ASMT-QWBE-Nxxxx Super 0.5W Cool White Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5W Cool White Power PLCC-4 SMT LED is first Cool white mid-Power PLCC-4 SMT LEDs using InGaN chip technology. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED. * Industry Standard PLCC 4 platform (3.2x2.8x1.9mm) The Super 0.5W Cool White Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. * Low Thermal Resistance 40C/W To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and sub color bin, to provide close uniformity. * High reliability package with enhanced silicone resin encapsulation * High brightness with optimum flux performance using InGaN chip technologies * Available in Cool White * Available in 8mm carrier tape & 7 inch reel * Super wide viewing angle at 120 degree * JEDEC MSL 2a Applications 1. Interior automotive a. Instrument panel backlighting b. Central console backlighting c. Navigation and audio system backlighting d. Dome/Map lighting e. Push button backlighting f. Puddle lamp. g. Glove compartment illumination 2. Exterior automotive a. Number plate illumination 3. Electronic signs and signals a. Decorative lighting 4. Office automation, home appliances, industrial equipment a. Panel/button backlighting b. Display backlighting CAUTION: ASMT-QWBE-Nxxxx LEDs are ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Drawing 1.9 0.2 2.2 0.2 A C C 1.15 0.2 0.56 (TYP .) 0.97 O 2.4 3.2 0.2 3.6 0.2 0.41 (TYP .) A 0.6 0.3 0.79 0.3 2.8 0.2 CATHODE MARKING Notes: 1. All dimensions in millimeters 2. Lead polarity as shown in figure 13. 3. Terminal finish: Ag plating. 4. Encapsulation material: silicone resin. Figure 1. Package Drawing Table 1. Device Selection Guide (TJ = 25 C) Luminous Flux, V[1] (lm) Color Part Number Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Dice Technology Cool White ASMT-QWBE-NFH0E 15.0 19.5 33.0 150 InGaN Notes: 1. V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = 12% Part Numbering System A S M T - Q X1B E - N X 2 X 3 X 4 X 5 Packaging Option Colour Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection Color W - Cool White 2 Table 2. Absolute Maximum Ratings (TA = 25 C) Parameters ASMT-QWBE-Nxxxx DC Forward Current [1] 150 mA Peak Forward Current [2] 300 mA Power Dissipation 513 mW Reverse Voltage -4V Junction Temperature 125 C Operating Temperature -40 C to +110 C Storage Temperature -40 C to +110 C Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz Table 3. Optical Characteristics (TJ = 25 C) Color Part Number Dice Technology Cool White ASMT-QWBE-Nxxxx InGaN Typical Chromaticity Coordinates Viewing Angle 21/2[1] (Degrees) Luminous Efficiency e (lm/W) Total Flux / Luminous Intensity V (lm) / IV (cd) x y Typ. Typ. Typ. 0.33 0.33 120 40 2.75 Notes: 1. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Table 4. Electrical Characteristics (TJ = 25 C) Forward Voltage VF (Volts) @ IF = 150 mA Part Number Typ. Max. Thermal Resistance RJ-P (C/W) ASMT-QWBE-NFH0E 3.6 4.1 40 3 350 300 FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 150 100 430 480 530 580 630 WAVELENGTH - nm 680 730 780 2 3 FORWARD VOLTAGE - V Figure 3. Forward Current Vs. Forward Voltage 0 1.4 1.0 1.2 RELATIVE LUMINOUS FLUX (NORMALIZED AT 25C) RELATIVE LUMINOUS FLUX (NORMALIZED AT 150 mA) 0 1.2 0.8 0.6 0.4 0.2 0 0 30 60 90 120 DC FORWARD CURRENT - mA 4 5 1.0 0.8 0.6 0.4 0.0 150 -50 -25 0 25 50 TJ - JUNCTION TEMPERATURE - C 75 100 100 120 Figure 5. Relative Flux Vs. Temperature 160 160 140 140 R JA = 90C/W 120 120 CURRENT - mA R JA = 110C/W 100 80 60 80 60 40 20 20 0 20 40 60 80 TEMPERATURE (C) 100 Figure 6a. Maximum Forward Current Vs. Ambient Temperature. DeratedBased on TJMAX = 125C, RJ-A=110C/W & 90C/W 120 R JP = 40C/W 100 40 0 1 0.2 Figure 4. Relative Flux Vs. Forward Current CURRENT - mA 200 50 Figure 2. Relative Intensity Vs. Wavelength 4 250 0 0 20 40 60 80 TEMPERATURE (C) Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 125C, RJ-P=40C/W. 0.40 0.40 D= 0.05 0.10 0.25 0.50 1 0.20 0.10 D= 0.00 0.00001 0.0001 0.001 0.01 0.1 tp - Time - (s) tp T 0.30 CURRENT - A 0.30 CURRENT - A D= IF T 0 10 100 0.00 0.00001 0.0001 0.001 FORWARD VOLTAGE SHIFT - V COORDINATE SHIFT 0.000 Cy -0.005 Cx 50 100 150 200 FORWARD CURRENT - mA 250 300 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES NORMALIZED INTENSITY Figure 10. Radiation Pattern 5 0 10 100 0.25 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -50 -25 0 25 50 TJ - JUNCTION TEMPERATURE - C Figure 9. Forward Voltage Shift Vs. Temperature. Figure 8. Chromaticity shift Vs. forward current 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.01 0.1 tp - Time - (s) Figure 7b. Maximum Pulse Current Vs. Ambient Temperature. Derated Based on TA= 85C, RJ-P=110C/W. 0.005 0 IF T D= 0.05 0.10 0.25 0.50 1 0.20 0.010 -0.015 tp 0.10 tp Figure 7a. Maximum Pulse Current Vs. Ambient Temperature. Derated Based on TA = 25C, RJ-A=110C/W. -0.010 tp T 90 75 100 10 - 30 SEC. 255 - 260C 3 C/SEC. MAX. TEMPERATURE 217C 200C -6C/SEC. MAX. ID 150C Note: Diameter "ID" should be bigger than 2.3mm 3C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX. TIME (Acc. to J-STD-020C) Figure 12. Recommended Pb-free Reflow Soldering Profile Figure 11. Recommended Pick and Place Nozzle Size Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. 2.4 0.6 0.9 X 6 1.3 x 6 A A A 0.4 A 1.1 C C C C CATHODE MARKING C 0.3 SOLDER MASK A ANODE C CATHODE Figure 13. Recommended Soldering Pad Pattern 6 4.6 C CATHODE MARKING MINIMUM 55 mm2 OF CATHODE PAD FOR IMPROVED HEAT DISSIPATION TRAILER COMPONENT LEADER 200 mm MIN. FOR O180 REEL. 200 mm MIN. FOR O330 REEL. 480 mm MIN. FOR O180 REEL. 960 mm MIN. FOR O330 REEL. C A USER FEED DIRECTION Figure 14. Tape Leader and Trailer Dimensions O1.5 +0.1 -0 4 0.1 4 0.1 2 0.05 1.75 0.1 2.29 0.1 C C A A 3.5 0.05 8 +0.3 -0.1 3.05 0.1 +0.1 O1 -0 0.229 0.01 8 ALL DIMENSIONS IN mm. Figure 15. Tape Dimensions USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 16. Reeling Orientation 7 3.8 0.1 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Device Color (X1) W Cool White Flux Bin Select (X2X3) Individual reel will contain parts from one bin only X2 Min Flux Bin X3 Max Flux Bin Moisture Sensitivity Flux Bin Limits This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. Bin ID Min. (lm) Max. (lm) 0 3.40 4.30 A 4.30 5.50 B 5.50 7.00 C 7.00 9.00 D 9.00 11.50 E 11.50 15.00 - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. F 15.00 19.50 G 19.50 25.50 H 25.50 33.00 J 33.00 43.00 - It is not recommended to open the MBB prior to assembly (e.g. for IQC). K 43.00 56.00 L 56.00 73.00 A. Storage before use B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. Color Bin Select (X4) - Individual reel will contain parts from one sub bin only. The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. X4 0 Full Distribution A 5K and 5L only B 6K and 6L only C 7K and 7L only D 8K and 8L only E 5K and 6K only F 5L and 6L only G 6K and 7K only H 6L and 7L only J 7K and 8K only K 7L and 8L only - "10%" is Not Green and "5%" HIC indicator is Azure. L 5K, 5L, 6K and 6L only - The LEDs are exposed to condition of >30C / 60% RH at any time. M 6K, 6L, 7K and 7L only N 7K, 7L, 8K and 8L only - The LEDs floor life exceeded 672 hours. Z Special binning C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: Recommended baking condition: 605C for 20 hours. 8 Tolerance of each bin limit = 12% Color Bin Limits Bin ID Sub Bin ID 5K 5Ka 5Kb 5Kc 5Kd 5L 5La 5Lb 5Lc 5Ld 6K 6Ka 6Kb 6Kc 6Kd 6L 6La 6Lb 6Lc 6Ld Limits (Chromaticity Coordinates) x 0.296 0.304 0.302 0.294 y 0.259 0.270 0.276 0.264 x 0.294 0.302 0.300 0.291 y 0.264 0.276 0.281 0.268 x 0.304 0.313 0.312 0.302 y 0.270 0.284 0.291 0.276 x 0.302 0.312 0.310 0.300 y 0.276 0.291 0.297 0.281 x 0.291 0.300 0.298 0.288 y 0.268 0.281 0.288 0.274 x 0.288 0.298 0.295 0.285 y 0.274 0.288 0.294 0.279 x 0.300 0.310 0.309 0.298 y 0.281 0.297 0.305 0.288 x 0.298 0.309 0.307 0.295 y 0.288 0.305 0.312 0.294 x 0.313 0.322 0.321 0.312 y 0.284 0.297 0.305 0.291 x 0.312 0.321 0.320 0.310 y 0.291 0.305 0.314 0.297 x 0.322 0.330 0.330 0.321 y 0.297 0.310 0.320 0.305 x 0.321 0.330 0.330 0.320 y 0.305 0.320 0.330 0.314 x 0.310 0.320 0.319 0.309 y 0.297 0.314 0.322 0.305 x 0.309 0.319 0.318 0.307 y 0.305 0.322 0.329 0.312 x 0.320 0.330 0.330 0.319 y 0.314 0.330 0.339 0.322 x 0.319 0.330 0.330 0.318 y 0.322 0.339 0.347 0.329 Bin ID Sub Bin ID 7K 7Ka 7Kb 7Kc 7Kd 7L 7La 7Lb 7Lc 7Ld 8K 8Ka 8Kb 8Kc 8Kd 8L 8La 8Lb 8Lc 8Ld Limits (Chromaticity Coordinates) x 0.330 0.336 0.337 0.330 y 0.310 0.320 0.330 0.320 x 0.330 0.337 0.337 0.330 y 0.320 0.330 0.341 0.330 x 0.336 0.343 0.344 0.337 y 0.320 0.331 0.341 0.330 x 0.337 0.344 0.345 0.337 y 0.330 0.341 0.352 0.341 x 0.330 0.337 0.337 0.330 y 0.330 0.341 0.349 0.339 x 0.330 0.337 0.338 0.330 y 0.339 0.349 0.358 0.347 x 0.337 0.345 0.346 0.337 y 0.341 0.352 0.362 0.349 x 0.337 0.346 0.347 0.338 y 0.349 0.362 0.371 0.358 x 0.343 0.351 0.352 0.344 y 0.331 0.343 0.354 0.341 x 0.344 0.352 0.354 0.345 y 0.341 0.354 0.364 0.352 x 0.351 0.360 0.362 0.352 y 0.343 0.357 0.369 0.354 x 0.352 0.362 0.364 0.354 y 0.354 0.369 0.380 0.364 x 0.345 0.354 0.355 0.346 y 0.352 0.364 0.375 0.362 x 0.346 0.355 0.356 0.347 y 0.362 0.375 0.385 0.371 x 0.354 0.364 0.366 0.355 y 0.364 0.380 0.391 0.375 x 0.355 0.366 0.367 0.356 y 0.375 0.391 0.401 0.385 Tolerance of each bin limit = 0.02 9 0.41 0.39 8Ld 8Lc 8Lb 0.37 7Ld Y-COORDINATE 0.35 6Ld 0.33 6Lc 6Lb 0.31 7Kd 7Kb 7Kc 8Kc 8Kb 8Ka 5000K - 4500K 7Ka 5600K - 5000K 6Kc 6Kb 5Ld 6Ka 5Lc 7000K - 5600K 5Kd 5Kc 5Lb 5La 5Kb 5Ka 0.27 7La 6Kd 6La 0.29 7Lb 7Lc 8Kd 8La 10000K - 7000K 0.25 0.28 0.30 0.32 0.34 0.36 0.38 X-COORDINATE Packaging Option (X5) VF Bin Limits Option Test Current Package Type Reel Size Bin ID Min. Max. E 150mA Top Mount 7 Inch S5 3.20 3.50 S6 3.50 3.80 S7 3.80 4.10 Tolerance of each bin limit = 0.1V For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2010 Avago Technologies. All rights reserved. AV02-0741EN - September 30, 2011