SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500M at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30m max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 100 - *54 - B5 *
Part Number (Details)
ICP-100-5
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 100 Pins (25x25) 0.5mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N3: These holes are only necessary for use with positioning pins.
27.00
15.30 x 15.30
27.00
13.20
15.40
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
N1
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
no mark= standard 1 = without SMT metal
fixing
Detail C
Detail A
N3
*
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
IC149 Series (SMT) QFP/TQFP - 100 Pins (25x25) 0.5mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N1: Metal soldering Tab Clip. Socket may be stabilized
by soldering (Reflow) in these 4 areas.
N3: These holes are only necessary for use with positioning pins.
26.00
15.24 x 15.24
26.00
11.00
13.20
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
14mm x 14mm
14.0
16.0
0.5
16.0
14.0
2.9
max.
15.0 • 15.0
0.15
0.2 0.5
N1
N3 Detail C
Detail C
10.0 ±0.05
Specifications
Insulation Resistance: 500M at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30m max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection =max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 100 - *25 - B5 *
Part Number (Details)
ICP-100-5
Compatible Emulation-Adapter
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
no mark= standard 1 = without SMT metal
fixing
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500M at 150V DC
Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30m max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: PTES, glass filled UL94V-0
Contact: Phosphor Bronze
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni
ICP-100-5
Adapter Part Number
Outline Adapter Dimensions (Reference Only)
Compatible Socket (Part No.)
29.00 8.08
29.00
2.4
16.50
16.50
Remarks
Note: No conduits within this hatched area.
Emulation-Adapter (100 pins)
IC149-100-025-B5 (w/o pos. pins)
IC149-100-125-B5 (with pos. pins)
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. Careful attention must be taken when fixing the Adapter,
since it is made from thermoplastic material.
By exceeding the maximum torque a perfect performance can
no longer be guaranteed.
20.40
20,40
IC149 / ICP Series
Adapter PCB-Layout (IC149-100-*25-B5) Top View from Soldering Side
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500M at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30m max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection =max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 100 - 028 - B5
Part Number (for IC-use)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
Contact Plating:
B 5 = Au over Ni
32.00
21.20 x 21.20
32.00
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
11.15
12.75
IC149 Series (SMT) BQFP - 100 Pins (25x25) 0.635mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
Notes
N3: These holes are only necessary for use with positioning pins.
not available
Compatible Emulation-Adapter
Detail C
N3
19.13mm x
19.13mm
Detail C
Coding
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500M at 150V DC
Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30m max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: PTES, glass filled UL94V-0
Contact: Phosphor Bronze
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni
ICP-100-6
Adapter Part Number
Outline Adapter Dimensions (Reference Only)
Adapter PCB-Layout (IC149-100-*28-B5)
Compatible Socket (Part No.)
IC149-100-028-B5 (w/o pos. pins)
IC149-100-128-B5 (with pos. pins)
44.20 5.50
44.20
3.1
29.88
40.41
40.41
29.88
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. Careful attention must be taken when fixing the Adapter,
since it is made from thermoplastic material.
By exceeding the maximum torque a perfect performance can
no longer be guaranteed.
Remarks
Note: No conduits within this hatched area.
Emulation-Adapter (100 pins)
IC149 / ICP Series
Top View from Soldering Side
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500M at 150V DC
Withstanding Voltage: 100Veff to 700Veff for 1 minute
Contact Resistance: 30m max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Solvent Durability: Freon
Allowable Torque (max.): - for 1-time screw connection =max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: Polyphenylenesulfide (PPS) glass filled UL94V-0
Contact: Beryllium Copper (BeCu)
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni = B5
IC149 - 100 - *14 - B5
Part Number (Details)
Series No.
No. of Contact Pins
Positioning Pins:
0 = Without Pins
1 = With Pins
Contact Plating:
B5 = Au over Ni
ICP-100-4-4 (with 4 x M2.0 -12.0mm)
Compatible Emulation-Adapter
IC149 Series (SMT) QFP/TQFP - 100 Pins (20x30) 0.65mm pitch
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. This Socket is not for automatic production. It is particulary suitable
for the development of software stored in ROM and for testing LSI-IC's.
3. Careful attention must be taken when fixing the Socket, since it is
entirely made from thermoplastic material. If the max. torque is
exceeded, the Socket will be damaged beyond repair.
4. If using the Socket with an Adapter, please use the gold-plated
Socket version.
Remarks
32.20
22.40 x 16.40
26.60
8.50
10.10
Outline Socket Dimensions (Reference Only)
IC - Dimensions Socket PCB-Layout Top View from Socket
23.2
14mm x 20mm
21.8 • 15.8
3.5
max.
17.2
14.0
20.0
0.15
0.3
N2
Coding
Detail E
0.65
N4
Detail E N3
Notes
N2:N2:
N2:N2:
N2:These holes are only necessary when fixing the Socket with screws.
N3: These holes are only necessary for use with positioning pins.
N4: The Socket may be glued to the PC Board within this area.
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER
CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW
Specifications
Insulation Resistance: 500M at 150V DC
Withstanding Voltage: 700V AC for 1 minute
Contact Resistance: 30m max. at 10mA and 20mV
Operating Temp. Range: -25°C to +85°C
Reflow-soldering Temp.: 220°C for 60 seconds
Mating Cycles: 20 insertions maximum
Allowable Torque (max.): - for 1-time screw connection = max 0.147 Nm
- for repetitive screw connection = min 0.078 Nm
max 0.098 Nm
Materials and Finish
Housing: PTES, glass filled UL94V-0
Contact: Phosphor Bronze
Plating: Au 0.3µm min. over 2.5 ~ 4.5µm Ni
Outline Adapter Dimensions (Reference Only)
Adapter PCB-Layout (IC149-100-*14-B5)
36.62 5.50
30.62
3.0
15.90
26.42
32.41
21.90
1. Ensure a clean contact area. Fluxes, dust and other impurifications
may cause corrosion and contact problems.
2. Careful attention must be taken when fixing the Adapter,
since it is made from thermoplastic material.
By exceeding the maximum torque a perfect performance can
no longer be guaranteed.
Remarks
Emulation-Adapter (100 pins)
ICP-100-4-4 (with 4 x M2.0 - 12.0)
Adapter Part Number
Compatible Socket (Part No.)
IC149-100-014-B5 (w/o pos. pins)
IC149-100-114-B5 (with pos. pins)
* PCB thickness from 1.2 - 3.4mm
*4 – Ø 2.80
Coding
IC149 / ICP Series
Top View from Soldering Side
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Yamaichi Electronics:
IC149-100-025-B5 IC149-100-014-B5