUT+ FET DRIVER MODULATOR IN- 22nF1 REXT VDD OUT- 37.5k 300k SD GAIN = BIAS OSCILLATOR POP/CLICK SUPPRESSION GND 300k (37.5k + R EXT ) 06161-021 SHUTDOWN 1 INPUT CAPS ARE OPTIONAL IF INPUT DC COMMON-MODE VOLTAGE IS APPROXIMATELY VDD/2. Figure 45. Differential Input Configuration, User-Adjustable Gain VBATT 2.5V TO 5.0V 10F 0.1F SSM2311 AUDIO IN+ 22nF1 R EXT IN+ 300k 37.5k OUT+ FET DRIVER MODULATOR IN- 22nF1 REXT VDD OUT- 37.5k 300k GAIN = BIAS OSCILLATOR POP/CLICK SUPPRESSION GND 300k (37.5k + R EXT ) 1 INPUT CAPS ARE OPTIONAL IF INPUT DC COMMON-MODE VOLTAGE IS APPROXIMATELY VDD/2. Figure 46. Single-Ended Input Configuration, User-Adjustable Gain Rev. 0 | Page 14 of 20 06161-022 SD SHUTDOWN SSM2311 APPLICATION NOTES The SSM2311 mono Class-D audio amplifier features a filterless modulation scheme that greatly reduces the external components count, conserving board space and thus reducing the system's cost. The SSM2311 does not require an output filter, but instead relies on the inherent inductance of the speaker coil and the natural filtering of the speaker and the human ear to fully recover the audio component of the square-wave output. While many Class-D amplifiers use some variation of pulse-width modulation (PWM), the SSM2311 uses - modulation to determine the switching pattern of the output devices. This provides a number of important benefits. - modulators do not produce a sharp peak with many harmonics in the AM frequency band, as pulse-width modulators often do. - modulation provides the benefits of reducing the amplitude of spectral components at high frequencies; that is, reducing EMI emission that might otherwise be radiated by speakers and long cable traces. Due to the inherent spreadspectrum nature of - modulation, the need for oscillator synchronization is eliminated for designs incorporating multiple SSM2311 amplifiers. The SSM2311 also offers protection circuits for overcurrent and temperature protection. GAIN The SSM2311 has a default gain of 18 dB, but can be reduced by using a pair of external resistors with a value calculated as follows: External Gain Settings = 300k/(37.5k + Rext) track length for lowest DCR, and use 1 oz or 2 oz of copper PCB traces to further reduce IR drops and inductance. A poor layout increases voltage drops, consequently affecting efficiency. Use large traces for the power supply inputs and amplifier outputs to minimize losses due to parasitic trace resistance. Proper grounding guidelines help to improve audio performance, minimize crosstalk between channels, and prevent switching noise from coupling into the audio signal. To maintain high output swing and high peak output power, the PCB traces that connect the output pins to the load and supply pins should be as wide as possible to maintain the minimum trace resistances. It is also recommended to use a large-area ground plane for minimum impedances. In addition, good PCB layouts isolate critical analog paths from sources of high interference. High frequency circuits (analog and digital) should be separated from low frequency ones. Properly designed multilayer printed circuit boards can reduce EMI emission and increase immunity to the RF field by a factor of 10 or more compared with double-sided boards. A multilayer board allows a complete layer to be used for the ground plane, whereas the ground plane side of a double-sided board is often disrupted with signal crossover. If the system has separate analog and digital ground and power planes, the analog ground plane should be underneath the analog power plane, and, similarly, the digital ground plane should be underneath the digital power plane. There should be no overlap between analog and digital ground planes or analog and digital power planes. POP-AND-CLICK SUPPRESSION 70 Voltage transients at the output of audio amplifiers can occur when shutdown is activated or deactivated. Voltage transients as low as 10 mV can be heard as an audio pop in the speaker. Clicks and pops can also be classified as undesirable audible transients generated by the amplifier system and therefore as not coming from the system input signal. Such transients can be generated when the amplifier system changes its operating mode. For example, the following can be sources of audible transients: system power-up/ power-down, mute/unmute, input source change, and sample rate change. The SSM2311 has a pop-and-click suppression architecture that reduces these output transients, resulting in noiseless activation and deactivation. 60 LEVEL (dB/V) 50 LAYOUT 40 30 20 10 0 -10 30 100 FREQUENCY (MHz) Figure 47. EMI Emissions from SSM2311 As output power continues to increase, care needs to be taken to lay out PCB traces and wires properly between the amplifier, load, and power supply. A good practice is to use short, wide PCB tracks to decrease voltage drops and minimize inductance. Ensure that track widths are at least 200 mil for every inch of Rev. 0 | Page 15 of 20 1000 06161-076 OVERVIEW SSM2311 INPUT CAPACITOR SELECTION PROPER POWER SUPPLY DECOUPLING The SSM2311 does not require input coupling capacitors if the input signal is biased from 1.0 V to VDD - 1.0 V. Input capacitors are required if the input signal is not biased within this recommended input dc common-mode voltage range, if high-pass filtering is needed (Figure 43), or if using a single-ended source (Figure 44). If high-pass filtering is needed at the input, the input capacitor along with the input resistor of the SSM2311 forms a high-pass filter whose corner frequency is determined by the following equation: To ensure high efficiency, low THD, and high PSRR, proper power supply decoupling is necessary. Noise transients on the power supply lines are short-duration voltage spikes. Although the actual switching frequency can range from 10 kHz to 100 kHz, these spikes can contain frequency components that extend into the hundreds of megahertz. The power supply input needs to be decoupled with a good quality low ESL, low ESR capacitor--usually of around 4.7 F. This capacitor bypasses low frequency noises to the ground plane. For high frequency transients noises, use a 0.1 F capacitor as close as possible to the VDD pin of the device. Placing the decoupling capacitor as close as possible to the SSM2311 helps maintain efficiency performance. fC = 1/(2 x RIN x CIN) The input capacitor can significantly affect the performance of the circuit. Not using input capacitors degrades both the output offset of the amplifier and the PSRR performance. Rev. 0 | Page 16 of 20 SSM2311 OUTLINE DIMENSIONS 0.65 0.59 0.53 1.575 1.515 1.455 3 2 A 0.35 0.32 0.29 1.750 1.690 1.630 B C 0.50 BSC BALL PITCH TOP VIEW (BALL SIDE DOWN) 1 0.28 0.24 0.20 BOTTOM VIEW (BALL SIDE UP) 091306-B BALL 1 IDENTIFIER SEATING PLANE Figure 48. 9-Ball Wafer Level Chip Scale Package [WLCSP] (CB-9-1) Dimensions shown in millimeters ORDERING GUIDE Model SSM2311CBZ-R2 1 SSM2311CBZ-REEL1 SSM2311CBZ-REEL71 SSM2311-EVALZ1 SSM2311-MINI-EVALZ1 1 Temperature Range -40C to +85C -40C to +85C -40C to +85C Package Description 9-Ball Wafer Level Chip Scale Package [WLCSP] 9-Ball Wafer Level Chip Scale Package [WLCSP] 9-Ball Wafer Level Chip Scale Package [WLCSP] Evaluation Board Evaluation Board, 7 mm x 7 mm Z = RoHS Compliant Part. Rev. 0 | Page 17 of 20 Package Option CB-9-1 CB-9-1 CB-9-1 Branding A1G A1G A1G SSM2311 NOTES Rev. 0 | Page 18 of 20 SSM2311 NOTES Rev. 0 | Page 19 of 20 SSM2311 NOTES (c)2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06161-0-1/08(0) Rev. 0 | Page 20 of 20