FIN1027MPX - Fairchild Semiconductor

April 2001

Revised June 2003

FIN1027 • FIN1027A 3.3V LVDS 2-Bit High Speed Differential Driver

FIN1027 • FIN1027A

3.3V LVDS 2-Bit High Speed Differential Driver

General Description

This dual driver is designed for high speed interconnects

utilizing Low Voltage Differential Signaling (LVDS) technol-

ogy. The driver tra nsl at es LVTTL sig nal l eve ls to LVDS lev-

els with a ty pical d ifferen tial outpu t swin g of 35 0 mV w hich

provides low EMI at ultra low power dissipation even at

high freq uencies . This device is ideal for hig h speed trans-

fer of clock or data.

The FI N1027 or FI N1027A can be paire d with its com pan-

ion receiver, the FIN1028, or with any other LVDS receiver.

Features

■Greater than 600Mbs data rate

■3.3V power supply operation

■0.5ns maximum differential pulse skew

■1.5ns maximum propagation delay

■Low power dissipa ti on

■Power-Off protection

■Meets or exceeds the TIA/EIA-644 LVDS standard

■Flow-th rou gh pinout simplif ie s PCB lay out

■8-Lead SOIC, US8, and 8-terminal MLP

packages save space

Ordering Code:

Order Number Package Number Package Description

FIN1027M M08A 8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow

[TUBE]

FIN1027MX M08A 8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow

[TAPE and REEL]

FIN1027K8X MAB08A 8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide

[TAPE and REEL]

FIN1027MPX

(Preliminary) MLP08C 8-Terminal Molded Leadless Package (MLP) Dual, JEDEC MO-229, 2mm Square

[TAPE and REEL]

FIN1027AM M08A 8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow

[TUBE]

FIN1027AMX M08A 8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow

[TAPE and REEL]

www.fairchildsemi.com 2

FIN1027 • FIN1027A

Connection Diagrams

Pin Assi gnments for SOIC

FIN1027

(Top View)

Pin Assi gnments for SOIC

FIN1027A

(Top View)

Pin Assignments for US8

for FIN1027

(Top View)

Terminal Assignments for MLP

FIN1027

(Top Through View)

Pin Descriptions Function Table

H = HIGH Lo gic Level

L = LOW Logic Le v el

X = Don’t Care

Pin Name Description

DIN1, DIN2 LVTTL Data Inputs

DOUT1+, DOUT2+Non-inverting Driver Outputs

DOUT1−, DOUT2−Invert ing Driver Outpu ts

VCC Power Supply

GND Ground

Input Outputs

DIN DOUT+DOUT−

LLH

HHL

OPEN L H

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FIN1027 • FIN1027A

Absolute Maximum Ratings(Note 1) Recommended Operating

Conditions

Note 1: The “Absolute Maximum Ratings”: are t hos e v alues bey ond whic h

damage to the device may occur. The databook specifications should be

met, with out exc ept ion, to ens ure t hat the sys tem des ign is reli able ov er its

power supply, temperature and output/input loading variables. Fairchild

does not recommend operation of circuits outside databook specification.

DC Electrical Characteristics

Over supply voltage and operating temperature ranges, unless otherwise specified

Note 2: All typical values are at TA = 25°C and wit h VCC = 3.3V.

Supply Voltage (VCC)−0.5V to +4.6V

DC In put Voltage (DIN)−0.5V to +6.0V

DC Output Vo ltage (DOUT)−0.5V to +4.7V

Driver Short Circuit Current (IOSD) Continuous

Storage Temperature Range (TSTG)−65°C to +150°C

Max Junct ion Temper atu re (T J)150°C

Lead Temperature (TL)

(Soldering, 10 seconds) 260°C

ESD (Human Body Model) ≥ 6500V

ESD (Machine Model) ≥ 400V

Supply Voltage (VCC) 3.0V to 3.6V

Input Voltage (VIN) 0 to VCC

Operati ng Temper atu re (T A)−40°C to +85°C

Symbol Parameter Test Co nditions Min Typ Max Units

(Note 2)

VOD Output Differential Voltage

RL = 100 Ω, See Figure 1

250 350 450 mV

∆VOD VOD Magnitude Change from 25 mV

Differential LOW-to-HIGH

VOS Offset Voltage 1.125 1.25 1.375 V

∆VOS Offset Magnitude Change from 25 mV

Differential LOW-to-HIGH

IOFF Power Off Output Current VCC = 0V, VOUT = 0V or 3.6V ±20 µA

IOS Short Circuit Output Current VOUT = 0V −8mA

VOD = 0V ±8

VIH Input HIGH V olta ge 2.0 VCC V

VIL Input LOW V olta ge GND 0.8 V

IIN Input Current VIN = 0V or VCC ±20 µA

II(OFF) Power-Off Input Current VCC = 0V, VIN = 0V or 3.6V ±20 µA

VIK Input Clamp Voltage IIK = −18 mA −1.5 V

ICC Power Supply Current No Load, VIN = 0V or VCC 12.5 mA

RL = 100 Ω, VIN = 0V or VCC 17.0 mA

CIN Input Capacitance 4pF

COUT Output Capacitance 6pF

www.fairchildsemi.com 4

FIN1027 • FIN1027A

AC Electrical Characteristics

Over supply voltage and operating temperature ranges, unless otherwise specified

Note 3: All typi c al valu es are at TA = 25°C and with VCC = 3.3V.

Note 4: tSK(LH), tSK(HL) is t he ske w betwee n specified outputs of a s ingle device when t he ou tp ut s have identic al loads and are swit c hing in t he sam e direc-

tion.

Note 5: tSK(PP) is t he mag nit ude of t he difference in pro pagatio n delay t im es betwe en any sp ecified t erminals of t w o devices swit c hing in the sam e d ire c ti on

(eithe r LOW-to-H I GH or HIGH-t o-LOW ) w hen both devices operate w it h t he same s upply voltage, same tempe rature, and have identica l test circuits.

FIGURE 1. Differential Driver DC Test Circuit

Note A: All input puls es have frequency = 10 MHz, tR or tF = 2 ns

Note B: CL includes all probe and f ixture capac itances

FIGURE 2. Differential Driver Propagation Delay and

Transition Time Test Circuit

FIGURE 3. AC Waveforms

Symbol Parameter Test Conditions Min Typ Max Units

(Note 3)

tPLHD Differential Propagation Delay 0.5 1.5 ns

LOW-to-HIGH

tPHLD Differential Propagation Delay 0.5 1.5 ns

HIGH-to-LOW

tTLHD Differential Output Rise Time (20% to 80%) RL = 100 Ω, CL = 10pF, 0.4 1.0 ns

tTHLD Differential Output Fall Time (80% to 20%) See Figure 2 and Figure 3 0.4 1.0 ns

tSK(P) Pulse Skew |tPLH - tPHL|0.5 ns

tSK(LH), Channel-to-Channel Skew 0.3 ns

tSK(HL) (Note 4)

tSK(PP) Part-to-Part Skew (Note 5) 1.0 ns

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FIN1027 • FIN1027A

DC / AC Typical Perf ormance Curves

FIGURE 4. Output High Voltage vs.

Power Supply Voltage FIGURE 5. Output Low Voltage vs.

Power Supply Volt ag e

FIGURE 6. Output Short Circuit Current vs.

Power Supply Voltage FIGURE 7. Differential Output Voltage vs.

Power Supply Volt ag e

FIGURE 8. Differential Output Voltage vs.

Load Resistor

FIGURE 9. Offset Voltage vs.

Power Supply Volt ag e

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FIN1027 • FIN1027A

DC / AC Typical Performance Curve s (Continued)

FIGURE 10. Power Supply Current vs.

Frequency FIGURE 11. Power Supply Current vs.

Power Supply Voltage

FIGURE 12. Power Supply Current vs.

Ambient Temperature FIGURE 13. Differential Propagation Delay vs.

Power Supply

FIGURE 14. Differential Propagation Delay vs.

Ambient Temperature FIGURE 15. Differential Skew (tPLH - tPHL) vs.

Power Supply

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FIN1027 • FIN1027A

DC / AC Typical Perf ormance Curves (Continued)

FIGURE 16. Differential Pulse Skew (tPLH - tPHL) vs.

Ambient Temperature FIGURE 17. Transition Time vs.

Power Supply Volt ag e

FIGURE 18. Transition Time vs.

Ambient Temperature

www.fairchildsemi.com 8

FIN1027 • FIN1027A

Tape and Reel Specification

TAPE FORMAT for US8

TAPE DIMENSIONS inches (millimeters)

REEL DIMENSIONS inches (millimeters)

Package Tape Number Cavity Cover Tape

Designator Section Cavities Status Status

Leader (Start End) 125 (typ) Empty Sealed

K8X Carrier 250 Filled Sealed

Trailer (Hub End) 75 (typ) Empty Sealed

Tape

Size ABCDN W1 W2 W3

8 mm 7.0 0.059 0.512 0.795 2.165 0.331 + 0.059/−0.000 0.567 W1 + 0.078/−0.039

(177.8) (1.50) (13.00) (20.20) (55.00) (8.40 + 1.50/−0.00) (14.40) (W1 + 2.00/−1.00)

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FIN1027 • FIN1027A

Tape and Reel Specification

TAPE FORMAT for MLP

MLP Embossed Tape Dimensions (Dimensions are in millimeters)

REEL DIMENSIONS (millimeters)

Package Ao Bo DD

1EFKoP

1Po P2TT

CWWc

±0.10 ±0.10 ±0.05 Min ±0.1 ±0.1 ±0.1 TYP TYP ±0/05 TYP ±0.005 ±0.3 TYP

2 x 2 2.30 2.30 1.55 1.0 1.75 3.5 1.0 8.0 4.0 2.0 0.3 0.06 8.0 5.3

Tape Width Dia A

Max Dim B

Min Dia C

+0.5/−0.2 Dia D

Min Dim N

Min Dim W1

+2/−0Dim W2

Max Dim W3

(LSL - USL)

8 mm 330 1.5 13 20.2 178 8.4 14.4 7.9 ∼ 10.4

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FIN1027 • FIN1027A

Physical Dimensions inches (millimeters) unless otherwise noted

8-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow

Package Number M08A

11 www.fairchildsemi.com

FIN1027 • FIN1027A

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide

Package Number MAB08A

www.fairchildsemi.com 12

FIN1027 • FIN1027A 3.3V LVDS 2-Bit High Speed Differential Driver

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

8-Terminal Molded Leadless Package (MLP) Dual, JEDEC MO-229, 2mm Square

Package Number MLP08C

(Preliminary)

Fairchild does not assu me any responsibility for use of any circuitry de scribed, no circuit patent licenses are implied and

Fairchild reserves the right at any time without notice to change said circuitry and specifications.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD

SEMICONDUCTOR CORPORATION. As used herein:

1. Life suppor t de vices o r syste ms a re device s or syste ms

which, (a) are intended for surgical implant into the

body, or (b) support or sustain life, and (c) whose failure

to perform when properly used in accordance with

instructions for use provided in the labeling, can be rea-

sonably expected to result in a significant injury to the

user.

2. A critical com ponent in any compon ent of a l ife supp ort

device or system whose failure to perform can be rea-

sonabl y ex pect ed to ca use the fa ilu re of the li fe su pp ort

device or system, or to affect its safety or effectiveness.