1
December 1997
HIP1030
1A High Side Driver with
Overload Protection
Features
Over Operating Temperature Range . . -40oC to 125oC
- Max VSAT at 1A . . . . . . . . . . . . . . . . . . . . . . . . . . . .1V
- Current Switching Capability . . . . . . . . . . . . . . . . .1A
- Power Supply Range . . . . . . . . . . . . . . . . 4.5V to 25V
Over-Voltage Shutdown Protected
Over-Current Limiting
Thermal Limiting Protection
Negative Output Voltage Clamp
CMOS/TTL Logic Level Control Input
Load Dump. . . . . . . . . . . . . . . . . . . . . . . . . . . . 60VPEAK
Reverse Battery Protection to -16V
Applications
Motor Driver/Controller
Driver for Solenoids, Relays and Lamps
MOSFET and IGBT Driver
Driver for Temperature Controller
Description
The HIP1030 is a High Side Driver Power Integrated Circuit
designed to switch power supply voltage to an output load. It
is the equivalent of a PNP pass transistor operated as a
protected high side current switch in the saturated ON state
with low forward voltage drop at the maximum rated current.
The HIP1030 has low output leakage and low idle current in
the OFF state.
The Functional Block Diagram for the HIP1030 shows the
protection control circuit functions of over-current, overvoltage
and over-temperature. A small metal resistor senses over-
current in the power supply path of the pass tr ansistor and load.
Overvoltage detection and shutdo wn of the output driver occurs
when a comparator determines that the supply voltage has
exceeded a comparator reference level. Over-temperature is
sensed from a VBE differential sense element that is ther mally
close to the output drive transistor. In addition to the input
detected overvoltage protection, negative peak voltage of a
s witched inductive load is clamped with an internal zener diode.
An internal bandgap voltage source provides a stable voltage
reference over the operating temperature range, providing bias
and ref erence control f or the protection circuits .
The HIP1030 is particularly well suited for driving lamps,
relays, and solenoids in automotive and industrial control
applications where voltage and current overload protection
at high temperatures is required. The HIP1030 is supplied in
a 5 lead TS-001AA Power SIP package.
Ordering Information
PART NUMBER TEMP.
RANGE (oC) PACKAGE PKG.
NO.
HIP1030AS -40 to 125 5 Ld TS-001AA SIP Z5.067C
Pinout
HIP1030 (SIP)
TOP VIEW
Functional Block Diagram
5 VIN (CONTROL)
4 GND
3 TAB GND
2 VOUT (LOAD)
1 VCC (SUPPLY) OVER-
VOLTAGE THERMAL
LIMIT
VCC
VIN
NEG.
CLAMP
ZENER
RSVOUT
LOAD
2
SHUTDOWN
CONTROL
CIRCUIT
43
GND GND
5
1
VBATT
TAB
HIP1030
SUPPLY CURRENT
LIMIT
CONTROL
File Number 2788.7
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 |Copyright © Intersil Corporation 1999
2
Absolute Maximum Ratings Thermal Information
Maximum Supply Voltage VCC. . . See O.V. Shutdown Limit, VOVSD
Input Voltage, VIN (Note 1). . . . . . . . . . . . . . . . . -1V to (VCC - 0.5V)
Load Current, IOUT . . . . . . . . . . . . . . . . . . . . . . . . .Internal Limiting
Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . . ±60VPEAK
Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC
Thermal Resistance (Typical, Note 2) θJA (oC/W) θJC (oC/W)
Plastic SIP Package . . . . . . . . . . . . . . 50 4
Maximum Power Dissipation (Note 3)
At TA = 125oC, Infinite Heat Sink. . . . . . . . . . . . . . . . . . . . .6.25W
Maximum Junction Temperature, TJ. . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-40oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The Input Control Voltage, VIN shall not be greater than (VCC - 0.5V) and shall not exceed +7V when VCC is greater than 7.5V.
2. θJA is measured with the component mounted on an evaluation PC board in free air.
3. The worst case thermal resistance, θJC for the SIP TS-001AA 5 lead package is 4oC/W. The calculation for dissipation and junction
temperature rise due to dissipation is:
PD = (VCC-VOUT)(IOUT) + (VCC)(ICCMAX - IOUT) or (VCC)(ICCMAX) - (VOUT)(IOUT)
TJ = TAMBIENT + (PD) (θJC) for an infinite Heat Sink.
Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Der ating from 150oC is based on the reciprocal of thermal
resistance, θJC + θHS. F or example: Where θJC = 4oC/W and given θHS = 6oC/W as the thermal resistance of an external Heat Sink,
the junction-to-air thermal resistance, θJA = 10oC/W. Therefore, for the maximum allowed dissipation, derate 0.1W/oC for each degree
from TAMB to the maximum rated junction temperature of 150oC. If TAMB = 100oC, the maximum PD is (150 - 100) x 0.1W/oC = 5W.
Electrical Specifications TA = -40oC to 125oC, VIN = 2V, VCC = +12V, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Operating Voltage Range VCC 4.5 - 25 V
Over-Voltage Shutdown VOVSD RL = 1K; VIN = 2V 26 33 38 V
Over-Temperature Limiting TSD - 150 - oC
Negative Pulse
Output Clamp Voltage VCL ICL = -100mA; VCC = 4.5V to 25V (VCC - 35) (VCC - 30.5) (VCC - 28) V
Short Circuit Current Limiting ISC (Note 4) 1.1 1.6 2.5 A
Input Control ON VIH 2.0 - - V
Input Control OFF VIL - - 0.8 V
Input Current High IIH VIN = 5.5V, VCC = 6V to 24V 6 - 40 µA
Input Current Low IIL VIN = 0.8V, VCC = 6V to 24V 6 - 30 µA
Supply Current, Full Load
Input Control ON ICCMAX VIN = 2V; IOUT = 1.0A; - 1.05 1.1 A
Supply Current, No Load
Input Control OFF ICCMIN VIN = 0V; IOUT = 0A; - 55 100 µA
Input-Output Forward Voltage
Drop (VCC - VOUT)VSAT IOUT = 1A; VCC = 4.5V to 25V - 0.6 1 V
Output Leakage IOUT_LK VIN = 0.8V; VCC = 6V to 24V - 4 50 µA
Turn ON Time tON RL = 80; (Note 5) - 5 20 µs
Turn OFF Time tOFF RL = 80; (Note 5) - 25 65 µs
NOTES:
4. Short circuit current will be reduced when thermal shutdown occurs. Testing of short circuit current may require a short duration pulse.
See Figure 7.
5. Refer to Figures 3A and 3B for typical switching speeds with a 20Load.
HIP1030
3
Typical Applications
Typical Performance Curves
FIGURE 1. DISSIPATION DERATING CURVES FIGURE 2. TYPICAL FORWARD VOLTAGE DROP, VSAT
CHARACTERISTICS vs AMBIENT OPERATING
TEMPERATURE
FIGURE 3A. OUTPUT TURN-ON TIME (µs)FIGURE 3B. OUTPUT TURN-OFF TIME (µs)
FIGURE 3. TYPICAL RISE TIME AND FALL TIME CHARA CTERISTICS OF THE HIP1030 WITH A RESISTIVE AND CAPACITIVE
LOAD. THE TURN-ON TIME OF APPROXIMATELY 1.1µs IS PRIMARILY DETERMINED BY THE VCC SUPPLY. THE OUT-
PUT FALL TIME IS LIMITED BY RC TIME CONSTANT OF THE LOAD.
CURRENT
LIMIT
OVER-
VOLTAGE THERMAL
LIMIT
VCC
VIN
NEG.
CLAMP
ZENER
RSVOUT
2
SHUTDOWN CONTROL
CIRCUIT
4
3
GND GND
5
1
TAB
HIP1030
LOADS:
RELAYS
SOLENOIDS
LAMPS
MOTORS
LOGIC SWITCH
TO VIN
0.47µFVBATT
CMOS/TTL
INPUT
VCLAMP
GND VOUT
VCC
VSAT
VCL
TYPICAL
LOAD
SUPPLY
POWER
HIP1030 HIGH SIDE DRIVER
AMBIENT TEMPERATURE (oC)
DISSIPATION WATTS (W)
-50 0 50 100 150
WITH EXT.
6oC/W H. S.
16
12
8
4
0
WITH EXT.
0oC/W H.S.
(INFINITE
HEAT SINK)
AMBIENT TEMPERATURE (oC)
VOLTAGE DROP (V)
1.5
1.0
0.5
0
-50 0 50 100 150
IL = 1.0 A
IL = 0.5A
IL= 1.25A
RL = 10, VCC = VSAT + IL RL; VSAT = (VCC - VOUT)
INPUT: VIN = 5V
DATA TAKEN USING 110CM x 110CM
FLAT ALUM. HEAT SINK
OUTPUT PULSE VOLTAGE (V)
012
15
10
5
0
tON
VCC = 12V, LOAD = 20 IN PARALLEL
INPUT: VIN = 0V to 2V STEP, 1ms PERIOD, 500µs PULSE
WITH 2200pF; TA =25
oC
OUTPUT PULSE VOLTAGE (V)
01020
15
10
5
0
tOFF
INPUT: VIN = 2V to 0V STEP, 1ms PERIOD, 500µs PULSE
WITH 2200pF; TA = 25oC
VCC = 12V, LOAD = 20 IN PARALLEL
HIP1030
4
FIGURE 4. TYPICAL SWITCHING CHARA CTERISTIC OF THE
HIP1030 WITH AN OUTPUT RESISTIVE LOAD FIGURE 5. TYPICAL OUTPUT INDUCTIVE LO AD SWITCHING
PULSE. THE NEGATIVE CLAMP VOLTAGE
(VCC -31V) FOR THE INDUCTIVE KICK PULSE IS
REFERENCED TO THE VCC SUPPLY INPUT
FIGURE 6A. TURN-ON TIME (µs) FIGURE 6B. TURN-OFF TIME (µs)
FIGURE 6. TYPICAL LO W SUPPLY VOLTAGE SWITCHING CHARACTERISTICS OF THE HIP1030. THE TURN-ON AND TURN-OFF
CHARACTERISTICS ARE SHOWN FOR VCC = 4.5V.
FIGURE 7. TYPICAL OUTPUT CURRENT PULSE WHEN
SWITCHING INTO A LOW IMPEDANCE (1), OR
SHORTED LOAD. FOR THE CONDITIONS SHOWN,
OUTPUT CURRENT LIMITING IS ~1.7A
FIGURE 8. TYPICAL IDLE CURRENT vs SUPPLY V OLTA GE
WITH NO LOAD
Typical Performance Curves
(Continued)
OUTPUT PULSE VOLTAGE (V)
SWITCHING TIME (ms)
VCC = 12V, LOAD = 16; TA = 25oC
INPUT: VIN = 0V to 2V STEP, 50% DUTY CYCLE PULSE
15
10
5
00 0.4 0.8 1.2 1.6 2.0
OUTPUT PULSE VOLTAGE (V)
INDUCTIVE PULSE SWITCHING TIME (ms)
VCC = 15V, LOAD = 70mH + 22.3 IN SERIES; TA = 25oC
INPUT: VIN = 0V to 2V STEP, 50% DUTY CYCLE PULSE
15
10
5
0
-15
-10
-5 NEGATIVE INDUCTIVE
SWITCHING PULSE
012345
6
4
2
0012345
OUTPUT PULSE VOLTAGE (V)
tON
VCC = 4.5V, LOAD = 8, TA = 25oC
INPUT: VIN = 0V to 2V STEP, 1ms PERIOD, 500µs PULSE
6
4
2
00 4 8 12 16 20
tOFF
OUTPUT PULSE VOLTAGE (V)
VCC = 4.5V, LOAD = 8, TA = 25oC
INPUT: VIN = 0V to 2V STEP, 1ms PERIOD, 500µs PULSE
3
2
1
00 40 80 120 160 200
VCC = 24V, LOAD = 1; TA = 25oC
INPUT: VIN = 2V, 1ms PERIOD, 100µs PULSE
CURRENT
LIMITING
OUTPUT PULSE VOLTAGE (V)
OUTPUT PULSE TIME (µs) 0 5 10 15 20 25 30 35 40 45 50
5
10
15
20
0
VCC VARIED FROM 4V TO 36V, NO LOAD
INPUT: VIN = 2V (DC); TA = 25oC
OVER-VOLTAGE
SHUTDOWN
25
SUPPLY CURRENT (mA)
SUPPLY VOLTAGE (V)
HIP1030
5
HIP1030
Single-In-Line Plastic Packages (SIP)
H1
D
L1
L
e
e1
b
b1
A1
A
c
J1
E
3
60o
Q
2145
ØPZ5.067C (ALTERNATE VERSION)
5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.170 0.180 4.32 4.57 -
A10.048 0.052 1.22 1.32 3, 4
b 0.030 0.034 0.77 0.86 3, 4
b10.031 0.041 0.79 1.04 3, 4
c 0.018 0.022 0.46 0.55 3, 4
D 0.590 0.610 14.99 15.49 -
E 0.395 0.405 10.04 10.28 -
e 0.067 TYP 1.70 TYP 5
e10.268 BSC 6.80 BSC 5
H10.235 0.255 5.97 6.47 -
J10.095 0.105 2.42 2.66 6
L 0.530 0.550 13.47 13.97 -
L10.110 0.130 2.80 3.30 2
ØP 0.149 0.153 3.79 3.88 -
Q 0.105 0.115 2.66 2.92 -
Rev. 1 4/96
NOTES:
1. These dimensions are within allowab le dimensions of Re v. A of
JEDEC TS-001AA outline dated 8-89.
2. Solder finish uncontrolled in this area.
3. Lead dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. Position of lead to be measured 0.250 inches (6.35mm) from
bottom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from
bottom of dimension D.
7. Controlling dimension: Inch.
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may result from its use. No license is granted b y implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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