RNC20E1402BTP - Kamaya, Inc. - Datasheet.Directory

K M Y Last update: 2012.10.5 No.RNC-K-HTS-0001-7

(Uncontrolled copy)

Specification

(Reference)

Title: FIXED THIN FILM CHIP RESISTORS;

RECTANGULAR TYPE

Style: RNC06, 20, 32

RoHS COMPLIANCE ITEM

Product specification contained in this specification

are subject to change at any time without notice

If you have any questions or a Purchasing Specification for any quality

Agreement is necessary, please contact our sales staff.

Issue Dept.: Research & Development Department Hokkaido Research Center

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 1/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

1. Scope

1.1 This specification covers the detail requirements for fixed thin film chip resistors; rectangular type & precision, style of

RNC06, 20, 32.

1.2 Applicable documents

JIS C 5201−1: 1998, JIS C 5201−8: 1998, JIS C 5201−8−1: 1998

IEC60115−1: 1999, IEC60115−8: 1989 Amendment 1: 1992, IEC60115−8−1: 1989

EIAJ RC−2133B−2002

2. Classification

Type designation shall be the following form.

(Example) RNC 32 E 1002 ＢＢ

1 2 3 4 5 6

Style

1 Fixed thin film chip resistors; rectangular type

2 Size

3 Temperature coefficient of resistance

4 Rated resistance Example; 1002 → 10kΩ

5 Tolerance on rated resistance

6 Packaging form

3. Rating

3.1 The ratings shall be in accordance with Table−1.

Table−1

Style Rated dissipation

(W)

Temperature coefficient

of resistance (10−6/°C)

Rated resistance

range(Ω)

Preferred number

series for resistors

Tolerance on rated

resistance

0.03 E: ±25 100~1k B(±0.1%)

E: ±25 47~4.99k

RNC06 0.05 C: ±50 5.1k~10k D(±0.5%)

100~130k B(±0.1%)

RNC20 0.1 10~130k C(±0.25%), D(±0.5%)

100~180k B(±0.1%)

RNC32 0.125

E: ±25

10~180k

E24,96

C(±0.25%), D(±0.5%)

Style Limiting element

voltage (V)

Isolation Voltage

(V)

Category temperature

range(°C)

RNC06 15 50

RNC20 75

RNC32 150 100 −55~+125

3.2 Climatic category

55/125/56 Lower category temperature −55 °C

Upper category temperature +125 °C

Duration of the damp heat, steady state test 56days

3.3 Stability class

1% Limits for change of resistance:

− for long - term tests ±(1.0%+0.05Ω)

− for short - term tests ±(0.25%+0.05Ω)

E ±25×10-6/ °C

C ±50×10-6/ °C

Style

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 2/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

3.4 Derating

The derated values of dissipation at temperature in excess of 70°C shall be as indicated by the following curve.

Figure–1 Derating curve

3.5 Rated voltage

d.c.or a.c.r.m.s.voltage calculated from the square root of the product of the rated resistance and the rated dissipation.

E: Rated voltage (V)

E = P · R P: Rated dissipation (W)

R: Rated resistance (Ω)

Limiting element voltage can only be applied to resistors when the resistance value is equal to or higher than the critical

resistance value.

At high value of resistance, the rated voltage may not be applicable.

4. Packaging form

The standard packaging form shall be in accordance with Table−2.

Table−2

Symbol Packaging form Standard packaging

quantity / units Application

B Bulk (loose package) 1,000 pcs. RNC06, 20, 32

PA Press pocket taping

(paper taping) 8mm width, 2mm pitches 15,000 pcs. RNC06

TP Paper taping 8mm width, 4mm pitches 5,000 pcs. RNC20, 32

−55

100

70 125

0

A

rea of recommended

operation

Percentage

of the rated

dissipation

A

mbient temperature (°C)

(%)

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 3/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

5. Dimensions

5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−2 and Table−3.

Figure−2

Table−3 Unit: mm

Style L W H c d

RNC06 0.6±0.03 0.3±0.03 0.23±0.03 0.1±0.05 0.15±0.05

RNC20 2.0±0.15 +0.10

1.25

−0.05 0.6±0.1 0.4±0.2 +0.2

0.3

−0.1

RNC32 3.1±0.1 +0.10

1.55

−0.05 0.6±0.1 0.45±0.20 +0.2

0.3

−0.1

5.2 Net weight (Reference)

Style Net weight(mg)

RNC06 0.16

RNC20 5

RNC32 9

6. Marking

The Rated resistance shall be marked in 3 digits (E24) or 4 digits (E96) and marked on over coat side.

The Rated resistance of RNC06 should not be marked.

(Example)

“123” → 12 ×103 [Ω] → 12 [kΩ]

“3R3” → 3.3 [Ω]

“5623” → 562 ×103 [Ω] → 562 [kΩ]

L

c

H

dd

W

c

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 4/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

7. Performance

7.1 The standard condition for tests shall be in accordance with Sub−clause 4.2, JIS C 5201−1: 1998.

7.2 The performance shall be satisfied in Table−4.

Table−4(1)

No. Test items Condition of test (JIS C 5201−1) Performance requirements

1 Visual examination Sub−clause 4.4.1

Checked by visual examination.

As in 4.4.1

The marking shall be legible, as

checked by visual examination.

2 Dimension

Resistance

Sub−clause 4.4.2

Sub−clause 4.5

As specified in Table−3 of this

specification.

As in 4.5.2

The resistance value shall

correspond with the rated resistance

taking into account the specified

tolerance.

3 Voltage proof Sub−clause 4.7

Method: 4.6.1.4(See Figure−5)

Test voltage: Alternating voltage with a peak

value of 1.42 times the insulation voltage.

Duration: 60 s ± 5 s

Insulation resistance

Test voltage: Insulation voltage

Duration: 1 min.

No breakdown or flash over

R ≥ 1 G Ω

4 Solderability Sub−clause 4.17

Without ageing

Flux: The resistors shall be immersed in a

non−activated soldering flux for 2s.

Bath temperature: 235 °C ± 5 °C

Immersion time: 2 s ± 0.5 s

As in 4.17.4.5

The terminations shall be covered

with a smooth and bright solder

coating.

5 Mounting

Overload

(in the mounted state)

Solvent resistance of the

marking

Sub−clause 4.31

Substrate material: Epoxide woven glass

Test substrate: Figure−3

Sub−clause 4.13

The applied voltage shall be 2.5 times the

rated voltage or twice the limiting element

voltage, whichever is the less severe.

Duration: 2 s

Visual examination

Resistance

Sub−clause 4.30

Solvent: 2−propanol

Solvent temperature: 23 °C ± 5 °C

Method 1

Rubbing material: cotton wool

Without recovery

No visible damage

∆R ≤ ± (0.25%+0.05Ω)

Legible marking

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 5/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

Table−4(2)

No Test items Condition of test (JIS C 5201−1) Performance requirements

6 Mounting

Bound strength of the end face

plating

Final measurements

Sub−clause 4.31

Substrate material: Epoxide woven glass

Test substrate: Figure−4

Sub−clause 4.33

Bent value: 3 mm

Resistance

Sub−clause 4.33.6

Visual examination

∆R ≤ ± (0.25%+0.05Ω)

No visible damage

7 Resistance to soldering heat

Component solvent resistance

Sub−clause 4.18

Solder temperature: 260 °C ± 5 °C

Immersion time: 10 s ± 0.5 s

Visual examination

Resistance

Sub−clause 4.29

Solvent: 2−propanol

Solvent temperature: 23 °C ± 5 °C

Method 2

Recovery: 48 h

Visual examination

Resistance

As in 4.18.3.4

No sign of damage such as cracks.

∆R ≤ ± (0.25%+0.05Ω)

No visible damage

∆R ≤ ± (0.25%+0.05Ω)

8 Mounting

Adhesion

Rapid change temperature

Sub−clause 4.31

Substrate material: Epoxide woven glass

Test substrate: Figure−3

Sub−clause 4.32

Force: 5 N (RNC06: 3N)

Duration: 10 s ± 1 s

Visual examination

Sub−clause 4.19

Lower category temperature: −55 °C

Upper category temperature: +125 °C

Duration of exposure at each temperature: 30

min.

Number of cycles: 5 cycles.

Visual examination

Resistance

No visible damage

∆R ≤ ±(0.25%+0.05Ω)

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 6/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

Table−4(3)

No Test items Condition of test (JIS C 5201−1) Performance requirements

9 Climatic sequence

−Dry heat

−Damp heat, cycle

(12+12hour cycle)

First cycle

−Cold

−Damp heat, cycle

(12+12hour cycle)

Remaining cycle

−D.C. load

Sub−clause 4.23

Sub−clause 4.23.2

Test temperature: + 125 °C

Duration: 16 h

Sub−clause 4.23.3

Test method: 2

Test temperature: 55 °C

[Severity(2)]

Sub−clause 4.23.4

Test temperature −55 °C

Duration: 2h

Sub−clause 4.23.6

Test method: 2

Test temperature: 55 °C

[Severity (2)]

Number of cycles: 5 cycles

Sub−clause 4.23.7

The applied voltage shall be the rated voltage

or the limiting element voltage whichever is

the smaller.

Duration: 1 min.

Visual examination

Resistance

No visible damage

∆R ≤ ± (1%+0.05Ω)

10 Mounting

Endurance at 70 °C

Sub−clause 4.31

Substrate material: Epoxide woven glass

Test substrate: Figure−3

Sub−clause 4.25.1

Ambient temperature: 70 °C ± 2 °C

Duration: 1000 h

The voltage shall be applied in cycles of 1.5 h

on and 0.5 h.

The applied voltage shall be the rated voltage

or the limiting element voltage whichever is

the smaller.

Examination at 48 h, 500 h and

1000 h:

Visual examination

Resistance

No visible damage

∆R ≤ ± (1%+0.05Ω)

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 7/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

Table−4(4)

No Test items Condition of test (JIS C 5201−1) Performance requirements

11 Mounting

Variation of resistance with

temperature

Sub−clause 4.31

Substrate material: Epoxide woven glass

Test substrate: Figure−3

Sub−clause 4.8

+20 °C / +125°C

As in Table−1

12 Mounting

Damp heat, steady state

Sub−clause 4.31

Substrate material: Epoxide woven glass

Test substrate: Figure−3

Sub−clause 4.24

Ambient temperature: 40 °C ± 2 °C

+2

Relative humidity : 93 %

−3

a) 1st group: without voltage applied.

b) 2nd group: The d.c.voltage shall be applied

continuously.

The voltage shall be accordance with

Sub−clause 4.24.2.1 b). without polarizing

voltage [4.24.2.1, c)]

Visual examination

Resistance

No visible damage

Legible marking

∆R ≤ ± (1%+0.05Ω)

13 Dimensions (detail)

Mounting

Endurance at upper

category temperature

Sub−clause 4.4.3

Sub−clause 4.31

Substrate material: Epoxide

woven glass

Test substrate: Figure−3

Sub−clause 4.25.3

Ambient temperature: 125 °C ± 2 °C

Duration: 1000 h

Examination at 48 h, 500 h and 1000 h:

Visual examination

Resistance

As in Table−3

No visible damage

∆R ≤ ± (1%+0.05Ω)

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 8/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

8. Test substrate

Unit: mm

RNC32 TEST SUBSTRATE

Unit: mm

Style a b c d

RNC06 0.3 1.5 0.45 5.2

RNC20 1.2 4.0 1.5 4.3

RNC06, 20 TEST SUBSTRATE

Figure−3

Remark 1). Material: Epoxide woven glass

Thickness: 1.6mm Thickness of copper clad: 0.035mm

2). In the case of connection by connector, the connecting terminals are gold plated.

However, the plating is not necessary when the connection is made by soldering.

2.5

8

1.5 2

5

1.5

2 2

2

49

42.5

7.5 5

2.5

30

4 3.5

2.5

Soldering land

c

3 3.5 d

a

5.5 7.5

25

b

2.5 5.08 5.08 3

58.5

Soldering land

:Copper clad

:Solder resist

:Copper clad

:Solder resist

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 9/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

Unit: mm

Style a b c d

RNC06 0.3 1.1 0.45 2.15

RNC20 1.2 4.0 1.65 3.0

RNC32 2.5 5.0 2.0 2.5

RNC BOUND STRENGTH OF THE END FACE PLATING TEST TEST SUBSTRATE

Figure−4

Remark 1). Material: Epoxide woven glass

Thickness: 1.6mm Thickness of copper clad: 0.035mm

⋅ RNC20, 32 ⋅ RNC06

Figure−5

:Copper clad

:Solder resist

d

a

d

c

14.5

40

b

70

100

Soldering land

R0.25∼R0.5mm

Metal block measurement

Point A

Insulation plate

Metal plate

Measurement

point B Insulation surface Component

Pressure by

spring (1±0.2N)

V

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 10/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

9. Taping

9.1 Applicable documents JIS C 0806−3: 1999, EIAJ ET−7103: 2004, EIAJ ET−7200B: 2003

9.2 Taping dimensions

9.2.1 Press pocket taping (Paper taping, 8mm width, 2mm pitches)

Taping dimensions shall be in accordance with Figure−6 and Table−5.

Unit: mm

Figure−6

Table−5 Unit: mm

Style A B t

1 t

2 t

3

RNC06 0.37±0.05 0.67±0.05 0.42±0.03 0.45±0.05 0.27±0.02

9.2.2 Paper taping (8mm width, 4mm pitches)

Taping dimensions shall be in accordance with Figure−7 and Table−6.

Unit: mm

Figure−7

Table−6 Unit: mm

Style A B t

1 t 2

RNC20 1.65 ± 0.15 2.5 ± 0.2

RNC32 2.00 ± 0.15 3.6 ± 0.2 0.8 ± 0.1 1.0max.

t1

+

0.1

φ1.5

0

4

±

0.05

1.75±0.1

t3

t2

2

±

0.05 3.5±0.05

8±0.2

A

B

Sprocket hole

Carrier cavity

Direction of unreeling

t 1

t 2

+

0.1

φ1.5

0

4

±

0.1

2

±

0.05 1.75±0.1

8±0.2

4

±

0.1 3.5±0.05

A

B

Sprocket hole

Carrier cavity

Direction of unreeling

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 11/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

1). The cover tapes shall not cover the sprocket holes.

2). Tapes in adjacent layers shall not stick together in the packing.

3). Components shall not stick to the carrier tape or to the cover tape.

4). Pitch tolerance over any 10 pitches ±0.2mm.

5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following RNC06:

Figure−8, RNC20, 32: Figure−9.

6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shall

maintain their position and orientation in the tape.

7). In no case shall there be two or more consecutive components missing.

The maximum number of missing components shall be one or 0.1%, whichever is greater.

8). The resistors shall be faced to upward at the over coating side in the carrier cavity.

Figure−8 Figure−9

9.3 Reel dimension

Reel dimensions shall be in accordance with the following Figure−10 and Table−7.

Plastic reel (Based on EIAJ ET−7200B) Unit: mm

Figure−10

Table−7 Unit: mm

Style A B Note

11.4±1.0 Injection molding

RNC06, 20, 32 +1.0

9 0 13±1.0 Vacuum forming

Note: Marking label shall be marked on a place of Marking A or two place of marking A and B.

φ21±0.8

2±0.5

Marking A

0

φ180

　−1.5

　　　　+1

φ

60

　　　　0

φ

13±0.2

B

A

Marking B

165°to180°

C

arr

i

er tape

T

op cover tape

Peel−off

(About 300mm/min)

Di

rec

ti

on o

f

unree

li

ng

165°to180°

C

arr

i

er tape

Top cover tape

Peel

−

off

(

About 300mm

/

min

)

Di

rect

i

on o

f

unree

li

ng

K M Y Drawing No: RNC−K−HTS−0001 /7

Title: FIXED THIN FILM CHIP RESISTORS; RECTANGULAR TYPE

RNC06, 20, 32 Page: 12/12

Product specification contained in this specification are subject to change at any time without notice.

If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.

Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2012.10.5

9.4 Leader and trailer tape.

(Example)

Figure−11

10. Marking on package

The label of a minimum package shall be legibly marked with follows.

10.1 Marking A

(1) Classification

(Style, Temperature coefficient of resistance, Rated resistance, Tolerance on rated resistance, Packaging form)

(2) Quantity (3) Lot number (4) Manufacturer’s name or trade mark (5) Others

10.2 Marking B (KAMAYA Control label)

160mm min. 100mm min.

400mm min.

End

Trailer

Direction of unreeling

Leader

Start