2
Absolute Maximum Ratings Thermal Information
Maximum Supply Voltage VCC. . . See O.V. Shutdown Limit, VOVSD
Input Voltage, VIN (Note 1). . . . . . . . . . . . . . . . . -1V to (VCC - 0.5V)
Load Current, IOUT . . . . . . . . . . . . . . . . . . . . . . . . .Internal Limiting
Load Dump (Survival) . . . . . . . . . . . . . . . . . . . . . . . . . . ±60VPEAK
Reverse Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -16V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC
Thermal Resistance (Typical, Note 2) θJA (oC/W) θJC (oC/W)
Plastic SIP Package . . . . . . . . . . . . . . 50 4
Maximum Power Dissipation (Note 3)
At TA = 125oC, Infinite Heat Sink. . . . . . . . . . . . . . . . . . . . .6.25W
Maximum Junction Temperature, TJ. . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-40oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The Input Control Voltage, VIN shall not be greater than (VCC - 0.5V) and shall not exceed +7V when VCC is greater than 7.5V.
2. θJA is measured with the component mounted on an evaluation PC board in free air.
3. The worst case thermal resistance, θJC for the SIP TS-001AA 5 lead package is 4oC/W. The calculation for dissipation and junction
temperature rise due to dissipation is:
PD = (VCC-VOUT)(IOUT) + (VCC)(ICCMAX - IOUT) or (VCC)(ICCMAX) - (VOUT)(IOUT)
TJ = TAMBIENT + (PD) (θJC) for an infinite Heat Sink.
Refer to Figure 1 for Derating based on Dissipation and Thermal Resistance. Der ating from 150oC is based on the reciprocal of thermal
resistance, θJC + θHS. F or example: Where θJC = 4oC/W and given θHS = 6oC/W as the thermal resistance of an external Heat Sink,
the junction-to-air thermal resistance, θJA = 10oC/W. Therefore, for the maximum allowed dissipation, derate 0.1W/oC for each degree
from TAMB to the maximum rated junction temperature of 150oC. If TAMB = 100oC, the maximum PD is (150 - 100) x 0.1W/oC = 5W.
Electrical Specifications TA = -40oC to 125oC, VIN = 2V, VCC = +12V, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Operating Voltage Range VCC 4.5 - 25 V
Over-Voltage Shutdown VOVSD RL = 1KΩ; VIN = 2V 26 33 38 V
Over-Temperature Limiting TSD - 150 - oC
Negative Pulse
Output Clamp Voltage VCL ICL = -100mA; VCC = 4.5V to 25V (VCC - 35) (VCC - 30.5) (VCC - 28) V
Short Circuit Current Limiting ISC (Note 4) 1.1 1.6 2.5 A
Input Control ON VIH 2.0 - - V
Input Control OFF VIL - - 0.8 V
Input Current High IIH VIN = 5.5V, VCC = 6V to 24V 6 - 40 µA
Input Current Low IIL VIN = 0.8V, VCC = 6V to 24V 6 - 30 µA
Supply Current, Full Load
Input Control ON ICCMAX VIN = 2V; IOUT = 1.0A; - 1.05 1.1 A
Supply Current, No Load
Input Control OFF ICCMIN VIN = 0V; IOUT = 0A; - 55 100 µA
Input-Output Forward Voltage
Drop (VCC - VOUT)VSAT IOUT = 1A; VCC = 4.5V to 25V - 0.6 1 V
Output Leakage IOUT_LK VIN = 0.8V; VCC = 6V to 24V - 4 50 µA
Turn ON Time tON RL = 80Ω; (Note 5) - 5 20 µs
Turn OFF Time tOFF RL = 80Ω; (Note 5) - 25 65 µs
NOTES:
4. Short circuit current will be reduced when thermal shutdown occurs. Testing of short circuit current may require a short duration pulse.
See Figure 7.
5. Refer to Figures 3A and 3B for typical switching speeds with a 20ΩLoad.
HIP1030